MILPITAS, CALIF. –– November 15, 2022 –– The 2022 Phil Kaufman Award ceremony and banquet honoring Dr. Giovanni De Micheli will be held Thursday, February 23, 2023, from 6:30 p.m. until 9:30 p.m. at The GlassHouse, 2 South Market Street in San Jose, Calif.

The evening will be hosted by the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA). Early bird ticket pricing is available through Friday, January 13, 2023, at $175 per individual from member companies and $225 each for non-members. After January 13, member tickets are $225 each and $275 per non-member. Member pricing is offered for individuals or companies that are active SEMI or IEEE members.

Corporate sponsorship opportunities are available. Contact Bob Smith, executive director of the ESD Alliance, at [email protected] for more information.

Dr. De Micheli is Professor and Director of the Institute of Electrical Engineering (IEL) and of the Integrated Systems Centre at the École Polytechnique Fédérale de Lausanne (EPFL) in Lausanne, Switzerland. He is being recognized for his contributions to electronic design automation (EDA). His research on EDA tools and methodologies has helped drive significant advances in the academic field of design automation and made a lasting impact on the industry through their incorporation into commercial EDA solutions.

About the Phil Kaufman Award
The Phil Kaufman Award, co-sponsored by the ESD Alliance and CEDA, honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The annual award was established in 1994 as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2021 recipient was Dr. Anirudh Devgan, President and CEO of Cadence Design Systems. Visit the Phil Kaufman Award webpage for more details and a list of previous recipients.

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in touch with IEEE CEDA:
Website: www.ieee-ceda.org
LinkedIn: https://www.linkedin.com/groups/8343531
Facebook: https://www.facebook.com/ieeeceda/
Twitter: https://twitter.com/IEEECEDA

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
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• Read more about 2022 Phil Kaufman Award Ceremony and Banquet Honoring Dr. Giovanni De Micheli Scheduled for February 23 in San Jose

microMIRA™ provides highly uniform, force-free lift-off of material layers at high speeds;
more than ten 3D-Micromac laser systems sold for microLED applications to date

Chemnitz, Germany, November 7, 2022—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets, today announced that a leading optical solutions provider has purchased multiple microMIRA™ Laser Lift-Off (LLO) systems from 3D-Micromac for use in the production of microLED devices. The customer will install the new microMIRA systems in pilot- and production lines at its state-of-the-art LED chip factory in Asia.

Laser Lift-Off an Enabling Process for microLEDs
MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime, and low power consumption. Potential applications include very large displays for indoor and outdoor use, as well as high-resolution displays for augmented reality (AR) and virtual reality (VR) wearable devices.

However, the microLED fabrication process is vastly more complex than LCD and OLED manufacturing, and faces several technical challenges that must be overcome before microLEDs can be readily available in the mass market. Among these challenges is detaching and transferring the processed microLED chips from the donor or growth substrate (e.g., sapphire) to an intermediate substrate for subsequent testing without damaging the expensive growth substrate, allowing it to be repurposed for future use. The microMIRA system from 3D-Micromac precisely addresses this task with superior performance.

3D-Micromac’s microMIRA system provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The system is capable of processing different substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.

According to Uwe Wagner, CEO of 3D-Micromac, “This multiple system order is a testament to our ability to provide innovative and enabling laser micromachining solutions for industrial applications serving both mature and emerging markets. It also represents an important milestone for 3D-Micromac as we continue to expand our product offerings and services into the display industry, addressing the production needs for exciting new display technologies, including microLEDs. To date, 3D-Micromac has sold more than 10 laser processing systems for microLED applications, including our industry-benchmark microMIRA laser-lift-off system as well as our recently introduced microCETI™ micromachining platform.”

The microMIRA LLO system has been used successfully in mass production by electronics manufacturers globally for years. In addition to gallium nitride (GaN) lift-off from glass and sapphire substrates in microLED display manufacturing, the microMIRA system can also be used for layer separation in semiconductor and sensor manufacturing, as well as for laser annealing and crystallization for surface modification.

More information on microMIRA, including our latest white paper “Laser technologies for microLED production,” can be found at https://3d-micromac.com/laser-lift-off/micromira/.

About 3D-Micromac
Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

• Read more about 3D-Micromac receives order for multiple Laser Lift-Off systems for microLED device manufacturing

• Total income of EUR 4.3 million in Q3 2022, a year-over-year growth of 19%
• Order book value has further grown since the beginning of the quarter
• New investments to increase capacity and capabilities

Deventer, October 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the third quarter of 2022. The total income for the quarter was EUR 4.3 million, which is 19% higher than the total income in the third quarter of 2021 (EUR 3.6 million). The test operations department is continuing to grow with existing and new customers. The total income for the first nine months of 2022 was EUR 11.6 million, which is 6% higher than the total income for the first nine months of 2021 (EUR 10.9 million). Due to long-term contracts and increasing demand from new customers, the value of the order book is higher than at the beginning of the quarter. This generates a good basis for the upcoming quarters.

“We are very pleased with the high total income throughout the year and especially with the third quarter, which drew the highest quarterly total in the last 20 years”, says Martin Sallenhag, CEO of RoodMicrotec. “We keep investing in new equipment to be able to support the increasing demands from our customers. During 2022, we have purchased new handlers and testers as well as new equipment for the Qualification and Failure Analysis department.”

Outlook
RoodMicrotec expects the total income in 2022 to be in the range of EUR 15.0 million to EUR 15.6 million with a positive result before tax. The current situation in the world regarding lead-times for wafers and packaging as well as shipment delays may impact the ability to achieve the expected total income. The war in Ukraine as well as the current energy crisis could also have an impact on the business but in the short term we don’t see any significant impacts. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any impact.

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, political situation, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

Financial calendar
January 26, 2023 Publication (preliminary) annual total income 2022
April 13, 2023 Trading update for the first quarter of 2023
April 20, 2023 Publication annual report 2022
April 20, 2023 Conference call for press and analysts
June 6, 2023 Annual general meeting of shareholders
July 20, 2023 Publication interim report 2023
July 20, 2023 Conference call for press and analysts
October 19, 2023 Trading update for the third quarter of 2023

Audit
The financial data in this press release have not been audited.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well established as a highly valued partner for many companies worldwide. The Company provides full turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions, the English version shall prevail.

• Read more about RoodMicrotec reports a 19% year-over-year growth rate for the third quarter of 2022

Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, launches the new Plasma Enhanced Atomic Layer Deposition (PEALD) system, "AD-800LP". The main target of the system is gate oxide film deposition for next-generation power devices of silicon carbide (SiC) and gallium nitride (GaN) materials, which will play important role toward carbon neutral.

The plasma enhanced ALD system "AD-800LP" is a multi-purpose R&D system equipped with a unique ICP plasma source called "Tornado ICP", in addition to the conventional thermal ALD capability. AD-800LP enables various film deposition such as oxide or nitride films by Tornado ICP, which is Samco's proprietary plasma technology and is different from remote plasma. Tornado ICP enables stable plasma discharge even in the high-pressure range during ALD deposition.

“We are also considering a cluster ALD system that can connect multiple reaction chambers for production” says Tsukasa Kawabe, President and COO of Samco. “The launch of the AD-800LP will greatly enhance our presence in the world ALD equipment market.” Tsukasa adds.

As a global mid-sized company, Samco has successfully delivered numerous dry etch systems and plasma enhanced CVD systems for the electronic device field, mainly for compound semiconductors such as SiC, GaN, and GaAs, not only in Japan but also in the United States, Europe, Taiwan, Korea, China, Southeast Asia, India, and other countries.

The new Research Center for Nano Thin Films & Materials, which opened in February 2022, conducts research and development of unique thin film deposition, including ALD system. Samco will continue to utilize our "thin-film technology" to develop unique products and expand sales globally.

AD-800LP system photo

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including BAW filters, SiC power devices, GaN RF devices, GaAs VCSELs, InP lasers, microLEDs, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samcointl.com/.

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]

• Read more about Samco Unveils Plasma Enhanced ALD System for SiC and GaN Power Devices

Xpeedic confirmed today that Chipletz, a fabless substrate startup developing advanced packaging technology, adopted its Metis electromagnetic (EM) simulation tool for Chipletz’s soon-to-be released Smart Substrate™ products that will enable multiple ICs in a single package.

“The slowing of Moore’s Law and demand for compute performance is ushering in the era of advanced packaging and the increasing need for products like Xpeedic’s,” remarks Bryan Black, CEO of Chipletz. “Xpeedic and its Metis EM simulation tool are helping us meet our unique signal and power integrity analysis challenges by delivering unprecedented performance advantages for runtime and memory usage.”

“The Chipletz Smart Substrate products will be a welcome addition to toolkits of designers working on advanced 2.5D and 3D IC packaging,” says Feng Ling, CEO of Xpeedic. “Smart Substrate will facilitate multiple ICs from different vendors in a single package, especially important for the AI workloads, immersive consumer experiences and high-performance computing markets. We’re pleased to have a role in the delivery of this advanced packaging technology.”

Xpeedic’s Metis is a fast EM simulation tool for advanced package simulation integrated with IC and package design tools to address capacity, accuracy and throughput requirements. Its three-dimensional EM solver technology delivers unprecedented performance without compromising accuracy. The single solver covers simulation from DC to high frequencies. It also supports multi-scale problems that enables unified EM simulations of die, interposer, and package for advanced packaging designs.
About Xpeedic

Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both US and China. For more information, please www.xpeedic.com.

Engage with Xpeedic
www.xpeedic.com
Twitter: @xpeedic
LinkedIn

About Chipletz
Incorporated in 2021, Chipletz is a fabless substrate vendor developing advanced packaging technology that bridges the gap between the slowing of Moore's Law and the rising demand for compute performance. The company's Smart Substrate™ products facilitate multiple ICs in a single package for critical AI workloads, immersive consumer experiences, and high-performance computing. Chipletz is targeting delivery of its initial products to its customers and partners in early 2024. www.chipletz.com

• Read more about Chipletz Selects Xpeedic’s Metis Tool for its Smart Substrate Products

Heterogenous integration in microelectronics requires advanced materials

Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present new developments in temporary and permanent bonding material technologies for advanced packaging at SEMICON Taiwan, an international event connecting supply chain partners across the semiconductor industry.

Dr. Alvin Lee, Regional Director, at Brewer Science, garners over a decade of diverse experience in the semiconductor industry developing global partnerships to improve next-generation advanced packaging materials.

Dr. Lee is a featured speaker at the SEMICON Taiwan Heterogeneous Integration Global Summit, which focuses on comprehensive high density and automotive heterogeneous integration. His presentation, New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging, will address cost-effective solutions and innovative material technologies that enable advanced wafer-level packaging applications. Materials will be discussed that address the growing challenges in applications requiring thin wafer handling, die attach, high-temperature processing, permanent adhesives, dielectrics, and wafer cleaning.

The presentation will address advanced materials that enable

• Collective die-to-wafer hybrid bonding,
• Cu/polymer hybrid bonding,
• Advancement of temporary bonding/debonding technologies

Brewer Science will be exhibiting at SEMICON Taiwan and you can visit our booth J2242 to connect with a member of our team and explore our advanced packaging solutions. If you are unable to attend, but wish to learn more about Brewer Science’s advanced packaging materials, you can visit our website to view datasheets and schedule a call with an expert.

Brewer Science is also a proud sponsor of SEMICON Taiwan, providing a Platinum Sponsorship to the Heterogeneous Integration Global Summit. Additionally, Brewer Science is sponsoring the IC Forum and the Gala Dinner.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

• Read more about Brewer Science presents advanced packaging innovations at SEMICON Taiwan 2022