Zhuhai, Guangdong
China
SEMI N-Type PV Technology and Test Standard Forum
Friday, April 14, 2023
09:30-16:30
Zhuhai, China
Zhuhai, Guangdong
China
SEMI N-Type PV Technology and Test Standard Forum
Friday, April 14, 2023
09:30-16:30
Zhuhai, China
Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Eighth Consecutive Year
Brewer Science is the first company in the semiconductor industry with GreenCircle Certification
Rolla, Mo.– March 2023–Brewer Science, a global technology leader, is pleased to announce it has earned Zero Waste to Landfill Certification for the eighth consecutive year. The Zero Waste to Landfill Certification represents Brewer Science’s commitment to the responsible management of end-of-life materials and demonstrates the company’s commitment to waste diversion practices.
Brewer Science is the first company in the semiconductor and microelectronics industry to achieve GreenCircle Certification – Zero Waste to Landfill. GreenCircle certifies an organization for Zero Waste to Landfill Certification if 100% of the materials leaving the facility are intended to be diverted from landfill via one of GreenCircle’s acceptable means of diversion. Waste diversion from landfill, defined as the prevention and reduction of generated waste through source reduction, recycling, reuse, or composting, has been characterized as one of the best ways manufacturing companies can demonstrate genuine environmental responsibility.
The in-person, on-site audit of the Rolla and Vichy manufacturing locations assessed 767,588 lbs of waste, and the company’s disposal methods.
Converted to energy: 65%
Fuel blending: 18%
Recycling: 12%
Reuse: 5%
Education continues to play an important role in advocating for sustainable development across the supply chain. Brewer Science has developed a new program aimed at bridging the gap in environmental initiatives among its stakeholders.
“The Sustainability Outreach Program we are launching this year is designed to work with our partners, whether that be our employees, suppliers, customers, or other organizations in the communities in which we serve, to collaborate and align on sustainability programs and projects to have a net positive impact on the environment,” states Matthew Beard, Executive Director, Strategic Planning, Management Systems, and Sustainability at Brewer Science.
For semiconductor companies, it is essential to evaluate the materials used in manufacturing, identify any more environmentally friendly alternatives, and handle the waste responsibly. Brewer Science established its Green Chemistry Program in 2019, which is an effort to identify chemical alternatives that are proven to be more sustainable, as well as divert hazardous materials for reuse applications. Additionally, Brewer Science organizes an annual community collection recycling program partnering with waste disposal companies and volunteer crews to prevent community e-waste from becoming a part of a landfill. The company shares about its sustainability programs via its blog and its “Going Green” page to encourage other tech companies to adopt more sustainable practices.
About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.
About the GreenCircle Certified, LLC
GreenCircle Certified, LLC was established to ensure specificity in third-party certification after encountering many unsubstantiated claims in the marketplace. Since 2009, GreenCircle has offered forward-thinking companies a competitive advantage by providing specific, third-party certification of environmental claims. GreenCircle’s rigorous evaluation process provides independent verification that claims of sustainable aspects of products and operations are valid. Manufacturers, suppliers, regulators, occupants, and consumers can be assured that products labeled with the GreenCircle Certified mark have been thoroughly assessed and their claims verified to applicable standards. Learn more at www.greencirclecertified.com/.
Rochester, N.Y. – Linton Crystal Technologies announces Edward Przybycien has joined the company as principal engineer. His responsibilities will include overseeing the research, development, design and optimization of Linton’s crystal growing machines, supporting processing equipment and accessories. As such, Przybycien will serve as design lead throughout the product realization process. Located in Henrietta, New York, Linton is the world leader in the design, development and manufacture of Czochralski (CZ) silicon furnaces for production of monocrystalline silicon ingots for the semiconductor and solar industries.
“We are thrilled to have Ed join our team,” says Scott Blazey, director of operations. “With more than 25 years of mechanical design and cost reduction experience specific to crystal growing furnace and hot zone design, Ed will be an integral part of our continued growth at Linton Crystal Technologies.”
Przybycien is a technical professional with a wide range of mechanical design and engineering management experience. This is complemented by business experience as the principal of Przybycien Consulting LLC, through which he provided technical trade compliance services for more than a decade prior to joining LCT.
His engineering experience includes several years as a professional engineering consultant providing specialized design expertise for hot zone development, vacuum chamber design, and development of retrofit devices for semiconductor processing equipment, as well as 13 years with Kayex, Linton’s predecessor. With Kayex, he began as a mechanical project engineer developing custom assemblies, was the project manager for the 300mm grower and then served as engineering manager. In this last role, he directed the activities of 12 mechanical, electrical, and software engineering personnel and managed order engineering, R&D and product maintenance worldwide.
Przybycien earned his B.S. in Mechanical Engineering magna cum laude from State University of New York at Buffalo. Additionally, he completed training in Complying in U.S. Export Controls and Encryption and Technical Data Controls from the U.S. Bureau of Industry and Security, as well as several trainings regarding U.S. export transactions and controls from the Export Compliance Training Institute.
About Linton
Linton specializes in silicon and produces equipment for materials such as germanium and gallium arsenide. They also provide technical support, process engineering support and replacement parts to help clients get businesses off the ground, improve productivity and continue to innovate. Linton has been the exclusive owner of Kayex technology since 2013.
For more information, visit www.lintoncrystal.com.
SLiM 100 delivers real-time detection and quantification of VOCs to the 1 ppb level
Santa Clara, CA — March 14, 2023 — Picarro Inc., a leading provider of chemical metrology systems for advanced semiconductor fabs, today announced the SLiM 100 Lithography Process Tool Monitoring System. The new 1-ppb class chemical metrology solution detects volatile organic compounds (VOCs) in the lithography process in real time, enabling semiconductor manufacturers to quickly take steps to prevent excursions and detect non-visual defects, thereby improving yield.
As design features shrink, small amounts of airborne molecular contamination (AMC) from VOCs are resulting in significant increases in non-visual defects on reticles and wafers. Crystal growth defects on reticles, hazing of scanner optics, and t-topping of photoresists are some of the serious problems that are caused by the presence of undesired VOCs. Ultimately, these contaminants not only damage expensive lithography tools; they result in yield loss on the wafer.
To mitigate the negative effects of VOCs in the lithography process, fab operators need real-time measurements of VOCs at very low concentration levels. This is very difficult to do in the fab environment with traditional technologies because they are slow and difficult to use.
The SLiM 100 system is a real-time measurement system that is designed to run 24/7 in the fab environment. It is a fully integrated chemical metrology system that is robust, easy to operate, and is ideal for use as a high-volume process monitoring and control system. It measures and monitors 10 organic compounds that negatively affect the lithography process with concentration sensitivity down to 1 part per billion. The system can also accommodate analyzers that measure inorganic molecules at parts-per-trillion concentration levels.
“The Picarro SLiM 100 enables fab operators to detect and resolve semiconductor manufacturing issues much faster than other solutions,” said Dr. Sanjay Yedur, Director of Product Management at Picarro. “This robust system will allow them to reduce costs by halting production of defective wafers sooner and minimize downtime of lithography tools for maintenance and repair."
About Picarro Semiconductor Solutions
Picarro’s Semiconductor business offers industry leading solutions for airborne molecular contamination (AMC) and chemical contaminant monitoring within fabs and process tools. Picarro’s Semiconductor solutions respond to contaminants in seconds, not hours, enabling semiconductor manufacturers to quickly mitigate contamination events in cleanrooms, FOUP, and lithography process equipment – improving production yield. For more information, visit semi.picarro.com.
Xpeedic today was named the 2023 Herb Reiter Design Tool Provider of the Year Award recipient by 3D InCites for its Metis platform, developed to address the signal/power integrity challenges arising from the advanced packaging for 2.5D/3D IC chiplet designs.
The award will be presented today by Françoise von Trapp, Founder, 3D InCites, during the IMAPS Device Packaging in Fountain Hills, Ariz. “Xpeedic only recently appeared on our radar when the company announced it was selected by Chipletz for its smart substrate products,” says von Trapp. “We were excited to have them participate in this year’s 3D InCites Awards program for the first time and congratulate them on winning the prestigious Herb Reiter Design Tool Provider of the Year Award.”
The Metis platform’s multi-scale capability and capacity advantage enables unified EM simulation of die, interposer, and substrate without resorting to an error-prone cut-and-stitch approach used by legacy electronic design automation (EDA) tools. Its multi-mode option offers engineers a choice of speed and accuracy to cover design phases from architectural exploration to sign-off.
“As a first-time 3D Incites Award nominee, we are honored to be selected as the 3D InCites Herb Reiter Design Tool Provider Award recipient and grateful to our community for voting for us,” remarks Feng Ling, Founder and CEO of Xpeedic. “We pledge to continue working with our customers and ecosystem partners to tackle 3D IC and heterogeneous integration design challenges as leading IC companies have done by adopting Metis for next-generation HPC chip design in data center, automotive and AR/VR applications.”
The 3D InCites Awards program, now in its 10th year, recognizes industry-wide contributions in the development of heterogeneous integration and 3D technologies. A total of 36 companies from around the world all working to advance the heterogenous integration roadmap were nominated for 10 award categories. Xpeedic was the winner of the online vote and garnered enough judge votes to win in the category. The award is named for Herb Reiter, who retired in 2020 after a distinguished career as an EDA tool designer, self-proclaimed 3D evangelist, 3D InCites blogger, and proponent of heterogeneous integration.
Metis Availability and Pricing
The Metis platform and the entire Xpeedic portfolio is available now. Pricing is available upon request.
Visit the Xpeedic website for additional information. Email requests should be sent to [email protected].
About Xpeedic
Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D-IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both U.S. and China. For more information, please www.xpeedic.com.
Engage with Xpeedic
www.xpeedic.com
Twitter: @xpeedic
LinkedIn
Deventer, March 8, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today announces that its wholly owned subsidiary RoodMicrotec GmbH has entered into an agreement for a full and final settlement with Prime Capital Debt SCS, SICAV-FIS – Robus Recovery Sub-Fund ("Robus") regarding the perpetual bond that RoodMicrotec GmbH issued in 2010 and which is held by Robus.
As announced on 21 February 2022, Robus had initiated legal proceedings against RoodMicrotec GmbH before the Regional Court of Frankfurt am Main. Robus claimed being entitled to an 11.7% compensation payment in relation to 2017, 2018 and H1-2021. In addition, alleging non-compliance by RoodMicrotec GmbH of the terms and conditions of the 2010 perpetual bond, Robus claimed the immediate and full repayment of the nominal amount of the perpetual bond asserting grounds for the extraordinary termination of the perpetual bond. The total amount claimed by Robus in the proceedings amounted to EUR 2,568k to be increased with 11.7% interest for the applicable period.
Following an oral hearing held on 7 March 2023, the parties have reached agreement on a full and final settlement that was reached before and confirmed by the Regional Court of Frankfurt am Main. Pursuant to the settlement, RoodMicrotec GmbH shall pay a total amount of EUR 2,194k, in four equal instalments of EUR 548k each, by 31 March, 30 June, 30 September and 31 December 2023. RoodMicrotec will be able to pay the installments from free available cash.
RoodMicrotec is pleased that the ongoing litigation procedure is now settled and the dispute is closed.
About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors.
RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com
This press release is published in English and German. In case of conflict between these versions the English version shall prevail.
Brewer Science’s new silicon-rich gapfill material enables a robust process necessary for advanced-node patterning
Advanced and legacy processes are improved by this next-generation material having superior gapfilling and planarizing capabilities and simplified, defect-free, and extremely clean removal.
Rolla, MO – February 8, 2023 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials for the microelectronics and optoelectronics industries, announces the launch of OptiStack® PL200 series material, a silicon-rich high-aspect ratio gapfill material designed to provide superior planarization, solving problems faced in sacrificial gapfill applications. This material series also facilitates next-generation advanced-node patterning by providing a protective, easily strippable, gapfill material that overcomes challenges with nanosheet architectures.
Gapfill for About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.
PENANG, MALAYSIA - FEBRUARY 2023 Wafer inspection is always a critical stage for quality assurance for wafer foundry, integrated device manufacturing (IDM), fabless, and outsourced semiconductor assembly & test (OSAT). Since semiconductor devices are continuously getting smaller and more complex, the requirement for wafer inspection has become more stringent to accommodate these changes. However, defects on the wafer may be overlooked and may pass through the final stages of fabrication and assembly if they are not eliminated or filtered out, which could be a costly mistake for the manufacturers. Consequently, this will lead to increasing demand for quality wafer production.
At ViTrox, we aim to be the World’s Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions. Therefore, we would like to introduce our all-new Wi8i G2 PRO Wafer Vision Inspection Handler, which is designed to offer high flexibility in wafer handling, cover different semiconductor processes and high-accuracy inspection results to the users of the semiconductor market, and is also an expansion to the inspection capabilities of our existing Wafer Vision Inspection Hander - Wi8i G2.
One Solution For Two Semiconductor Processes
The all-new Wi8i G2 PRO solution is enhanced with hardware and programming features to accommodate both bare wafers (pre-dicing process) and mounted wafers (post-dicing process) inspection requirements. This innovative configuration eliminates the need for hardware conversion on the wafer robot arm when inspecting these two wafer types of the same size, which is suitable for production involving both pre-and-post-dicing processes and/or having a high-mix-low-volume of bare and mounted wafers. Hence, our Wi8i G2 PRO is the ideal solution to deliver high overall equipment effectiveness (OEE) which guarantees excellent wafer quality without any machine stop time.
Ability To Handle Up To 12” Wafers & FOUP
Based on the current market trend, there is a demand for wafer inspection equipment to cater to larger wafers due to the increasing number of chip-related productions. To address this, our Wi8i G2 PRO offers a significant enhancement in catering to a new type of wafer carrier box, Front Opening Unified Pod (FOUP) which is particularly important to users with such production practice to accommodate 12 inches of bare wafer transferring. Nowadays, FOUPs are the preferred carrier boxes to handle raw water because FOUPs offer a sealed wafer environment that provides static protection, white-light shielding, and control of moisture and oxygen. Today’s FOUPs not only address particles, but also minimize and control volatile organic compounds (VOCs), oxygen, and relative humidity. Any of these potential contamination sources can negatively impact device yield. Alternatively, should the user need to handle framed wafers, they can opt for a metal cassette instead.
Users are also able to configure their load ports based on their production needs, which can be either:
FOUP + Metal cassette
FOUP + FOUP
Metal cassette + Metal cassette
This load port design accommodates both 8 inches and 12 inches of metal cassettes on the load ports, which translates to cost-effectiveness on different-sized wafer inspections!
Robust Wafer Inspection With Our Advanced Vision Optics
Wi8i G2 PRO is not only equipped with robust vision optics that provides high-quality image under different magnification lenses but also integrates an advanced deep-learning algorithm in defect detection and determining the defect types. When a user’s wafer has a complex circuit design and/or is required to inspect different defect types at different regions, this algorithm is the perfect solution for enhancing the accuracy of defect detection.
With the combination of cutting-edge wafer handling mechanisms and robust wafer vision inspection, our latest Wafer Inspection Solution is guaranteed to solve your production pain points! Additionally, we also seek to better understand our customers’ needs in their production line and boost their production yield and also significantly reduce their long-term costs.
Interested to know more about our Wi8i G2 PRO? Do get in touch with our Sales Expert Ms Kong Poh Mei ([email protected]). To top it off, we also invite you to visit us here at ViTrox Campus 2.0 in Penang, Malaysia for a demonstration of the solution. We look forward to serving you!
About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company to provide the most innovative, advanced, and cost-effective machine vision solutions of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances.
ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Electronics Communication Systems, and Industry 4.0 Manufacturing Intelligence Solutions. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States, as well as sales and support sites worldwide.
For more information about ViTrox’s products and services, please visit www.vitrox.com.
CUPERTINO, Calif., Feb. 01, 2023 (GLOBE NEWSWIRE) -- Xpeedic today released Notus, an electronic design automation (EDA) platform for package/board SI/PI/thermal analysis, at DesignCon 2023 at the Santa Clara Convention Center in Santa Clara, Calif.
Notus, powered by Xpeedic’s electromagnetic and multiphysics solver engine, helps designers to meet the SI, PI, and thermal requirements in an efficient and automated way. It provides a comprehensive simulation flow, including DC IR-drop and AC impedance analysis, decoupling capacitor optimization, signal topology extraction, signal interconnect modeling, and thermal analysis.
In addition to Notus, Xpeedic also announced today upgrades to its Advanced Packaging and High-Speed Digital Solutions.
Metis, the EM simulation tool for 2.5D/3DIC advanced packaging designs, now delivers further improvement on performance. The unique speed-balanced-accuracy multi-mode capability is enhanced to achieve optimal accuracy-speed tradeoff.
Hermes, Xpeedic’s 3D EM simulation tool, further improves its adaptive mesh technology to achieve desired accuracy with faster convergence. It enhances the editing function associated with via, trace, and shape operation for package and PCB. It supports board-level antenna analysis and near-field and far-field view with integrated powerful data post-processing capability.
ChannelExpert, the diagram GUI-based circuit simulation platform, provides a fast, accurate and simple approach to analyze high-speed channels. It supports IBIS/AMI simulations and integrates compliance specs for various SerDes and DDR standards. ChannelExpert provides a comprehensive analysis for high-speed channels including frequency-domain S-parameter, time-domain eye diagram, statistic eye, and channel operating margin (COM) with parameter sweep and optimization. In this release, ChannelExpert integrates Hermes and Notus EM modeling tools for EM-circuit co-simulation and supports the AMI modeling and the latest DDR5 standard.
Other tools within the Xpeedic expert suite including SnpExpert, ViaEpxert, CableExpert and TmlExpert are improved with the usability and additional built-in templates to enable easy and quick evaluations of S-parameter, via, cable, and transmission line, respectively.
Availability and Pricing
Notus and the entire Xpeedic portfolio is shipping now. Pricing is available upon request.
Visit the Xpeedic website for additional information or requests for a demonstration. Email requests should be sent to [email protected].
Xpeedic at DesignCon
Xpeedic will be in DesignCon Booth #633 today and tomorrow, February 1 and February 2, at the Santa Clara Convention Center.
About Xpeedic
Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D-IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both U.S. and China. For more information, please www.xpeedic.com.
Engage with Xpeedic
www.xpeedic.com
Twitter: @xpeedic
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American IC manufacturers have 56% of their wafer capacity installed at fabs located in other regions of the world, according to the new Global Wafer Capacity 2023 report from Knometa Research. As of year-end 2022, American companies have installed capacity of 4.6 million 200mm-equivalent wafers per month, with 2.0 million in domestic fabs and 2.6 million in fabs at foreign sites.
Of the major IC producing countries and regions (Americas, China, Europe, Japan, Korea, and Taiwan), the Americas region is unique in that foreign capacity exceeds that of domestic capacity.
The biggest volumes of offshore capacity for American companies are in Singapore (22% share of total), Taiwan (12%), Japan (10%), Germany (4%), Ireland (3%), and Israel (2%).
With its many large fabs in Singapore, Taiwan, and Japan, Micron owns by far the most offshore capacity, accounting for 65% of the 2.6 million wafers in monthly capacity. GlobalFoundries is next with a 14% share followed by Intel with 9% and Texas Instruments with 5%.
In the past couple years, American companies have announced several major fab construction projects in the U.S. Some of these came about as a result of the CHIPS Act passed by the U.S. government in July 2022 to boost American semiconductor research, development, and manufacturing.
American-owned fabs under construction in the U.S. and scheduled to open during 2024-2025 include:
Micron will also build a large fab site in Clay, New York, but this project is part of the company's long-term capacity expansion plans and construction will not begin until 2024 at the earliest. In January 2023, Analog Devices announced plans to double the capacity of its fab in Beaverton, Oregon.
While the share of domestic IC wafer capacity will increase some in the next several years with the opening of these large new fabs in the U.S., American companies are building or have plans to build additional fabs at overseas sites as well. Moreover, Intel's pending acquisition of Tower Semiconductor, with its fabs in Israel and Japan (as well as the U.S.), will shift the balance in the direction of more foreign capacity. Had Tower been part of Intel at the end of 2022 with the headquarters of the combined operations being in the U.S., the foreign share of American-owned capacity would be one percentage point higher at 57%.
About Global Wafer Capacity 2023
Global Wafer Capacity provides a detailed examination of existing fab capacity along with a five-year forecast to 2027. The report has been published on an annual basis since 2007, initially by IC Insights. In December 2021, IC Insights transferred business associated with Global Wafer Capacity to co-founder Trevor Yancey. Mr. Yancey became an independent contractor in 2014 but continued as the principal analyst and project manager for Global Wafer Capacity. Published in January 2023, Global Wafer Capacity 2023 is sold by Mr. Yancey’s company Knometa Research. For more information, visit https://knometa.com/gwc.
About Knometa Research
Knometa Research is a semiconductor technology and market analysis firm led by former IC Insights executive, Trevor Yancey. Mr. Yancey co-founded IC Insights in 1997 with Bill McClean and Brian Matas. In 2014, Mr. Yancey established Knometa Research to serve as an independent contractor for TechSearch International and for IC Insights until that business closed in December 2022. For more information, visit https://knometa.com.