RoodMicrotec shows strong financial performance for the year 2021, resulting in:

• Total income of EUR 14.5 million with an EBITDA of EUR 2.8 million
• Net profit of EUR 1.4 million
• Cash flow from operating activities of EUR 2.2 million

Deventer, April 21, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today publishes the Company’s Annual Report for the financial year 2021 including the audited financial statements. The 2021 Annual Report is available for download on the corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.

The total income for 2021 amounted to EUR 14.5 million, which was 22% higher than in 2020. The net result after taxes for 2021 was EUR 1.4 million positive, mainly due to a higher delivery of services during the year.

“We were expecting a significant increase in total income and a profit in 2021 and managed to outperform our expectations by focusing on our core business and services”, says Martin Sallenhag, CEO of RoodMicrotec. “We are very pleased with the overall Company development during 2021 and expect that the increase in total income will continue in 2022. The cash situation makes it possible for us to invest in capacity and capability to meet the increasing demand from the market and our customers.”

Throughout 2021, the Test Operations unit showed a sharp increase, which was related to the general up-swing in the market and the excellent position RoodMicrotec has with its customers. The Supply Chain Management unit also showed a strong increase compared to last year. In the second half of 2021, we however saw a decrease in total income compared to the first half of 2021 due to the world-wide shortage of components and raw materials in the semiconductor industry. RoodMicrotec has put actions in place to mitigate the impacts as far as possible. Some of the new projects have not yet been moved into volume production due to the COVID-19 pandemic. In 2021, the Qualification & Failure Analysis unit saw a decrease compared to 2020 due to the delayed start of new projects. Some of these delayed projects started in the second half of 2021, so the total income in this unit increased compared to the first half of 2021.

2021 HIGHLIGHTS / MAIN DEVELOPMENTS
Financials
• Total income: EUR 14.5 million (2020: EUR 11.9 million).
• EBITDA: EUR 2.8 million (2020: EUR 1.3 million).
• Balance sheet total: EUR 15.0 million (2020: EUR 14.3 million).
• Net result: EUR 1.4 million positive (2020: EUR 0.3 million negative).
• Net cash flow from operating activities: EUR 2.0 million (2020: EUR 1.5 million).
Commercial/operational
• RoodMicrotec now offers test services at wafer level for new types of photonic integrated circuits to customers from the semiconductor industry. Jenoptik provides the necessary technology platform with the UFO Probe® Card and thus supports RoodMicrotec in setting up the respective test structure.
• An AIOLOS Wafer Level Test Handler from AEM’s Afore Wafer Level Test Solutions has been installed at the RoodMicrotec facility in Nördlingen. With this handler, RoodMicrotec is now able to offer its customers additional capabilities in the fast-growing markets of sensor testing. This system is also set up for 200 mm wafer frame probing of a wide range of semiconductor devices. RoodMicrotec will not only extend its business areas, but also its testing capabilities.
• During 2021 the booked SCM projects have continued to progress towards production through test program development as well as qualification work. Some of the projects are now close to ramp-up and we start to see the first volumes for these customers. The SCM team is continuing to prepare for future projects with pre-development of certain functions that will be used in future products.
• A consortium of 31 key players for packaging of electronics, optics and photonics, leading equipment suppliers and testing experts from 11 countries are involved in APPLAUSE, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,”. The project fosters the European semiconductor value chain by building new tools, methods and processes for high volume manufacturing where RoodMicrotec will be able to benefit with new solutions in these areas.
• The refinancing of the bond loan issued in 2014 has been completed by the end of the first quarter 2021. A group of long-time investors provides the refinancing in the amount of EUR 2.6 million. Also the management participates so show their confidence in the Company’s business plans and future projects.
• The Court of Appeal has given a verdict in the legal proceedings concerning the dispute about (non) fulfillment of contractual obligations of a debtor. The Court of Appeal ratified the verdicts of the Subdistrict Court of Zwolle and sentenced the debtor to bear the costs of appeal.
• Prime Capital Debt SCS, SICAV-FIS – Robus Recovery Sub-Fund ("Robus") initiated legal proceedings before the Regional Court of Hamburg (Landgericht Hamburg) against RoodMicrotec GmbH regarding the perpetual bond (Genussscheine) of EUR 500k that RoodMicrotec GmbH issued in 2012.

Events after balance sheet date
• In February 2022 Robus and RoodMicrotec GmbH agreed on a full and final settlement of the 2012 perpetual bond. This final settlement has been reached before and confirmed by the Regional Court of Hamburg.
• Robus initiated legal proceedings before the Regional Court of Frankfurt am Main (Landgericht Frankfurt am Main) against RoodMicrotec GmbH regarding the perpetual bond (Genussscheine) of EUR 1,994k that RoodMicrotec GmbH issued in 2010. RoodMicrotec GmbH contests all allegations and claims, and denies that any compensation payments are due on the perpetual bond or that any grounds for extraordinary termination of the perpetual bond exist. Accordingly, RoodMicrotec GmbH will ask the court to reject Robus' claim.

Key figures
(x EUR 1,000) 2021 2020
Results
Total income 14,532 11,874
EBITDA 2,786 1,345
EBIT (operating result) 1,227 -199
EBT 1,038 -369
Net cash flow from operating activities 2,049 1,517
Net result 1,435 -265

Capital, Debt & Liquidity Ratios
Total assets 14,995 14,337
Group equity 5,583 3,844
Net debt 374 1,870
Invested capital (net debt + equity) 5,957 5,714
Gearing ratio (net debt/ capital) 6% 33%
Solvency (group equity / total liabilities) 37% 27%
Debt ratio (net debt / EBITDA) 0.1 1.4
Net working capital 317 -55
Working capital ratio (net working capital / total income) 2.2% -0.5%
ROCE (EBIT / average invested capital) 21.0% -3.3%

Assets
Tangible and intangible fixed assets 8,295 9,177
Investments in (in)tangible fixed assets 681 866
Depreciation of (in)tangible fixed assets 1,559 1,544

Data per share (x EUR 1)
Group equity 0.074 0.051
Operating results 0.016 -0.003
Net cash flow from operating activities 0.027 0.020
Net result 0.019 -0.004
Share price: at year-end 0.201 0.183
Share price: highest 0.267 0.267
Share price: lowest 0.176 0.107

Other information
Number of issued shares at year end (x 1,000) 75,076 74,896
Average number of employees (FTE) 89 86
Total income / Average FTE 163 138

Sales and result
In 2021, RoodMicrotec’s total income came in 22% higher than in 2020 at EUR 14.5 million (2020: EUR 11.9 million), with 94% of its total sales in the European countries.

In the first half of 2021, wafers were ordered and received for one of our SCM customers to manage the supply chain during a planned change of an assembly house. About EUR 0.5 million has been realized for these wafers as total income and approximately the same amount has been accounted for in the cost for raw materials and consumables. The parts will be delivered during 2022, where only part of the selling price will be recognized in the total income but with a positive impact on the net result.

Total income from the automotive sector increased in 2021 by 37% to EUR 6.9 million (2020: EUR 5.0 million) and represents 48% of the total income. The total income in the industrial / medical sector increased in 2021 by 15% to EUR 6.3 million (2020: EUR 5.5 million) and represents 43% of the total income. The HiRel / aerospace sector increased by 2% to EUR 0.9 million (2020: EUR 0.9 million). The total income in this sector mainly consists of failure analysis and qualification work and this is very much depending on the design cycles at our customers. Total income in other sectors declined by 8% to EUR 0.5 million (2020: EUR 0.5 million).

Total income by market sector:
(x EUR 1,000) 2021 2020 change

Automotive 6,886 5,021 37.1%
Industrial/Healthcare 6,270 5,454 15.0%
HiRel / Aerospace 926 908 2.0%
Others 450 491 -8.4%
Total 14,532 11,874 22.4%

In 2021 the total income in the Supply Chain Management unit increased by 27% to EUR 3.4 million (2020: EUR 2.7 million). The total income in the Test Operations unit increased by 46% to EUR 7.9 million (2020: EUR 5.4 million). The total income in the Qualification & Failure Analysis unit came in 15% lower, at EUR 3.2 million (2020: EUR 3.8 million).

Total income results per operational unit:
(x EUR 1,000) 2021 2020 change

Supply Chain Management 3,364 2,659 26.5%
Test Operations 7,938 5,429 46.2%
Qualification & Failure Analysis 3,230 3,786 -14.7%
Total 14,532 11,874 22.4%

Personnel and organization
During 2021, RoodMicrotec continued to optimize the organization to keep track with the changing demands from the customers and markets. Furthermore, we recruit highly experienced personnel to be able to support our plans for the future. The average number of full time employees (FTE) was 89 in 2021. Total income per average full-time employee increased to EUR 163,000 from EUR 138,000 in 2020. Our policy is to strive for growth of sales per FTE.

Until May 2021 we used short-time working in our company in order to be able to react to the international effects of COVID-19. After that date the demand from our customers was high and stable and we therefore decided to discontinue the short-time work. Short-time work had an effect on the average full-time employees of minus 4 FTEs. It was and is absolutely crucial for us not to have to lay off any employees, so we were very happy to be able to use the short-time working option. In some positions, our employees have also decided to voluntarily work more from home in order to reduce the number of colleagues present in our facilities.

We have not experienced any interruptions in the business operations due to the COVID-19 pandemic. The measures taken with masks, distance between the working places, home offices and general care, have enabled us to offer a safe environment for our employees and we have had very few incidents in the company during 2021.

Outlook
RoodMicrotec expects the total income in 2022 to be in the range of EUR 15.0 million to EUR 15.6 million with a positive result before tax. The current situation in the world regarding lead-times for wafers and packaging as well as shipment delays may impact the ability to achieve the expected total income. The war in Ukraine could also have an impact on the business but in the short term we don’t see any significant impacts. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any impact.

Conference call
You are invited to take part in RoodMicrotec’s conference call for shareholders, financial press and analysts on
Thursday, April 21, 2022 at 9:30 CEST.
The management will present the Annual Report 2021 in detail and answer your questions.
The dial-in number for the call is: +31 (0)20 531 5863 (via operator)

Annual General Meeting of Shareholders
The Annual General Meeting of Shareholders of the Company will be held by webcast (virtual meeting) on Thursday, June 9, 2022 at 15:00 CEST. The Board of Management and Supervisory Board have decided to organize the AGM in such manner, that it can only be attended by registered shareholders through a webcast. Shareholders do not have the option to attend the AGM in person, as the Meeting will only be held remotely via a digital platform (virtual meeting).

The convening notice (including registration and voting instructions) and the agenda with explanatory notes, as well as all other meeting documents for the AGM will be available from Thursday April 28, 2022 onwards on our corporate website: www.roodmicrotec.com/en/investor-relations-en/annual-general-meeting.
 
Financial calendar
April 28, 2022 Publication of invitation and agenda for the Annual General Meeting of Shareholders
June 9, 2022 Annual General Meeting of shareholders
July 21, 2022 Publication Interim Report 2022
July 21, 2022 Conference call for shareholders, press and analysts
October 13, 2022 Trading update quarter 3-2022

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses of the Board of Management and on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English only.

• Read more about RoodMicrotec N.V. publishes 2021 annual report with audited financial statements

Nijmegen, the Netherlands, April 12, 2022

Chip Integration Technology Center (CITC) has signed a Memorandum of Understanding (MoU) with the Electronics & Photonics Innovation Centre (EPIC) in Torbay, UK. The move offers an exciting opportunity for both organizations to collaborate and benefit from the synergies that exist between the two centers.

EPIC is located within a rich cluster of microelectronics and photonics packaging specialists. The center offers businesses access to labs, offices, >€3M of prototyping capability and a classified cleanroom. Dutch-owned EFFECT Photonics have chosen EPIC as their R&D facility and have benefited from extensive local funding to support this growth. Other businesses located within EPIC include Spanish MEMS innovators Nanusens and photonics packaging specialists Bay Photonics.

CITC is a non-profit innovation center specializing in heterogeneous integration and advanced chip packaging technology for semiconductor and photonic applications. It is a place where companies, research and educational institutes work together on bridging the gap between academics and industry and creating a new generation of packages providing smart, safe and rugged housing for chips.

The MoU will see both parties sharing information with their respective businesses to showcase the technical capability and services on offer at both centers. EPIC and CITC will also be exploring opportunities to add each other’s centers to future funding bids with a view of generating additional revenue for both projects.

Both centers have close links to relevant universities and higher education partners therefore encouraging collaboration between academia will also be explored.

EPIC Centre Director, Wayne Loschi, is excited about the partnership: “There are so many clear opportunities for collaboration which will benefit our respective centers and our businesses. We’d love to see our companies working closer with CITC to improve innovation and equally we’d welcome more Dutch companies to join EFFECT Photonics within EPIC”.

CITC Business Development Manager, Marco Koelink, is also looking forward to starting the relationship: “EPIC offers a rich ecosystem in microelectronic and photonic R&D and assembly activities. Collaboration, especially in photonic packaging is crucial to develop high-volume and low-cost solutions for meaningful application areas such as communications, medical and automotive. CITC and EPIC jointly strengthen their value proposition in providing access to innovation, infrastructure and education”.

• Read more about CITC formalizes collaboration with EPIC UK

• Total income for the first quarter of 2022 was EUR 3.6 million (first quarter 2021: EUR 3.8 million)
• Cash position further improved in the first quarter of 2022
• Order book value increased with 16% compared to March 31, 2021

Deventer, April 12, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the first quarter of 2022. The total income for the quarter was EUR 3.6 million, which is 5% lower than the total income in the first quarter of 2021. In the first quarter of 2021, the total income included work in progress of EUR 0.5 million for SCM project preparations. With this adjustment, the total income for the first quarter of 2022 rose by 9% compared to the first quarter of 2021.
“The cash position at the end of the first quarter of 2022 has further improved compared to the end of 2021 thanks to the increased total income and a continued tight control of operational expenses”, says Martin Sallenhag, CEO of RoodMicrotec. “The increase of the total income in the first quarter, adjusted for work in progress movements, compared to 2021 also shows that the company is focusing on the right markets, customers and services.”
With the forecasted increase of total income in 2022 over last year, it is encouraging to see that the order book value continues to increase. The order book contains orders for both long term contracts and engagements as well as short term orders. The long term contracts and engagements are mainly in the SCM and Test Operations units and the short term orders are mainly in the Failure Analysis & Qualification unit. RoodMicrotec is maintaining a very tight control of all expenses, and only absolutely necessary costs for delivering our high-quality services to the customers are approved. Additional capital investments are also reviewed in detail to make sure they are done to either increase capacity or to add new capabilities to the service portfolio.

Outlook
RoodMicrotec expects the total income in 2022 to be in the range of EUR 15.0 million to EUR 15.6 million with a positive result before tax. The current situation in the world regarding lead-times for wafers and packaging as well as shipment delays may impact the ability to achieve the expected total income. The war in Ukraine could also have an impact on the business but in the short term we don’t see any significant impacts. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any impact.

Audit
The financial data in this press release have not been audited.
 
About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.
This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.

• Read more about Trading Update: RoodMicrotec announces total income for the first quarter of 2022

Deventer, April 8, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today announces that the trading update for the first quarter of 2022 will be published on April 12, 2022.

Financial calendar
April 12, 2022 Trading update quarter 1-2022
April 21, 2022 Publication Annual Report 2021
April 21, 2022 Conference call for press and analysts
April 28, 2022 Publication of invitation and agenda for the Annual General Meeting of Shareholders
June 9, 2022 Annual General Meeting of shareholders
July 21, 2022 Publication Interim Report 2022
July 21, 2022 Conference call for press and analysts
October 13, 2022 Trading update quarter 3-2022

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is only published in English. This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.

• Read more about Trading update for first quarter of 2022 will be published on April 12, 2022

Brewer Science Earns Intel’s 2022 EPIC Distinguished Supplier Award
Brewer Science is one of only 26 Distinguished Award recipients across Intel’s global supply chain

Rolla, MO. April 7, 2022 – Brewer Science, Inc., is proud to announce that it has earned Intel’s EPIC Distinguished Supplier Award. Through its dedication to excellence, partnership, inclusion, and continuous quality improvement, Brewer Science has achieved a level of performance that consistently exceeds Intel’s expectations.

 
“As one of only 26 Distinguished Supplier Award recipients across the Intel global supply chain, Brewer Science has been crucial to Intel’s success while offering agility and flexibility during the ongoing volatile supply chain environment,” said Keyvan Esfarjani, EVP and Chief Global Operations Officer at Intel. “They have provided exceptional collaboration and commitment toward safety, quality, diversity & inclusion, and exceeded our expectations in support of Intel’s supply chain operational excellence. Earning this award speaks to their dedication to Intel values and their partnership.”
 

The Intel EPIC Distinguished Supplier Award recognizes a consistent level of strong performance across all performance criteria. Of the thousands of Intel suppliers around the world, only a few hundred qualify to participate in the EPIC Supplier Program. The EPIC Distinguished Award is the second-highest honor a supplier can achieve. In 2022, only 26 suppliers in the Intel supply chain network earned this award.

To qualify for an Intel EPIC Distinguished Supplier Award, suppliers must exceed expectations, meet aggressive performance goals, and score 80 percent or higher in performance assessments throughout the year. Suppliers must also meet 80 percent or more of their improvement plan deliverables and demonstrate formidable quality and business systems.

Get more information about the Intel EPIC Supplier Awards

Find the latest at the Intel Newsroom

Visit the Intel EPIC Supplier Awards page

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

PRESS RELEASE CONTACT

Tracy Jenkins

Tel: (US) +1.573.364.0300, ext. 1427

Email: [email protected]

www.brewerscience.com

• Read more about Brewer Science Earns Intel’s 2022 EPIC Distinguished Supplier Award

At the end of 2021, 57% of the industry’s total monthly wafer capacity was owned by the top five companies. One year earlier the share was 56% and back in 2018 it was 53%. A decade ago, the share held by the top five was about 40%. The industry continues to get more top heavy regarding the composition of companies fabricating ICs. This analysis comes from Knometa’s recently released Global Wafer Capacity 2022 report.

Combined, the top five companies had the capacity to process 12.2 million wafers per month at the end of the year, or 10% more than the year before. That growth rate was one percentage point higher than for the industry’s total capacity.

View Table of Data

Samsung — In 2021, the company widened its lead as the industry’s biggest source of fab capacity. At the end of the year, Samsung held 19% of total global IC wafer capacity and 44% more capacity than the second largest company TSMC. Samsung boosted its capital spending 45% in 2020 and that translated into a sizable increase in available capacity in 2021. Most of the money was spent on the construction of multiple 300mm fab lines at its site in Pyeongtaek.

Samsung said at its 2021 Investors Forum that, when compared to its 2017 capacity level, the company’s fab expansion plans will result in a tripling of capacity by 2026. Those plans will include a new $17 billion fab to be built in Taylor, Texas, the construction of which is due to start in 2022. The Taylor fab will support the company’s strong push to expand foundry services for leading edge processes.

TSMC — The company’s capacity growth in 2021 was relatively mild, but strong demand for its services spurred a significant increase in capital spending during the year that will result in a higher capacity growth rate in 2022. TSMC plans to remain aggressive with its spending in 2022 and 2023 as well.

Most of TSMC’s recent fab construction activity has been centered at its Fab 18 site in Tainan. The company recently started adding capacity again at its Fab 12 site in Hsinchu. The last fab phase to open at the site was Phase 7 in 2017. Fab 12 Phase 8 is under construction and scheduled to begin operations in 2022.

TSMC has also experienced strong demand for mature technologies, especially for 28nm CMOS. To meet this demand, the company is expanding its Fab 16 facility in China to double the capacity there by mid-2023.

Fabs at three entirely new or “greenfield” sites around the globe are or soon will be under construction. The first phase of a large fab site (Fab 21) in Phoenix, Arizona, is already under construction and will begin processing 300mm wafers in 2024. The $12 billion Fab 21 Phase 1 plant will be used to make chips with 5nm technology. In Kumamoto, Japan, TSMC partnered with Sony to build a $7 billion 300mm fab that will also open in 2024. In November 2021, the company announced the selection of Kaohsiung as the site for another fab complex in Taiwan.

Micron — The company’s capital spending the past couple years has been focused more on upgrading existing capacity for more advanced processing capabilities than on increasing capacity. Nevertheless, the company made some additional capacity available in 2021 in the form of phase 4 at Fab 15, phase 2 at Fab 16, and an expansion of its legacy products fab in Virginia.

During Micron’s fiscal Q1 2022 earnings call it was reported that for both DRAM and NAND the company plans to achieve bit supply growth with node transitions through the middle of the decade. In other words, Micron’s capital spending is focused on new technologies and equipment that will enable it to increase chip production volumes via die shrinks for DRAM and continued 3D scaling for 3D NAND. As a result, the company will not bring online any major fab expansions in the next couple years. The next big fab project for Micron, announced in October 2021, is the construction of a new 300mm fab at its site in Hiroshima. This fab will open for production in 2024.

SK Hynix — After boosting its capital spending substantially in 2018 for the construction of new fabs in Korea and China, SK Hynix scaled back expenditures in 2019 and 2020. Fab M15 in Cheongju and Fab C2F in Wuxi both began operations in 2019 but ramping of capacity and production at the fabs has been gradual. The company lifted its capex significantly in 2021 and that should translate to a larger increase in capacity for 2022.

Construction of the company’s newest fab, M16 in Icheon was finished in early 2021 and the company began operations in the fourth quarter of the year.

In December 2021, SK Hynix took ownership of Intel’s Fab 68 facility in Dalian, China. However, the fab is still used by Intel to fabricate 3D NAND chips, so its capacity at the end of 2021 was not included as part of SK Hynix. The acquisition of Intel’s NAND and SSD businesses by SK Hynix is a multiple-stage transaction over several years and stipulates that Intel can use the fab for wafer fabrication until March 2025, when SK Hynix will complete the purchase.

Kioxia/Western Digital — Capacity jointly owned by Kioxia and Western Digital increased at the lowest rate among the top five companies in 2021. The partners are increasing 3D NAND die production volumes more by 3D scaling advancements than by increasing capacity. Western Digital’s President of Technology & Strategy, Srinivasan Sivaram reported in December 2021 that the company’s approach to production capacity is currently about “95% conversion, 5% new wafers,” meaning that nearly all its product supply needs are being met by converting to new technologies. For 3D NAND, that means increasing NAND layer counts on the chips to achieve a greater amount of memory storage per unit area. Mr. Sivaram has said Western Digital has a clear roadmap to more than 300 layers in the next four to five years.

Kioxia and Western Digital have a new fab at their site in Yokkaichi scheduled to begin operations in early 2023. Like other fabs at the site, the Y7 fab will be built in two phases. In April 2022, the partners started building a second fab at their site in Kitakami. The existing K1 fab started production in 2020 and the new K2 fab is expected to start up in 2024.

About Global Wafer Capacity 2022
Global Wafer Capacity provides a detailed examination of existing fab capacity along with a five-year forecast. The report has been published on an annual basis since 2007, initially by IC Insights. In December 2021, IC Insights transferred business associated with Global Wafer Capacity to co-founder Trevor Yancey. Mr. Yancey became an independent contractor in 2014 but continued as the principal analyst and project manager for Global Wafer Capacity. Published in February 2022, Global Wafer Capacity 2022 is sold by Mr. Yancey’s company Knometa Research. For more information, visit https://knometa.com/gwc.

About Knometa Research
Knometa Research is a semiconductor technology and market analysis firm led by former IC Insights executive, Trevor Yancey. Mr. Yancey co-founded IC Insights in 1997 with Bill McClean and Brian Matas. In 2014, Mr. Yancey established Knometa Research to serve as an independent contractor for IC Insights and TechSearch International. For more information, visit https://knometa.com.

• Read more about Top Five Leaders Continue Expanding Share of Global IC Fab Capacity

ESPOO, Finland, 5th of April 2022 – Picosun Atomic Layer Deposition (ALD) has played a vital role in enhancing electro-optical characteristics of micro-LEDs in research done by National Yang Ming Chiao Tung University (NYCU) in Taiwan.

The usage of dielectric films as a passivation material is a popular technique to suppress dangling bonds as well as to improve output power and external quantum efficiency in LEDs. The study conducted at NYCU compared III-Nitride micro-LEDs of different sizes with and without ALD Al2O3 passivation. The results showed external quantum efficiency enhancement of 70% for 5 µm × 5 µm micro-LEDs and 60% for 10 µm ×10 µm micro-LEDs when using ALD Al2O3 passivation.

In addition, to achieve full color display, an inkjet printing to pattern quantum dots automatically has been developed at NYCU. The solution can considerably improve the precision of color pixels and satisfy the high-resolution requirements. Picosun ALD passivation technology was successfully used for preventing the quantum dots from photo-oxidation and degradation. After a 500 hours environmental reliability test, the color gamut remained at excellent level.*

“Micro-LED technology has been the disruptive technology in the next generation displays, and more application areas are emerging its benefits being long lifetime, high power efficiency and high brightness. With quantum dot-based technology micro-LEDs can be used in applications such as virtual and mixed reality as they allow the use of single-color, blue, micro-LED chips resulting in lower manufacturing costs. Our study has proved that ALD passivation plays a key role in upcoming nanometer-scale devices”, says Hao-Chung Kuo, professor at NYCU.

“Picosun’s ALD technology has been production-proven at many prominent LED manufacturers. ALD films’ superior conformality and uniformity, and their ability to ensure reliable, pinhole-free encapsulation even at extremely low film thicknesses is a key benefit. Furthermore, the ALD process can be run at moderate temperatures”, explains Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

*NTSC and Rec. 2020 standards: Color gamut 99% and 90% at 50% humidity and 50℃ temperature
NTSC: Analog television format encoding system developed by National Television Standards Committee
Rec. 2020: International Telecommunication Union Recommended standard defining various aspects of ultra-high-definition television with standard dynamic range and wide color gamut.

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

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Heidelberg, Germany – Heidelberg Instruments has received a significant order from a leading semiconductor wafer-level packaging production company in Asia for its MLA 300 Maskless Aligner. With this order, Heidelberg Instruments has reached another important milestone towards the company’s goal of becoming a leading supplier of maskless lithography tools to the advanced wafer-level packaging industry.

Optimized for industrial manufacturing, the MLA 300 Maskless Aligner features distinct benefits for the wafer-level technology: The flexibility of maskless lithography allows rapid design customizations, and even unique designs on each substrate. This is of particular use for chip packaging where mounted die shift and each panel is unique. Meeting these demands, the MLA 300 can be seamlessly integrated into wafer-level packaging production lines, fully automating wafer production with a resolution down to 2 µm lines and spaces. The MLA 300 reduces production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. Modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning.

Since its market introduction at the end of 2019, the MLA 300 has received a terrific reception and has become a popular tool for the microfabrication industry. The MLA 300 comprises a customizable wafer handling system, customizable vacuum chucks, and a large autofocus compensation help account for challenges like warped substrates, and software designed for production environments.

“This latest order, by a leading advanced wafer packaging production group, is a big step forward for us and maskless lithography. With the MLA 300, Heidelberg Instruments has introduced the most innovative maskless lithography system for mid-volume wafer production and high-volume prototyping. So far, several fabrication groups globally have purchased and installed the MLA 300 tool, replacing their traditional lithography production platforms, such as mask aligners and steppers,” says Alexander Forozan, Head of Global Sales and Business Development, Heidelberg Instruments group of companies.

MLA300 is a versatile tool for application areas such as advanced semiconductor packaging, IR sensors, MEMS, electronic probes, and high precision electronic components.

Contact:
Veronika Loose
Marketing and Communications
[email protected]
+49 931 90879288

Further information:
https://heidelberg-instruments.com/

About Heidelberg Instruments Mikrotechnik GmbH
With over 35 years of experience and more than 1,200 installed systems, Heidelberg Instruments is one of the leading international players in developing and producing high-precision photolithography systems and nanofabrication tools. Heidelberg Instruments systems are installed in industrial and scientific facilities around the world. They are used for efficient direct writing and photomask fabrication for various industries, including semiconductors, quantum computing, photonics, 2D materials, IoT, and many related fields.

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Brewer Science Expands Analytical and Application Testing Services
Chemical, Polymer, Trace Impurity, On-Wafer & Thin Film Characterization among many testing services company offers
 

Rolla, Mo. March 30, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, has recently expanded its analytical and application testing services to include stand-alone chemical, polymer, trace impurity, on-wafer & thin film characterization testing services to customers – services the company has perfected through its processes for nearly four decades.

 
Material purity requires metrology and statistical analysis
Material purity within the industry is being pushed to unprecedented levels for many reasons, including extending the life of the products and ensuring the functionality of products within a wide range of applications. Brewer Science invests in metrology to better create customized solutions and better understand our supply chain. Our standards of materials testing and tracking are unmatched in the industry.

Concerns over additive tolerances and mixing pure materials with suppliers’ products that may not be as pure requires careful attention to statistical analysis, to measure what level of purity a material can handle before it loses its characteristics. An impurity can be required for certain reactions, thus understanding the material, and balancing that knowledge with the models and research of polymer chemists, is critical. We can not only measure the purity of materials but report on the impurities with a parts-per-trillion detection capability.

Four decades of refining testing processes led us to become a world-class manufacturer
Over 40 years of experience in chemical analysis and semiconductor application testing has allowed us to apply this expertise to not becoming a world-class manufacturer, but also apply the knowledge of defect detection to supply chain partners to elevate material purity standards.

Brewer Science offers a complete line of analytical and application testing services, specializing in semiconductor and other high-technology products, through materials characterization and contaminant reduction that we now offer to customers worldwide.

Since this is just a brief overview of our capabilities, not an exhaustive list, please contact a testing services expert to find out which services we offer will provide the most benefit to you and your company.

Analytical testing services offered:

• Small Molecule Analysis
  • purity determination
  • impurity identification
  • structure
  • quantification
  • general profile
• Polymer Analysis
  • accurate molecular weight and polydispersity
  • polymer conformation
  • oligomer investigation
• Thermal Analysis
  • thermal properties
  • mechanical properties
• Trace Metal Analysis
• Particle Analysis

Wafer and Thin Film Testing services offered:

• 300-mm Si Wafer Testing
• SEM – Cross-Section and Focused Ion Beam (FIB)

To learn more about how our state-of-the-art instruments, combined with our analysts' knowledge, experience, and skills, enable our advanced material characterization capabilities, schedule a call with a testing service expert.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

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Company Contact:

Tracy Jenkins
Tel: (US) +1.573.364.0300, ext. 1427
Email: [email protected]

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Rochester, NY—Linton Crystal Technologies (LCT) has been awarded a U.S. Letters Patent for its Seed Lifting and Rotating System for Use in Crystal Growth. Patent 11,255,024 is the first of four applications Linton has made to the USPTO for innovations related to the seed lifting and rotating mechanism, and the company’s first approved patent.

“This patent is the first of four applications that address the increasingly critical need to counteract centrifugal forces created by the rotating mass of the seed lift as the cable spool translates along its axis of travel. As growers become larger, the need for this technology becomes even more essential” explains John Reese, mechanical engineering manager with Linton Crystal Technologies.

Typically, silicon crystal growing furnaces use a cable winch system to lift and rotate a growing crystal. Most traditional seed lift mechanisms have a grooved spool that wraps and gathers the seed cable, lifting the crystal. The spool must translate side to side to keep the gathering cable centered to a pulley, which in turn is centered on the growth chambers. Most often, the spool moves this way via an attached thread that engages to a nut. As the bolt turns into the nut in its fixed position, the head of the bolt becomes closer to the nut. In the case of a seed lift spool, the length of the screw depends on the length of translation that is necessary to wind and/or unwind the cable enough to grow the crystal to a desired length. Thus, the length of the screw increases the overall length of the cable winch system. This adds size and weight to the overall system.

As the spools shifts/translates from one end of its travel to the other, the shifting mass of the spool dramatically and negatively influences the dynamic balance of the rotating seed lift assembly, thus creating centrifugal forces that have a negative impact on the stability of the overall growth process.

Linton’s patented new “guided spool” design utilizes a floating roller that engages with the grooved spool, therefore eliminating the need for the extra threaded feature and fixed position nut. This reduces the overall weight of the mechanism, making for a more stable rotating mass. Current units that don’t have this feature require additional fixed and active weight to balance them.

About Linton
Linton is the world leader in the design, development and manufacture of equipment for producing monocrystalline ingots for the solar and semiconductor industries. The company specializes in silicon and produces equipment for materials such as germanium and gallium arsenide. They also provide technical support, process engineering support and replacement parts to help clients get businesses off the ground, improve productivity and continue to innovate. Linton has been the exclusive owner of Kayex technology for eight years.

For more information, visit www.lintoncrystal.com.

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