Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Russ Sanchez has joined the company’s senior leadership team as Vice President of Quality and Managing Director of YES’s new Technology Center in Chandler, Arizona.

Mr. Sanchez, who is based in Chandler, is a seasoned operations and business leader with over two decades of experience driving excellence in the manufacturing operations of semiconductors, microelectronics, printed electronics, antenna technology, and hard drives.

“Russ has an impressive track record of developing technology centers and manufacturing operations to support the growth of high-technology sector customers,” said Rezwan Lateef, President of YES. “His ability to implement quality systems and to partner closely with our customers to realize their next-generation devices will be invaluable as we move into the next phase of our company’s growth.”

Mr. Sanchez came to YES from NthDegree Worldwide Technologies, where he was Vice President of Operations. Before that, he held a variety of roles within Manufacturing and Quality at technology companies including Airgain, NXP Semiconductors, ST Microelectronics/Western Digital Corporation, Hynix Semiconductor of America, and Philips Semiconductors. He holds a Bachelor of Science degree in Business Administration from the University of Phoenix.

About YES
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.

• Read more about Russ Sanchez Joins YES as VP of Quality and Managing Director of YES Technology Center

Deventer, July 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, will publish the Company’s first half-year report for 2022 before stock opening on July 21, 2022.

CEO Martin Sallenhag and CFO Arvid Ladega will comment on the report and will respond to questions during the conference call for media, analysts and shareholders on July 21, 2022 at 9:30 CEST.

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About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English only.

• Read more about RoodMicrotec N.V.: Invitation to the presentation of the first half-year’s results for 2022

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility. MRSI-H-HPLD+ will be available in the 3rd quarter of 2022.

“MRSI’s die bonders have been widely used over many years by high power laser manufacturers. This new HPLD+ version takes the performance to the next level. This new product continues with our proven track record of providing a combination of ultra-precision, high-speed, and high-flexibility. This is critical for our customers’ high-mix high-volume flexible manufacturing,” said Dr. Yi Qian, Mycronic Group’s Vice President and General Manager for MRSI Systems.

For additional information, please contact:
Dr. Irving Wang
Director of Product Marketing, MRSI Systems, Mycronic Group
Tel: +1 (978) 667 9449, e-mail: [email protected]
Time Zone: ET – Eastern Time

Jennifer Russo
Marketing Manager, MRSI Systems, Mycronic Group
Tel: +1 (978) 495 9731, e-mail: [email protected]
Time Zone: ET – Eastern Time

About MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com

• Read more about MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

Sikama International is excited to exhibit at SEMICON West 2022 this July, presenting the innovative Electron Attachment fluxless reflow technology, our upcoming 40th anniversary, and an extensive product line for a broad range of applications providing customers with the highest efficiency, smallest footprint, and most versatility in the industry. Our patented Electron Attachment technology, developed in partnership with AirProducts™, provides unmatched performance offering truly safe and residue-free fluxless reflow. The system is operated with N2 cover gas and an H2/N2 blend with less than 5% hydrogen, ensuring safe operation. The EA UP1200 utilizes an electrically isolated ceramic roller transport mechanism to move the work item from zone-to-zone through the oven. The work item is deoxidized in the EA zones prior to reflow which eliminates the need for flux coating or washing. This technology has shown to be superior to formic acid processes time and time again. In addition, this revolutionary breakthrough offers the safest and lowest cost per wafer yet for the semiconductor packaging industry.

Sikama is looking forward to discussing their full product line at SEMICON West this year. Visit our booth #1447 to learn more and enter to win an iPad Air!

• Read more about Sikama International at SEMICON West 2022 – “Reliable, Repeatable, Responsible Reflow”

Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that it has promoted Dan O’Connell to Vice President of Strategic Accounts.

Mr. O’Connell joined YES in November of 2021 as Senior Director of Key Account Management. In his newly expanded role, he will work closely with the company’s Sales, Marketing and Technology teams to nurture strategic customer relationships and ensure YES’s alignment with current and future customer technology requirements.

“Dan’s extensive strategic account experience in the semiconductor industry has contributed to our rapid growth,” said Rezwan Lateef, President of YES. “His proven ability to develop strong industry relationships aimed at enabling technology roadmaps, coupled with his intimate knowledge of Advanced Packaging processes, make Dan a valued addition to our senior leadership team.”

Prior to joining YES, Mr. O’Connell held senior key account management positions of increasing responsibility at ASM Pacific Technology Ltd., Tokyo Electron (TEL), LAM/Novellus, and Ebara. He holds a bachelor’s degree in Chemical Engineering from Worcester Polytechnic Institute.

About YES
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.

• Read more about YES Names Dan O’Connell as Vice President of Strategic Accounts

Primarius Technologies will unveil its flexible and scalable design environment for custom memory and analog/mixed-signal IC design and new circuit simulation and design enablement solutions during the Design Automation Conference (DAC) July 11-13 at Moscone Center in San Francisco.

Demonstrations will feature Primarius’ NanoDesigner™, a full custom design platform; SDEP™, an innovative spec-driven modeling automation platform; PCellLab™, a PDK parameterized cell library development platform; NanoCell™, a standard cell library characterization solution; and 9812AC, the first commercial AC dynamic noise measurement system.

Other demonstrations will highlight products such as an all-in-one semiconductor parameter analyzer FS-Pro™, and a portfolio of solutions for SPICE model, process design kit (PDK) and standard cell library verification including ME-Pro™, PQLab™ and LibWiz™.

New Additions to Primarius Product Portfolio
Primarius is committed to delivering innovative data-driven design technology co-optimization (DTCO) EDA solutions powered by leading-edge SPICE/FastSPICE simulation technologies, shortening time to market and improving yield, power, performance and area of circuit designs at advanced process nodes.

Its DTCO solutions such as SDEP, PCellLab, NanoCell and FS-Pro reduce the iteration cycle from process technology development to IC design for models, PDKs and standard cell development products available from Primarius.

NanoDesigner provides an extendable and flexible design environment with schematic entry, layout editing and in-design physical verification that supports full-custom memory and analog/mixed-signal designs. It integrates with NanoSpice, Primarius’ circuit simulator series that offer the full spectrum of circuit simulation capabilities including high-performance parallel SPICE to an adaptive dual-simulation engine FastSPICE. Both offer more accurate and faster results than traditional SPICE and FastSPICE. NanoDesigner’s expanded capabilities cover mixed-signal verification, aging, EM/IR, random telegraph noise (RTN) and high Sigma yield analysis.
PCellLab, a user-friendly automated standard Pcell library development tool, pairs with PQLab, a PDK-quality verification platform, to form a complete solution for PCell generation and verification.

Primarius’ new NanoCell, a solution used for standard cell library characterization, and LibWiz, a user-friendly GUI to qualify libraries, combine for a standard cell library characterization and qualification solution.

And finally, 9812AC is the first commercial low-frequency dynamic noise measurement system. It has superior capabilities and versatility for measuring low-frequency noise characteristics of semiconductor devices over a wide range of bias voltage and excitation frequencies.

More Products in the Primarius Portfolio
SDEP, an innovative model development platform designed to tackle advanced SPICE modeling challenges, provides a system to retain and receive device modeling expertise and build automated flows for different process platforms and applications with intelligent target-oriented algorithms. It has a built-in parallel SPICE simulation engine for fast performance and includes rich data analysis and validation utilities, powerful parameter control and optimization functions and flow automation features.

FS-Pro is an all-in-one parametric analyzer used with semiconductor device DC/AC, reliability and statistical measurement solutions.

At 2022 Design Automation Conference
Primarius Technologies will exhibit at DAC Booth #1419 (First floor) Monday, July 11, through Wednesday, July 13, from 10 a.m. until 6 p.m. at the Moscone Center in San Francisco.

To arrange a meeting or demonstration of the Primarius Technologies product portfolio, send email to: [email protected].

About Primarius
Primarius Technologies (688206.SH) is a global electronic design automation (EDA) company. It delivers the semiconductor industry’s leading design enablement technologies for advanced SPICE modeling, PDK generation and standard cell library characterizations, and a complete design technology co-optimization (DTCO)-enabled custom design flow for complex memory, analog and mixed-signal designs. Powered by leading-edge SPICE/FastSPICE simulation technologies, Primarius is committed to delivering innovative DTCO solutions. Its mission is to shorten time to market and improve yield, power, performance and area of circuit designs at advanced process nodes. Primarius’ unique data-driven EDA solutions are supported by a full range of semiconductor parametric testing systems and the industry’s golden low-frequency noise testing systems. Visit Primarius Technologies for more information.

• Read more about Primarius Unveils Custom Design Environment, Circuit Simulation and Design Enablement Solutions at DAC

Deventer, June 21, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and EnSilica plc, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), today announce that they have successfully brought a mixed signal automotive ASIC to commercial production following the official launch of a new flagship vehicle by a premium automotive company. The ASIC provides key differentiating features in the chassis control of the vehicle.

As announced in 2018, RoodMicrotec was selected by EnSilica to support it in the qualification and testing of this mixed signal automotive ASIC. RoodMicrotec will undertake final testing and shipment of the ASICs for EnSilica.

EnSilica is pleased to confirm that the main production run has now commenced with the official launch of the vehicle. The production schedule for more than 2.5 million ASICs over the next 12 months has been received. The ASIC has an anticipated seven-year production life and depending on the model, there are up to 24 ASICs per vehicle.

“It has been exciting to support EnSilica in bringing this project to production over the last few years. We are now looking forward to supporting production of this device in our Nördlingen facility”, says Martin Sallenhag, CEO of RoodMicrotec. “It again shows the demand for our unique combined capabilities, in depth experience and excellent track record in bringing automotive products to the market for our valued customers.”

“We are delighted to be entering the full production volume of this exciting project, having successfully collaborated with RoodMicrotec over a number of years. Our joint effort across this highly technical automotive project has now resulted in successful launch of the vehicle”, says Ian Lankshear, CEO of EnSilica.

About EnSilica
EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar and communications systems. EnSilica has a track record in delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has a design centres across the UK and in Bangalore, India and Porto Alegre, Brazil.
Further information on EnSilica at www.ensilica.com

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
Further information on RoodMicrotec at www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

• Read more about Premium Automotive Vehicle Launched with EnSilica’s Key Mixed Signal ASIC

Brewer Science presents EUV lithography innovation at largest tech conference in Asia
Roles of underlayers in EUV lithography is the keynote speech at CSTIC 2022
 

Rolla, Mo. June 20, 2022 - Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present the keynote address, Roles of Underlayers in Novel Patterning for EUV Lithography, at the China Semiconductor Technology International Conference (CSTIC), one of the largest and the most comprehensive annual semiconductor technology conferences in Asia.

Semiconductor Innovation Requires Materials for Extreme Ultraviolet Lithography (EUV)
EUV lithography is used to pattern the smallest features in advanced semiconductor devices. The demand for smaller devices with more capabilities requires industry innovation in EUV processes and materials. Additionally, EUV plays a critical role in the evolution of technology and enables the continuous advancement of the semiconductor roadmap, as it provides the capabilities of higher processing power, while using less energy, and providing higher performance. However, one of the biggest challenges facing EUV lithography is material requirements, recognizing the critical role underlayers play in the patterning of EUV lithography. Unlike bottom anti-reflective coatings (BARC), thickness is not limited by wavelength, but rather related to resist and process requirements.

 
Roles of Underlayers in Novel Patterning for EUV Lithography
Dr. Douglas Guerrero, Senior Technologist at Brewer Science, has published over 60 papers in the areas of conducting polymers, BARCs, DSA, and underlayers for EUV lithography, and is an inventor on over 20 US patents. In his keynote address, Roles of Underlayers in Novel Patterning for EUV Lithography, during the Symposium II: Lithography and Patterning at CSTIC, he will provide information on the device and materials roadmap, as well as answer questions to the most critical questions in the industry:

• How does overall EUV patterning require thinner layers?
• What challenges do chemically amplified resists (CARs) and underlayers face?
• What role will underlayer play in future patterning?
• What are the options for patterning without a CAR?

Additionally, Zhimin Zhu, Senior Scientist at Brewer Science, will be co-chairing the Session II panel, Lithography Materials, within the Symposium II: Lithography and Patterning.

CSTIC will have nine symposiums covering all aspects of semiconductor technology with focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. CSTIC is organized by SEMI and IEEE-EDS, co-organized by IMECAS. The conference will be held June 14th, 2022 through July 12, 2022 accessed online through the SEMI Cloud.

If you are unable to attend, but wish to learn more about Brewer Science’s innovative EUV lithography materials, you can visit our website to view datasheets and schedule a call with an EUV expert.

 
About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

• Read more about Brewer Science presents EUV lithography innovation at largest tech conference in Asia

Zurich, Switzerland / Heidelberg, Germany – Heidelberg Instruments Nano AG in Zurich, a subsidiary office of Heidelberg Instruments Mikrotechnik GmbH celebrated the 10-year anniversary of the commercialization of the NanoFrazor system series. The NanoFrazor is based on the Thermal Scanning Probe (t-SPL) technology and can be used for nanopatterning of quantum devices on 1D/2D materials, grayscale photonics devices, nanofluidic structures or biomimetic substrates for cell growth.

Originally the Thermal Scanning Probe technology was developed at IBM, where a group of researchers showed that the sharp tips of atomic force microscopes can be heated and used as a tool to “drill” nanoscale holes and later to write arbitrary nanostructures by using special, evaporating materials.

After exploring the technology at IBM, Felix Holzner and Philip Paul incorporated SwissLitho AG as a spin-off from ETH Zurich (Heidelberg Instruments Nano AG since 2021) as CEO and CTO with the idea of selling nanolithography equipment for t-SPL. The technical term “Thermal Scanning Probe Lithography” was then replaced by the product name “NanoFrazor”.

After starting operations of then SwissLitho in early 2013, the first commercial NanoFrazor machine named “Titlis”, a NanoFrazor Explore, was installed in 2014 at McGill University in Canada. “Titlis” is still running and just recently received an upgrade with the integration of the laser writer module jointly developed in Heidelberg and Zurich. Today, more than 50 NanoFrazor systems have been installed at renowned facilities all over the world, with new customers lined up for future systems.

“The NanoFrazor team in Zurich works on various promising developments on the instrument as well as on the materials to continuously expand the applications range of the technology. There are still manifold open opportunities for the NanoFrazor, as it can still be considered novel, even 10 years after the start of its commercialization. Everyone at Heidelberg Instruments is excited to see how the NanoFrazor will have developed in another 10 years from now”, Konrad Roessler, CEO of Heidelberg Instruments Mikrotechnik says.

The anniversary was celebrated in the newly opened office of Heidelberg Instruments Nano in Zurich together with family, friends, and numerous partners, who supported the successful journey of the NanoFrazor.

About Heidelberg Instruments Mikrotechnik GmbH
With over 35 years of experience and more than 1,200 installed systems, Heidelberg Instruments is one of the leading international players in developing and producing high-precision photolithography systems and nanofabrication tools. Heidelberg Instruments systems are installed in industrial and scientific facilities around the world. They are used for efficient direct writing and photomask fabrication for various industries, including semiconductors, quantum computing, photonics, 2D materials, IoT, and many related fields.

• Read more about Heidelberg Instruments celebrates 10 years of NanoFrazor