Illinois Institute of Technology (Illinois Tech) alumnus Rick Carlson (MATH ’70), vice president of sales for Verific Design Automation, a leading provider of SystemVerilog, Verilog, VHDL, and UPF Parser Platforms, has been elected to the College of Computing Board of Advisors.

Carlson graduated from Chicago’s comprehensive tech-focused university with a Bachelor of Science in Mathematics and was also a member of the Illinois Tech men’s basketball team. “I’m exceptionally proud to join the College of Computing’s Board of Advisors,” he says. “Illinois Tech and the College of Computing provide students of all backgrounds with the best-in-class computational and data science platform to excel in their respective fields.”

With more than 40 years of experience in the electronic design automation (EDA) industry, Carlson will help the College of Computing promote its collective power of difference to advance technology and progress for all. He will serve as an advocate to reinforce the college’s position as the leading creator of computational talent, knowledge and innovation for Chicago and beyond.

Carlson is a Lanza techVentures Investment Partner and an adviser to many EDA startups in his role as vice president of sales for Verific. He was one of the co-founders of the ESD Alliance (formerly the EDA Consortium), an industry trade association that is a SEMI Technology Community. While at Highland Software (now Flexera Software), Carlson helped launch FLEXlm, a software license manager intended for corporate environments to provide floating licenses to multiple computer software end users.

About Illinois Institute of Technology’s College of Computing
Illinois Tech created the College of Computing in 2020 as part of an effort to drive Chicago’s thriving tech ecosystem by educating a future diverse workforce that is rigorously trained in data and computation. Illinois Tech is home to the Midwest’s only Bachelor of Science in Artificial Intelligence degree, and the numerous cybersecurity and intelligence pathways at Illinois Tech explore not only the deep foundations of fast-growing fields of computer science, but also emphasize societal ethics in developing this technology. The United States Department of Homeland Security and the National Security Agency have designated Illinois Institute of Technology (Illinois Tech) as a National Center of Academic Excellence in Cyber Defense Education. The university’s Center for Cyber Security and Forensics Education (C2SAFE) is at the core of Illinois Tech’s designation. Additionally, the center is a member of the United States Strategic Command (USSTRATCOM) Academic Alliance and North American Defense and Security Academic Alliance (NADSAA).

About Verific Design Automation
Verific Design Automation is the leading provider of SystemVerilog, Verilog, VHDL and UPF Parser Platforms that enable project groups to develop advanced electronic design automation (EDA) products quickly and cost effective worldwide. With offices in Alameda, Calif., and Kolkata, India, Verific has shipped more than 60,000 copies of its software used worldwide by the EDA and semiconductor industry since it was founded in 1999.

Engage with Verific at:
Email: [email protected]
Website: www.verific.com
LinkedIn: https://www.linkedin.com/company/verific-design-automation-inc/
Facebook: https://www.facebook.com/Verific-Design-Automation-100448363329771/

• Read more about Verific’s Rick Carlson Appointed Advisory Board Member for the College of Computing at Illinois Institute of Technology

PENANG, MALAYSIA - August 2022 ViTrox Technologies, aims to be the world’s most trusted vision inspection solutions provider to the Semiconductor and SMT PCB Assembly industries, is pleased to present the latest edition of Tray-based Vision Series - TH1000SEi Tray-to-tray vision handler. TH1000SEi is a user-friendly model designed that allows you to enjoy high-speed tray to tray inspection capabilities while improving cost efficiency.

TH1000SEi will be your first choice to fulfil all the stringent inspection requirements of today’s advanced integrated circuit (IC) packaging market. This special edition of the Tray-to-tray vision handler features the world's most cutting-edge vision technologies for various IC package sizes ranging from 3mm x 3mm to 40mm x 40mm with no conversion needed on its vision module for the 6-sided inspection.

With an auto-pitching mechanism, TH1000SEi allows you to enjoy speedy and reliable nozzle pitch conversion time with its fourteen (14) pick-up nozzles. Having fourteen (14) pick up nozzles optimizes the machine throughput up to 33,000 units per hour (UPH). Additionally, the warpage clamper flattens unbalanced trays during the process. With this user-friendly and simple operating model, you can enjoy the highest performance in your precise production environment.

Besides, TH1000SEi is designed with various innovative vision technologies to provide high speed, high accuracy, and one-stop vision inspection solutions. Our TH1000SEi supports leaded packages inspection, ball packages inspection, and leadless packages inspection, suitable for BGA, QFP, QFN, CSP, TSSOP, MSOP, SOP, etc. Apart from all these attractive features, we offer additional inspection capabilities add-ons such as 2D barcode inspection, mark inspection, package vision inspection, passive component inspection, top colour inspection, etc.

Apart from these features, TH1000SEi is also upgradeable with the tape module for more high speed tray to tape and reel inspection capabilities. Ultimately, the TH1000SEi maximises inspection capabilities, allowing you to achieve maximum machine throughput cost-effectively.

For more exclusive details on the Tray-based Vision Handler series or TH1000SEi, contact our experts at [email protected] for further assistance.

About ViTrox Technologies
Since its inception in 2000, ViTrox aims to be the World’s Most Trusted Technology Company to provide the most innovative, advanced, and cost-effective machine vision solutions of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances. ViTrox offers a full spectrum of advanced 3D vision inspection solutions, including Intelligent Advanced Robotic Vision System, PCB Assembly SMT Vision Inspection Solutions and Industry 4.0 Smart Manufacturing Solution. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States, along with sales and support sites globally. For more information about ViTrox’s products and services, please visit www.vitrox.com.

• Read more about ViTrox Unveiling An All-in-One Special Edition of TH1000SEi Tray-based Vision Solution

Deventer, July 27, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and Rohde & Schwarz GmbH & Co. KG, a market leader in the fields of measurement technology and communications, today announce the continuation of their longstanding partnership through several new projects in ASIC development.

The two companies have been working together for over 10 years and in this period RoodMicrotec has carried out the test development for various high frequency ASICs used by Rohde & Schwarz in their products. RoodMicrotec performs wafer and component level tests as well as qualifications prior to product launch. For the coming years, further projects of this kind are already scheduled.

"At Rohde & Schwarz, we rely on our own in-house expertise to develop our high-performance ASICs and therefore count on partners who share our high standards. We appreciate the quality RoodMicrotec offers - from quotation to test development, qualification and volume testing," says Bastian Nagel, Senior Director Mixed Signal ASIC Development at Rohde & Schwarz.

RoodMicrotec also appreciates the collaboration with Rohde & Schwarz, especially the respectful interaction and the high level of professional expertise.

Jan de Koning Gans, Managing Director of RoodMicrotec GmbH says: "Our projects with Rohde & Schwarz constantly pose new technical challenges, thus allowing us to broaden our know-how and the quality of our work from project to project."

About Rohde & Schwarz
The Rohde & Schwarz technology group develops, produces and sells a wide range of electronic capital goods. The company’s entire product portfolio represents a valuable contribution to a secure and networked world. In the markets of test & measurement, secure communications, networks & cybersecurity, as well as broadcast & media, customers around the world rely on Rohde & Schwarz and its technologically leading solutions. In addition to its well-established business areas, the Group invests in future technologies such as artificial intelligence, Industrial Internet of Things (IIoT), 6G, cloud, and quantum technology.

Further Information
Email: [email protected], Web: www.rohde-schwarz.com
 
About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

• Read more about RoodMicrotec and Rohde & Schwarz extend longstanding partnership in ASIC development

MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC (“Lumentum“, NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR industry. This collaboration promises to generate innovative LiDAR solutions for the industry.

LiDAR (light detection and ranging) technology is becoming the standard equipment in medium-end and high-end vehicles. In the next five years, the demand for automotive LiDAR in advanced driver assistance systems (ADAS) applications will grow at a compound annual growth rate (CAGR) of 94%. Compared to optical transceivers, automotive LiDAR needs to pass more stringent reliability verification, in which both the reliability of the photonic chips and their assembly technologies are critical. Assembling photonic chips with high reliability and zero-defect in large-scale productions is one of the great challenges facing the emerging automotive LiDAR industry.

Both companies bring decades of expertise to the collaboration. Based on its expertise in providing reliable diode laser solutions for communication and consumer applications, Lumentum has developed a series of diode laser products that meet the quality, scope, and reliability requirements of the automotive industry. Lumentum provides 1550 nm narrow linewidth DBR diode lasers for the frequency modulated continuous wave (FMCW) coherent LiDAR, 905 nm and 940 nm VCSEL array laser with corresponding power for long-distance LiDAR and in-cabin monitoring.

MRSI Systems is a global leading supplier of fully automated high-accuracy die bonders, providing high-precision, high-flexibility, high-reliability, and high-speed fully automatic chip assembling solutions for the optoelectronic and microelectronic industries. In the automotive LiDAR industry, MRSI provides high reliability and fully automated assembling solutions for different die bonding processes.

To be announced at the 2022 Compound Semiconductor Conference for Advanced Technology and Applications (Suzhou, Taicang), MRSI’s collaboration with Lumentum will provide high-reliability photonic chip assembly solutions and services for the automotive LiDAR industry. The conference presentation titled, “Discussion on Photonic Chips and Assembling Technologies in Automotive LIDAR”, will be delivered by Dr. Limin Zhou of MRSI on behalf of both companies. Dr. Zhou’s speech will focus on the companies’ collaborative work, including key assembly requirements and technologies, best mass production solutions for high-reliability and zero-defect, and experimental results.

“Reliability is critical for automotive LiDAR applications and both the laser chip and the module assembly technology are essential to passing the strict reliability requirements for vehicles,” said Mr. Lu Yong, Senior Product Line Manager of Lumentum. “We are excited to continue our work with MRSI Systems, Mycronic Group. Our combined efforts will better support customers with a complete solution that includes high-reliability laser chip and assembly products.”

Dr. Yi Qian, Mycronic Group’s Vice President and General Manager for MRSI Systems, said, “We are happy to collaborate with Lumentum in the automotive LiDAR industry. MRSI Systems, Mycronic Group will have more opportunities to work with the global leading photonics company to develop high-reliability chip assembly solutions for the fast-growing Industry. The end-to-end solutions from chip to module assembly provided by our collaboration will shorten time-to-market and play a very important role in enabling mass production of automotive LiDAR solutions.”

For additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd.
Tel: +86 135 0289 9401
E-mail: [email protected]

About MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com

• Read more about MRSI Systems, Mycronic Group announces a new collaboration to provide LiDAR solutions for the Automotive Industry

RoodMicrotec N.V. publishes the unaudited Interim Report for 2022

• Total income EUR 7.3 million (HY1 2021: EUR 7.3 million)
• EBITDA EUR 1.4 million (HY1 2021: EUR 1.3 million)
• Net profit EUR 0.6 million (HY1 2021: EUR 0.4 million)

Deventer, July 21, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today publishes the unaudited Interim Report and the half-year results for the period ended on June 30, 2022.

The total income in the first half-year of 2022 is EUR 7.3 million, which is equal to the total income reported for the first half-year of 2021 and for the second half of 2021. The stable total income is driven by a continued strong delivery level, especially in the test operations unit. In the first half of 2021 we ordered and received wafers for one of our SCM customers to manage the supply chain during a planned change of an assembly house. About EUR 0.4 million was realized for these wafers as total income and approximately the same amount was accounted for in the cost for raw materials and consumables. This resulted in a higher total income and a higher cost of materials in the first half of 2021 without an impact on the net profit. These parts will be delivered during the second half of 2022 where only part of the selling price will be recognized in the total income. The profit will therefore be positive.

EBITDA increased from EUR 1.3 million for the first half of 2021 to EUR 1.4 million for the first half of 2022. The lower cost of raw materials together with a good cost control have continued to reduce the overall costs in the first half-year of 2022.

Compared to the first half of 2021, the depreciation was lower in the first half of 2022 due to lower investments during 2021. The financing costs remained unchanged.

The net profit for the first half-year of 2022 increased by 47% to EUR 0.6 million compared to the first half-year of 2021.

(x EUR 1,000) Unaudited
HY1 2022 Unaudited
HY1 2021
Total Income 7,317 7,282
EBITDA 1,440 1,317
Net profit 644 437

 
Net cash flow from operating activities was positive with EUR 0.3 million (2021: positive with EUR 0.9 million). The change is the result of an increase in working capital during the first half of 2022. Net cash flow was negative with EUR 0.6 million (2021: positive with EUR 0.6 million). This was mainly due to the lower net cash from operating activities as well as investments and redemption of the 2012 perpetual bond during the first half of 2022.

The order book increased considerably compared to December 31, 2021, which is encouraging and indicates that a big part of the forecasted increase in total income for 2022 over last year is now covered with orders.

“Despite the general supply chain situation in the world, we have been able to continue our test operations at a high utilization level. This shows that we have logistics under control and are well prepared for the future increase in demand”, says Martin Sallenhag, CEO of RoodMicrotec. “The global shortage of semiconductor supplies as well as logistic challenges may still impact our ability to meet our plan for the full-year 2022, but we are closely monitoring the situation to be able to act if necessary.”

Unaudited Interim Report 2022
You will find the complete unaudited Interim Report 2022, which is available only in English and as an electronic version, on our corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.

Conference call
CEO Martin Sallenhag and CFO Arvid Ladega will present the unaudited Interim Report 2022 and respond to questions. You are invited to join RoodMicrotec’s conference call for media, analysts and shareholders (a Microsoft TEAMS event) on Thursday, July 21, 2022 at 9:30 CEST

Login-information:
Join with your computer or mobile app Click here to join the meeting
Or call in (audio only)
+49 69 509544247 Germany, Frankfurt am Main
+31 20 399 9804 The Netherlands, Amsterdam
+32 2 895 09 68 Belgium, Bruxelles
+41 43 217 23 02 Switzerland, Zurich

Find a local number – in case you are in another country
Phone Conference ID: 760 330 187#

Financial calendar
July 21, 2022 Conference call for media, analysts and shareholders
October 13, 2022 Trading update quarter 3-2022
January 26, 2023 Publication (preliminary) annual total income 2022

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com
Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is only published in English. This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.

• Read more about RoodMicrotec N.V. publishes the unaudited Interim Report for 2022