The wide adoption of Artificial Intelligence is profoundly impacting many industries, perhaps none more so than the semiconductor industry. Beyond serving as a growth driver for chips across a diverse range of applications, AI and semiconductors are beginning a virtuous cycle where AI is helping to design more powerful chips that in turn enable more advanced AI. The semiconductor industry’s path to $1 trillion in annual revenue by the end of the decade is promising, thanks in large part to AI, but what will that journey actually look like?
This webinar will examine the industry’s AI-driven growth opportunities in depth, while looking at the technological innovation needed to fuel the market expansion. Dr. Handel Jones, CEO of IBS, and author of When AI Rules the World, will share his analysis of how AI will shape the outlook for semiconductor end-markets and segments – along with the race to achieve 1.0nm technology nodes and accelerate the virtuous AI-semiconductor development cycle. He will also cover the future of semiconductor market growth in the AI era as well as areas of opportunities.
SEMI Smart Data-AI Initiative and Future of Computing Update
10:10 am
-
11:00 am
Dr. Handel Jones
CEO
IBS
Why AI Will Propel the Semiconductor Market to $1 Trillion and Achieve 1.0nm by 2030
11:00 am
-
11:15 am
Q&A
Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments.
Analyzing AI-Driven Growth: $1T and Beyond
Webinar
November 20, 2024
10:00am - 11:15am PT
10:00 am - 11:15 am
Off
Add to Calendar2024-11-20 10:00:002024-11-20 11:15:00Analyzing AI-Driven Growth: $1T and BeyondExplore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
On-demand
The principles of Microelectronics packaging range from Electronics, Mechanical, and Material to Chemical Engineering. Due to this multi-discipline nature, many industry professionals don’t know what they don’t know as they do not undergo multi-discipline training to understand these principles. This course provides the necessary technical knowledge for industry professionals.
Who Should Attend
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
Directors
Managers
Process Engineers
R&D Engineers
Sales and Application Engineers who supply packaging materials and tools
Learning Objectives
Understand the principles in the evolution of IC packaging and how the semiconductor industry has evolved with time.
Understand the principles of Interconnections ranging from TAB, and Wirebond to various Flip Chip bonding, such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development.
Review the interposer of leadframe, ceramic, flex to BT substrates for Microelectronics packaging.
Explain the assembly flow and new assembly techniques from backgrinding to singulation.
Describe the material characterization from bulk to interfaces to reduce stress and enhance interfacial adhesion for reliability enhancement.
Course Topics
Advanced packaging and material characterization.
Packaging principles and how packaging evolves into heterogeneous packaging.
Packaging concepts such as Fan-in, Fan-out WLP, Embedded packaging technology, 3D packaging, TSV.
Wirebond and Flip chip interconnect technologies inclusive of interposer technologies, such as leadframe, ceramic, flex and substrate.
Assembly processes from backgrinding to singulation for QFP and FBGA packages.
Material characterization to select materials to reduce stress and strengthen the interface for reliability enhancement.
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 of this course focuses on the design in electrical and thermal which are used to enhance the electrical, thermal, and reliability performance of the package.
Pricing
Members: $599
Non-Members: $649
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].
Advanced Packaging and Material Characterization for Microelectronics
Virtual Training - Asia & EU
2:00 pm - 6:00 pm
Off
Add to Calendar2025-02-24 14:00:002025-02-25 18:00:00Advanced Packaging and Material Characterization for Microelectronics (Virtual Training, Asia & EU) Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 of this course focuses on the design in electrical and thermal which are used to enhance the electrical, thermal, and reliability performance of the package. PricingMembers: $599Non-Members: $649* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. SingaporeSEMI.org[email protected]America/Los_AngelespublicClosed
The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies. Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.
Learning Objectives
Understand the fundamental principles and theories semiconductor technology.
Communicate with other associates and understand wafer processing steps.
Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
Analyze and evaluate research literature in semiconductor technology.
Develop critical thinking and problem-solving skills applicable to semiconductor technology.
Who Should Attend
This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.
Pricing
Members: $845
Non-Members: $945
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].
Understanding Semiconductor Technology and Business
Virtual Training - US & EU
8:00 am - 12:00 pm
Off
Add to Calendar2025-02-10 08:00:002025-02-11 12:00:00Understanding Semiconductor Technology and Business (Virtual Training, US & EU)Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $845Non-Members: $945* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Closed
This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.
Learning Objectives
Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals
Course Topics
Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
Process Nodes: Process nodes and their impact on device performance and cost
Device Physics and Transistor Operation: Principles of device operation and transistor functionality
Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
Wafer Processing:
Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
Etching and Cleaning Processes: Plasma and wet etching processes
Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
Electroplating and Sputtering: Metal deposition techniques used in manufacturing
Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
Semiconductor Industry Ecosystem: The major players in the industry
Who Should Attend
Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.
Pricing
Members: $995
Non-Members: $1,095
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].
Overview of Semiconductor Manufacturing
Virtual Training - US & EU
8:00 am - 12:00 pm
Off
Add to Calendar2025-01-27 08:00:002025-01-29 12:00:00Overview of Semiconductor Manufacturing (Virtual Training, US & EU) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingMembers: $995Non-Members: $1,095* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Closed
In today’s fast-paced and interconnected world, the electronics industry faces unprecedented challenges from global disruptions, geopolitical uncertainties, and supply chain vulnerabilities. To remain competitive and resilient, organizations must adopt robust risk management frameworks that proactively identify and mitigate risks.
This webinar is brought to you by the Resiliency Working Group, part of the SEMI Supply Chain Management Initiative. We will explore the creation and implementation of an industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Attendees will learn how to assess potential risks, develop mitigation strategies, and leverage cutting-edge tools to improve visibility and responsiveness across their supply networks.
Key topics include:
• The critical risks impacting electronics supply chains and how to address them. • Best practices for building a resilient and adaptable risk management framework. • Strategies for real-time risk monitoring, supplier risk assessments, and scenario planning. • How to align your supply chain with industry standards for business continuity and operational stability.
Who should attend:
• Supply chain managers • Risk officers • Operations executives • Anyone involved in supply chain planning and resilience in the electronics sector
Join us to discover actionable insights and practical approaches to future-proof your electronics supply chain, ensuring it remains resilient, efficient, and prepared for any disruption.
Speaker bio:
Austin Evans is the Director of Supply Chain Risk Management at Intel. He is responsible for overseeing risk management for Intel’s supply chain as well as Intel’s Contingent Workforce Program Office. His organization is responsible for business continuity, governance, resilience, supply chain security and compliance.
Join us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring.
Building Resilient Supply Chains: Creating an Industry Standard for Risk Management
Webinar
Date: October 24, 2024
Off
Add to Calendar2024-10-24 00:00:002024-10-24 00:00:00Building Resilient Supply ChainsJoin us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
SEMI Sustainability—Building a Sustainable $1T Industry
Join us for an insightful exploration of the semiconductor industry's pivotal role in advancing sustainability, including emissions, water, waste, climate equity and achieve net zero emissions. This forum will bring together leading experts, industry pioneers, and sustainability advocates to across the electronic supply chain to discuss innovative strategies, emerging technologies, and collaborative efforts driving the semiconductor sector toward a greener future.
Topics Include—
Industry Perspectives—Hear from top executives and/or leaders about the current state of sustainability in the semiconductor industry and the challenges and opportunities they face on the journey to net zero.
Innovative Technologies—Discover cutting-edge technologies and practices that reshape how semiconductor companies approach climate equity, energy efficiency, waste reduction, and resource management.
Case Studies—Learn from real-world examples of successful sustainability initiatives within the semiconductor sector and how these practices can be adapted across the industry.
Collaborative Solutions—Engage in discussions on how various stakeholders can collaborate to drive meaningful change and achieve collective sustainability goals.
Future Outlook—Gain insights into future trends and strategies that will influence the semiconductor industry's path to net zero, including regulatory developments and advancements in green technologies.
Whether you are a semiconductor industry professional, a sustainability enthusiast, or someone interested in the intersection of technology and environmental stewardship, this event promises valuable takeaways and actionable knowledge.
Participate in a U.S. Time Zone:
Pacific: 9am–10:45am
Mountain: 10am–11:45am
Central: 11am–12:45pm
Eastern: 12pm–1:45pm
Register now to be part of this important conversation and contribute to shaping a sustainable future for the semiconductor industry!
Worldwide, companies in the semiconductor value chain are undergoing paradigm shifts in how sustainable business is conducted, governed, and reported. From engineering to the board room, the number of interdependent corporate functions charged with improving corporate sustainability performance is growing rapidly, with implications for decision-making across the enterprise.
New global sustainability regulations mean that key decisions regarding a company's sustainability strategy can now have significant regulatory implications. Understanding how one decision affects (or forecloses) another is critical, and companies must think several steps ahead to put themselves in a position to achieve their sustainability objectives without painting themselves into a corner.
This webinar will focus on discrete examples where such an approach is paramount – including making climate risk materiality determinations, adopting a climate transition plan, making product-related sustainability claims, disclosing conflict minerals smelter names, and selecting a double materiality assessment methodology. For each example, we will leverage data to examine industry trends, identify the specific potential issues, and suggest practical strategies to navigate those issues.
To ground the conversation, we will illustrate various ways in which these issues can come up in practice by discussing a set of hypothetical sustainability decisions, the related regulatory implications, and approaches that balance sustainability objectives and regulatory considerations.
As the semiconductor industry prepares for the coming wave of new sustainability laws and regulations, companies have an opportunity to develop a regulatory strategy for sustainability that takes an integrated approach to regulatory requirements, encourages coordination and collaboration between the sustainability and legal departments, minimizes regulatory burden and compliance risk, and enables sustainable and responsible business. We will share common features of strategies that have been successful in this regard and provide our recommendations regarding operationalizing such a strategy in your organization.
This event inaugurates the SEMI webinar series, “Global State of Play: Sustainability Regulations, Reporting, & Incentives.” New in 2024, this series offers semiconductor industry professionals the chance to interact with top-tier experts on the most pressing challenges in compliance, disclosure, and strategy for sustainable business.
Speaker
Ashley Walter is Partner & Chief Sustainability Officer at Orrick, Herrington & Sutcliffe LLP, where he advises large technology companies, leading apparel brands, multinational retailers, and renewable energy project developers on business-critical climate, product sustainability, human rights and responsible sourcing issues. As Orrick’s Chief Sustainability Officer, he also oversees Orrick’s strategic sustainability initiatives.
Ashley focuses on developing innovative methods of supporting clients in achieving ESG objectives, including designing novel systems to manage supply chain risk; forming and guiding management-level ESG Steering Committees; and helping clients address the ESG requirements of major customers by engaging with those customers on his clients’ behalf.
Ashley is also heavily involved in ESG initiatives at Stanford Law School, where he has served as a moderator at the Stanford Directors’ College, has lectured on ESG at business law courses, and will be teaching the course “Law and Governance in ESG Strategy” in the spring of 2025.
Worldwide, companies in the semiconductor value chain are undergoing paradigm shifts in how sustainable business is conducted, governed, and reported. From engineering to the board room, the number of interdependent corporate functions charged with improving corporate sustainability performance is growing rapidly, with implications for decision-making across the enterprise.
Join us for this first event in our series, “Global State of Play: Sustainability Regulations, Reporting, & Incentives.” The series offers semiconductor industry professionals the chance to interact with top-tier experts on the most pressing challenges in compliance, disclosure, and strategy for sustainable business.
Times
Multiple sessions available!
EMEA: Monday, November 18, 2024 5:30-6:30 pm Central European Time (=8:30-9:30 am Pacific)
America: Monday, November 18, 2024 8:30-9:30 am or 4-5 pm Pacific Time
Asia Pacific: Tuesday, November 19, 2024 9-10 am Japan Standard Time (=4-5 pm Pacific)
Developing a Regulatory Strategy for Sustainability
Heterogeneous Integration (HI) has come a long way in 50 years. The world of multi-chip modules (MCMs) has given way to a vast ecosystem of chiplets, 3D stacked die, and co-packaging of antenna, high-bandwidth memory (HBM), and optics. HI is at the center of “More than Moore” development activities, as innovative engineers look for creative ways to overcome the slower scaling of silicon technology. The promise of HI is new devices with superior power, performance, area, and cost (PPAC). All these promises come with new challenges. Managing different process nodes, physical characteristics, mechanical stresses, and other system-level challenges not found in monolithic system-on-chip (SoC) devices, creates a great opportunity for design and manufacturing companies to reshape our industry.
In this webinar, we’ll explore this enabling technology from both the device maker and material supplier perspectives. We will learn about demands placed on devices by new applications and what new tools are needed to meet these demands. We will also hear about the challenges placed on materials and equipment suppliers to develop processes capable of manufacturing the individual components and integrating them into final products. Join us as our panel of experts address the issues and opportunities involved with heterogeneous integration.
United States
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging
2nd Generation 3D V-Cache™ Enablement
Andrea Chacko, PhD
Director of Packaging Solutions
Brewer Science
Dongshun Bai, PhD
Business Development Director and Senior Technologist of Packaging Solutions
Brewer Science
Enabling Heterogeneous Integration through Material Design
The realization of Heterogeneous Integration (HI) has been key in driving advancements in semiconductor technology. The complexities of integrating dissimilar materials continue to be a challenge for HI. All advanced packaging technologies rely on advanced materials to address the many challenges in achieving continued shrinking and improved performance of devices. Novel materials capable of managing mechanical stresses and increased thermal budgets with strict cleanliness requirements are required for processes such as wafer thinning, fan-out wafer-level packaging, and hybrid bonding. This presentation will highlight how advanced materials can address the growing challenges in the industry.
Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.
Heterogenous Integration finds its place
Webinar
10:00 am - 11:00 am PT
Zoom
10:00 am - 11:00 am
Off
Add to Calendar2024-10-16 10:00:002024-10-16 11:00:00Heterogeneous Integration finds its placeDive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
REGISTER NOW
Accelerating Piezoelectric MEMS Product Development with AMFitzgerald and MEMS Infinity
There is an increasing need for sensors and smart devices in optical communications, medical devices, automotive navigation and every market in between. MEMS technology is at the center of this groundswell, presenting new revenue opportunities to companies of all sizes.
As companies seek to push performance and manufacturing limits, a new generation of commercial MEMS devices that use piezoelectric thin films has been emerging. The global piezoelectric MEMS wafer volume is forecast to exceed 1.5M wafers per year or 30% of all MEMS wafers by 2029*.
Piezoelectric thin films, particularly PZT, are the new foundation for high-growth MEMS products like microspeakers and micromirrors, gas sensors, image stabilizers, and ultrasonic transducers.
An alliance between MEMS product development firm AMFitzgerald and foundry service MEMS Infinity, Sumitomo Precision Products, Co.,Ltd. is opening new paths for commercialization of PZT MEMS. Together, AMFitzgerald and MEMS Infinity offer an integrated design-to-production service that expedites commercialization by leveraging production-proven processes from day one.
Join this webinar to learn:
Trends that are driving the adoption of PZT MEMS
Why access to production-quality PZT is especially important for early-stage development
MEMS Infinity’s distinctive foundry service and PZT lineup for actuators, sensors, and transducers
150mm and 200mm wafer lines
The world’s highest piezoelectric coefficient e31f for actuators
Combined high e31f and low relative permittivity for sensors and transducers
Extreme e31f using dual-layer PZT actuators
How to access the highest-quality PZT thin films for your product development
Accelerating Piezoelectric MEMS Product Development
Presented by AMFitzgerald and MEMS Infinity
8:00 am - 9:00 am
Off
Add to Calendar2024-09-18 08:00:002024-09-18 09:00:00Accelerating Piezoelectric MEMS Product Development with AMFitzgerald and MEMS Infinity United StatesSEMI.org[email protected]America/Los_AngelespublicRegister here
SEMI MEMS & Sensors Industry Group—MSIG, manages a 5-year $5M per year ($25M total) Positioning, Navigation, and Timing—PNT funded R&D Program.
Join us for an overview of the program’s 3rd-year request for proposal (RFP) instructions and get answers to any questions you may have on submitting a proposal.
Presented by: SEMI MEMS & Sensors Industry Group—MSIG
8:00 am - 9:00 am
Off
Add to Calendar2025-06-13 08:00:002025-06-13 09:00:00SEMI MSIG Positioning, Navigation, and Timing Request for Proposal WebinarWEBINAR United StatesSEMI.org[email protected]America/Los_AngelespublicRegister here
