United States Science Corp Webinar Tile

Abstract

Science Foundry innovates on the traditional MEMS foundry business in three key ways: robust Multi-Project Wafer (MPW) offerings, a custom Manufacturing Execution System (MES), and a modular approach to our manufacturing capabilities. Some of our MPW offerings have been around for decades, while others were designed to serve the rapidly growing brain-computer interface industry, but all of our offerings provide production quality manufacturing at a fraction of the cost of custom wafer runs. We designed our MES for flexibility, enabling a level of efficiency beyond traditional wafer fabrication facilities and empowering us to engage with customers earlier in their development. Ultimately, this unlocks bandwidth from our technical staff to focus on creative problem solving and faster iteration cycles. We are expanding into a new facility with a modular upgrading plan that will add new process capabilities and strategically scale for the right partners. Our adaptability is our greatest strength, not only meeting our customers' needs but proactively anticipating the needs of nascent and burgeoning industries.

 

Kara Zappitelli, Foundry Director

 

Dr. Kara Zappitelli is the Lead Engineer & Foundry Director at Science Corporation’s pure-play MEMS foundry in RTP, North Carolina. She is a physicist-gone-engineer with a penchant for hard problems and more than a decade of experience in micro and nano fabrication for applications in neural engineering and MEMS. Kara joined Science at its inception and helped drive the initial R&D for the Science Eye device before moving to head up production of both internal and external devices. Kara received a B.S. in Physics from California Polytechnic State University in San Luis Obispo and a Ph.D. in Physics from the University of Oregon, where she was fabricating high surface area electrodes for applications in retinal prostheses. Before joining Science, she completed a post-doc investigating 2-photon lithography integration with 2D planar processing for complex neural interfaces.

 

 

 

 

 

Scott Smyser, VP of Sales

Scott has over 25 years of experience in the semiconductor industry leading commercial teams as a strategy, corporate marketing, and sales and business development professional. He has spent much of his career working with MEMS based products including timing devices, inertial sensors, and spectral sensors. At Science Foundry, Scott leads the go-to-market strategy developing long-term relationships with companies that need MEMS foundry services. Scott earned a BS in Electrical Engineering and an MBA from the University of Southern California.

United States

Feb 12, 2025 MSIG 8:00 am - 9:00 am Off Add to Calendar 2025-02-12 08:00:00 2025-02-12 09:00:00 Innovating in the MEMS Foundry Business United States SEMI.org [email protected] America/Los_Angeles public Jan 22, 2025 Register

Registration

 

Early Bird Pricing (until February 18, 2025) 
$25 members
$49 non-members

Regular Pricing (after February 18, 2025)
$75 members
$149 non-members

Students:  Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
 

Postponed

Belgium France Germany Italy United States FEMC 24 Postponed tile.jpg Business Executive Technical

NOTE: This webinar has been indefinitely postponed. 

The FDA’s Center for Devices and Radiological Health (CDRH) launched the voluntary Total Product Life Cycle (TPLC) Advisory Program (TAP) Pilot to help spur more rapid development of high-quality, safe, effective, and innovative medical devices that are critical to public health. TAP’s primary goal is to expedite patient access to innovative medical devices by providing early, frequent, and strategic communications with the FDA and by facilitating engagement with other key parties for developers of devices of public health importance. To achieve this goal, a dedicated cadre of FDA TAP Advisors proactively provide solutions-focused engagement that is tailored to each TAP Innovator’s needs in advancing devices to market and patient access. In this seminar, FDA TAP Advisors will discuss this pilot program and provide participants input on when in their regulatory journey TAP may be an option for them. 

ABOUT THE SPEAKERS:

Kimberly Knish, MS, CCRP, RAC
Kimberly is a TAP Advisor within FDA’s Center for Devices and Radiological Health, Total Product Life Cycle (TPLC) Advisory Program (TAP). In this role, she establishes and cultivates a wide network of synergistic relationships across the entire medical technology innovation ecosystem and integrates ecosystem, sponsor, and lead reviewer input into strategic planning options intended to reduce stakeholder risk and maximize the opportunities of timely commercial rollout and sustainable patient access. She brings to the FDA 30 years of medical technology industry experience within clinical affairs, regulatory affairs, health economics, reimbursement and quality systems. She has been involved with all phases of medical device development (concept through obsolescence) involving device types from Class III implantables to wearables and remote monitors. Therapeutic expertise spans cardiovascular, nervous, digestive, endocrine, respiratory, and skeletal systems. Kimberly holds a B.A. degree in Biology from the College of St. Benedict, a M.S. degree in Management from Cardinal Stritch University and has professional certifications in clinical research (CCRP) and regulatory affairs (RAC).

April Marrone, PhD, MBA
April is a Senior Advisor in the FDA/CDRH Total Product Lifecycle Program (TAP) since November 2023. Prior to her current role, April has served on the Obesity and Hepatobiliary Devices Team as the acting Assistant Director, Team Lead, Lead Reviewer, and chemistry consultant since 2014. In addition to supervisory, leadership, and medical device review responsibilities, April has promoted improvement in product manufacturing and quality through developing device specific FDA guidance documents, creating review tools to ensure consistency and quality in device review, and publishing external manuscripts on topics relevant to the FDA and industry on topics in the obesity and hepatobiliary device space. April has served as a Commissioner Fellowship Program (CFP) preceptor, mentor to new reviewers and advisors, and has developed and instructed Reviewer Certification Program courses. 

Prior to joining CDRH in 2014, April was a Commissioner Fellow at FDA’s National Center for Toxicology Research (NCTR) and has served on the CFP Advisory Board. During her tenure at the NCTR, April did research to develop novel epigenetic approaches to safely assess the safety and carcinogenicity of FDA regulated products. Prior to joining the FDA, April was a post-doctoral scientist at the University of Pittsburgh, Children’s Hospital of Pittsburgh where she studied epigenetic regulation of congenital kidney disease in a mouse model. April also completed post-doctoral training at the Max Planck Institute for Biophysical Chemistry where she studied genetic and epigenetic regulation of neuromuscular disease. April has a PhD in Chemistry and BS in Physics from the University of Central Florida and an MBA from Florida Institute of Technology.

United States

Kimberly Knish

TAP Advisor

FDA’s Center for Devices and Radiological Health

April Marrone

Senior Advisor

FDA’s Center for Devices and Radiological Health

Gity Samadi

Sr. Director R&D

SEMI

Mar 12, 2025 NBMC FlexTech

FDA TPLC Advisory Program (TAP): Piloting a New Approach

Flexible Electronics Master Class #24
Postponed. New Date TBD

Off Add to Calendar Disabled Feb 12, 2025 America/Los_Angeles Postponed

Sold Out Cancellation Policy

United States Wafer Fab Processing Image Training

Course Description

By focusing on the basics of each processing step and the issues surrounding them, participants will learn why certain techniques are preferred over others. Our instructors work hard to explain how semiconductor processing works without delving heavily into the complex physics and mathematical expressions that normally accompany this discipline.

Participants learn basic but powerful aspects about the semiconductor industry. This skill-building series is divided into three segments:

1. Basic Processing Steps. Each processing step addresses a specific need in IC creation. Participants learn the fundamentals of each processing step and why they are used in the industry today.

2. The Evolution of Each Processing Step. It is important to understand how wafer fab processing came to the point where it is today. Participants learn how each technique has evolved for use in previous and current generation ICs.

3. Current Issues in Wafer Fab Processing. Participants learn how many processing steps are increasingly constrained by physics and materials science. They also learn about the impact of using new materials in the fabrication process and how those materials may create problems for the manufacturers in the future.

Learning Objectives

• Review of the semiconductor industry and its technical issues.
• Understand the basic concepts behind the fundamental wafer fab processing steps.
• Identify the key issues related to each of the processing techniques and their impact on the continued scaling of the semiconductor industry.
• Identify the basic features and principles associated with each major processing step. These include processes like chemical vapor deposition, ion implantation, lithography, and etching.
• Understand how processing, reliability, power consumption and device performance are interrelated.
• Make decisions about how to construct and evaluate processing steps for CMOS, BiCMOS, and bipolar technologies.

Who Should Attend

This course is a must for every manager, engineer and technician working in the semiconductor industry, using semiconductor components or supplying tools to the industry. 

Course Topics

• Raw Silicon Wafers
• Ion Implantation
• Thermal Processing
• Contamination Monitoring and Control
• Wafer Cleaning and Surface Preparation
• Chemical Vapor Deposition
• Physical Vapor Deposition
• Lithography
• Etch
• Chemical Mechanical Polishing
• Cu Interconnect and low-k Dielectrics
• Leading Edge Technologies and Techniques
• ALD
• High-k gate and capacitor dielectrics
• Metal gates
• SOI
• Strained silicon
• Plasma doping

Instructor

Chris Henderson 

Semitracks, Inc. 

Instructor Bio

United States

Apr 14, 2025 - Apr 15, 2025 SEMI U

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today’s wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is a 8 hour course (across two days) that offers an overview look into the semiconductor manufacturing process, and the individual processing technologies required to make them. We place special emphasis on the basics surrounding each technique, and we summarize the current issues related to manufacturing the next generation devices. 

Pricing

• Members: $599
• Non-Members: $649
• Students/Vets: $549

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

Wafer Fab Processing

Virtual Training - US & EU

8:00 am - 12:00 pm Off Add to Calendar 2025-04-14 08:00:00 2025-04-15 12:00:00 Wafer Fab Processing (Virtual Training, US & EU) Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today’s wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is a 8 hour course (across two days) that offers an overview look into the semiconductor manufacturing process, and the individual processing technologies required to make them. We place special emphasis on the basics surrounding each technique, and we summarize the current issues related to manufacturing the next generation devices. PricingMembers: $599Non-Members: $649Students/Vets: $549* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public Apr 11, 2025 America/Los_Angeles Sold Out

Registration Details

$39 for SEMI Members (sign into your account with your work email to be recognized)

$59 for non-SEMI Members

Register for the first Webinar Register for the second Webinar

Belgium China France Germany Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Vietnam Register for the 9:00-10:00 AM PT Session Register for the 4:00-5:00 PM PT Session SSI Webinar Series tile 360x317 - Cloned Business Executive

Abstract

Companies across the semiconductor value chain must respond to a dynamic horizon as the ISSB Standards are adopted by securities regulators, standard-setters and stock exchanges around the world. At the same time, investors are asking companies to voluntarily transition from the TCFD recommendations to the ISSB Standards to meet their information needs.

To clarify what the ISSB Standards mean for the semiconductor value chain, SEMI is pleased to collaborate with the IFRS Foundation, which is the organizational seat of the ISSB. Our webinar, ISSB Standards Adoption and Reporting for the Semiconductor Value Chain, outlines the stakes for companies, demonstrates the business value of the Standards (IFRS S1 and IFRS S2), answers audience questions, and provides a venue for information exchange. There will be a deep dive into implications for climate reporting under IFRS S2 after a high-level look at the background and workplan of the ISSB.

Our distinguished speakers from IFRS Foundation are Neil Stewart, Director of Corporate Outreach, and Jing Zhang, Head of Climate Research.

This event is part of the SEMI webinar series, “Global State of Play: Sustainability Regulations, Reporting, & Incentives.” This series offers semiconductor industry professionals the chance to interact with top-tier experts on the most pressing challenges in compliance, disclosure, and strategy for sustainable business.

Speakers

Neil Stewart, Director of Corporate Outreach, IFRS Foundation

Neil Stewart is the International Sustainability Standards Board’s New York-based Director of Corporate Outreach, working with preparers, industry associations, the accounting profession and consultants to build awareness and understanding of the ISSB Standards and SASB Standards. Neil joined SASB in 2020 from Citigroup.

 

 

 

 

Jing Zhang, Head of Climate Research, IFRS Foundation

Jing Zhang is Head of Climate Research on the International Sustainability Standards Board’s technical staff. Previously he was the Global Head of Quantitative Research at Moody’s Analytics. Jing has numerous published books and research papers on financial risk, including the Risk Publications book “Climate Change: Managing the Financial Risk and Funding the Transition.” Jing has a PhD from the Wharton School of the University of Pennsylvania.

United States

Jan 23, 2025 Sustainability

Worldwide, companies in the semiconductor value chain are undergoing paradigm shifts in how they report sustainability-related risks and opportunities to stakeholders in government and capital markets.

Semiconductor manufacturing and design firms, together with their business partners, face heightened pressure to report on their performance related to climate transition, human capital management, supply chain management, and a host of other environmental, social, and governance issues.

On one hand, companies face a patchwork of reporting rules conditioned on where they do business. On the other hand,  a global baseline of sustainability-related disclosures ushered in by the IFRS Foundation’s International Sustainability Standards Board (ISSB) is gathering momentum.

Times

ISSB Standards Adoption and Reporting

Off Add to Calendar Disabled Dec 6, 2024 America/Los_Angeles

Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Paul Cohen ([email protected]) with a picture of your student ID to receive your discount code.

Register Now to Watch the Recorded Event

Germany Japan South Korea Taiwan United States Savage on Security 1 Recording Tile.jpg Technical

New horizons for semiconductors have been revealed by innovations in heterogeneous integration, especially due to the availability of an abundance of inter-chiplet wires. All this has implications on security leading to new challenges as well as opportunities. This talk presents an overview on how prior work on 2D SoCs may or may not be helpful in addressing this challenge.

Meet the Speakers

Guest Speaker

Ankur Srivastava
Director of the Institute for Systems Research
University of Maryland
Biography

Moderator

Warren Savage
Researcher at University of Maryland
Applied Research Laboratory for Intelligence and Security
Biography

United States

Jan 23, 2025 APHI ESD Alliance SiPAT

The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for Intelligence and Security.

ESD Alliance Webinar: Security Constructs for Heterogenous Integration

Savage on Security Webinar Series #1
Recording
Recorded January 23, 2025

Off Add to Calendar Disabled Jan 27, 2025 Register Now to Watch the Recorded Event

Closed Cancellation Policy

United States Overview of Semiconductor Manufacturing

Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

• Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
• Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
• Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

• Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
• Process Nodes: Process nodes and their impact on device performance and cost
• Device Physics and Transistor Operation: Principles of device operation and transistor functionality
• Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
• Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
• Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
• Wafer Processing:
  • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
  • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
  • Etching and Cleaning Processes: Plasma and wet etching processes
  • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
  • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
  • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
  • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
  • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
• Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

 

Instructor

Denny Frye 

PT International, LLC

Instructor Bio

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

Mar 3, 2025 - Mar 5, 2025 SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Pricing

• Members: $895
• Non-Members: $995

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

Overview of Semiconductor Manufacturing

Virtual Training - US & EU

8:00 am - 12:00 pm Off Add to Calendar 2025-03-03 08:00:00 2025-03-05 12:00:00 Overview of Semiconductor Manufacturing (Virtual Training, US & EU) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingMembers: $895Non-Members: $995* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public Mar 3, 2025 America/Los_Angeles Closed

Sold Out Cancellation Policy

United States Understanding Semiconductor Technology and Business (Asia)

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

• Understand the fundamental principles and theories semiconductor technology.
• Communicate with other associates and understand wafer processing steps.
• Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
• Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
• Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
• Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
• Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
• Analyze and evaluate research literature in semiconductor technology.
• Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

Singapore

Mar 10, 2025 - Mar 11, 2025 SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing

• Members: $645
• Non-Members: $745

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

Understanding Semiconductor Technology and Business

Virtual Training - Asia

9:00 am - 1:00 pm Off Add to Calendar 2025-03-10 09:00:00 2025-03-11 13:00:00 Understanding Semiconductor Technology and Business (Virtual Training, Asia) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $645Non-Members: $745* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. Singapore SEMI.org [email protected] Asia/Singapore public Mar 7, 2025 Asia/Singapore Sold Out

United States Overview of Semiconductor 4/21 Training

Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

• Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and ecosystem of the semiconductor industry
• Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
• Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

• Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
• Process Nodes: Process nodes and their impact on device performance and cost
• Device Physics and Transistor Operation: Principles of device operation and transistor functionality
• Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
• Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
• Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
• Wafer Processing:
  • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
  • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
  • Etching and Cleaning Processes: Plasma and wet etching processes
  • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
  • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
  • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
  • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
  • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
• Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

Apr 21, 2026 - Apr 22, 2026 SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Dates and Times

April 21 7:30 - 3:00 PT

April 22 7:30 - 1:30 PT

Pricing

Early Bird Special! $100 off

• Members: $995 $895
• Non-Members: $1,095 $995

 * Group pricing for up to 20+ attendees: $12,900
Any questions, please contact [email protected]

Overview of Semiconductor Manufacturing

Webinar - Americas

7:30 am - 3:00 pm Off Add to Calendar 2026-04-21 07:30:00 2026-04-22 15:00:00 Overview of Semiconductor Manufacturing (Americas) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.Dates and TimesApril 21 7:30 - 3:00 PTApril 22 7:30 - 1:30 PTPricingEarly Bird Special! $100 offMembers: $995 $895Non-Members: $1,095 $995 * Group pricing for up to 20+ attendees: $12,900Any questions, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public Mar 24, 2026 America/Los_Angeles Register Now

United States Laser Annealing Graphic Featured Speakers

Laser Annealing: Revolutionizing Sensor and Semiconductor Manufacturing

 

3D-Micromac, a leader in high-precision laser-based semiconductor processing and micromachining, has consistently adapted to meet evolving market demands. As the need for greater precision and efficiency in semiconductor and sensor technology grows, traditional production methods began to show their limitations. To address these challenges, 3D-Micromac has applied its laser technology expertise to develop selective laser annealing, offering innovative solutions that enhance both production quality and efficiency while also enabling the creation of entirely new products.

Laser annealing offers a transformative alternative to conventional annealing methods, particularly in the production of Giant Magnetoresistance (GMR) and Tunneling Magnetoresistance (TMR) sensors. Traditional techniques, such as large magnetic annealing furnaces, significantly limit the throughput for complex sensor designs and increase production costs. The furnace approach also introduces potential yield losses due to its inherent processing complexity.

In contrast, selective laser annealing enables heating only illuminated wafer areas and not the entire wafer to provide extremely precise process control and enable closer placement of sensors to logic elements, laying the foundation for an integrated, monolithic sensor design (Fig. 1). This laser-based sensor programming enables a one-step process, eliminating the need for additional production steps such as dicing or chip transfer, which results in higher throughput and reduced costs.

Another semiconductor processing application that benefits from laser annealing is ohmic contact formation, which is a critical and challenging step in manufacturing silicon carbide (SiC)-based power devices. Traditionally, rapid thermal processing (RTP) has been used to generate well-controlled silicide interfaces because of its small thermal budget, but even RTP limitations become evident as SiC devices become thinner. Pulsed laser sources offer extremely small thermal budgets which enable ohmic contact formation on thinned SiC substrates resulting in superior device performance.

Both of these applications have already been successfully implemented in industrial machining solutions by 3D-Micromac. This webinar will provide in-depth insights into the processes and results (Fig. 2), while also exploring potential new applications of selective laser annealing. This innovative approach enhances device quality and streamlines manufacturing, marking a significant shift towards more efficient and cost-effective production methods in the sensor and semiconductor industries.

 

Fig. 1. Comparison traditional approach vs. selective laser annealing approach in magnetic sensor annealing

 

Fig. 2. Result of backside annealing for ohmic contact formation: SEM of Ni_xSi_y interface showing outstanding homogeneity

 

 

 

FEATURED SPEAKER

 

Maurice Clair | Team Lead Technology & Innovation Management

Maurice Clair studied Mechanical Engineering at the University of Technology Chemnitz (Germany). He joined 3D-Micromac in 2005 as a development engineer and is now team leader of the technology and innovation management department. In his current role, he serves as the technical lead for ohmic contact formation on SiC (silicon carbide) materials, a critical area in advancing semiconductor technologies.

Through his expertise in laser technologies, he has been instrumental in the development of innovative laser micromachining processes, including: laser trimming techniques for fine-tuning electronic components with both digital and analogue approaches and beam shaping for ultra-short pulsed lasers.

 

 

 

 

United States

Dec 4, 2024 MSIG Off Add to Calendar 2024-12-04 00:00:00 2024-12-04 00:00:00 Laser Annealing: Revolutionizing Sensor and Semiconductor Manufacturing United States SEMI.org [email protected] America/Los_Angeles public Nov 8, 2024 Register

Closed Cancellation Policy

United States Plasma Etching, ALE, & Rie

Course Description

The instructor discusses the applied aspects of plasma-assisted etching from a general point of view. The emphasis is on mechanistic understanding. The etching of Si and its compounds is covered in detail. The chemistries used in the etching of other technology-related materials such as Al, organics, and III-V compounds are summarized. Other topics presented include selectivity, loading, ARDE and feature scale problems, damage, and issues associated with high-density plasma RIE. A section on plasma diagnostics and ion-beam based etching methods is briefly discussed. 

Learning Objectives

• Understand the fundamentals of dry etching and the basic concepts of plasma etching

Who Should Attend

This course is intended for scientists, technicians and others working with or interested in the dry etching of materials in reactive gas glow discharges, particularly those who do not have extensive experience in the field. 

Instructor

Richard Beaudry

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

Feb 4, 2025 - Feb 5, 2025 SEMI U

This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. 

Pricing

• Members: $845
• Non-Members: $945

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

Plasma Etching, ALE, & RIE

Virtual Training - US & EU

8:00 am - 12:00 pm Off Add to Calendar 2025-02-04 08:00:00 2025-02-05 12:00:00 Plasma Etching, ALE, & RIE (Virtual Training, US & EU) This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. PricingMembers: $845Non-Members: $945* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public Feb 4, 2025 America/Los_Angeles Closed