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Featured Speakers

Virtual Global Smart Manufacturing Conference Event Guide

 

 

 

 

 

 

 

 

 

Globalized supply chains, combined with limited travel and access to experts, has led to rapid acceleration in implementations of smart manufacturing strategies. These systems are focused on improving things such as:

• Quality and yield
• Efficiency
• Security and safety
• Optimizing manufacturing cost

This inaugural Global SEMI Smart Manufacturing event brought together experts around the world to share strategies and best practices for professionals improving their manufacturing data capture & analysis and maintaining business continuity, while meeting increasing demands of customers.

The Virtual Conference includes:

• 6 Keynotes 
• 6 Tutorials
• 6 Case Studies

Want to hear about all of our Smart Manufacturing Activities?  Register for the Interest List.

For more information contact Ayo Kajopaiye at [email protected].

United States

Oct 23, 2020 - Nov 23, 2020 FOA ITL Standards

The [LIVE] event is over, but the presentations and content remains fresh and applicable via the ON DEMAND platform.  To access the information, just register for the event and click on the Agenda for access to the presentations.

Content available until November 23, 2020

Global Smart Manufacturing Conference

Sensing, Connecting & Predicting for Capturing the ROI of Smarter Manufacturing

12:00 am - 12:00 am Off Add to Calendar Disabled Jun 2, 2021 America/Los_Angeles

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

The course explores how reliability testing plays a critical role for Flexible Hybrid Electronics throughout the development process. The presentation highlights how it is essential to create a reliability test plan that covers the requirements for EV, DV and finally though PV, in order to insure product reliability and performance.

The instructors discuss how the Molex design process is used to identify risks and challenges for custom FHE applications and how the various reliability test are used evaluate and eliminate the potential risk and challenges.

AGENDA

• Overview of Molex Printed Circuits Solutions
• FHE challenges & requirements
• Overview of reliability testing development process
• Reliability test standards
• Reliability lab set up
• Q&A

The various industry standards related to HMI, FHE, PE, Printed Sensors and other applications are also reviewed in conjunction with usage in reliability testing related to FHE.

Instructors Tom Seputis, Lab Manager, and Dave Rasmussen. Director, PCS Engineering, as they provide an overview of Molex Printed Circuit Solutions and the reliability testing and challenges related to Flexible Hybrid Electronics.

This Master Class is 4th in a series of 4 classes. Classes 1-3, and the series are also available On Demand at the following links:  

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#3 Integration Techniques for Flexible Electronics

Read more about the full Master Class Series

United States

Dave Rasmussen

Director of PCS Engineering

Molex

Tom Seputis

Lab Manager

Molex

Oct 21, 2020 - Jul 31, 2021

Flexible Electronics Master Class #4 explores best practices for ensuring reliability of FHE devices throughout the production process. The course is taught by experts from Molex's Printed Circuit Solutions Division which has been successfully building complex and reliable flexible circuits for many advanced applications.

Flexible Electronics Reliability Testing and Challenges

A Flexible Electronics Master Class

12:00 am - 12:00 am Off Add to Calendar Disabled Nov 2, 2020 America/Vancouver

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

This Master Class is 3rd in a series of 4 classes.  Classes 1 and 2 are available On Demand.  Class 4 will be announced shortly.

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#4 Reliability Measurement and Test for Flexible Electronics

United States

Robert Street

Fellow, Palo Alto Research Center

Sep 24, 2020

The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

 

HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS

A Flexible Electronics Master Class

10:00 am - 12:00 pm Off Add to Calendar 2020-09-24 10:00:00 2020-09-24 12:00:00 Flexible Electronics Master Class#3: Integration The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.   United States SEMI.org [email protected] America/Vancouver public Aug 31, 2020 America/Vancouver

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

This Master Class is 3rd in a series of 4 classes.  Classes 1 and 2 are available On Demand.  Class 4 will be announced shortly.

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#4 Reliability Measurement and Test for Flexible Electronics

United States

Robert Street

Fellow, Palo Alto Research Center

Sep 24, 2020

The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

 

HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS

A Flexible Electronics Master Class

10:00 am - 12:00 pm Off Add to Calendar 2020-09-24 10:00:00 2020-09-24 12:00:00 Flexible Electronics Master Class#3: Integration The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.   United States SEMI.org [email protected] America/Vancouver public Aug 31, 2020 America/Vancouver

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

Specific topics covered in this course include:

• printing interconnects
• printing fine lines, pads and pad pitches with < 100um
• logic circuits and resistors
• bonding integrated circuits
• integrating sensors of different types on flexible substrates without significant performance degradation
• pick and place with micron-level accuracy

MASTER CLASS SERIES

This Master Class is 3rd in a series of 4 classes.  Classes 1 and 2 are available On Demand.  Class 4 will cover Building in Reliability Testing and is now available for registration.

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#4 Overview of FHE Reliability Testing and Challenges 

Read more about the full Master Class Series

United States

Robert Street

Fellow, Palo Alto Research Center

Sep 24, 2020 - Jul 31, 2021

The 1-hour class describes techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS

A Flexible Electronics Master Class

12:00 am - 12:00 am Off Add to Calendar Disabled Nov 2, 2020 America/Vancouver

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States SEMI Standards PV and PV Materials China Joint TC Chapter Spring Meeting 2020 Business Technical Featured Speakers

This course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

Cornell University has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano ElectroMechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. This presentation highlights that, as well as a decision tree based AI model for predicting lithography outcomes.

The AI work used as the basis for the course has been applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience have been developed.

The course provides a useful basis upon which to formulate AI strategies for all thin film manufacturing sites.

United States

Robert Street

Fellow, Palo Alto Research Center

Chris Ober

Cornell University

Peter Doerschuk

Cornell University

Benyamin Davaji

Cornell University

Garry Bordonaro

Cornell NanoScale Facility

Jeremy Clark

Cornell NanoScale Facility

Aug 18, 2020 FlexTech

This on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

Artificial Intelligence in Thin Film Manufacturing

A Flexible Electronics Master Class

10:00 am - 12:00 pm Off Add to Calendar 2020-08-18 10:00:00 2020-08-18 12:00:00 Flexible Electronics Master Class#2: AI in Mfg This on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability. United States SEMI.org [email protected] America/Vancouver public Aug 20, 2020 America/Vancouver

Registration Includes: 

• Live access to one webinar (register separately for each in series)
• Post-webinar access to recording

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States SEMI Standards PV and PV Materials China Joint TC Chapter Spring Meeting 2020 Business Technical Featured Speakers

This course describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

The team from Cornell has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano ElectroMechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. We report on a decision tree based AI model for predicting lithography outcomes.

This work is being applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience are developed.

Read more about the full Master Class Series

United States

Robert Street

Fellow, Palo Alto Research Center

Chris Ober

Cornell University

Peter Doerschuk

Cornell University

Benyamin Davaji

Cornell University

Garry Bordonaro

Cornell NanoScale Facility

Jeremy Clark

Cornell NanoScale Facility

Aug 18, 2020 - Jul 31, 2021 FlexTech

This course describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

Originally recorded August, 2020, this course is now offered On-Demand.

Artificial Intelligence in Thin Film Manufacturing

A Flexible Electronics Master Class

12:00 am - 12:00 am Off Add to Calendar Disabled Jul 25, 2022

Member Price:  $75

Non-Member Price:  $147

Non-Member Price for Government, Military, and Academia Non-Members:  $99

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Watch on-demand

United States Watch Now SEMI & FlexTech Technical Featured Speakers

#1 Flexible Power Sources (1.5 hours)

As new materials and process emerge to enable the integration of high performance micro-electronics into paper-thin, flexible hybrid electronics (FHE), there is an increasing demand for new power sources that also support the goals of ultra-thin and flexible.

Among the key challenges is the ability to achieve high energy densities as the battery thickness decreases to a point where the packaging becomes an increasing fraction of the total volume. The challenge is further complicated by the demanding duty cycles for many FHE systems that require both high power (periodic, large current bursts) and high energy  (operation across many years in some cases).

At the same time, the new power sources must meet the typical high standards for safety, durability, compatibility with a wide range of storage and operation temperatures, and the needs to support effective integration into the FHE platforms.

The session reviews the challenges and progress for new power supplies that are emerging to meet the needs of the FHE community.

Course provided by Brian Berland, Chief Technology Officer, ITN Energy Systems

#2 AI in Thin-Film Manufacturing (2 hours)

This session describes how machine learning and AI-based approaches to research, development, and production brings advantages to clean room processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

The team from Cornell University has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano Electro Mechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. The work is applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience are developed and explained in this session.

Course instructors includes Amit Lal, Chris Ober, Peter Doerschuk, Banyamin Davaji from Cornell University, and Garry Bordonaro and Jeremy Clark with the Cornell NanoScale Facility.

#3 Hybrid Integration Techniques for Flexible Electronics (1.5 hours)

The 1-hour class describes techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

Specific topics covered in this session include:

• printing interconnects
• printing fine lines, pads and pad pitches with < 100um
• logic circuits and resistors
• bonding integrated circuits
• integrating sensors of different types on flexible substrates without significant performance degradation
• pick and place with micron-level accuracy

Course instruction given by Robert Street, Palo Alto Research Center

#4 Flexible Electronics Reliability Testing and Challenges (1.5 hours)

This online Reliability Engineering Master class is for people with an engineering or science background, who want to learn and use methods and techniques to conduct reliability analysis and improvement. This course is intentionally structured to show you a wide variety of reliability engineering knowledge and important applications.

This session outlines the foundation reliability engineering concepts and methods, and how to apply fundamental failure investigation techniques. You will also learn a range of effective workplace improvement solutions and risk analyses used to implement reliability engineering strategies.

Course Instruction given by Dave Rasmussen and Tom Seputis, Molex.

Flexible Hybrid Master Classes for 2021 are offered on many additional topics!  Visit this page for entire list and links to more detailed information on each one.

United States

Brian Berland

Chief Technology Officer, ITN Energy Systems

Amit Lal

Cornell University

Chris Ober

Cornell University

Peter Doerschuk

Cornell University

Benyamin Davaji

Cornell University

Garry Bordonaro

Cornell NanoScale Facility

Jeremy Clark

Cornell NanoScale Facility

Robert Street

Palo Alto Research Center

Dave Rasmussen

Molex

tom seputis

molex

Jul 21, 2020 - Jul 31, 2021 FlexTech

SEMI FlexTech organizes this series of Flexible Electronics Master Classes on topics proving most challenging to the design, manufacture and use of flexible and printed electronics. The series enables product designers, integrators, and others new to the fields to evaluate technologies and components and make the best choices for their product.

The courses were offered to a live audience July-October, 2020, and are now available on-demand.

Flexible Electronics Master Class Series

Power Sources, Integration & AI and Reliability in Thin-Film Manufacturing

Off Add to Calendar Disabled Apr 30, 2026 America/Vancouver

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Watch Now SEMI & FlexTech Technical Featured Speakers

Master Class Abstract: As new materials and process emerge to enable the integration of high performance micro-electronics into paper-thin, flexible hybrid electronics (FHE), there is an increasing demand for new power sources that also support the goals of ultra-thin and flexible.

Among the key challenges is the ability to achieve high energy densities as the battery thickness decreases to a point where the packaging becomes an increasing fraction of the total volume. The challenge is further complicated by the demanding duty cycles for many FHE systems that require both high power (periodic, large current bursts) and high energy  (operation across many years in some cases).

At the same time, the new power sources must meet the typical high standards for safety, durability, compatibility with a wide range of storage and operation temperatures, and the needs to support effective integration into the FHE platforms.

The webinar will review challenges and progress for new power supplies that are emerging to meet the needs of the FHE community.

United States

Brian Berland

Chief Technology Officer, ITN Energy Systems

Jul 29, 2020 FlexTech

SEMI FlexTech offers a series of Flexible Electronics Master Classes on topics proving most challenging to the use of flexible and printed electronics. The series enables product designers, integrators, and others new to the fields to evaluate technologies and components and make the best choices for their product.

The first course in the series is on Flexible Power Sources: Challenges, Progress and Integration. This course was offered to a live audience on July 29, 2020, and is now available on-demand.

Flexible Power Sources: Challenges, Progress, and Integration

The first in the FlexTech Master Class Series

11:00 am - 12:00 pm Off Add to Calendar Disabled Oct 19, 2020 America/Vancouver

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Watch Now SEMI & FlexTech Technical Featured Speakers

Master Class Abstract: As new materials and process emerge to enable the integration of high performance micro-electronics into paper-thin, flexible hybrid electronics (FHE), there is an increasing demand for new power sources that also support the goals of ultra-thin and flexible.

Among the key challenges is the ability to achieve high energy densities as the battery thickness decreases to a point where the packaging becomes an increasing fraction of the total volume. The challenge is further complicated by the demanding duty cycles for many FHE systems that require both high power (periodic, large current bursts) and high energy  (operation across many years in some cases).

At the same time, the new power sources must meet the typical high standards for safety, durability, compatibility with a wide range of storage and operation temperatures, and the needs to support effective integration into the FHE platforms.

The webinar reviews challenges and progress for new power supplies that are emerging to meet the needs of the FHE community.

Read more about the full Master Class Series

United States

Brian Berland

Chief Technology Officer, ITN Energy Systems

Jul 29, 2020 - Jul 31, 2021 FlexTech

SEMI FlexTech offers a series of Flexible Electronics Master Classes on topics proving most challenging to the use of flexible and printed electronics. The series enables product designers, integrators, and others new to the fields to evaluate technologies and components and make the best choices for their product.

The first course in the series is on Flexible Power Sources: Challenges, Progress and Integration. This course was offered to a live audience on July 29, 2020, and is now available on-demand.

Flexible Power Sources: Challenges, Progress, and Integration

The first in the FlexTech Master Class Series

12:00 am - 12:00 am Off Add to Calendar Disabled Nov 2, 2020 America/Vancouver