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Malaysia Singapore APS Workshop Mar 2024 Executive Technical

Supporting Partners

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This course will cover:

  • Evolution of IC Packaging – Fan-in, Fan-out WLP, Embedded Packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc.
  • Principles of Interconnects ranging from TAB, Wirebond to various Flip Chip bonding such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development
  • Board level assembly and its soldering materials and failure mechanisms for 2nd level interconnect
  • Overview of interposer of lead frame, ceramic, flex to BT substrates for Microelectronics Packaging
  • Assembly flow and new assembly techniques such as stealth dicing, compression molding, underfill molding etc., and its assembly materials for Microelectronics packaging
  • Material characterization from bulk to interfaces for Microelectronics packaging

Why should I attend?

  • Gain technical knowledge for industry professionals
  • Enhance knowledge in manufacturing and R&D know-how in IC packaging
  • Apply Key Technical Concepts in Problem Solving through Real Case Studies
  • Networking opportunities with industry peers

Who should attend?

  • Beneficial for directors, managers, process & equipment engineers, R&D engineers and Quality & Reliability engineers working in the areas of microelectronics packaging
  • Useful for sale or application engineers who supply packaging materials and tools to the industry

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Penang Business Summit Seminar 1: Advanced Packaging

Royale Chulan Penang
No 1 & 2, Pengkalan Weld, Georgetown
10300 Penang
Pulau Pinang
Malaysia

Image of Dr Lee Teck Kheng
MEET OUR SPEAKER
Dr. Lee Teck Kheng
Director, Technology Development Centre, Institute of Technical Education Singapore,
SEMI SEA Advance Packaging Technical Committee Member
9:00 am

Introduction to IC Packaging & Interconnects

Introduction to IC Packaging
• Functions of Packaging – Mechanical, Material, Electrical and Chemical
• Review of Packaging Trend – BGA, CSP, Fan-in & Fan-out WLP, 3D Packaging, SoC vs SiP etc
• Challenges in Assembly and Packaging

Interconnects
• Overview
• TAB Bonding
• Wirebonding – Ultrasonic, Thermocompression, Thermosonic mechanisms
• Flip Chip Bondings – Thermocompression, C4, Re-cap reflow, solid-state, ACF, Conductive paste bonding

12:00 pm

Lunch

1:00 pm

Board Assembly and Soldering & PCB and IC Carriers

Board Assembly and Soldering
• Through Hole & SMT – Stencil Print Process, Reflow Profile
• Solder Materials – Alloy, Flux, Solvents, self-alignment effect
• Pb Free Solder – Ternary phase diagram, SnAgCu
• Intermetallics and Growth – Diffusion mechanism, Arrhenius equation
• Testing and Reliability – Ball shear & pull failure strength and modes, Fatigue, Weibull distribution

PCB and IC Carriers
• PCB Technology – Material properties, PCB fabrication process, drilling, patterning, plating, solder resist, laminating
• IC Carriers – Design rule, Leadframe, LTCC, Flex and BT substrates
• Substrate Development

4:00 pm

Q&A | Case Studies

5:00 pm

End of Day 1

9:00 am

Assembly Process

• Thickness Reduction – Grinding, Lapping, Polishing, CMP
• Dicing/Singulation – Blade, Laser, Stealth dicing, Dicing after grind
• Die Attach – Eutectic bonding, DA materials, Collets
• Plasma – Argon, Oxygen plasma, Surface tension
• Encapsulation – Mold constitutes and properties, Transfer, Film and compression molding, Dam and fill
• Plating – Solder plating, NiPd finish, PPF
• Trim & Form – ESD, Lead formation, Spring back mechanism

12:00 pm

Lunch

1:00 pm

Material Characterization Techniques

• Introduction
• Bulk Material Characterization – Stress strain, Bending, Impact toughness, TGA, DSC, TMA, DMA
• Interfaces Characterization – Failure mode and strength, Wire pull, Ball pull, Double cantilever bending, Die shear, Mold button shear, Ball shear

2:30 pm

Q&A | Case Studies

3:30 pm

Lucky Draw

3:35 pm

End of Workshop

Note: Program is subject to changes.

Seminar 1 and Seminar 2 timing will overlap on 7 Mar .

- APHI Workforce Development

Advanced Packaging and Material Characterization

*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar

 

Participating Fee:

Usual Member Rate: SGD 750 
Usual Non-member Rate: SGD 935 

*The above rates are inclusive of coffee/tea breaks and luncheon for both days

Register before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates.

 

A certificate of completion will be awarded at the end of the seminar.

 

HRD Corp Logo
 

*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).
For HRDC claims, please refer to the following links on the claiming matrix and guidelines:

 

Contact us for enquiries!

For Program: 

Ms. Cecelia Fong | [email protected] | +65.9750.2382 

For Registration / HRDC Claims: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

 

Off Add to Calendar 2024-03-06 00:00:00 2024-03-07 00:00:00 Penang Business Summit Seminar 1: Advanced Packaging Advanced Packaging and Material Characterization*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar Participating Fee:Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935 *The above rates are inclusive of coffee/tea breaks and luncheon for both daysRegister before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates. A certificate of completion will be awarded at the end of the seminar.  *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Ms. Cecelia Fong | [email protected] | +65.9750.2382 For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123  Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Asia/Kuala_Lumpur SOLD OUT
Belgium China France Germany Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Register Now EMG tile Business Executive Technical Featured Speakers

PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

This webinar will address the what, why, and how of PFAS in the semiconductor industry. Laurie Beu, noted semiconductor EHS consultant and leader of SIA’s Semiconductor PFAS Consortium, will provide an overview of PFAS materials, concerns about health effects, and the current state of regulatory response. Laurie’s talk will be followed by Ralph Dammel, Technology Fellow at EMD Electronics, who will provide insights from a materials manufacturer’s perspective on the use of PFAS in the multiple markets addressed by EMD. He will discuss the importance of PFAS in lithography chemicals, the impact of potential new regulations, and options to reduce or eliminate the use of PFAS in semiconductor applications.

Virtual, Online
United States

Laurie Beu
Laurie S. Beu, P.E.
Consultant
Laurie S. Beu Consulting
Ralph R. Dammel
Ralph R. Dammel
Technology Fellow, CTO Office
EMD Electronics
James Amano
Moderator
James Amano
Sr. Director, EHS
SEMI
EMG FOA Standards

PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector. 

 

10:00 am - 11:00 am Off Add to Calendar 2023-10-18 10:00:00 2023-10-18 11:00:00 Spelling semiconductors without “F” (luorine) PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue. Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector.    Virtual, Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Malaysia TTOC Website tile image (360 x 317 px) Business

Supporting Partner

Invest Penang
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Session Speaker: 

Mr. Tan Say Chuan

Principal Engineer, Intel Malaysia

Say Chuan is a Principal Engineer within Intel’s Network and Edge (NEX) Group, specializing in Edge AI solutions. He is focusing on ensuring AI applications from Intel’s customers are optimized on Intel Processor by providing technical advisory and technical support to the customer. 

 

Guest Speaker:

Mr. Ewe Kok Howg

Senior Director of Software Validation & Engineering, Intel Malaysia

Kok Howg has been with Intel for more than 24 years and currently leading the PID software validation team spread across all geo. Kok Howg is an advocate for AI development and acceleration within the organization and the local community. He has been involved in AI/Machine learning projects since 2013 including, anomaly detection in HVAC systems, and early involvement in autonomous driving etc.

 

Navy Specialty Coffee
72-1-23 & 23A, Arena Curve, Jalan Persiaran Mahsuri, Mk12, 11950 Bayan Lepas, Penang, Malaysia
11950 Penang
Malaysia

Thursday | 22 Aug

2:00 pm

Welcome Remarks & Introduction of Speaker

2:05 pm

SEMI Overview

2:20 pm

Demystifying AI: Unveiling Its Potential, Capabilities and Future Trajectories

Mr. Tan Say Chuan | Principal Engineer, Intel Malaysia

3:20 pm

"GenAI" Live Dialogue Session featuring Mr. Ewe Kok Howg

Speakers:
Mr. Tan Say Chuan | Principal Engineer, Intel Malaysia
Mr. Ewe Kok Howg | Senior Director of Software Validation & Engineering, Intel Malaysia

4:30 pm

Q&A

4:45 pm

Penang STEM Talent Blueprint

Ms. Chin Sook Cheng | Lead, Talent Programs, Invest Penang

5:05 pm

SEMI University

Ms. Cecelia Fong | Manager, Workforce & Talent Development, SEMI

5:30 pm

Evaluation & Plaque Presentation

5:45 pm

Lucky Draw & Closing Remarks

6:00 pm

Program End

Program is subject to change

Workforce Development

Demystifying AI: Unveiling Its Potential, Capabilities and Future Trajectories

Artificial intelligence (AI) is transforming industries and enhancing productivity and decision-making across diverse domains. This presentation provides an introduction to AI techniques and key concept, and demonstration of the GenAI platform.  We will explore its current capabilities and limitations, and also emerging trends and opportunities in AI. The presentation aims to establish a common understanding of AI while addressing concerns, so that the audience leaves better equipped to evaluate if and how AI can augment their work. 

 

Registration Fee: RM 120/pax (includes snacks, drinks and goodie bag)

Dress code: Smart Casual

Target Audience: Engineers < 5yrs of industrial experience

 

HRDC_2023

 

This event is HRDC Claimable for Malaysian Companies (Subject to T&C, please contact HRDC for more information)

For HRDC Claims, please refer to the following:

More Information: https://hrdcorp.gov.my/training-providers/ 

2:00 pm - 6:00 pm Off Add to Calendar 2024-08-22 14:00:00 2024-08-22 18:00:00 Tech Talk Over Coffee | Penang, Malaysia Demystifying AI: Unveiling Its Potential, Capabilities and Future TrajectoriesArtificial intelligence (AI) is transforming industries and enhancing productivity and decision-making across diverse domains. This presentation provides an introduction to AI techniques and key concept, and demonstration of the GenAI platform.  We will explore its current capabilities and limitations, and also emerging trends and opportunities in AI. The presentation aims to establish a common understanding of AI while addressing concerns, so that the audience leaves better equipped to evaluate if and how AI can augment their work.  Registration Fee: RM 120/pax (includes snacks, drinks and goodie bag)Dress code: Smart CasualTarget Audience: Engineers < 5yrs of industrial experience   This event is HRDC Claimable for Malaysian Companies (Subject to T&C, please contact HRDC for more information)For HRDC Claims, please refer to the following:HRDC Approval Letter for Tech Talk Over Coffee Allowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim HelperMore Information: https://hrdcorp.gov.my/training-providers/  Navy Specialty Coffee 72-1-23 & 23A, Arena Curve, Jalan Persiaran Mahsuri, Mk12, 11950 Bayan Lepas, Penang, Malaysia 11950 Penang Malaysia SEMI.org [email protected] Asia/Singapore public Asia/Singapore Sign Up
Belgium France Germany Ireland Italy United States Register Now MEMS Mfg Webinar 100823 Technical Featured Speakers
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Micro-electromechanical systems (MEMS) are revolutionizing how humans interact with the world. Atomic layer deposition (ALD) can be an enabling technology to improve performance of existing MEMS architectures and developing future devices.

Due to their digital growth nature, ALD processes provide a discrete and reproducible amount of film in each cycle. Multilayered films can be deposited to tune physical properties of the films, including dielectric properties, such as dielectric constant, leakage current, and breakdown voltage.  These “nanolaminate” barrier films can be produced by adding discrete layers of a 2nd metal oxide, like Al2O3 or ZrO2, to a primary dielectric, like HfO2. The multilayer technique can also be exploited to drastically improve moisture and oxygen barrier properties of ALD films over a bulk film and to tune the internal film stresses.

Whether using a single-wafer system or multi-wafer batch system, extremely low ALD deposition rates have made it difficult to implement ALD into high volume manufacturing. Another barrier to adoption of ALD in MEMS applications is the inefficiency of precursor usage, which leads to unacceptable operating costs.

In this webinar, Nano Forge will present how to use ALD to tune a few different thin film properties such as electrical barrier performance, gas diffusion barrier behavior, and internal film stress. A brief description of the differentiating features and product offerings in the ALDx toolset will also be discussed.

Forge Nano’s ALDx toolset offers the fastest and most efficient single-wafer system on the market, enabling ALD to be integrated earlier in the product development cycle.

Online, Virtual
United States

Paul Carey, SEMI
Moderator
Paul Carety
Director, MSIG
SEMI MSIG
Matt Weimer
Matt Weimer
Principal R&D Scientist
Forge Nano
MSIG

In this webinar, Forge Nano will present how to use Atomic Layer Deposition (ALD) to tune a few different thin film properties such as electrical barrier performance, gas diffusion barrier behavior, and internal film stress. This approach overcomes the perception of ALD as a barrier to high-volume manufacturing and as a material intensive process.  Join Paul Carey and Matt Weimer of Forge Nano to explore a new approach.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
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United States

Jennifer Braggin
Moderator
Jennifer Braggin
Director, Technology
Entegris
Soley Ozer, Intel
Dr. Soley Ozer
Strategic Assistant to Logic Technology Department GM
Intel
Stallar Jardine
Dr. Stallar Lufrano-Jardine
Sustainability & Supplier Diversity Program Manager
JSR Micro
EMG

In recent years, sustainability has emerged as a critical aspect of global development, demanding increased attention across industries. The semiconductor industry has a pivotal role to play in promoting environmental responsibility.

In this webinar we will hear the successes, challenges, and ongoing efforts from both a semiconductor device manufacturer and a semiconductor material supplier and how efforts across the supply chain influence each other. Join us as we foster knowledge sharing and collaborations to create a sustainable future for the semiconductor industry and the planet as a whole.

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles Register
Event format
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United States

Dilip Deshpande Beneq
Dilip Deshpande
Director, Business Development & Sales
Beneq
Paul Carey, SEMI
Moderator
Paul Carey
Sr. Director
SEMI MSIG
MSIG

Micro-electromechanical systems, or MEMS, constitute many devices that combine electrical and mechanical components, range in size from a few microns to millimeters, and are often fabricated using traditional semiconductor manufacturing processes. ALD builds material up Angstroms at a time with high conformality, even on complex geometries.

For MEMS and Sensor fabrication, including inkjet heads, pressure sensors, and microfluidics, ALD offers the most precision deposition technique on the market. Beneq ALD solutions include a wide range of materials and processes, making it simple to coat tiny, complicated components with anti-stiction, piezoelectric, or barrier films.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Vancouver
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SPEAKERS

 

Dr. Sreeni Rao has been in the MEMS sensing and semiconductor sector for the last 25 years, and has previously held technical and business leadership positions at Texas Instruments, IBM, Analog Devices, Qualtre, Inc., TDK and currently is GM, Gas and Environmental Sensing at Interlink Electronics. He has a PhD in ECE from University of California, Irvine and an MBA from Northeastern University. 

Radislav Potyrailo is a Principal Scientist at GE Research and the Chair of the Device Working Group of the MEMS and Sensors Industry Group. Radislav has been leading multiple programs for gas, chemical, and biological detection on inventing new sensing systems and bringing them from lab feasibility studies, to field validation, and to commercialization.  He has MS degree in Optoelectronics from Kyiv Polytechnic Institute and PhD in Analytical Chemistry from Indiana University. 

Ryotaro Sakauchi is a Senior Manager at Robert Bosch LLC and is responsible for Business Development of Bosch Sensortec’s MEMS sensors for the consumer market. He has been in the MEMS sensor sector for the last 13 years and has previously held technical and business positions at Bosch’s USA and Japan locations. He has a Bachelor’s degree of Liberal Arts from International Christian University in Japan.

Virtual, Online
United States

Paul Carey
Paul Carey
Sr. Director
SEMI MSIG
Sreeni Rao
Dr. Sreeni Rao
GM of Gas & Environmental Sensing
Interlink Electronics
Radislav Potyrailo
Radislav Potyrailo
Principle Scientist
GE Research
Ryotaro Sakauchi Bosch Sensortec
Ryotaro Sakauchi
Senior Manager Business Development
Bosch Sensortec
MSIG Standards

As miniature gas sensors become increasingly popular, especially for emerging applications, it is important for the gas sensor device community to adhere to standard ways of describing them. We propose that the first step in doing so is to standardize the set of functional parameters thatform the core of a gas sensor specification.

This presentation dives into the basic list of parameters, their definitions and measurement units, and where applicable, testing procedures, that we recommend be part of a standard gas sensor datasheet.

12:00 am - 12:00 am Off Add to Calendar Disabled America/Los_Angeles

Registration

  • SEMI Members: $999/person
  • Non-Members: $1,299/person

David Ghodsizadeh
[email protected]
Phone: 408-628-9401 

+
United States Register Silicon Chip FH Workshop Business Executive Featured Speakers
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Experience the industry through Listen, Discuss, See, Touch, and Learn activities and enjoy improved job satisfaction and operational efficiency.

Session 1: The Silicon Chip

  • "World in a Grain of Sand" Video
  • Industry chronology
  • The development of electronics from the thermionic valve to complex ICs
  • Semiconductor family tree
  • IC types (logic, memory, microprocessors)

Session 2: Basic Electronics

  • Introduction to electronics theory
  • Binary language & ASCII code
  • Semiconductor materials & their operation
  • The p-n junction & transistor operation
  • Boolean algebra & digital logic explained

Session 3: Semiconductor Manufacture

  • Industry structure
  • Polysilicon & silicon water production
  • Wafer fab/front-end process
  • Back-end (wafer probe, assembly, final test & finishing) operations
  • "Silicon Chip" video

Session 4: Economics of IC Manufacture

  • Wafer fab investment trends
  • Cost structure & cost models
  • Process yields & manufacturing defects
  • Die size & cost reduction issues
  • Back-end cost elements
  • Typical device costs

Session 5: IC Market Overview

  • Market segmentation
  • Company size
  • Packaging & technology trends
  • Industry learning curve
  • Industry cyclicality
  • Industry dynamics
  • Market outlook

Session 6: The IT Revolution

  • Impact of Information Technology
  • Market trends & industry outlook
  • Impact of microelectronics

 

More about the instructor:

Malcolm Penn is the founder of Future Horizons, a leading global semiconductor industry analyst. He has over 50 years’ experience in the semiconductor and electronics industry, from advanced research to manufacturing and applications.

SEMI
673 S. Milpitas Blvd
Milpitas, CA 95035
United States

Malcolm Penn, Chairman & CEO, New Horizons
Malcolm Penn
Chairman & CEO
Future Horizons

Gain a competitive edge in the Semiconductor Industry by learning how the IC industry works from the science that enables silicon chips to be made from sand to the market fundamentals that drive applications and economics.

This workshop is relevant to technical and non-technical professionals in the semiconductor and IT industry:

  • Sales, marketing, business development professionals
  • R&D, engineers, product managers,
  • Purchasing managers, finance, product planners
  • Human resources, recruitment and industry training personnel
  • Government officials, public/private investors
  • Media, PR and advertising organizations

Attendance is limited to 40 participants.

 

9:30 am - 4:00 pm Off Add to Calendar 2023-05-15 09:30:00 2023-05-15 16:00:00 Silicon Chip Industry Awareness Workshop Gain a competitive edge in the Semiconductor Industry by learning how the IC industry works from the science that enables silicon chips to be made from sand to the market fundamentals that drive applications and economics. This workshop is relevant to technical and non-technical professionals in the semiconductor and IT industry: Sales, marketing, business development professionals R&D, engineers, product managers, Purchasing managers, finance, product planners Human resources, recruitment and industry training personnel Government officials, public/private investors Media, PR and advertising organizations Attendance is limited to 40 participants.   SEMI 673 S. Milpitas Blvd Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

This webinar will be recorded. Registrants will receive a link to the recording after the event.

If you have any questions, please contact:

Paul Cohen
[email protected]

+
United States REGISTER NOW ESDA Export Regulations 360.jpg Business Executive Featured Speakers

The discussion will help attendees understand why and how governments implement trade controls, what “exports” are and how they take place in different business contexts, and common due diligence methods – such as customer screening – that United States companies use to incorporate regulatory compliance into their business processes. Finally, the discussion will address recent regulatory updates which address current issues such as US-China trade relations and the anticipated effects of those regulations on the US semiconductor design ecosystem.

Following the presentations we will address questions from attendees as time permits.

 

Meet the Speakers

Ada Loo
Ada Loo
Group Director and Associate General Counsel,
Cadence Design Systems
Biography

 

Ben Kallen

Ben Kallen
Senior Manager, Public Policy & Advocacy
SEMI
Biography

 

Marc Coldiron

Marc Coldiron
Director of Global Public Policy & Advocacy
SEMI
Biography

 

Peter Lichtenbaum
Partner
Covington
Biography

 

Lisa-Ann Johnson
Senior Associate
Covington
Biography 

Hosted by

SEMI ESDA                        

CA
United States

ESD Alliance

Join us as members of SEMI's Public Policy and Advocacy team will join representatives from Cadence Design Systems to host a webinar focused on export control policy—a topic which is especially relevant to the ESD Alliance given the global reach of the EDA industry. SEMI staff will contextualize export controls within the broader national political landscape and offer their perspective on what EDA companies can expect over the longer term. 

9:00 am - 10:30 am Off Add to Calendar 2026-06-11 09:00:00 2026-06-11 10:30:00 ESD Alliance Export Webinar Join us as members of SEMI's Public Policy and Advocacy team will join representatives from Cadence Design Systems to host a webinar focused on export control policy—a topic which is especially relevant to the ESD Alliance given the global reach of the EDA industry. SEMI staff will contextualize export controls within the broader national political landscape and offer their perspective on what EDA companies can expect over the longer term.  CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles 1
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United States Register Now 800x800 tile for EMG WEbinar Business Executive Featured Speakers
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United States

Claire Fonteno
Manager, American Technology Partnership
Claire Fonteno
Moderator
Brewer Science
Jason Bernstein
Jason Bernstein
Director of Global Affairs
American Chemistry Council
Dave Medeiros
Dave Medeiros
Senior Director of Engineering
Entegris
Kyle Liske
Kyle Liske
General Counsel
Arkema
EMG

The passage of the CHIPs Act and the Inflation Reduction Act have created opportunities and challenges for the semiconductor industry supply chain.  Join industry professionals as we discuss the implications of this legislation and how materials companies can make the most of it.

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles 2
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