In recent years, sustainability has emerged as a critical aspect of global development, demanding increased attention across industries. The semiconductor industry has a pivotal role to play in promoting environmental responsibility.
In this webinar we will hear the successes, challenges, and ongoing efforts from both a semiconductor device manufacturer and a semiconductor material supplier and how efforts across the supply chain influence each other. Join us as we foster knowledge sharing and collaborations to create a sustainable future for the semiconductor industry and the planet as a whole.
Push & Pull: How the Members of the Semiconductor Supply Chain Drive a Sustainable Future
Brought to you by the EMG Webinar Sub-Committee
10:00 am - 11:00 am
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Micro-electromechanical systems, or MEMS, constitute many devices that combine electrical and mechanical components, range in size from a few microns to millimeters, and are often fabricated using traditional semiconductor manufacturing processes. ALD builds material up Angstroms at a time with high conformality, even on complex geometries.
For MEMS and Sensor fabrication, including inkjet heads, pressure sensors, and microfluidics, ALD offers the most precision deposition technique on the market. Beneq ALD solutions include a wide range of materials and processes, making it simple to coat tiny, complicated components with anti-stiction, piezoelectric, or barrier films.
Atomic Layer Deposition (ALD) Solutions for MEMS and Actuators
An MSIG Sensors Manufacturing Webinar
8:00 am - 9:00 am
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Dr. Sreeni Rao has been in the MEMS sensing and semiconductor sector for the last 25 years, and has previously held technical and business leadership positions at Texas Instruments, IBM, Analog Devices, Qualtre, Inc., TDK and currently is GM, Gas and Environmental Sensing at Interlink Electronics. He has a PhD in ECE from University of California, Irvine and an MBA from Northeastern University.
Radislav Potyrailo is a Principal Scientist at GE Research and the Chair of the Device Working Group of the MEMS and Sensors Industry Group. Radislav has been leading multiple programs for gas, chemical, and biological detection on inventing new sensing systems and bringing them from lab feasibility studies, to field validation, and to commercialization. He has MS degree in Optoelectronics from Kyiv Polytechnic Institute and PhD in Analytical Chemistry from Indiana University.
Ryotaro Sakauchi is a Senior Manager at Robert Bosch LLC and is responsible for Business Development of Bosch Sensortec’s MEMS sensors for the consumer market. He has been in the MEMS sensor sector for the last 13 years and has previously held technical and business positions at Bosch’s USA and Japan locations. He has a Bachelor’s degree of Liberal Arts from International Christian University in Japan.
As miniature gas sensors become increasingly popular, especially for emerging applications, it is important for the gas sensor device community to adhere to standard ways of describing them. We propose that the first step in doing so is to standardize the set of functional parameters thatform the core of a gas sensor specification.
This presentation dives into the basic list of parameters, their definitions and measurement units, and where applicable, testing procedures, that we recommend be part of a standard gas sensor datasheet.
Gas Sensor Standard Overview - SEMI MS14
A SEMI Standards STEP Course
12:00 am - 12:00 am
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Experience the industry through Listen, Discuss, See, Touch, and Learn activities and enjoy improved job satisfaction and operational efficiency.
Session 1: The Silicon Chip
"World in a Grain of Sand" Video
Industry chronology
The development of electronics from the thermionic valve to complex ICs
Semiconductor family tree
IC types (logic, memory, microprocessors)
Session 2: Basic Electronics
Introduction to electronics theory
Binary language & ASCII code
Semiconductor materials & their operation
The p-n junction & transistor operation
Boolean algebra & digital logic explained
Session 3: Semiconductor Manufacture
Industry structure
Polysilicon & silicon water production
Wafer fab/front-end process
Back-end (wafer probe, assembly, final test & finishing) operations
"Silicon Chip" video
Session 4: Economics of IC Manufacture
Wafer fab investment trends
Cost structure & cost models
Process yields & manufacturing defects
Die size & cost reduction issues
Back-end cost elements
Typical device costs
Session 5: IC Market Overview
Market segmentation
Company size
Packaging & technology trends
Industry learning curve
Industry cyclicality
Industry dynamics
Market outlook
Session 6: The IT Revolution
Impact of Information Technology
Market trends & industry outlook
Impact of microelectronics
More about the instructor:
Malcolm Penn is the founder of Future Horizons, a leading global semiconductor industry analyst. He has over 50 years’ experience in the semiconductor and electronics industry, from advanced research to manufacturing and applications.
SEMI 673 S. Milpitas Blvd Milpitas, CA95035 United States
Malcolm Penn
Chairman & CEO
Future Horizons
Gain a competitive edge in the Semiconductor Industry by learning how the IC industry works from the science that enables silicon chips to be made from sand to the market fundamentals that drive applications and economics.
This workshop is relevant to technical and non-technical professionals in the semiconductor and IT industry:
Sales, marketing, business development professionals
R&D, engineers, product managers,
Purchasing managers, finance, product planners
Human resources, recruitment and industry training personnel
Government officials, public/private investors
Media, PR and advertising organizations
Attendance is limited to 40 participants.
Silicon Chip Industry Awareness Workshop
A one-day introduction to the Integrated Circuit (IC) Industry technology, manufacturing and markets
9:30 am - 4:00 pm
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Add to Calendar2023-05-15 09:30:002023-05-15 16:00:00Silicon Chip Industry Awareness WorkshopGain a competitive edge in the Semiconductor Industry by learning how the IC industry works from the science that enables silicon chips to be made from sand to the market fundamentals that drive applications and economics.
This workshop is relevant to technical and non-technical professionals in the semiconductor and IT industry:
Sales, marketing, business development professionals
R&D, engineers, product managers,
Purchasing managers, finance, product planners
Human resources, recruitment and industry training personnel
Government officials, public/private investors
Media, PR and advertising organizations
Attendance is limited to 40 participants.
SEMI 673 S. Milpitas Blvd Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
ESD Alliance Export Webinar
This webinar will be recorded. Registrants will receive a link to the recording after the event.
The discussion will help attendees understand why and how governments implement trade controls, what “exports” are and how they take place in different business contexts, and common due diligence methods – such as customer screening – that United States companies use to incorporate regulatory compliance into their business processes. Finally, the discussion will address recent regulatory updates which address current issues such as US-China trade relations and the anticipated effects of those regulations on the US semiconductor design ecosystem.
Following the presentations we will address questions from attendees as time permits.
Meet the Speakers
Ada Loo Group Director and Associate General Counsel, Cadence Design Systems Biography
Ben Kallen Senior Manager, Public Policy & Advocacy SEMI Biography
Marc Coldiron Director of Global Public Policy & Advocacy SEMI Biography
Join us as members of SEMI's Public Policy and Advocacy team will join representatives from Cadence Design Systems to host a webinar focused on export control policy—a topic which is especially relevant to the ESD Alliance given the global reach of the EDA industry. SEMI staff will contextualize export controls within the broader national political landscape and offer their perspective on what EDA companies can expect over the longer term.
ESD Alliance Export Webinar
Navigating Export Controls in EDA
June 11, 2026 | 9–10:30am PT | Virtual
9:00 am - 10:30 am
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Add to Calendar2026-06-11 09:00:002026-06-11 10:30:00ESD Alliance Export WebinarJoin us as members of SEMI's Public Policy and Advocacy team will join representatives from Cadence Design Systems to host a webinar focused on export control policy—a topic which is especially relevant to the ESD Alliance given the global reach of the EDA industry. SEMI staff will contextualize export controls within the broader national political landscape and offer their perspective on what EDA companies can expect over the longer term. CA United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
1
The passage of the CHIPs Act and the Inflation Reduction Act have created opportunities and challenges for the semiconductor industry supply chain. Join industry professionals as we discuss the implications of this legislation and how materials companies can make the most of it.
What's In it for Materials Companies?
CHIPs Act, Inflation Reduction Act, and Tax Incentives
10:00 am - 11:00 am
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Thermal Interface Materials (TIMs) come in a wide variety of options and are used in a range of applications. Thermal greases, phase-change materials, and silicon pads are just a few examples of TIMs that are used in today’s devices. Each has its own benefits and downsides, but they are all limited in their effectiveness in performing the one essential function of a TIM, conducting heat in an efficient manner. Zeon’s new technology combines the physical characteristics of an elastomer pad with the thermal benefits of a carbon filler to achieve a thermal conductivity of 38 W/mK, a value that is unmatched in the industry.
Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.
This webinar will focus on the performance and technology of such a material while also discussing how it can best benefit the MEMs and Sensors community by creating solutions to thermal problems plaguing the packaging space.
Speaker Bio
Nikhil Jani is a Business Development Specialist representing Zeon Specialty Materials, a San Jose based company and subsidiary of the Zeon corporation a company you may be familiar with for its widely used Electron Beam Resist ZEP520A. He studied Material Science and Engineering at Rutgers University with a focus on semiconductors and polymers. He has co-authored a paper on polymer nanocomposites titled “Non-Destructive Investigation of Dispersion, Bonding, and Thermal Properties of Emerging Polymer Nanocomposites Using Close-Up Lens Assisted Infrared Thermography”. Prior to joining Zeon, he had worked at Morgan Advanced Materials.
Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.
Join us for the 3rd in our Innovative Sensors Webinar Series to explore how Zeon has solved this perennial issue for electronics.
High Efficiency Thermal Interface Materials for the Next Generation of MEMs and Sensor Packages
The MSIG Advanced Sensor Webinar Series
8:00 am - 9:00 am
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Abstract: Quantum sensing often uses atomic systems in vapor phase. This talk will briefly review Twinleaf’s wafer-scale atomic vapor cell fabrication capabilities and some of the applications that have been addressed.
Speaker Bio: Dr. Kornack is an expert in the design, fabrication and operation of atomic magnetometers. At Twinleaf, he has commercialized a wide variety of high performance magnetic field sensors. As a graduate student and a postdoctoral research assistant working with the magnetometer research group at Princeton University, he developed the first laser zero-field SERF magnetometer. He has also developed co-magnetometers for use as a sensitive gyroscope and as a probe into fundamental laws of physics.
Laser Based Magnetic Field Sensor Formation for GMR / TMR Sensor Arrays
Dr. Dirk Lewke, Team Leader Technology Innovation Management
Abstract: This presentation provides a deep inside into a laser-based annealing technology for GMR/TMR sensors, which enables the programming of advanced sensor structures at wafer level. The key feature is the combination of reaching the Curie-Temperature by applying a selective laser spot and an in-situ rotatable magnetic field while wafer travelling at high speed. Unique single sensor field programming enables high quality sensor read-out repeatability.
Speaker Bio: Dr. Dirk Lewke studied mechatronic engineering at the University of Erlangen-Nuremberg. He received his doctorate in 2017. From 2011 to 2017 he worked at Fraunhofer IISB in the field of semiconductor manufacturing equipment as a scientist. Since 2017, Dr. Lewke has been working working at 3D-Micromac as a team leader for process development and technology manager for laser production equipment for semiconductor and photovoltaic industry.
We continue our Advanced Sensor webinar series with dual webinar presentations from technical leads at Twinleaf and 3D-Micromac, covering advanced magnetic sensor design and fabrication.
These amazing devices play a critical role in measuring what we cannot see by their ultra-sensitivity to magnetic currents. Thinking about adding a magnetic sensor to extend the functionality of your device? Then this is the webinar series for you.
Join these technology experts to see how magnetic sensors work, are built and how to utilize them in your products or research.
Design & Fabrication of Ultra-Sensitive Magnetic Sensors
The MSIG Advanced Sensors Webinar Series
8:00 am - 9:00 am
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Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.
Crocus has cracked the code to fabricating and integrating TMR sensors with its XtremeSense(tm) range of magnetic sensors. XtremeSense TMR technology is integrated in the back-end of a standard CMOS process on 8” and 12” wafers enabling single-die sensor products. In fact, Crocus has successfully shipped >100 Million ICs based on the XtremeSense process.
This webinar will focus on the principles of TMR sensor and the technology gains made by Crocus to enable Mass Production of TMR sensors.
Speaker Biography
Dr. Mohan is currently serving as VP of Engineering at Crocus Technology, a Silicon-Valley based Magnetic Sensor Company. He is responsible for Worldwide Applications Engineering and New Product Introduction. He has developed next generation of Integrated Magnetic Devices since 2007 and has 15+ granted patents in the field. Prior to joining Crocus Technology, he has worked at Texas Instruments, Maxim Integrated and Bosch Sensortec.
Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.
During this webinar, hear how Crocus Technology has cracked the code on fabricating and integrating TMR sensors.
Tunnel Magnetoresistance Sensors: From Concept to Commercialization
Innovations in Sensors Webinar Series
8:00 am - 9:00 am
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Add to Calendar2022-12-14 08:00:002022-12-14 09:00:00Tunnel Magnetoresistance Sensors WebinarTunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.
During this webinar, hear how Crocus Technology has cracked the code on fabricating and integrating TMR sensors.Virtual, Online United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
FEMC#13 FHE Market Forecast and Review
Registration
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that combines the best of conventional and printed circuitry. By enabling flexibility and digital manufacturing without compromising on processing capability, it promises to remove the constraints of rigid PCBs while reducing costs and hence enable new applications.
This webinar from Dr Matthew Dyson of IDTechEx provided the status of FHE, including examples that are already commercialized.
Standards and other attributes required for mass manufacturing was outlined, and the scope for FHE to be used for novel applications (including harsh environments) assessed. Finally, a roadmap covering the near, medium, and long term was presented, including how FHE development fits with the ongoing development of heterogeneous integration.
ABOUT THE SPEAKER
Matthew is a Senior Technology Analyst at IDTechEx, specializing in printed/organic/flexible/hybrid electronics and sensors. He has an MRes and PhD in Physics from Imperial College London, which aimed to better establish processing/structure/property relationships in organic semiconductors. This was followed by two years post-doctoral researcher at Eindhoven Technical University in the Netherlands, focusing primarily on organic photodetectors (OPDs). His academic research, which has been cited over 500 times, also included work on perovskite photovoltaics and aggregation induced emission materials.
At IDTechEx, Matthew analyses technical innovations and applications across the printed/flexible/hybrid landscape, attending multiple conferences and interviewing companies to establish a clear picture of the technical and commercial landscape. This analysis is published in reports on topics such as 3D electronics and printed/flexible sensors, and applied to consulting projects evaluating commercialization opportunities across printed/flexible electronics. He also manages a team of analysts covering wearable technologies, AR/VR, and emerging photovoltaics.
United States
Dr. Craig Milroy
National Research Council (NRC) Research Associate
This webinar featured Dr. Matthew Dyson of IDTechEx outlining the status of FHE, including examples that are already commercialized. Standards and other attributes required for mass manufacturing were discussed, and the scope for FHE to be used for novel applications (including harsh environments) assessed. In addition, he presented a roadmap covering the near, medium, and long term will be presented, including how FHE development fits with the ongoing development of heterogeneous integration.
FHE Market Forecast & Review
Flexible Electronics Master Class #13
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