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In today’s fast-paced and interconnected world, the electronics industry faces unprecedented challenges from global disruptions, geopolitical uncertainties, and supply chain vulnerabilities. To remain competitive and resilient, organizations must adopt robust risk management frameworks that proactively identify and mitigate risks.


This webinar is brought to you by the Resiliency Working Group, part of the SEMI Supply Chain Management Initiative. We will explore the creation and implementation of an industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Attendees will learn how to assess potential risks, develop mitigation strategies, and leverage cutting-edge tools to improve visibility and responsiveness across their supply networks.

Key topics include:


•     The critical risks impacting electronics supply chains and how to address them.
•     Best practices for building a resilient and adaptable risk management framework.
•     Strategies for real-time risk monitoring, supplier risk assessments, and scenario planning.
•     How to align your supply chain with industry standards for business continuity and operational stability.

Who should attend:


•    Supply chain managers
•    Risk officers
•    Operations executives
•    Anyone involved in supply chain planning and resilience in the electronics sector

Join us to discover actionable insights and practical approaches to future-proof your electronics supply chain, ensuring it remains resilient, efficient, and prepared for any disruption.
 

Speaker bio:

Austin Evans is the Director of Supply Chain Risk Management at Intel.  He is responsible for overseeing risk management for Intel’s supply chain as well as Intel’s Contingent Workforce Program Office.  His organization is responsible for business continuity, governance, resilience, supply chain security and compliance. 

United States

Austin Evans.jpg
Austin Evans
Director of Supply Chain Risk Management
Intel
Standards

Join us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring.

Off Add to Calendar 2024-10-24 00:00:00 2024-10-24 00:00:00 Building Resilient Supply Chains Join us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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United States AMFitz Webinar Featured Speakers
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Accelerating Piezoelectric MEMS Product Development with AMFitzgerald and MEMS Infinity

There is an increasing need for sensors and smart devices in optical communications, medical devices, automotive navigation and every market in between. MEMS technology is at the center of this groundswell, presenting new revenue opportunities to companies of all sizes.

As companies seek to push performance and manufacturing limits, a new generation of commercial MEMS devices that use piezoelectric thin films has been emerging. The global piezoelectric MEMS wafer volume is forecast to exceed 1.5M wafers per year or 30% of all MEMS wafers by 2029*.

Piezoelectric thin films, particularly PZT, are the new foundation for high-growth MEMS products like microspeakers and micromirrors, gas sensors, image stabilizers, and ultrasonic transducers.

An alliance between MEMS product development firm AMFitzgerald and foundry service MEMS Infinity, Sumitomo Precision Products, Co.,Ltd. is opening new paths for commercialization of PZT MEMS. Together, AMFitzgerald and MEMS Infinity offer an integrated design-to-production service that expedites commercialization by leveraging production-proven processes from day one. 

Join this webinar to learn:

  • Trends that are driving the adoption of PZT MEMS 
  • Why access to production-quality PZT is especially important for early-stage development
  • MEMS Infinity’s distinctive foundry service and PZT lineup for actuators, sensors, and transducers
    • 150mm and 200mm wafer lines
    • The world’s highest piezoelectric coefficient e31f for actuators
    • Combined high e31f and low relative permittivity for sensors and transducers
    • Extreme e31f using dual-layer PZT actuators
  • How to access the highest-quality PZT thin films for your product development

Status of MEMS Industry 2024. Yole Intelligence

United States

Andrew Fung, AM Fitzgerald and Associates
Andrew O. Fung, PhD
Director of Business Development
A. M. Fitzgerald & Associates
Mario Kiuchi, MEMS Infinity Sumitomo Precision Products
Mario Kiuchi, PhD
Manager, Design & Consulting Group
MEMS Infinity, Sumitomo Precision Products
MSIG

8:00 am - 9:00 am Off Add to Calendar 2024-09-18 08:00:00 2024-09-18 09:00:00 Accelerating Piezoelectric MEMS Product Development with AMFitzgerald and MEMS Infinity United States SEMI.org [email protected] America/Los_Angeles public Register here
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Belgium France Germany Ireland United States Register Now EAGS Image Business Executive Featured Speakers
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United States

Michael Doescher NXP
Michael Doescher
NXP
Mani Goswami, DuPont
Manibarsha Goswami
DuPont
Wojtek Lam
Wojtek Osowiecki
Lam Research
Justin Harris, CEC SEMI
Justin Harris
SEMI / Climate Equity Collaborative
Sustainability Workforce Development

Join this webinar to find out how companies across the semiconductor value chain are prioritizing employee-driven climate action and social impact,. Hear how employee-driven initiatives are enhancing sustainability and equity -- and gain ideas on how you and your organization might benefit.

With the Paris Climate Agreement and growing awareness of the climate crisis, many people are asking "how can I contribute in my private and professional life?"  

This Employee Action Workshop, organized by the Climate Equity and Social Impact (CESI) workgroup of SEMI will focus on setting up sustainability-based employee groups within your company. How to engage speakers and attendees, and the resources that exist to help.  

We will show you how to create an in-house, bottom-up sustainability network and offer concrete ideas for action. Industry leaders will share their experiences and successes, providing valuable insights into volunteerism, ESG innovation, and impactful employee initiatives.

For anyone who wants to use your biggest multiplier - your workplace - to make a difference in Climate Change.

This webinar takes place 8:00 AM - 9:00 AM Pacific Time Zone

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
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Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $75

Students:  Free

Contact [email protected] with a picture of your student ID to receive your discount code.

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Bio

The Department of Defense needs non-linear advances in gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiological changes present in human breath. Currently, fieldable instruments for gas analysis are large (>0.5 cubic feet), expensive (>$50,000), and slow. Hand-held devices are limited to identification of specific targets such as nitrogen oxide, oxygen, and carbon dioxide or generalized estimated concentration of total volatile organic compounds (VOCs). Biohybrid sensing involves combining biological sensory elements with electronic components in a SWaP-C solution for fast and accurate detection of VOCs. Unprecedented VOC sensing potential lies within the biological sense of olfaction, which boasts rapid, selective, and sensitive capability to identify hundreds of thousands of compounds in complex environments. However, there are currently no commercially available devices harnessing the capability of olfaction due to the challenges in the bioelectronic interfacing necessary for maintaining long-term stability and environmental conditions necessary to sustain olfactory signaling elements (whether it be at the organ-, cell-, or protein-level). This course will provide an overview of the current state of biohybrid VOC sensing comparing and contrasting examples utilizing olfactory organ/tissue-based, cell-based, and protein-based modalities.

ABOUT THE SPEAKER

Dr. Elisabeth Steele is a biomedical engineer at Blue Halo serving as a Lead Scientist and Team Lead supporting sensor development at the Air Force Research Laboratory (AFRL). Her expertise is in neural tissue engineering and electrophysiology with recent focus in the design and testing of biohybrid gas sensors inspired by insect olfaction. Dr. Steel conducted neuromodulation research as a post-doctoral fellow with Dr. Tim Bruns at the University of Michigan. Additionally, she served as a Technical Sales Engineer with NeuroNexus Technologies, the industry leader in microelectrode array technology for neuroscience electrophysiology applications. She received her PhD (2018) and M.S. (2013) in Biomedical Engineering from Wayne State University in Detroit, Michigan. She completed her B.S. in Bioengineering in 2007 from University of Toledo.  
 

United States

Dr. Elisabeth Steele
Dr. Elisabeth Steele
Lead Scientist and Team Lead
UES
Gity Samadi
Dr. Gity Samadi
Director, R&D Programs
SEMI
FlexTech

This webinar features Dr. Elisabeth Steele of UES covering the status of non-linear advances in gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiological changes present in human breath.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles Watch Now!
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United States Register Pulsus webinar Business Technical Featured Speakers
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Arjen Janssens, Senior Director PLD, Lam Research Corporation

 

Arjen Janssens initially worked on Pulsed Laser Deposition (PLD) during his Master’s Degree in Applied Physics at the University of Twente in 2001, and then during his internship at Stanford University on superconducting thin films.

 

 

Arjen started his career as a strategic consultant at Arthur D. Little, and after a year become a shareholder and consultant of Quintel Management Consultancy (spin-out of Arthur D. Little). In 2004 he started studying for his PhD. at the University of Twente, focusing on depositing Piezo materials with PLD. During his PhD, he completed the Executive MBA at TSM Business School of Technology, and co-founded Solmates. Currently Arjen is Senior Director PLD at Lam Research and is very proud of how the PLD technology has matured into a high-volume production system at Lam.

United States

arjen janssens
Dr. Arjen Janssens
MSIG

And yes, we’ve got a solution for that.

MEMS devices have become well established as critical components in a wide range of everyday applications. Accelerometers and gyroscopes improve safety in automotive applications, RF filters enable wireless connectivity in mobile phones, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart, consumer products.

Developers are now looking to the next generation of MEMS devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to Piezoelectric based MEMS devices that can offer a paradigm shift in capability.

In this webinar, discover Lam Research’s solution a pioneering approach to thin film deposition.

8:00 am - 9:00 am Off Add to Calendar 2024-03-27 08:00:00 2024-03-27 09:00:00 Enabling PiezoMEMS applications for today and tomorrow And yes, we’ve got a solution for that.MEMS devices have become well established as critical components in a wide range of everyday applications. Accelerometers and gyroscopes improve safety in automotive applications, RF filters enable wireless connectivity in mobile phones, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart, consumer products.Developers are now looking to the next generation of MEMS devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to Piezoelectric based MEMS devices that can offer a paradigm shift in capability.In this webinar, discover Lam Research’s solution– a pioneering approach to thin film deposition. United States SEMI.org [email protected] America/Los_Angeles public
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SEMI University celebrates its first anniversary! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.

Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "SEMI University - Introduction and 2024 Roadmap." This webinar promises to be an informative session where you'll gain insights into the latest updates, exciting live trainings, new certifications, and courses offered by SEMI U in 2024.  

During this webinar, you can expect to:  

  • Discover the latest updates and enhancements to SEMI U's course catalog.  
  • Learn about the exciting live, in-person training courses scheduled for spring of 2024.  
  • Get insights into new certifications and courses designed to keep you ahead in the industry.  
  • Gain access to a special 10% discount on ALL courses.  

Choose your session:

United States

Naresh Naik
Naresh Naik
Director, SEMI University
SEMI
Workforce Development

Join us to discover our current course offerings, upcoming additions, new certifications, and more! Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all our courses.

Off Add to Calendar 2024-03-19 00:00:00 2024-03-19 00:00:00 SEMI University - Introduction and 2024 Roadmap Join us to discover our current course offerings, upcoming additions, new certifications, and more! Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all our courses. United States SEMI.org [email protected] America/Los_Angeles public
Event format

Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $75

Students:  Free

Contact [email protected] with a picture of your student ID to receive your discount code.

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Bio

The healthcare industry has transformed over the last twenty-five years due to the co-development of diagnostics along with state-of-the-art therapeutics and treatments; notably, this has led to the field of companion diagnostics. The best example of this is the prescribed use of insulin based on glucose levels monitored via test strips or the continuous glucose monitor. The future goal of medicine is to have truly personalized treatment protocols based on an individual’s biometrics, physiology, and exposure.  

However, this goal requires further identification and quantitation of biomarkers and health exposures, both biological and chemical, both at the point-of-care as well as in real-time.  Therefore, technologies are needed that can miniaturize current diagnostics to make them inexpensive, simple-to-use, and ideally wearable. 

However, where and what to sense remains a critical question to solve, as each biofluid, including blood, sweat, saliva, tears, breath, and exhaled breath condensate contains a different profile of biomarkers. Additionally, biomarkers have vastly different physiochemical properties and abundances, which present different challenges as well as require a range of sensing modalities.  Therefore, this course will be an overview of the “What, Where, and How of Sensing to Meet Current and Future MedTech Needs”.  At the end of the course, a perspective of where these technologies can impact the future of health outcomes will be presented as well as key considerations for future technologies to gain commercial acceptance

ABOUT THE SPEAKER

Dr. Michael Brothers, PMP currently is a Principal Scientist and Technical Program Manager at UES, a Blue Halo Company. In these roles, Dr. Brothers supervises contractors executing research to identify biomarkers indicative of human performance, develop novel sensors, as well as field research. Dr. Brothers also serves as a subject matter expert on biochemical sensors, both in the liquid phase and gas phase, for the 711th Human Performance Wing at Wright Patterson Air Force Base. 

Notably, Dr. Brothers has co-authored multiple publications and patents on using novel sensing modalities to sense in complex fluids and environments, including jet fuel, sweat, saliva, and breath. Dr. Brothers has also served as the Principal Investigator on sensor development efforts for both optical based gas sensors and flexible, ink-printed gas sensors for wearable applications.  

Dr. Brothers has his Ph.D. from the University of Illinois Urbana-Champaign in Chemical Biology and his B.S. in Chemistry and Biology from the University of Cincinnati.  
 

United States

Dr. Michael Brothers
Dr. Michael Brothers
Principal Scientist and Technical Program Manager
UES, a Blue Halo Company
Gity Samadi
Dr. Gity Samadi
Director, R&D Programs
SEMI
FlexTech

This webinar featured Dr. Michael Brothers of UES, a Blue Halo Company, outlining the status of personalized medical treatment protocols based on an individual’s biometrics, physiology, and exposure. This course will be an overview of the “What, Where, and How of Sensing to Meet Current and Future MedTech Needs"

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles Watch Now
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United States Spectrochip tile Business Technical Featured Speakers

Kevin (Cheng-Hao) Ko received his Physics Ph.D. from State University of New York, Stony Brook (SUNY, Stony Brook) in 1995. During his thesis research, he worked at Beamline X1A of the National Synchrotron Light Source (NSLS) at Brookhaven National Laboratory (BNL) to construct the world's first Mult-channel Scanning Photoemission Electron Microscope (SPEM) by focusing soft X-rays using a zone plate under the supervision of Prof. Janos Kirz. After receiving his Ph.D. degree, he was invited by Taiwan Nation Synchrotron Radiation Research Center (NSRRC) to lead a team to develop X-ray Microcopy technology in Taiwan. By 1999 Ko’s team had successfully developed the world’s most advanced SPEM. After that, Dr. Ko started to devote his efforts to developing the SpectroChip technology. After nearly 20 years of research and development, Ko’s team was finally able to mass produce the SpectroChip using wafer-based methodology and founded the company SpectroChip, Inc. This technology received 9 national best innovation awards in Taiwan and one international best application award in Asia. To enable further global business development of the SpectoChip technology, in 2023, Dr. Ko and Dr. Sean Lin founded SPU System Inc.

United States

dr. ko
Dr. Kevin (Cheng-Hao) Ko
MSIG

SpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card.  It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology.  The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization.  This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.

In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology.

8:00 am - 9:00 am Off Add to Calendar 2024-02-21 08:00:00 2024-02-21 09:00:00 SpectroChip: an Optical System-on-Chip Enabling Ultra-Portable Devices for Broad Industrial Sensing Applications SpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card.  It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology.  The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization.  This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch On-demand
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Malaysia Singapore APS Workshop Mar 2024 Executive Technical

Supporting Partners

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Featured Speakers
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This course will cover:

  • Evolution of IC Packaging – Fan-in, Fan-out WLP, Embedded Packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc.
  • Principles of Interconnects ranging from TAB, Wirebond to various Flip Chip bonding such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development
  • Board level assembly and its soldering materials and failure mechanisms for 2nd level interconnect
  • Overview of interposer of lead frame, ceramic, flex to BT substrates for Microelectronics Packaging
  • Assembly flow and new assembly techniques such as stealth dicing, compression molding, underfill molding etc., and its assembly materials for Microelectronics packaging
  • Material characterization from bulk to interfaces for Microelectronics packaging

Why should I attend?

  • Gain technical knowledge for industry professionals
  • Enhance knowledge in manufacturing and R&D know-how in IC packaging
  • Apply Key Technical Concepts in Problem Solving through Real Case Studies
  • Networking opportunities with industry peers

Who should attend?

  • Beneficial for directors, managers, process & equipment engineers, R&D engineers and Quality & Reliability engineers working in the areas of microelectronics packaging
  • Useful for sale or application engineers who supply packaging materials and tools to the industry

BROWSE OUR PHOTO GALLERY

Penang Business Summit Seminar 1: Advanced Packaging

Royale Chulan Penang
No 1 & 2, Pengkalan Weld, Georgetown
10300 Penang
Pulau Pinang
Malaysia

Image of Dr Lee Teck Kheng
MEET OUR SPEAKER
Dr. Lee Teck Kheng
Director, Technology Development Centre, Institute of Technical Education Singapore,
SEMI SEA Advance Packaging Technical Committee Member
9:00 am

Introduction to IC Packaging & Interconnects

Introduction to IC Packaging
• Functions of Packaging – Mechanical, Material, Electrical and Chemical
• Review of Packaging Trend – BGA, CSP, Fan-in & Fan-out WLP, 3D Packaging, SoC vs SiP etc
• Challenges in Assembly and Packaging

Interconnects
• Overview
• TAB Bonding
• Wirebonding – Ultrasonic, Thermocompression, Thermosonic mechanisms
• Flip Chip Bondings – Thermocompression, C4, Re-cap reflow, solid-state, ACF, Conductive paste bonding

12:00 pm

Lunch

1:00 pm

Board Assembly and Soldering & PCB and IC Carriers

Board Assembly and Soldering
• Through Hole & SMT – Stencil Print Process, Reflow Profile
• Solder Materials – Alloy, Flux, Solvents, self-alignment effect
• Pb Free Solder – Ternary phase diagram, SnAgCu
• Intermetallics and Growth – Diffusion mechanism, Arrhenius equation
• Testing and Reliability – Ball shear & pull failure strength and modes, Fatigue, Weibull distribution

PCB and IC Carriers
• PCB Technology – Material properties, PCB fabrication process, drilling, patterning, plating, solder resist, laminating
• IC Carriers – Design rule, Leadframe, LTCC, Flex and BT substrates
• Substrate Development

4:00 pm

Q&A | Case Studies

5:00 pm

End of Day 1

9:00 am

Assembly Process

• Thickness Reduction – Grinding, Lapping, Polishing, CMP
• Dicing/Singulation – Blade, Laser, Stealth dicing, Dicing after grind
• Die Attach – Eutectic bonding, DA materials, Collets
• Plasma – Argon, Oxygen plasma, Surface tension
• Encapsulation – Mold constitutes and properties, Transfer, Film and compression molding, Dam and fill
• Plating – Solder plating, NiPd finish, PPF
• Trim & Form – ESD, Lead formation, Spring back mechanism

12:00 pm

Lunch

1:00 pm

Material Characterization Techniques

• Introduction
• Bulk Material Characterization – Stress strain, Bending, Impact toughness, TGA, DSC, TMA, DMA
• Interfaces Characterization – Failure mode and strength, Wire pull, Ball pull, Double cantilever bending, Die shear, Mold button shear, Ball shear

2:30 pm

Q&A | Case Studies

3:30 pm

Lucky Draw

3:35 pm

End of Workshop

Note: Program is subject to changes.

Seminar 1 and Seminar 2 timing will overlap on 7 Mar .

- APHI Workforce Development

Advanced Packaging and Material Characterization

*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar

 

Participating Fee:

Usual Member Rate: SGD 750 
Usual Non-member Rate: SGD 935 

*The above rates are inclusive of coffee/tea breaks and luncheon for both days

Register before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates.

 

A certificate of completion will be awarded at the end of the seminar.

 

HRD Corp Logo
 

*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).
For HRDC claims, please refer to the following links on the claiming matrix and guidelines:

 

Contact us for enquiries!

For Program: 

Ms. Cecelia Fong | [email protected] | +65.9750.2382 

For Registration / HRDC Claims: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

 

Off Add to Calendar 2024-03-06 00:00:00 2024-03-07 00:00:00 Penang Business Summit Seminar 1: Advanced Packaging Advanced Packaging and Material Characterization*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar Participating Fee:Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935 *The above rates are inclusive of coffee/tea breaks and luncheon for both daysRegister before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates. A certificate of completion will be awarded at the end of the seminar.  *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Ms. Cecelia Fong | [email protected] | +65.9750.2382 For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123  Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Asia/Kuala_Lumpur SOLD OUT
Belgium China France Germany Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Register Now EMG tile Business Executive Technical Featured Speakers

PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

This webinar will address the what, why, and how of PFAS in the semiconductor industry. Laurie Beu, noted semiconductor EHS consultant and leader of SIA’s Semiconductor PFAS Consortium, will provide an overview of PFAS materials, concerns about health effects, and the current state of regulatory response. Laurie’s talk will be followed by Ralph Dammel, Technology Fellow at EMD Electronics, who will provide insights from a materials manufacturer’s perspective on the use of PFAS in the multiple markets addressed by EMD. He will discuss the importance of PFAS in lithography chemicals, the impact of potential new regulations, and options to reduce or eliminate the use of PFAS in semiconductor applications.

Virtual, Online
United States

Laurie Beu
Laurie S. Beu, P.E.
Consultant
Laurie S. Beu Consulting
Ralph R. Dammel
Ralph R. Dammel
Technology Fellow, CTO Office
EMD Electronics
James Amano
Moderator
James Amano
Sr. Director, EHS
SEMI
EMG FOA Standards

PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector. 

 

10:00 am - 11:00 am Off Add to Calendar 2023-10-18 10:00:00 2023-10-18 11:00:00 Spelling semiconductors without “F” (luorine) PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue. Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector.    Virtual, Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles