Join this webinar to find out how companies across the semiconductor value chain are prioritizing employee-driven climate action and social impact,. Hear how employee-driven initiatives are enhancing sustainability and equity -- and gain ideas on how you and your organization might benefit.
With the Paris Climate Agreement and growing awareness of the climate crisis, many people are asking "how can I contribute in my private and professional life?"
This Employee Action Workshop, organized by the Climate Equity and Social Impact (CESI) workgroup of SEMI will focus on setting up sustainability-based employee groups within your company. How to engage speakers and attendees, and the resources that exist to help.
We will show you how to create an in-house, bottom-up sustainability network and offer concrete ideas for action. Industry leaders will share their experiences and successes, providing valuable insights into volunteerism, ESG innovation, and impactful employee initiatives.
For anyone who wants to use your biggest multiplier - your workplace - to make a difference in Climate Change.
This webinar takes place 8:00 AM - 9:00 AM Pacific Time Zone
How to Start & Grow an Employee Action Group for Sustainability
8:00 am - 9:00 am
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The Department of Defense needs non-linear advances in gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiological changes present in human breath. Currently, fieldable instruments for gas analysis are large (>0.5 cubic feet), expensive (>$50,000), and slow. Hand-held devices are limited to identification of specific targets such as nitrogen oxide, oxygen, and carbon dioxide or generalized estimated concentration of total volatile organic compounds (VOCs). Biohybrid sensing involves combining biological sensory elements with electronic components in a SWaP-C solution for fast and accurate detection of VOCs. Unprecedented VOC sensing potential lies within the biological sense of olfaction, which boasts rapid, selective, and sensitive capability to identify hundreds of thousands of compounds in complex environments. However, there are currently no commercially available devices harnessing the capability of olfaction due to the challenges in the bioelectronic interfacing necessary for maintaining long-term stability and environmental conditions necessary to sustain olfactory signaling elements (whether it be at the organ-, cell-, or protein-level). This course will provide an overview of the current state of biohybrid VOC sensing comparing and contrasting examples utilizing olfactory organ/tissue-based, cell-based, and protein-based modalities.
ABOUT THE SPEAKER
Dr. Elisabeth Steele is a biomedical engineer at Blue Halo serving as a Lead Scientist and Team Lead supporting sensor development at the Air Force Research Laboratory (AFRL). Her expertise is in neural tissue engineering and electrophysiology with recent focus in the design and testing of biohybrid gas sensors inspired by insect olfaction. Dr. Steel conducted neuromodulation research as a post-doctoral fellow with Dr. Tim Bruns at the University of Michigan. Additionally, she served as a Technical Sales Engineer with NeuroNexus Technologies, the industry leader in microelectrode array technology for neuroscience electrophysiology applications. She received her PhD (2018) and M.S. (2013) in Biomedical Engineering from Wayne State University in Detroit, Michigan. She completed her B.S. in Bioengineering in 2007 from University of Toledo.
This webinar features Dr. Elisabeth Steele of UES covering the status of non-linear advances in gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiological changes present in human breath.
Biohybrid Sensing Systems for Volatile Organic Compounds
Flexible Electronics Master Class #18
10:00 am - 12:00 pm
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Arjen Janssens, Senior Director PLD, Lam Research Corporation
Arjen Janssens initially worked on Pulsed Laser Deposition (PLD) during his Master’s Degree in Applied Physics at the University of Twente in 2001, and then during his internship at Stanford University on superconducting thin films.
Arjen started his career as a strategic consultant at Arthur D. Little, and after a year become a shareholder and consultant of Quintel Management Consultancy (spin-out of Arthur D. Little). In 2004 he started studying for his PhD. at the University of Twente, focusing on depositing Piezo materials with PLD. During his PhD, he completed the Executive MBA at TSM Business School of Technology, and co-founded Solmates. Currently Arjen is Senior Director PLD at Lam Research and is very proud of how the PLD technology has matured into a high-volume production system at Lam.
MEMS devices have become well established as critical components in a wide range of everyday applications. Accelerometers and gyroscopes improve safety in automotive applications, RF filters enable wireless connectivity in mobile phones, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart, consumer products.
Developers are now looking to the next generation of MEMS devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to Piezoelectric based MEMS devices that can offer a paradigm shift in capability.
In this webinar, discover Lam Research’s solution– a pioneering approach to thin film deposition.
8:00 am - 9:00 am
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Add to Calendar2024-03-27 08:00:002024-03-27 09:00:00Enabling PiezoMEMS applications for today and tomorrowAnd yes, we’ve got a solution for that.MEMS devices have become well established as critical components in a wide range of everyday applications. Accelerometers and gyroscopes improve safety in automotive applications, RF filters enable wireless connectivity in mobile phones, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart, consumer products.Developers are now looking to the next generation of MEMS devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to Piezoelectric based MEMS devices that can offer a paradigm shift in capability.In this webinar, discover Lam Research’s solution– a pioneering approach to thin film deposition.United StatesSEMI.org[email protected]America/Los_Angelespublic
SEMI University celebrates its first anniversary! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.
Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "SEMI University - Introduction and 2024 Roadmap." This webinar promises to be an informative session where you'll gain insights into the latest updates, exciting live trainings, new certifications, and courses offered by SEMI U in 2024.
During this webinar, you can expect to:
Discover the latest updates and enhancements to SEMI U's course catalog.
Learn about the exciting live, in-person training courses scheduled for spring of 2024.
Get insights into new certifications and courses designed to keep you ahead in the industry.
Gain access to a special 10% discount on ALL courses.
Join us to discover our current course offerings, upcoming additions, new certifications, and more! Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all our courses.
SEMI University - Introduction and 2024 Roadmap
Discover upcoming certifications, in-person trainings and new courses from SEMI University!
Webinar
March 19, 2024
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Add to Calendar2024-03-19 00:00:002024-03-19 00:00:00SEMI University - Introduction and 2024 RoadmapJoin us to discover our current course offerings, upcoming additions, new certifications, and more! Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all our courses.United StatesSEMI.org[email protected]America/Los_Angelespublic
The healthcare industry has transformed over the last twenty-five years due to the co-development of diagnostics along with state-of-the-art therapeutics and treatments; notably, this has led to the field of companion diagnostics. The best example of this is the prescribed use of insulin based on glucose levels monitored via test strips or the continuous glucose monitor. The future goal of medicine is to have truly personalized treatment protocols based on an individual’s biometrics, physiology, and exposure.
However, this goal requires further identification and quantitation of biomarkers and health exposures, both biological and chemical, both at the point-of-care as well as in real-time. Therefore, technologies are needed that can miniaturize current diagnostics to make them inexpensive, simple-to-use, and ideally wearable.
However, where and what to sense remains a critical question to solve, as each biofluid, including blood, sweat, saliva, tears, breath, and exhaled breath condensate contains a different profile of biomarkers. Additionally, biomarkers have vastly different physiochemical properties and abundances, which present different challenges as well as require a range of sensing modalities. Therefore, this course will be an overview of the “What, Where, and How of Sensing to Meet Current and Future MedTech Needs”. At the end of the course, a perspective of where these technologies can impact the future of health outcomes will be presented as well as key considerations for future technologies to gain commercial acceptance
ABOUT THE SPEAKER
Dr. Michael Brothers, PMP currently is a Principal Scientist and Technical Program Manager at UES, a Blue Halo Company. In these roles, Dr. Brothers supervises contractors executing research to identify biomarkers indicative of human performance, develop novel sensors, as well as field research. Dr. Brothers also serves as a subject matter expert on biochemical sensors, both in the liquid phase and gas phase, for the 711th Human Performance Wing at Wright Patterson Air Force Base.
Notably, Dr. Brothers has co-authored multiple publications and patents on using novel sensing modalities to sense in complex fluids and environments, including jet fuel, sweat, saliva, and breath. Dr. Brothers has also served as the Principal Investigator on sensor development efforts for both optical based gas sensors and flexible, ink-printed gas sensors for wearable applications.
Dr. Brothers has his Ph.D. from the University of Illinois Urbana-Champaign in Chemical Biology and his B.S. in Chemistry and Biology from the University of Cincinnati.
This webinar featured Dr. Michael Brothers of UES, a Blue Halo Company, outlining the status of personalized medical treatment protocols based on an individual’s biometrics, physiology, and exposure. This course will be an overview of the “What, Where, and How of Sensing to Meet Current and Future MedTech Needs"
Perspectives on Biosensor Applications
Flexible Electronics Master Class #17
10:00 am - 12:00 pm
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Kevin (Cheng-Hao) Ko received his Physics Ph.D. from State University of New York, Stony Brook (SUNY, Stony Brook) in 1995. During his thesis research, he worked at Beamline X1A of the National Synchrotron Light Source (NSLS) at Brookhaven National Laboratory (BNL) to construct the world's first Mult-channel Scanning Photoemission Electron Microscope (SPEM) by focusing soft X-rays using a zone plate under the supervision of Prof. Janos Kirz. After receiving his Ph.D. degree, he was invited by Taiwan Nation Synchrotron Radiation Research Center (NSRRC) to lead a team to develop X-ray Microcopy technology in Taiwan. By 1999 Ko’s team had successfully developed the world’s most advanced SPEM. After that, Dr. Ko started to devote his efforts to developing the SpectroChip technology. After nearly 20 years of research and development, Ko’s team was finally able to mass produce the SpectroChip using wafer-based methodology and founded the company SpectroChip, Inc. This technology received 9 national best innovation awards in Taiwan and one international best application award in Asia. To enable further global business development of the SpectoChip technology, in 2023, Dr. Ko and Dr. Sean Lin founded SPU System Inc.
SpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card.It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology.The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization.This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.
In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology.
8:00 am - 9:00 am
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Add to Calendar2024-02-21 08:00:002024-02-21 09:00:00SpectroChip: an Optical System-on-Chip Enabling Ultra-Portable Devices for Broad Industrial Sensing ApplicationsSpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card. It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology. The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization. This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Watch On-demand
Evolution of IC Packaging – Fan-in, Fan-out WLP, Embedded Packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc.
Principles of Interconnects ranging from TAB, Wirebond to various Flip Chip bonding such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development
Board level assembly and its soldering materials and failure mechanisms for 2nd level interconnect
Overview of interposer of lead frame, ceramic, flex to BT substrates for Microelectronics Packaging
Assembly flow and new assembly techniques such as stealth dicing, compression molding, underfill molding etc., and its assembly materials for Microelectronics packaging
Material characterization from bulk to interfaces for Microelectronics packaging
Why should I attend?
Gain technical knowledge for industry professionals
Enhance knowledge in manufacturing and R&D know-how in IC packaging
Apply Key Technical Concepts in Problem Solving through Real Case Studies
Networking opportunities with industry peers
Who should attend?
Beneficial for directors, managers, process & equipment engineers, R&D engineers and Quality & Reliability engineers working in the areas of microelectronics packaging
Useful for sale or application engineers who supply packaging materials and tools to the industry
Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300Penang Pulau Pinang Malaysia
MEET OUR SPEAKER
Dr. Lee Teck Kheng
Director, Technology Development Centre, Institute of Technical Education Singapore,
SEMI SEA Advance Packaging Technical Committee Member
9:00 am
Introduction to IC Packaging & Interconnects
Introduction to IC Packaging
• Functions of Packaging – Mechanical, Material, Electrical and Chemical
• Review of Packaging Trend – BGA, CSP, Fan-in & Fan-out WLP, 3D Packaging, SoC vs SiP etc
• Challenges in Assembly and Packaging
Board Assembly and Soldering & PCB and IC Carriers
Board Assembly and Soldering
• Through Hole & SMT – Stencil Print Process, Reflow Profile
• Solder Materials – Alloy, Flux, Solvents, self-alignment effect
• Pb Free Solder – Ternary phase diagram, SnAgCu
• Intermetallics and Growth – Diffusion mechanism, Arrhenius equation
• Testing and Reliability – Ball shear & pull failure strength and modes, Fatigue, Weibull distribution
PCB and IC Carriers
• PCB Technology – Material properties, PCB fabrication process, drilling, patterning, plating, solder resist, laminating
• IC Carriers – Design rule, Leadframe, LTCC, Flex and BT substrates
• Substrate Development
4:00 pm
Q&A | Case Studies
5:00 pm
End of Day 1
9:00 am
Assembly Process
• Thickness Reduction – Grinding, Lapping, Polishing, CMP
• Dicing/Singulation – Blade, Laser, Stealth dicing, Dicing after grind
• Die Attach – Eutectic bonding, DA materials, Collets
• Plasma – Argon, Oxygen plasma, Surface tension
• Encapsulation – Mold constitutes and properties, Transfer, Film and compression molding, Dam and fill
• Plating – Solder plating, NiPd finish, PPF
• Trim & Form – ESD, Lead formation, Spring back mechanism
Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935
*The above rates are inclusive of coffee/tea breaks and luncheon for both days
Register before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates.
A certificate of completion will be awarded at the end of the seminar.
*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information). For HRDC claims, please refer to the following links on the claiming matrix and guidelines:
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Add to Calendar2024-03-06 00:00:002024-03-07 00:00:00Penang Business Summit Seminar 1: Advanced PackagingAdvanced Packaging and Material Characterization*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar Participating Fee:Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935 *The above rates are inclusive of coffee/tea breaks and luncheon for both daysRegister before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates. A certificate of completion will be awarded at the end of the seminar. *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Ms. Cecelia Fong | [email protected] | +65.9750.2382 For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123 Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang MalaysiaSEMI.org[email protected]Asia/Kuala_Lumpurpublic
Asia/Kuala_Lumpur
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PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.
This webinar will address the what, why, and how of PFAS in the semiconductor industry. Laurie Beu, noted semiconductor EHS consultant and leader of SIA’s Semiconductor PFAS Consortium, will provide an overview of PFAS materials, concerns about health effects, and the current state of regulatory response. Laurie’s talk will be followed by Ralph Dammel, Technology Fellow at EMD Electronics, who will provide insights from a materials manufacturer’s perspective on the use of PFAS in the multiple markets addressed by EMD. He will discuss the importance of PFAS in lithography chemicals, the impact of potential new regulations, and options to reduce or eliminate the use of PFAS in semiconductor applications.
PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.
Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector.
How can you spell semiconductors without “F” (luorine)
An EMG Webinar
10:00 am - 11:00 am
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Add to Calendar2023-10-18 10:00:002023-10-18 11:00:00Spelling semiconductors without “F” (luorine)PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.
Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector.
Virtual, Online United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Say Chuan is a Principal Engineer within Intel’s Network and Edge (NEX) Group, specializing in Edge AI solutions. He is focusing on ensuring AI applications from Intel’s customers are optimized on Intel Processor by providing technical advisory and technical support to the customer.
Guest Speaker:
Mr. Ewe Kok Howg
Senior Director of Software Validation & Engineering, Intel Malaysia
Kok Howg has been with Intel for more than 24 years and currently leading the PID software validation team spread across all geo. Kok Howg is an advocate for AI development and acceleration within the organization and the local community. He has been involved in AI/Machine learning projects since 2013 including, anomaly detection in HVAC systems, and early involvement in autonomous driving etc.
Navy Specialty Coffee 72-1-23 & 23A, Arena Curve, Jalan Persiaran Mahsuri, Mk12, 11950 Bayan Lepas, Penang, Malaysia 11950Penang Malaysia
Thursday | 22 Aug
2:00 pm
Welcome Remarks & Introduction of Speaker
2:05 pm
SEMI Overview
2:20 pm
Demystifying AI: Unveiling Its Potential, Capabilities and Future Trajectories
Mr. Tan Say Chuan | Principal Engineer, Intel Malaysia
3:20 pm
"GenAI" Live Dialogue Session featuring Mr. Ewe Kok Howg
Speakers:
Mr. Tan Say Chuan | Principal Engineer, Intel Malaysia
Mr. Ewe Kok Howg | Senior Director of Software Validation & Engineering, Intel Malaysia
Demystifying AI: Unveiling Its Potential, Capabilities and Future Trajectories
Artificial intelligence (AI) is transforming industries and enhancing productivity and decision-making across diverse domains. This presentation provides an introduction to AI techniques and key concept, and demonstration of the GenAI platform. We will explore its current capabilities and limitations, and also emerging trends and opportunities in AI. The presentation aims to establish a common understanding of AI while addressing concerns, so that the audience leaves better equipped to evaluate if and how AI can augment their work.
Registration Fee: RM 120/pax (includes snacks, drinks and goodie bag)
Dress code: Smart Casual
Target Audience: Engineers < 5yrs of industrial experience
This event is HRDC Claimable for Malaysian Companies (Subject to T&C, please contact HRDC for more information)
2:00 pm - 6:00 pm
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Add to Calendar2024-08-22 14:00:002024-08-22 18:00:00Tech Talk Over Coffee | Penang, MalaysiaDemystifying AI: Unveiling Its Potential, Capabilities and Future TrajectoriesArtificial intelligence (AI) is transforming industries and enhancing productivity and decision-making across diverse domains. This presentation provides an introduction to AI techniques and key concept, and demonstration of the GenAI platform. We will explore its current capabilities and limitations, and also emerging trends and opportunities in AI. The presentation aims to establish a common understanding of AI while addressing concerns, so that the audience leaves better equipped to evaluate if and how AI can augment their work. Registration Fee: RM 120/pax (includes snacks, drinks and goodie bag)Dress code: Smart CasualTarget Audience: Engineers < 5yrs of industrial experience
This event is HRDC Claimable for Malaysian Companies (Subject to T&C, please contact HRDC for more information)For HRDC Claims, please refer to the following:HRDC Approval Letter for Tech Talk Over Coffee Allowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim HelperMore Information: https://hrdcorp.gov.my/training-providers/ Navy Specialty Coffee 72-1-23 & 23A, Arena Curve, Jalan Persiaran Mahsuri, Mk12, 11950 Bayan Lepas, Penang, Malaysia 11950 Penang MalaysiaSEMI.org[email protected]Asia/Singaporepublic
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Dynamic Control of ALD Films for Fast Efficient MEMS Mfg
Micro-electromechanical systems (MEMS) are revolutionizing how humans interact with the world. Atomic layer deposition (ALD) can be an enabling technology to improve performance of existing MEMS architectures and developing future devices.
Due to their digital growth nature, ALD processes provide a discrete and reproducible amount of film in each cycle. Multilayered films can be deposited to tune physical properties of the films, including dielectric properties, such as dielectric constant, leakage current, and breakdown voltage. These “nanolaminate” barrier films can be produced by adding discrete layers of a 2nd metal oxide, like Al2O3 or ZrO2, to a primary dielectric, like HfO2. The multilayer technique can also be exploited to drastically improve moisture and oxygen barrier properties of ALD films over a bulk film and to tune the internal film stresses.
Whether using a single-wafer system or multi-wafer batch system, extremely low ALD deposition rates have made it difficult to implement ALD into high volume manufacturing. Another barrier to adoption of ALD in MEMS applications is the inefficiency of precursor usage, which leads to unacceptable operating costs.
In this webinar, Nano Forge will present how to use ALD to tune a few different thin film properties such as electrical barrier performance, gas diffusion barrier behavior, and internal film stress. A brief description of the differentiating features and product offerings in the ALDx toolset will also be discussed.
Forge Nano’s ALDx toolset offers the fastest and most efficient single-wafer system on the market, enabling ALD to be integrated earlier in the product development cycle.
In this webinar, Forge Nano will present how to use Atomic Layer Deposition (ALD) to tune a few different thin film properties such as electrical barrier performance, gas diffusion barrier behavior, and internal film stress. This approach overcomes the perception of ALD as a barrier to high-volume manufacturing and as a material intensive process. Join Paul Carey and Matt Weimer of Forge Nano to explore a new approach.
Dynamic Control of ALD Films for Fast & Efficient MEMS Manufacturing
A MEMS Manufacturing Webinar
8:00 am - 9:00 am
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