Creating a U.S Fabrication Capabilities for Leading Edge IC-Substrate and 3D-Interconnect Fabrics
ABSTRACT
Hyperion Technologies is pioneering a new era in U.S. semiconductor manufacturing. With a mission to enable scalable compute systems, reduce energy consumption in AI and data center applications, and reinforce domestic supply chain resilience, Hyperion addresses a critical gap: the lack of high-volume IC-substrate production in the United States.
Currently leveraging reserved capacity with strategic partners, Hyperion provides advanced packaging design and manufacturing services for customers working at the leading edge of technology. By the end of 2026, Hyperion will launch domestic manufacturing operations, offering a robust alternative to foreign dependency.
Once fully operational, Hyperion’s U.S. fabrication facilities will deliver full automation, hybrid wafer and panel-level processing, and cost structures competitive with Asian suppliers. This capability will be vital to supporting national security, economic competitiveness, and the future of high-performance computing.
BIOGRAPHY
Amit Shah leads global sales and marketing at Hyperion, where he’s driving the adoption of advanced packaging solutions across the semiconductor industry. With over two decades of experience at Intel, Amit brings deep expertise in customer development, ecosystem strategy, business operations, and finance. His unique blend of technical insight and business acumen helps bridge innovation with market impact. Amit holds an MBA from Michigan State University and is passionate about accelerating technology adoption through strategic collaboration.