Semiconductor technology advancements and added device complexity put ever more stringent requirements on semiconductor manufacturing process monitor and control. Pressure exerted on devices during grinding, CMP, polishing, lamination, bonding, pick and place encapsulation, electrical testing, and packaging can cause failures that may not even be measurable using conventional sensors.
Currently chip test, monitoring and packaging process control is widely done via optical displacement sensors and electrical testing which do not adequately measure the pressure on devices. Without the ability to adequately monitor these processes, root cause failure identification is challenging and maintaining or improving process quality and yield are difficult.
In this webinar the piezoelectric sensor technology will be described and how it used to improve chip test, monitoring and packaging semiconductor processes.
Learn how high-sensitivity, high dynamic range piezo dynamic force measurement sensors can be used to better measure strain during grinding, CMP, polishing, lamination, and electrical test.
MSIG Webinar: Ultra-sensitive, high bandwidth piezoelectric pressure sensors
First in the Innovative Sensors Webinar Series
8:00 am - 9:00 am
Off
Add to Calendar Disabled
America/Los_Angeles
SiC—Silicon Carbide Webinar #6: Basal Plane Dislocation Defects and the Impact on Device Performance
Silicon carbide (SiC) chips are displacing their incumbent silicon counterparts in several high-volume power applications. As SiC market share continues to grow, the industry is lifting remaining barriers to mass commercialization including the higher-than-silicon chip cost that increases disproportionately with area, defects that limit chip yield and area, reliability and ruggedness concerns, and the need for a trained workforce to skillfully insert SiC into power electronics circuits.
With respect to fabrication, the SiC industry is successfully leveraging the fully depreciated legacy silicon fab infrastructure and is making the relatively small financial investments that allow mature silicon fabs to process SiC. A key aspect of cost-effective fabrication is limiting defects that degrade device performance and compromise yields. Over the past twenty years, significant progress has been made in improving SiC material quality, and Basal-Plane-Dislocations (BPDs) are the last major catastrophic defect. In this presentation, I will discuss how bipolar-current induced electron-hole pair recombination at basal plane dislocations generates stacking fault (SF) formation and expansion, which degrade on-state current conduction. I will present and interpret experimental data of several transistors that exhibit severe BPD related electrical degradation, and of others that demonstrate “intermediate” or no degradation at all. For impacted transistors, I will identify and analyze the electrical characteristics that exhibit degradation as well as those that remain unaffected under bipolar stress. Finally, I will show that BPD related degradation is fully reversed by high temperature annealing, and the transistor returns to its original “undamaged” operational state.
View other webinars in the SiC Series
Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
Webinar #3—Bidirectional SiC and GaN Switch Technology
Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level
Advanced Semiconductor Technology Conference (ASTC) is supported through corporate sponsorship. Be recognized as part of the key players to this event that bridge the industry, leading the congregation of leaders and technologists to drive new development and adoption enabling advanced manufacturing landscapes.
Please contact our sales team for more information on Sponsorships.
New sensor technologies enabling dramatically reduced size, weight, power, and cost are creating exciting opportunities for future applications. ASTC 2023 presents to you a conference and exhibition that gathers companies, industry leaders, semiconductor experts, and academia to help gain insights on the latest development and trends, as well as challenges in design, manufacturing, integration, and applications. Visit the exhibition booths to find out the latest technologies, products, services, and solutions.
ITE College Central Theatre@illuminITE College Central, Level 2 Blk A 2 Ang Mo Kio Drive 567720 Singapore
17 Jan 2023 (Day 1)
8:30 am
Registration @ Theatre@illuminITE at 2nd Floor
9:30 am
Singapore Electronics Week Opening, Arrival of GoH: Minister Gan Siow Huang, Minister of State, Ministry of Education and Ministry of Manpower
at Tay Eng Soon Convention Centre 4th Floor
9:40 am
Welcome Speech by Ms Low Khah Gek, CEO of ITE
at Tay Eng Soon Convention Centre 4th Floor
9:50 am
Opening Address by Ms Jennifer Teong, Chairman of SSIA
at Tay Eng Soon Convention Centre 4th Floor
10:00 am
Launching of Semiconductor Active Youth (SAY) Ambassador Program
at Tay Eng Soon Convention Centre 4th Floor
10:15 am
Signing of MOU between SSIA and ITE
at Tay Eng Soon Convention Centre 4th Floor
10:20 am
Tea Break | Networking
at Tay Eng Soon Convention Centre 4th Floor
10:45 am
Semiconductors: The "Intelligent Steel of the 21st Century" | Mr. Francois Guibert | Former EVP and President | STMicroelectronics Greater China and South Asia
at Tay Eng Soon Convention Centre 4th Floor
11:20 am
Panel Discussion: Why the Electronics Sector is still a Beacon of Light?
at Tay Eng Soon Convention Centre 4th Floor
Moderator:
Mr. Chan Si En | Process Support Engineer | Applied Materials
Panelists:
Mr. Goh Ru Gene | Senior Director | AMD
Mr. Foo Kuo Yang | HR Director | STMicroelectronics
Prof. Kelvin Fong Xuanyao | National University of Singapore
Mr. Teo Zhi Sen | Student | National University of Singapore
12:00 pm
Networking Lunch
at Theatre@illuminITE College Central, 2nd Floor
12:30 pm
ASTC Registration
at Theatre@illuminITE College Central, 2nd Floor
1:05 pm
SEMI SEA Regional Advisory Board Member
Dr. John Nelson
President & CEO
UTAC
Welcome Address
1:15 pm
SEMI SEA Regional Advisory Board Member
Mr. Terence Gan
Executive Director
A*Star: Institute of Microelectronics (IME)
Opening Keynote
1:30 pm
Presentation of SEMI-MSIG Global Emerging Young Leader Award
1:35 pm
Dr. Tim Brosnihan
Executive Director
MSIG
MEMS Market Outlook and MEMS & Sensors Industry Group update
1:55 pm
Prof. Vincent Lee
Associate Professor
National University of Singapore
AI-Enhanced Sensors - Leveraging the Cloud Computing Towards AIoT Enabled Smart Home, Digital Twin and Metaverse Applications
2:15 pm
Dr. Piotr Kropelnicki
Vice President of Engineering and Founding Member
Meridian Innovation
Thermal Imaging Using a CMOS Compatible, Hybrid MEMS Structure
2:35 pm
Dr. Wu Jie
Head of Application Engineering
Henkel
Adhesive Solutions to Enable MEMS and Sensor Packages
2:55 pm
SEMI SEA Advanced Packaging Technical Committee Member
Dr. Lee Teck Kheng
Director
ITE Technology Development Centre
A Glimpse into MEMS Packaging and its Future
3:15 pm
Plaque Presentation & Lucky Draw
3:30 pm
End of Day 1
18 Jan 2023 (Day 2)
9:00 am
Registration |Coffee & Tea| Networking
9:30 am
Mr. Anton Hofmeister
Group Vice President and General Manager, R&D and Strategy
STMicroelectronics
Opening Keynote
9:50 am
Dr. Zhu Yao
Head of MEMS
A* Star IME
Dr. Lennon Lee
Deputy Director
A*Star IME
New Piezoelectric and Infrared Technologies for Emerging Opportunities
10:10 am
Mr. John West
Senior Division Director, Semiconductor Subsystems and Test
Yole Group
MEMS Manufacturing Equipment Market
10:30 am
Dr. Koukou Suu
President and CEO
ULVAC Technologies, Inc
Advanced MEMS & Sensor as functional device Fabrications enabled by thin film sputtering technologies
10:50 am
Fireside Chat | Moderated by Tim Brosnihan | Executive Director, MSIG
Anton Hofmeister; Zhu Yao; Dr. Koukou Suu
11:40 am
Plaque Presentation
11:50 am
Lunch Break | Networking | Exhibits
12:35 pm
Dr. David Lacey
Director, Advanced Development & Services, R&D
ams Osram
How the Semiconductor Industry is Driving Future Healthcare
12:55 pm
Mr. Alastair Attard
Director of Business Development - MEMS & Sensing Applications
UTAC
Image Sensor Solutions for Automotive Imaging Applications
1:15 pm
Mr. Glen Siew
Director of Strategic R&D
Amkor Technology
The New "SIP" Sensor in Package for Sensor Fusion & IoT
1:35 pm
Mr. Jackson Seah
Senior Technical Consultant
DISCO Hi-Tec
Stealth Dicing for MEMS
1:55 pm
Dr. Shen Li Ming
Principal Engineer, BB Process Engineering
Kulicke & Soffa
Ball Bonding Process Optimization on MEMS Devices
2:15 pm
Plaque Presentation and Lucky Draw
2:25 pm
Mr Travers Lim
Associate Director, Program & Business Development
With MEMS and Sensor innovations driving an explosion of automotive, consumer electronics, healthcare, mobile, industrial space, and Internet of Things (IoT) applications, the stage is set for the SEMI Southeast Asia ASTC Conference & Exhibition focusing on MEMS & Sensors.
Visit the exhibition booths to discover the latest technologies, products, services, and solutions. This event will also provide many opportunities for delegates to engage and network with other semiconductor peers.
NOTE: ASTC is a paid conference. Visitor registration for the exhibition is free.
Held in:
ASTC 2023 Conference Materials is available on demand here.
17 - 18 January 2023
Venue: Theatre@illuminITE College Central, Singapore
9:00 am - 5:00 pm
Off
Add to Calendar2023-01-17 09:00:002023-01-18 17:00:00[IN-PERSON EVENT] Advanced Semiconductor Technology Conference (ASTC) 2023 JanuaryAdvanced Semiconductor Technology Conference (ASTC) 2023
With MEMS and Sensor innovations driving an explosion of automotive, consumer electronics, healthcare, mobile, industrial space, and Internet of Things (IoT) applications, the stage is set for the SEMI Southeast Asia ASTC Conference & Exhibition focusing on MEMS & Sensors.
Visit the exhibition booths to discover the latest technologies, products, services, and solutions. This event will also provide many opportunities for delegates to engage and network with other semiconductor peers.
NOTE: ASTC is a paid conference. Visitor registration for the exhibition is free.
Held in:
ASTC 2023 Conference Materials is available on demand here.ITE College Central Theatre@illuminITE College Central, Level 2 Blk A 2 Ang Mo Kio Drive 567720 SingaporeSEMI.org[email protected]Asia/Singaporepublic
Asia/Singapore
GSMC On-Demand gives you access to approved presentations and videos. You'll hear global experts share strategies and best practices to improve manufacturing data capture and analysis. Find ideas and solutions to maintain business continuity and meet the increasing demands of customers.
ACCESS GSMC On-Demand 24/7 until December 11, 2022.
WATCH available presentations and video recordings.
DOWNLOAD and save a copy of approved PDFs
2022 Organizing Committee
John Behnke | INFICON
Holland Smith | INFICON
Chan Pin Chong | KULICKE & SOFFA
Michael Arnold | PEER GROUP
Bobby Mitra | TEXAS INSTRUMENTS
James Lin | UMC
United States
TUESDAY, NOVEMBER 8, 2022 | TIMES IN PT
SESSION 1—Intelligent ACQUIRE: Data Sources, Variety and Acquisition
7:00 am
Mark da Silva
SEMI
Opening Remarks
7:02 am
Ajit Manocha
SEMI
Conference Opening Remarks
7:15 am
Chair, SEMI Smart Manufacturing Global Executive Committee
