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REGISTRATION PRICING

  • Member: $250
  • Non-Member: $275 
     

CANCELLATION POLICY:
Cancellations received on or before August 15, 2026 will be fully refunded. After this date, only substitutions will be accepted. 

Krish Raghunath
Program Manager, Programs & Committees, SEMI
[email protected]

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United States Stone Creek Golf Club Business
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Become a Sponsor

Sponsorship is an excellent way to promote your brand, especially on the golf course where many business transactions take place.
Sponsorships are tailored to meet your branding and marketing objectives.

To learn more please contact Tim Janes ([email protected] | 1.720.939.4992). 

MULLIGANS + RAFFLE TICKETS

PURCHASE A TICKETSUPPORT THE SEMI PACIFIC NORTHWEST STEM SCHOLARSHIP

The scholarship will be awarded to a deserving university and/or college in the region. Mulligans and Raffle Tickets are sold onsite, $5 per ticket. 

Proceeds from the sales directly fund the scholarship. Players and non-players are welcome to participate.

To donate a raffle prize please contact—Krish Raghunath, Program Manager, SEMI Americas at [email protected]

 

REGISTRATION INCLUDES   

  • Golf Cart
  • Grab & Go Breakfast
  • Contests and Prizes
  • Beverage Ticket
  • Award Ceremony and Lunch

 

PLAYER AWARDS                                                                   

  • Closest to Pin
  • Longest Drive
  • Putting Contest
  • Best Foursome
  • Needs Most Improvement

 

DRESS CODE

Stone Creek Golf Club requires generally accepted dress for golf tournaments. Shirts and shoes must always be worn. Stone Creek Golf Club is a soft-spike only facility. Following is a list of unacceptable clothing:

  • Tank tops
  • Cut-offs
  • Swimwear
  • Gym shorts

 

Stone Creek Golf Club
14603 South Stoneridge Drive
Oregon City, OR 97045
United States

Tuesday, September 15, 2026 | 7:00am–3:00pm Pacific Time

7:00 am - 8:00 am

Registration | Breakfast | Networking

8:00 am - 1:00 pm

Shotgun Start

1:00 pm - 3:00 pm

Award Ceremony | Lunch | Networking

4th Annual SEMI Oregon Golf Classic

Join us for a morning of golf, fun, and networking at the beautiful Stone Creek Golf Club in Oregon City, Oregon. Whether you're a beginner or a proenjoy friendly competition and camaraderie with your colleagues and customers. 

The Stone Creek Golf Club is a a Peter Jacobsen/Jim Hardy designed golf course. Presenting spectacular views of Mt Hood, the course perfectly depicts the Pacific Northwest. Stone Creek is laid over 165 acres of land with old growth Douglas Firs, Lakes, and features some of the best greens in Oregon (OR).

Visit Stone Creek Golf Club for additional course details.

7:00 am - 3:00 pm Off Add to Calendar 2026-09-15 07:00:00 2026-09-15 15:00:00 SEMI Oregon Golf Classic 4th Annual SEMI Oregon Golf ClassicJoin us for a morning of golf, fun, and networking at the beautiful Stone Creek Golf Club in Oregon City, Oregon. Whether you're a beginner or a pro—enjoy friendly competition and camaraderie with your colleagues and customers. The Stone Creek Golf Club is a a Peter Jacobsen/Jim Hardy designed golf course. Presenting spectacular views of Mt Hood, the course perfectly depicts the Pacific Northwest. Stone Creek is laid over 165 acres of land with old growth Douglas Firs, Lakes, and features some of the best greens in Oregon (OR).Visit Stone Creek Golf Club for additional course details. Stone Creek Golf Club 14603 South Stoneridge Drive Oregon City, OR 97045 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
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Registration

PRICING

$25 Members, $50 Non-Members

Paul Cohen
1.978.769.2106 
[email protected]

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United States Register Now Business Executive

The discussion will help attendees understand why and how governments implement trade controls, what “exports” are and how they take place in different business contexts, and common due diligence methods – such as customer screening – that United States companies use to incorporate regulatory compliance into their business processes. Finally, the discussion will address recent regulatory updates which address current issues such as US-China trade relations and the anticipated effects of those regulations on the US semiconductor design ecosystem.

 

Meet the Speakers

Ada Loo

Ada Loo
Group Director and Associate General Counsel,
Cadence Design Systems

Biography

William Duffy

William Duffy
Corporate Counsel (Government and Trade, Cadence Legal)

Biography

Hosted by

SEMI ESDA                Cadence        

Cadence Design Systems
2655 Seely Avenue
San Jose, CA 95134
United States

ESD Alliance

The ESD Alliance Export Committee will hold a seminar called “The Impact of New Regulations on the Semiconductor Design Ecosystem.” This seminar is presented by the ESD Alliance, a SEMI Technology Community, and will be hosted by Cadence Design Systems at their San Jose Headquarters. The Cadence Government and Trade Team will cover general trade compliance concepts, how export control and sanctions regulations affect the industry, as well as current trends and emerging issues. 

Breakfast Hosted by Cadence

8:30 am - 11:00 am Off Add to Calendar 2023-04-26 08:30:00 2023-04-26 11:00:00 ESD Alliance Export Seminar The ESD Alliance Export Committee will hold a seminar called “The Impact of New Regulations on the Semiconductor Design Ecosystem.” This seminar is presented by the ESD Alliance, a SEMI Technology Community, and will be hosted by Cadence Design Systems at their San Jose Headquarters. The Cadence Government and Trade Team will cover general trade compliance concepts, how export control and sanctions regulations affect the industry, as well as current trends and emerging issues.  Breakfast Hosted by Cadence Cadence Design Systems 2655 Seely Avenue San Jose, CA 95134 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles 1
United States Register Now Smart Manufacturing Business Executive Technical

The Fourth Industrial Revolution, or Industry 4.0, revolutionized automation monitoring, enhanced production efficiencies, and improved product quality. Industry 5.0 is the next industrial revolution coming to the forefront. 

Industry 5.0 builds and adapts the components of Industry 4.0 (robotization, automation, IoT, connected machines, smart systems, data analytics, AI, ML) with a focus on sustainability, environmental, social, and well-being of the worker, and optimized human-robot interactions.  
With the renewed interest in on-shoring manufacturing in the United States, this breakfast forum is a great opportunity to learn about Industry 5.0 and the ecosystem partners developing these future ideas.  

Join the conversation on— 

  • Market Trends, Forecast & Outlook

  • Industry 4.0 + Transition to 5.0—Challenges + Solutions  

  • Digital Journey–AI/ML, Autonomous Solutions, Digital Twin, etc.  

  • Supply Chain / Disruptions: Linear to Circular Economy and Localized Sourcing

  • Green Factories of Future—Sustainability

  • Talent Gap for Upcoming Transformation  

 

Hosted by

Analog Devices

 

 

 

Event Contact

Lin Tso | Sr. Program Manager | [email protected]

Analog Devices—ADI
OR
United States

FRIDAY, MAY 12, 2023 | PACIFIC TIME

8:00 am - 8:30 am

Check-In and Breakfast

Analog Devices
8:30 am - 8:35 am
Ann Hao
Anne Hao
GSM Technical Strategy
Intel Corporation

Welcome Remarks - SEMI Pacific Northwest Chapter Co-Chair

8:35 am - 9:00 am
Fred Bailey, Corporate Vice President, Fab Operations
Fred Bailey
Corporate Vice President, Fab Operations
Analog Devices

Keynote —Analog Devices— Reinventing a Legacy Wafer Fab

9:00 am - 9:25 am
Diana Tang, Management Consultant, McKinsey & Company
Diana Tang
Management Consultant
McKinsey & Company

Semiconductor Construction in United States

9:25 am - 9:50 am
Heath Fewel
Heath Fewel
Associate Director, Equipment Engineering
Microchip Technology Inc.

Smart Manufacturing: Legacy Fab Life Extension

9:50 am - 10:00 am

Break

10:00 am - 10:25 am
David Hanny Automation Product Group, Senior Director, Strategy & Marketing Applied Materials
David Hanny
Automation Product Group, Senior Director, Strategy & Marketing
Applied Materials

Methods to Mature Your Automation Intelligence

10:25 am - 10:40 am
David Corey
David Corey
Vice President, Semiconductor Industry
Siemens Digital Industries Software

Digitalization: An Evolution to Improve Productivity and Sustainability

10:40 am - 10:55 am
Brian Taylor
Brian Taylor
Semiconductor Business Manager Siemens Digital Industry Software
Siemens Digital Industries Factory Automation

Digitalization: An Evolution to Improve Productivity and Sustainability

10:55 am - 11:20 am
Jade Mende, Operations Systems Architect, Tektronix
Jade Mende
Operations Systems Architect
Tektronix

Enhancing the Work Experience

11:20 am - 11:40 am

Tour of Analog Devices

IN-PERSON AND VIRTUAL EVENT

Hosted by Analog Devices
Presented by the SEMI Pacific Northwest Chapter

8:00 am - 11:30 am Off Add to Calendar 2023-05-12 08:00:00 2023-05-12 11:30:00 [Pacific Northwest Forum] Smart Manufacturing—What Does a Smarter World Look Like With Industry 5.0? IN-PERSON AND VIRTUAL EVENT Hosted by Analog Devices Presented by the SEMI Pacific Northwest Chapter Analog Devices—ADI OR United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Health and Safety

We Are Excited to Welcome You Back to the Pacific Northwest Forum

Your health and safety are our top priority. SEMI Americas (“SEMI”) monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events.

SEMI will comply with and follow current facility and local government jurisdiction guidelines of the venue's location. The health and safety guidelines outlined below continue to evolve and will be updated as necessary to help support a safe experience for all attendees onsite.  

FACE COVERINGS 

  • Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.

RELEASE AND WAIVER FORM

  • This was included in your online registration.

ADDITIONAL SAFETY PROTOCOLS

  • Please practice social distancing.
  • Wash and sanitize your hands frequently.
  • Avoid handshakes.
  • Wear your attendee badge at all times to indicate that you have gone through the health screening process.

SEMI is committed to upholding the health and safety standards outlined on this page. We will continue to monitor the guidance of public health authorities and government agencies going forward and will make appropriate adjustments in the future based on that guidance. Additional details about policies and procedures will be posted here as they are made available.  

Subject to Change. Updated August 18, 2022

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Event format

On-Demand Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #2 

Taylor Zhao
Manager, Programs & Committees
[email protected]

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United States REGISTER NOW Business Technical

SiC—Silicon Carbide Webinar #2:

Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs

SiC devices are displacing their incumbent Si counterparts in several high-volume power applications. As SiC market share continues to grow, the industry is lifting the last barriers to mass commercialization that include higher than Si device cost, relative lack of wafer planarity, the presence of defects like basal plane dislocations, reliability and ruggedness concerns, and the need for a workforce skilled in SiC power technology to keep up with the rising demand. To enable cost-effective manufacturing, high-yielding SiC fabrication in conventional Si fabs is desirable.

In this webinar, I will summarize key aspects of SiC fabrication technology and outline non-CMOS compatible processes that have been streamlined to allow for mass SiC chip fabrication in conventional Si mature fabs. The SiC industry has successfully leveraged the Si fab infrastructure and has made the relatively small financial investments required to allow existing Si fabs to process SiC. Consequently, SiC chip fabrication in volume fabs alongside Si has emerged as a “cost reduction” model that exploits “silicon” manufacturing economies of scale. Today’s SiC fab infrastructure is vibrant, mirrors that of silicon, and is rapidly expanding. 

 

View Previous Webinar in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology 
  • Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level
  • Webinar #5—SiC Edge Termination Technology


 

Meet the Speaker

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Now Available On-Demand!

Join us online as we dive into SiC fabrication technology and non-CMOS compatible processes that have been streamlined to allow for mass SiC chip fabrication in conventional Si mature fabs.

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PRICING
Regular Pricing:
Member: $100 | Non-member: $125

Cancellation Policy
Registration is final. No refunds provided. No substitutions.

United States REGISTER NOW SEMI TX Spring Breakfast Chapter Tile Business Technical
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Become a Sponsor 

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Texas Chapter Spring Breakfast Forum.

Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.

Program Questions

Contact Eric Rude, [email protected]

HOST—

Applied Materials

 

Texas at Scale: From Fab to Cloud, AI, Power, and the Future of the Semiconductor Ecosystem

The SEMI Texas Spring Forum brings together industry executives, technologists, policymakers, academic leaders, and downstream enterprises — from GPU/accelerator companies to cloud, automotive, industrial, and system OEMs. Together, we will explore how Texas can harness AI, digitalization, and cross-ecosystem collaboration to lead in next-generation chip production and full-stack system integration.

A central focus will be aligning materials and equipment suppliers, foundries, OSATs, and EDA providers, and advanced packaging organizations with the roadmaps of AI and HPC leaders, ensuring silicon, systems, and software evolve cohesively and efficiently.

Applied Materials
9700 US HWY 290 East, Building 32
Austin, TX 78724
United States

8:00 am - 8:30 am

Registration, Networking Breakfast, & Sponsors Showcase

Applied Materials
8:30 am - 8:35 am
Andrea Valencia, EMD Electronics
Andrea Valencia
Marketing Communications & Events, Semiconductor Materials
EMD Electronics

Welcome Remarks

8:35 am - 8:45 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

State of the Semiconductor Industry

8:45 am - 9:05 am
Steve Gustafson, Applied Materials Headshot
Steve Gustafson
VP of Worldwide Manufacturing
Applied Materials

Keynote

Applied Materials
9:05 am - 9:25 am
Stephen Davis Headshot
Stephen Davis, PhD
Director
Texas CHIPS Office

Texas Semiconductor Ecosystem

9:25 am - 9:45 am
Da Yang Headshot
Da Yang, PhD
Senior Director of Product, Semiconductor and EDA
NVIDIA

AI‑Accelerated Design: Transforming EDA Workflows with Accelerated Computing and AI Agents

9:45 am - 10:05 am
Chuck Alpert, Phd, Cadence Headshot
Chuck Alpert, PhD
AI Fellow
Cadence

Design for AI and AI for Design

10:05 am - 10:35 am

Networking Break & Sponsors Showcase

10:35 am - 10:40 am
Mike Glavin
Mike Glavin
Program Director, Workforce Development
SEMI Foundation

Workforce Development Update

10:40 am - 11:00 am
Hetul Sanghvi, Texas Instruments Headshot
Hetul Sanghvi
Director of Embedded AI @ Kilby Labs
Texas Instruments Inc.

Intelligence at the Edge: Smaller, Faster, Smarter

11:00 am - 11:20 am
Brett Wilkerson Headshot
Brett Wilkerson
Fellow
AMD

Advanced Packaging in the AI Era

11:20 am - 11:40 am
Joseph Rivers
Joseph Rivers PhD
Senior Director, Product Management
Entegris

Everything's Purer in Texas: How Entegris Is Building the Semiconductor Supply Chain Where It Matters

11:40 am - 12:25 pm
Steve Putna Headshot
Moderator
Steve Putna, PhD
Associate Vice Chancellor for Research; Director
Texas A&M Semiconductor Institute

Panel Discussion and Q&A—Texas at Scale: From Fab to Cloud, AI, Power, and the Future of the Semiconductor Ecosystem

Hear from leaders across the ecosystem, including Applied Materials, AMD, Cadence, Entegris NVIDIA, Texas Instrument, and Texas Chip Office.

Steve Putna, Ph.D.'s Biography

12:25 pm - 12:30 pm
Adrian Franco, Olsson
Adrian Franco
Senior Client Consultant, Semiconductor
Olsson

Closing Remarks

12:30 pm

Adjourn

SEMI Spring Breakfast Forum

Organized by the SEMI Texas Chapter

8:00 am - 12:30 pm Off Add to Calendar 2026-05-14 08:00:00 2026-05-14 12:30:00 SEMI Texas Spring Breakfast Forum SEMI Spring Breakfast ForumOrganized by the SEMI Texas Chapter Applied Materials 9700 US HWY 290 East, Building 32 Austin, TX 78724 United States SEMI.org [email protected] America/Chicago public America/Chicago 2
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SEMI Headquarters
673 South Milpitas Blvd.
Milpitas, CA 95035
United States

- Off Add to Calendar 2023-03-13 00:00:00 2023-03-15 00:00:00 Key Semiconductor Account Selling & Management SEMI Headquarters 673 South Milpitas Blvd. Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

No Registration Fee Required.

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  1.  

Thermal Interface Materials (TIMs) come in a wide variety of options and are used in a range of applications. Thermal greases, phase-change materials, and silicon pads are just a few examples of TIMs that are used in today’s devices. Each has its own benefits and downsides, but they are all limited in their effectiveness in performing the one essential function of a TIM, conducting heat in an efficient manner. Zeon’s new technology combines the physical characteristics of an elastomer pad with the thermal benefits of a carbon filler to achieve a thermal conductivity of 38 W/mK, a value that is unmatched in the industry.

Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.

This webinar will focus on the performance and technology of such a material while also discussing how it can best benefit the MEMs and Sensors community by creating solutions to thermal problems plaguing the packaging space.

Speaker Bio 

Nikhil Jani is a Business Development Specialist representing Zeon Specialty Materials, a San Jose based company and subsidiary of the Zeon corporation a company you may be familiar with for its widely used Electron Beam Resist ZEP520A. He studied Material Science and Engineering at Rutgers University with a focus on semiconductors and polymers. He has co-authored a paper on polymer nanocomposites titled “Non-Destructive Investigation of Dispersion, Bonding, and Thermal Properties of Emerging Polymer Nanocomposites Using Close-Up Lens Assisted Infrared Thermography”. Prior to joining Zeon, he had worked at Morgan Advanced Materials. 

Online, Virtual
United States

Nikhil Jani
Nikhil Jani
Business Development Specialist
Zeon Specialty Materials
MSIG

Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.

Join us for the 3rd in our Innovative Sensors Webinar Series to explore how Zeon has solved this perennial issue for electronics.  

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles