This year’s theme for the International Trade Partners Conference—ITPC—will guide an exploration of geopolitics, contentious trade and national security concerns, and our deep-rooted ambitions to maintain the global footprints we have created. Our manufacturing infrastructures, trade connections, and supply chains are now part of the geopolitical state – something few could have anticipated. We are finally witnessing governments, the media, and the general public taking notice of semiconductors and their critical importance.
Registration Details
Registration is Required. There are no fees.
If you are registering to attend the Workshop Virtually, please follow the same registration procedure (via the Button Below) and we will email you the Dial-In information a week before the session.
Registration for this Workshop is separate from SEMICON West registration, but necessary to access the workshop room. To waive the SEMICON West Registration fee, use code "STANDARDSGUEST22" when registering on the SEMICON West Registration page.
Questions? Contact Laura Nguyen at [email protected].
In this workshop, our journey of navigating the detection limit obstacle course begins with a broad view of the problem focused on developing a conceptual understanding of key detection limit concepts and limitations. Statistics plays a key role in effective detection limit definition; but need to be the last and final piece of solving the detection limit puzzle where they drive the development of an appropriate statistical practice for detection limit standards.
The current version of SEMI C10 - Guide for Determination of Method Detection Limits sets out important and useful guidance for these concepts. Key detection limit concepts, including the problems caused by our natural biases must be explored and understood. Issues in detection limit and rule-set application will be probed since it is at the application level that detection limit standards succeed or fail.
Workshop Agenda
Part 1: Detecting the Detection Limit – Broad View of Detection Limit Standards / Issues
- The Swamp: Why so much disagreement?
- Basic Detection Limit concepts
- Calibration’s under-appreciated role
- Detection Limit Quantification Uncertainty
- DL Usage Contexts and Reporting Practices
- What’s required to build a Detection Limit standard?
Part 2: SEMI C10 – Guide for Determination of Method Detection Limits
- How does it work?
- What does it assume?
- What are its strengths and limitations?
- How should Semi C10 derived Detection Limits be applied?
- What form could an update to SEMI C10 take and why?
@ SEMICON WEST
Moscone Center
San Francisco, CA
United States
Thomas Bzik
Statistical Methods Task Force Co- Leader
EMD Electronics
Join this workshop during SEMICON West 2022 to explore SEMI C10 and discuss how its application to your procedures will improve your yields and manufacturing processes. Quality experts, analytical experts, statisticians and those involved with product quality and process metrics should attend.
Registration Details
Members: $113.00
Non-Members: $150.00
Registration includes a copy of the RITdb Standard - SEMI E183
No refunds for cancellations; Substitutions can be made at any time.
Contact: Michelle Sun, [email protected]
Industry 4.0 brings machine to machine IOT, human augmentation, cloud, edge, and AI together to enable a better manufacturing process. Before we can take advantage of the promise we need a efficient means to share the very complex and wide ranging data which is created and used on the test floor. This data comes from many sources, has latency and security issues with constantly changing sources and applications. RITdb solves the sharing issues via extensible machine focused data structures and transport formats which have been validated in an advanced test environment.
This 2 hour workshop is divided into three sections: and introduction to the problems and values, a walk through on how RI and TI implemented the POC in a working production environment and finally a deep technical dive into the implementation effort needed to get started.
Course Outline
- Introducation
- Topology
- Topic
- Structure
- Usage with Examples
- Body
- Structure (CBOR*)
- CBOR (include embedded OMAP)
- Events
- Data
- Usage
- Examples
- Structure (CBOR*)
- Proof of Concept (POC) findings
- Identity Requirements
- Connection Process
- Review use of Channels in Messaging
- Admin
- Logging
- Events
- Object Save(OS)/ Object Read (OR) Message
- Demonstrate link between the messaging and repo
- Demonstrate embedded OMAP
*CBOR – Concise Binary Object Representation
Virtual, Online
United States
Looking to take advantage of Industry 4.0 to bring order to the chaos of your semiconductor test process? Attend this course online and learn how an implementation of the latest SEMI Standard for test floor data and events sharing can improve the productivity of your test operations.
This 2 hour workshop is a follow-on from this July STEP Class.
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United States
10:00 am
-
10:05 am
Kevin McLaughlin
SACHEM
Welcome
10:05 am
-
10:25 am
Matthew Beard
Executive Director, Strategic Planning, Mgmt Systems & Sustainability
Brewer Science
Sustainability Approaches for the Semiconductor Materials Industry
10:25 am
-
10:45 am
Shari Liss
Executive Director
SEMI Foundation
SEMI Workforce Development – When Everyone Wants Workers Now
10:45 am
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11:00 am
Q&A
Two overarching business issues face the industry today – how to responsibly create sustainability strategies and how to find and train strong workers. Both issues are challenging management teams to think creatively and change fundamental processes of their business.
SEMI members are looking to SEMI to provide industry-wide guidance and support to share best practices, build grassroots processes, and guidebooks that both large and small companies can use to improve their efforts.
Attend this webinar to get an update and insights, with a special tilt toward the materials industry, on how you can incorporate SEMI guidebooks for hiring qualified and diverse DEI and Veterans hiring, as well as other efforts toward strengthening your workforce. On the Sustainability topic, hear how the industry is coming together to help each other in Scope 1,2, and 3 measuring and reporting mechanisms, and more!
Event format
China
https://www.semiconchina.org/zh/1443#2
Business
Executive
Technical
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Shanghai
China
Registration for this webinar is free, but required.
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This webinar unveiled the details of the 5-year $5M per year ($25M total) Positioning, Navigation, and Timing Phase 2 (PNT2) funded R&D Program starting in 2022. The formal Request for Proposals (RFP) is expected on June 6, 2022.
The PNT2 program follows a successful Phase 1 program that saw 10 projects funded over 2 years starting in 2020 ($6M total funding).
Watch to learn how you can respond to the PNT2 RFP. Topics covered:
- technical thrust area
- cost share requirements
- proposal instructions
- team requirements
- Q&A
About the Speaker
Dr. Paul Carey joined SEMI in April 2021 and is responsible for managing the MSIG PNT program, the MSIG webinars, and supporting the Manufacturing, Device and Reliability Workgroups and all MSIG related conferences and events. Before joining SEMI, he worked at X-Ray imaging backplane supplier and FOA member, dpiX, in various positions starting in 2003. He was the process, equipment, and yield manager in their Gen 2.5 Palo Alto glass Fab until 2012 when dpiX moved its production to a new Gen 4.5 Fab in Colorado Springs. He rejoined dpiX in 2014 and worked on the flexible substrate equipment selection team and later became their first business development manager in 2018 when dpiX announced its Foundry Business.
Earlier positions were held at Applied Materials where he helped develop a laser annealing system for semiconductor shallow junctions and silicides, and start-up company FlexICs, where he was a co-founder and VP of Engineering. FlexICs developed low temperature thin film transistor (TFT) fabrication technology relevant to flexible OLED displays now used in cellphones. Prior to founding FlexICs, he worked as a staff scientist and program leader at Lawrence Livermore National Laboratory where his group initially developed the low temperature polysilicon-on-plastic TFT technology.
Dr. Carey received a double major BS from UC Berkeley in Electrical Engineering and Computer Science (EECS) and Materials Science and Engineering (MSE). He received his MS in EECS from UC Berkeley and Ph.D. in MSE from Stanford University.
Virtual, Online
United States
Paul Carey
Director
SEMI MSIG
Watch this webinar to learn more about this opportunity to propose for R&D Funding to advance the state-of-the-art in positioning, navigation and timing (PNT) technology.
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
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Abstract/Description
Current electromechanical design practice is predicated on the exercise of expert-level judgement through an interactive and iterative design and fabrication process that requires skilled humans at every step. This approach doesn't scale because it is labor intensive, and therefore biases robots toward longer-lasting, more general-purpose (and expensive) designs in order to justify the development and fabrication costs. Though appropriate in some cases, not all applications are well-served by this process. Many robot applications might be better-served by rapidly-built special-purpose or single-use machines, but automated design and fabrication tools will be critical to control costs, accelerate development, and be responsive to application needs.
The overall goal is to make electromechanical systems (robots) so easy to design and fabricate that we could enable people who are application experts (but not necessarily robot design or fabrication experts) to rapidly create robots for their specific needs. Although Roboticists claim that robots are for dull, dirty, and dangerous use-cases, the community predominantly uses them for the first case, because robots are currently expensive and slow to build, which makes them precious. If we change this situation by making robots practically disposable/expendable, we could potentially re-imagine many robot use-cases.
With this future in mind, new design tools to convert high-level requirements specified by non-experts into concrete electromechanical design plans, new materials that leverage multi-material additive manufacturing, and new multi-material 3D printing methods to automatically convert these designs into functional robots are being developed. During this course we will describe these various areas of current study as well as possible applications for 3D printed robotics.
About the Instructors
Dr. Robert MacCurdy is an assistant professor in Mechanical Engineering at the University of Colorado Boulder where he leads the Matter Assembly Computation Lab (MACLab). He is developing new algorithms, materials, and fabrication tools to automatically design and manufacture electromechanical systems, with a focus on robotics. Rob did his PhD work with Hod Lipson at Cornell University and his postdoctoral work at MIT with Daniela Rus. He holds a B.A. in Physics from Ithaca College, a B.S. in Electrical Engineering from Cornell University, and an M.S. and PhD in Mechanical Engineering from Cornell University.
Dr Gregory Whiting is an Associate Professor in the Department of Mechanical Engineering and a member of the Materials Science and Engineering Program at the University of Colorado Boulder (CU). At CU he leads the Boulder Experimental Electronics and Manufacturing (BEEM) Laboratory, which is focused on studying and developing materials, processes and devices for novel and additively manufactured electronic systems used in applications including distributed sensing (particularly for environmental monitoring) and robotics. Prior to joining CU in 2017, Greg was a member of the Rapid Evaluation Team at Google[X] and managed the Novel Electronics Area at the Palo Alto Research Center. He received a PhD from Cambridge University in 2007 and a BS from UC Berkeley in 2002.
United States
Dr. Robert MacCurdy
Asst. Professor of Mechanical Engineering
University of Colorado, Boulder
Greg Whiting, PhD.
Assoc. Professor
University of Colorado, Boulder
Fabricating robots using additive design and manufacturing methods has the potential to transform when, where and how the advantages of robots are brought to bear.
Take this FlexTech Master Class to explore the potential applications and how to use new design tools, 3D printing methods and multi-material additive manufacturing to convert ideas into solid electromechanical robotic systems.
Led by Dr. Robert MacCurdy and Prof. Greg Whiting of the University of Colorado, Boulder, this course will provide you new ways to approach manufacturing, additive design and the role of robots.
Event format
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
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Printed, flexible and hybrid electronics (PFHE) enable emerging applications in IoT, medical sensing, smart packaging and labels, structural monitoring, human wellness and performance, monitors, extreme environment, and display applications. At the same time, PFHE approaches can also provide faster product development, prototyping, and manufacturing cycles for single, custom items to large areas, low-cost mass manufacturing scales in additive, more sustainable pathways for electronics as they become even more ubiquitous in our world.
This class covers the basics of PFHE processing technologies, from dispensing and inkjet printing to roll to roll printing and coating, along with the materials and supplementary thermal processes that enable these processes.
Next-generation technologies are also explored for high-resolution PFHE and additive manufacturing that could provide new form factors and manufacturing approaches and exceed the performance of conventionally-processed electronics. These technologies also have impact on unmet heterogeneous integration possibilities in fields ranging from electronics to optics and quantum materials.
Example PFHE and printed energy materials topics:
- Dispensing and 3D printing of electronic and energy materials
- Aerosol printing
- High resolution inkjet printing and coating
- Screen Printing
- Flexographic Printing
- Gravure printing
- Slot die coating
- Convective, IR and photonic thermal processing
- Microcontact printing and embossing
- Submicron electrohydrodynamic printing
About the Instructor
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J. Devin MacKenzie is the Washington Research Foundation Professor of Clean Energy and an Associate Professor of Materials Science and Engineering and Mechanical Engineering at UW. Dr. MacKenzie is also the director of the Washington Clean Energy Testbeds, an open access laboratory with world-class printed electronics, flexible electronics and energy device fabrication and testing capabilities. Dr. MacKenzie has 20 years of experience co-founding or leading startups in novel fabrication including as a co-founder and CEO of Imprint Energy commercializing printed flexible batteries, as CTO of Add-Vision, a printed flexible OLED display company that was acquired in 2011, and as a VP at Kovio, an MIT spin out, leading printed Si RF device integration. Devin also co-founded the world’s first printed electronics company, Plastic Logic Ltd. in the United Kingdom. Previously Dr. MacKenzie was a researcher at AT&T Bell Laboratories. Prior to entering the start-up world, Devin was a postdoc in Physics at the University of Cambridge and earned PhD, MS, and BS degrees from the University of Florida and MIT. Dr. MacKenzie has over 220 patents and publications and has been cited over 10,000 times. |
This is the 11th Flexible Electronics Master Class. This and previous classes are available On Demand. See the full list.
United States
FlexTechThe field of printed, flexible and hybrid electronics (PFHE) and energy devices provides pathways to new products and form factors for ultralight, thin, flexible and large-area electronics, sensors, processing, I/O, photonics, and power. Indeed, flexible electronics is quietly transforming packages and enabling radical changes in electronics from the inside out.
In this Flexible Electronics Experts Class (recorded on June 22, 2022) you will learn the basics and the next generation improvements in processing technologies, from dispensing and inkjet printing to roll-to-roll printing and coating. The instructor also addressed the latest materials and updates on supplementary thermal processing needs.
This course is appropriate for newcomers to the field, as well as those looking to rapidly gain information on the latest materials and equipment advancements.
Event format
On-Demand Registration
Member: $49
Non-Member: $99
Registrants will receive the presentation recording and PDFs of Webinar #1
SiC—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
Silicon (Si) power devices have dominated power electronics due to their excellent starting material quality, ease of fabrication, low cost volume production, and proven reliability. Although Si power devices continue to make progress, they are approaching their operational limits primarily due to their relatively low bandgap and critical electric field that result in high conduction and switching losses, and poor high temperature performance.
In this webinar, the favorable material properties of Silicon Carbide (SiC), which allow for highly efficient power devices with reduced form-factor and cooling requirements, will be outlined. High impact application opportunities, where SiC devices are displacing their incumbent Si counterparts, will be reported. Material and device fabrication aspects will be highlighted with an emphasis on the processes that do not carry over from the mature Si manufacturing world and are thus specific to SiC. Fab models will be analyzed, and the vibrant U.S. SiC manufacturing infrastructure (that mirrors that of Si) will be presented.
View Previous Webinar in the SiC Series
- Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
- Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
- Webinar #3—Bidirectional SiC and GaN Switch Technology
- Webinar #4—Understanding Sic Chip Cost, the Impact of Defects, and the Case of Price Parity With Si at the System Level
- Webinar #5—SiC Edge Termination Technology
Meet the Speaker
Biography
United States
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica
Now Available On-Demand!
Join us as we dive into the special properties of silicon carbide (SiC) and how they're displacing their incumbent silicon counterparts.
Event format
Sponsored by
About the Speaker
Dr. Chris Huang currently serves as Deputy Project Manager for MEMS & Photonics Engineering at ASE. In his current role, he is focused on MEMS and optical sensor packaging in automotive applications, as well as smart sensor and smart system technologies for emerging applications. Since joining ASE over four years ago, he has gained significant experience in the fields of sensor and actuator design, MEMS device and wafer manufacturing, and sensor packaging, including extensive work in the field of microfabrication of piezoresistive MEMS sensors and wafer bonding process.
Prior to ASE, he worked as an R&D Technologist at Asia Pacific Microsystems Inc., a pure-play MEMS foundry, where he managed the development of standard fabrication platforms for customizable sensors, such as MEMS optical actuators/piezoresistive pressure and force sensors. Dr. Huang has published over thirty-five technical SCI journal papers and international conference papers and holds eight worldwide patents on MEMS and sensor applications. Dr. Huang received his Ph.D. from National Tsing Hua University, Taiwan, where he also completed work as a post-doctoral researcher within the Department of Power Mechanical Engineering
United States
MSIGThe incredible power of MEMS technology and sensor applications has been elevated onto the world stage in recent times, given how they help enable technology and applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, and from 5G to beyond.
During this SEMI MSIG webinar, ASE’s Dr. Chris Huang will elaborate and put a spotlight on the role that packaging technologies play and the innovation evolving to progress miniaturization and integration, both key attributes within the MEMS and Sensors arena.
He will present unique approaches required to overcome MEMS and Sensor packaging and test challenges and achieve highest possible performance when responding and interacting with any external or environmental stimuli.
Q&A will follow.
Event format
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