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Add to Calendar2023-10-18 00:00:002023-10-18 00:00:00SEMI China Equipment Committee Meeting (by invitation) Shenzhen ChinaSEMI.org[email protected]America/Los_Angelespublic
Display Chip Conference-Micro LED Supply Chain International Forum
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Add to Calendar2023-10-18 00:00:002023-10-18 00:00:00Display Chip Conference-Micro LED Supply Chain International ForumShenzhen ChinaSEMI.org[email protected]America/Los_Angelespublic
2023 SEMI China Semiconductor Supply Chain International Forum (SEMI China Member Day）
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Add to Calendar2023-10-18 00:00:002023-10-20 00:00:002023 SEMI China Semiconductor Supply Chain International Forum (SEMI China Member Day）Shenzhen ChinaSEMI.org[email protected]America/Los_Angelespublic
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Add to Calendar2023-10-18 00:00:002023-10-20 00:00:002023 SEMI中国半导体供应链国际论坛暨SEMI中国会员日Shenzhen ChinaSEMI.org[email protected]America/Los_Angelespublic
Silicon Valley Breakfast Forum—Is Silicon Valley Surging Again as the Technology Innovation Hub?
Registration
Member Price: $100
Non-Member Price: $125
REGISTRATION INCLUDES:
Breakfast
Networking
DuPont Tour + Lunch
PDF Speaker Presentations
Registration is final. No refunds provided. No substitutions.
Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley Breakfast Forum.
Contact Lin Tso, [email protected] to learn about available sponsorship opportunities.
Is Silicon Valley Surging Again as the Technology Innovation Hub?
Silicon Valley is considered worldwide to be the global center of technology and innovation. Many of the world’s largest technology corporations and startups reside in Silicon Valley. Besides leading in semiconductor chips and computers, Silicon Valley has been bustling with venture capital funding opportunities, brilliant innovations, ideas from the brightest minds, and inventions from leading high-tech universities.
With high-tech companies moving to other states, hear first-hand how Silicon Valley will maintain its leadership as the Technology Innovation Hub of the future. Hear insight on–
Market Trends & Technology Drivers, Emerging Sectors, Forecast and Outlook
Semiconductor Growth and How It Will Impact Silicon Valley
Mobility of STEM Talent, Free Trade, Global Value Chains
Is Silicon Valley’s Star Rising Again
Legacy & Startup Culture
Mergers & Acquisitions
Rise of AI Startups
And More
The SEMI Silicon Valley Breakfast Forum is a great opportunity to network with Industry leaders, speakers, and colleagues. Come together to meet other local industry executives to spark ideas. Collaborate with peers and share how your business may be impacted.
DuPont Silicon Valley Technology & Innovation Center Tour
All registered SVBF attendees are cordially invited to an exclusive tour of the DuPont cutting-edge applied engineering labs and innovation center. Enjoy light hors d'oeuvres, beverages, and networking while exploring new technologies. DuPont looks forward to showcasing its state-of-the-art facilities and hosting you for a day of discovery.
12:15–2:30pm
965 W Maude Ave, Sunnyvale, CA 94085
In-Person—Pacific Time SEMI HQ 673 S. Milpitas Blvd. Milpitas, CA95035 United States
Pacific Time | Friday, October 13, 2023 | In-Person
8:00 am
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8:30 am
Networking Breakfast & Check-In
8:30 am
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8:35 am
Cheryl Knepfler
Silicon Valley Chapter Co-Chair and Vice President Marketing
Ultra Clean Technology
Welcome & Introduction—Silicon Valley Chapter Co-Chair
8:35 am
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9:00 am
Tristan Holtam
Head of Corporate Strategy & Development, Chief of Staff to CEO
Silicon Valley Chapter Co-Chair & Director of Human Resources
SCREEN
Closing Remarks and Travel to DuPont for Tour
12:15 pm
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2:30 pm
Tour of DuPont Silicon Valley Technology & Innovation Center
SEMI Silicon Valley Breakfast Forum
Is Silicon Valley Surging Again as the Technology Innovation Hub?
Presented by the SEMI Silicon Valley Chapter
8:00 am - 11:30 am
Off
Add to Calendar2023-10-13 08:00:002023-10-13 11:30:00Silicon Valley Breakfast Forum—Is Silicon Valley Surging Again as the Technology Innovation Hub? SEMI Silicon Valley Breakfast ForumIn-Person—Pacific Time SEMI HQ 673 S. Milpitas Blvd. Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
2
All registered SVBF attendees are cordially invited to an exclusive tour of the DuPont cutting-edge applied engineering labs and innovation center. Enjoy light hors d'oeuvres, beverages, and networking while exploring new technologies. DuPont looks forward to showcasing its state-of-the-art facilities and hosting you for a day of discovery.
Cancellations received on or before October 4, 2024 will be fully refunded. After this date, only substitutions will be accepted.
Please email your cancellation request to Agnes Cobar at [email protected]. Refunds will not be issued for cancellations (including no-shows) made after October 2. Substitutes are only accepted with written permission from the original registrant.
As AI proliferates rapidly, AI models and datasets are also growing rapidly in size, giving rise to two fundamental challenges. First, this growth far outpaces performance improvement in hardware systems and infrastructure, and second, the energy consumption for AI continues to grow unsustainably.
These challenges are formidable and cannot be solved by one entity or in isolated silos. SEMI (www.semi.org), a global electronics industry association with 3300 member companies, is organizing this workshop under its Smart Data-AI Initiative. We are bringing together experts to discuss the latest innovations in the entire-AI ecosystem – including novel devices, 2D materials, analog computing, advanced packaging, chiplets, photonics, hardware-software co-optimzation and energy-efficient architectures & algorithms for data centers, cloud & edge.
Please join us on March 19th in Milpitas, CA. We will start with an inspiring keynote from Tristan Holtam, GVP, CEO Chief of Staff, Corporate Strategy and Development, Applied Materials, and continue through the day with industry leaders (AMD, Arm, ASE, Google DeepMind, IBM, Intel, Lam Research, Mckinsey, Micron, Nvidia, Qualcomm, SK Hynix); exciting start-ups (Cerebras, LightMatter, Mentium) and leading-edge academic researchers (Stanford U. and U. of California). Together, let us explore collaborative, system-level solutions for sustainable progress in AI systems.
SEMI 673 S. Milpitas Blvd Milpitas, CA95035 United States
8:00 am
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8:30 am
Registration, Coffee/Tea + Pastries
8:30 am
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8:35 am
Welcome
Pushkar Apte, Smart Data-AI Lead and Strategic Technology Advisor, SEMI
8:35 am
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8:45 am
SEMI Perspective
Ajit Manocha, CEO, SEMI
8:45 am
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9:30 am
Accelerating Energy-Efficient Computing
Tristan Holtam, GVP, CEO Chief of Staff, Corporate Strategy and Development, Applied Materials
9:30 am
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10:00 am
Future of Computing Landscape- Opportunities and Challenges
Jim Sexton, Fellow, IBM
10:00 am
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10:15 am
Coffee Break
10:15 am
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11:30 am
Chair/Moderator: Gity Samadi, Senior Director of R&D Programs, SEMI
David Fried, Corporate VP, Lam Research
Eric Pop, Pease-Ye Professor of Electrical Engg., Stanford University
Geoffrey Burr, Distinguished Research Scientist, IBM Research
Saif Islam, Professor, Dept. of Electrical & Computer Engg., U. of California, Davis
Ashonita Chavan, Distinguished Member of Technical Staff, Micron
11:30 am
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11:40 am
SEMI Technology Communities
Melissa Grupen-Shemansky, VP & CTO, SEMI
11:40 am
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12:55 pm
Chair/Moderator: Melissa Grupen-Shemansky, SEMI
Steve Klinger, LightMatter, VP of Product
Jaesik Lee, VP of Package Engineering, SK Hynix
Debendra Das Sharma, Senior Fellow, Intel and Chair of UCIe & CXL Consortium
Boris Vaisband, Asst. Professor, UC Irvine
12:55 pm
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2:00 pm
Lunch
2:00 pm
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2:10 pm
Market Overview for AI
Wendy Zhu, McKinsey & Co.
2:10 pm
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2:20 pm
SEMI Smart Data-AI Initiative Overview
Pushkar Apte
2:20 pm
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3:35 pm
Chair/Moderator: Jim Sexton, IBM
Evgeni Gousev, Senior Director, Qualcomm; and Chair, Board of Directors, TinyML Foundation
Mirko Prezioso, CEO, Mentium
Wilfred Gomes, CEO, Mueon
Chloe Jian Ma, Vice President, Arm
3:35 pm
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3:45 pm
Coffee Break
3:45 pm
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5:00 pm
Chair/Moderator: Pushkar Apte, SEMI
JP Fricker, Founder and Chief System Architect, Cerebras
The SEMI Server Certification Protocol was developed to minimize the unauthorized use (piracy) of licensed software. Developed by a partnership of companies in the Electronic Design Automation (EDA) industry and managed by the Electronic System Design Alliance, a SEMI Technology Community, the protocol is applicable to many high-value software solutions. The protocol achieves this by being able to uniquely identify license servers – closing a loophole that is often exploited to enable unauthorized software use.
Later this year, SEMI will begin offering licenses to the protocol to companies wishing to strengthen their software license management systems against unauthorized usage.
On Wednesday, September 27th, the ESD Alliance will be presenting a webinar on the protocol including:
How software piracy impacts both software vendors and their customers
An overview of how the protocol is used to prevent license server duplication
A description of the protocol and its scope
How the protocol can be integrated into a software license management system
Additional background on use cases and how the protocol can be applied in different environments
The webinar will be presented by the chair of the joint development team that developed the protocol and will include a Q&A session.
United States
Wednesday, September 27, 2023 | 10:00-11:30am Pacific Time
10:00 am
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10:15 am
Bob Smith
Executive Director, ESDA,
SEMI
Welcome and Impact of Software Piracy
10:15 am
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11:00 am
Chair, SEMI/ESDA License Management and Anti-Piracy Committee
Sashi Subramanian
Senior Group Director, Licensing, Downloads and Release Operations,
Cadence
Introduction to the SEMI Server Certification Protocol
Are you involved in managing your company’s software licensing practices and infrastructure? If so, this free webinar is for you!
Register today for this informative webinar presented by the Electronic System Design (ESD) Alliance.
SEMI License Server Certification Protocol
[VIRTUAL WEBINAR]
September 27, 2023
10:00–11:30am Pacific Time
10:00 am - 11:30 am
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Add to Calendar2023-09-27 10:00:002023-09-27 11:30:00SEMI License Server Certification Protocol WebinarAre you involved in managing your company’s software licensing practices and infrastructure? If so, this free webinar is for you!
Register today for this informative webinar presented by the Electronic System Design (ESD) Alliance.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
REGISTER NOW
Leveraging the CHIPS Act: Texas Semiconductor Industry Incentives & Initiatives
Texas is the top state in the nation for semiconductor manufacturing, according to Business Facilities Magazine, and has led the nation for 12 years in a row in the exporting of semiconductors and other electronic components. Join SEMI and the Texas Economic Development & Tourism Office (EDT) for an overview of the Lone Star State’s plan to continue leading the nation in the research, design and production of semiconductors.
Significant industry investments announced in Texas in the last two years will accelerate domestic semiconductor manufacturing, reducing reliance on foreign production and supply chains and further ensuring our national security. Texas has the innovation, the infrastructure and the talent to continue to lead the American resurgence in critical semiconductor manufacturing and the technologies of tomorrow.
This webinar will provide the opportunity to learn more about the state’s new incentives and initiatives that leverage the federal CHIPS Act, including the Texas Semiconductor Innovation Consortium and the Texas Semiconductor Innovation Fund.
Join us to learn more about how Texas is focused on the future of semiconductor industry development!
Meet the Speakers
John Cooney
VP, Global Advocacy & Public Policy
SEMI
Arizona CHIPS Act Support: Leveraging State Government Incentives
SEMI has invited the Arizona Commerce Authority (ACA) to discuss Arizona state services and programs that can be leveraged in alignment with current and upcoming CHIPS Funding opportunities. The Arizona Commerce Authority is Arizona’s leading economic development organization and provides comprehensive, customized support to companies of all sizes across the entire semiconductor value chain.
Arizona leads the nation for semiconductor investments, with more than $60 billion invested since 2020. Webinar participants will learn why Arizona is a premier location for semiconductor operations and what government incentives are available to strategically complement competitive CHIPS proposals. Following a short presentation, there will be an opportunity for Q&A.
Meet the Speakers
Joe Stockunas
President
SEMI Americas
Vic Narusis
Executive Vice President, Business Development
Arizona Commerce Authority
Co-sponsored by
This Virtual Forum is 10:00–11:00am Pacific Time
United States
Co-sponsored by SEMI and Arizona Commerce Authority
The Arizona CHIPS Act webinar will outline the customized support and advantageous programs that companies can leverage for more competitive CHIPS Act applications.
Arizona CHIPS Act Support: Leveraging State Government Incentives
[VIRTUAL EVENT]
Arizona CHIPS Act Support: Leveraging State Government Incentives
July 25, 2023
10:00 am - 11:00 am
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Register Now
Hetero Integration, High Performance Computing and AI
Xin Wu received PhD and MSc from University of California Berkeley USA and Peking University, China, respectively. Since 1993, he has worked in Xilinx (acquired by AMD in 2022) from 0.6um till 2nm generations of technologies and products, from many foundries and suppliers. His responsibilities include silicon, hetero-integration, advanced packaging, thermal mechanical solutions and many other technologies development.
Mr. Moon is currently working as a technical leader (VP) for package technology development, in SK hynix. He has more than 25 years’ experience in semiconductor package development including wafer level, flip chip and 2.5D/ 3D packaging as well as conventional package.
He previously served as package development project manager for package material, process and equipment until assuming his current role in 2022. And he has been involved in the development and mass production of NAND Flash, DRAM/ Mobile, MCP, RDL, Flip chip, WLCSP and TSV.
He received degree in chemistry from Sogang University in Seoul, Korea.
The next wave of Semiconductor Innovation – Multi-die system solution
Donghan Kim is a leader of Strategy Collaboration Solution Development at Synopsys Korea. He is responsible for leading 2.5D and 3D multi-die system solution business aiming to offer a complete end-to-end solution for efficient multi-die system integration.
He has more than 20 years of experience in semiconductor industry and has worked extensively on SOC mobile chip designs such as Exynos series at Samsung Electronics. He had a strong track record of successfully developing modem, WiFi and Bluetooth chipset products.
He received MS degree in electronic engineering from Sogang university in Seoul Korea where he did research topics on wireless communications and Semiconductor.
10:30 am
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11:00 am
Stefan Chitoraga
Technology and Market Analyst, Packaging and Assembly
Yole Group
Status of High-End Performance Packaging (2.5D & 3D) - Technology and Market Trends
Stefan Chitoraga is a Technology and Market Analyst specializing in Packaging and Assembly at Yole Intelligence, part of Yole Group. Within the Semiconductor, Memory & Computing division at Yole, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is involved daily in the production of technology & market reports and custom consulting projects.
Prior to Yole, Stefan served as a Package Design Engineer at Teledyne E2V for 4 years, where he was in charge of the ceramic package and glass lid development for image sensors, developing mechanical design, routing, electrical and thermal simulations.
Stefan holds a Bachelor’s in Electronics and Computer Science for Industry Applications from the Polytech Grenoble (France).
Jongsoo Choi, Ph.D. was appointed as head of marketing strategy part at Business Development Team of AVP Business, Samsung Electronics in December 2022, after completing Advanced PKG Task Force for six months. Before his new role, Dr. Choi was responsible for SoC product marketing as a director at System LSI Business from 2014.
Prior to joining the System LSI, Dr. Choi was Principal Engineer, and has led 4G mobile communication standards project at DMC R&D Center (now Samsung Research) since he joined Samsung Electronics in 2005, where he contributed to the 3rd Generation Partnership Project (3GPP) specifications which cover cellular telecommunications technologies, and also served as a vice chairman of 3GPP TSG GERAN from 2007 to 2011.
Dr. Choi received a Ph.D. degree in Electrical Engineering from the University of Ottawa, Ontario, Canada, where he focused research topics on wireless communications and adaptive signal processing.
Interconnect via scaling and challenges with hybrid bonding
Dr. Vikas Dubey, is a senior scientist at Fraunhofer ENAS since 2021 with system packaging department. He is into advanced system packaging for more than 10 years. He is currently leading the research activities related to hybrid bonding, collective die to wafer bonding and several other wafer bonding technologies for MEMS/NEMS integration. Besides, in his current role he is directly responsible for project acquisition, managing public and industrial projects and related to advance system integration, hybrid wafer bonding and assembly.
Prior to joining Fraunhofer ENAS he worked as a technology manager at national nanofabrication center (NNFC) at Indian Institute of Sciences, Bangalore. During his time at APTIV services located in hungary, he was responsible for several six sigma projects which lead to million of euros in earnings.
Dr. Dubey received his PhD degree from materials engineering department from KU Leuven, where he worked at imec with his research focused on self-aligned assembly for fine pitch integration.
3:00 pm
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3:30 pm
Dongshun Bai
Senior Technologist & Business Development Director
Brewer Science
Novel Materials for Advanced Packaging
Dongshun Bai, Ph.D. has been with Brewer Science, Inc. since 2007. Dongshun works as the Senior Technologist & Business Development Director in the Packaging Solutions Business Unit, in charge of technology roadmap direction of new material development for advanced packaging. He also leads the Business Development team and oversees the global business activities for advanced packaging materials.
Dongshun spent his first 10 years at Brewer Science in its Advanced Technologies R&D group. Working as Senior Program Manager and Senior Scientist, he led an R&D team focused on material design and development for advanced packaging. Many materials developed by his team went to commercialization and became the major products in the portfolio.
Dongshun earned a Ph.D. degree in Chemical Engineering from Vanderbilt University, Nashville, TN, USA and a Master of Engineering degree in Chemical Engineering from the National University of Singapore. Dongshun has published numerous papers and patents and delivered many talks, including invited talks at international conferences. He currently serves as a technical committee member for IMAPS and EPTC.
SeokHo Na joined Amkor Technology Korea in 1996 and worked for R&D engineer until now with responsibility of semiconductor material & process development. Major work is chip to substrate interconnection technology development such as wire bonding, Material Characterization, Flip Chip package CIP (chip to package interaction) and LAB (Laser Assisted Bonding) technology.
Prior to joining Amkor Technology Korea, Na received a bachelor’s degree and master’s’ degree in Material Science & Technology from Yeungnam University, Korea
The Advanced Packaging Summit is a conference dedicated to exploring the latest advancements in packaging technology for high-performance computing (HPC) and interconnection. The summit brings together leading experts, researchers, and industry professionals to share their insights and experiences on advanced packaging solutions that enable high-density, high-bandwidth, and low-latency interconnects for HPC systems. Topics covered at the summit include 3D packaging, hybrid bonding, LAB(Laser Assisted Bonding), heterogeneous integration, supply chain management, and more. Attendees will gain valuable insights and have the opportunity to network with experts in the industry.
Advanced Packaging Summit 2023
September 5(Tue), 2023 | Hall 3, Suwon Convention Center
9:00 am - 5:30 pm
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Add to Calendar2023-09-05 09:00:002023-09-05 17:30:00Advanced Packaging Summit 2023The Advanced Packaging Summit is a conference dedicated to exploring the latest advancements in packaging technology for high-performance computing (HPC) and interconnection. The summit brings together leading experts, researchers, and industry professionals to share their insights and experiences on advanced packaging solutions that enable high-density, high-bandwidth, and low-latency interconnects for HPC systems. Topics covered at the summit include 3D packaging, hybrid bonding, LAB(Laser Assisted Bonding), heterogeneous integration, supply chain management, and more. Attendees will gain valuable insights and have the opportunity to network with experts in the industry.Suwon Convention Center South KoreaSEMI.org[email protected]Asia/Seoulpublic
Asia/Seoul
DISCOVER APS 2025
