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  • SEMI Member:  $175 

  • Non-Members:  $225

This Event is SOLD OUT

Cancellations received on or before October 4, 2024 will be fully refunded. After this date, only substitutions will be accepted. 

Please email your cancellation request to Agnes Cobar at [email protected]. Refunds will not be issued for cancellations (including no-shows) made after October 2. Substitutes are only accepted with written permission from the original registrant. 

For questions, please contact Pushkar Apte at [email protected]

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United States 800x800_Futrue_Computing Business Executive Technical

As AI proliferates rapidly, AI models and datasets are also growing rapidly in size, giving rise to two fundamental challenges. First, this growth far outpaces performance improvement in hardware systems and infrastructure, and second, the energy consumption for AI continues to grow unsustainably.

These challenges are formidable and cannot be solved by one entity or in isolated silos. SEMI (www.semi.org), a global electronics industry association with 3300 member companies, is organizing this workshop under its Smart Data-AI Initiative. We are bringing together experts to discuss the latest innovations in the entire-AI ecosystem – including novel devices, 2D materials, analog computing, advanced packaging, chiplets, photonics, hardware-software co-optimzation and energy-efficient architectures & algorithms for data centers, cloud & edge.

Please join us on March 19th in Milpitas, CA. We will start with an inspiring keynote from Tristan Holtam, GVP, CEO Chief of Staff, Corporate Strategy and Development, Applied Materials, and continue through the day with industry leaders (AMD, Arm, ASE, Google DeepMind, IBM, Intel, Lam Research, Mckinsey, Micron, Nvidia, Qualcomm, SK Hynix); exciting start-ups (Cerebras, LightMatter, Mentium) and leading-edge academic researchers (Stanford U. and U. of California). Together, let us explore collaborative, system-level solutions for sustainable progress in AI systems.

SEMI
673 S. Milpitas Blvd
Milpitas, CA 95035
United States

8:00 am - 8:30 am

Registration, Coffee/Tea + Pastries

8:30 am - 8:35 am

Welcome

Pushkar Apte, Smart Data-AI Lead and Strategic Technology Advisor, SEMI

8:35 am - 8:45 am

SEMI Perspective

Ajit Manocha, CEO, SEMI

8:45 am - 9:30 am

Accelerating Energy-Efficient Computing

Tristan Holtam, GVP, CEO Chief of Staff, Corporate Strategy and Development, Applied Materials

9:30 am - 10:00 am

Future of Computing Landscape- Opportunities and Challenges

Jim Sexton, Fellow, IBM

10:00 am - 10:15 am

Coffee Break

10:15 am - 11:30 am

Chair/Moderator: Gity Samadi, Senior Director of R&D Programs, SEMI

David Fried, Corporate VP, Lam Research

Eric Pop, Pease-Ye Professor of Electrical Engg., Stanford University

Geoffrey Burr, Distinguished Research Scientist, IBM Research

Saif Islam, Professor, Dept. of Electrical & Computer Engg., U. of California, Davis

Ashonita Chavan, Distinguished Member of Technical Staff, Micron

11:30 am - 11:40 am

SEMI Technology Communities

Melissa Grupen-Shemansky, VP & CTO, SEMI

11:40 am - 12:55 pm

Chair/Moderator: Melissa Grupen-Shemansky, SEMI

Steve Klinger, LightMatter, VP of Product

Jaesik Lee, VP of Package Engineering, SK Hynix

Debendra Das Sharma, Senior Fellow, Intel and Chair of UCIe & CXL Consortium

Boris Vaisband, Asst. Professor, UC Irvine

12:55 pm - 2:00 pm

Lunch

2:00 pm - 2:10 pm

Market Overview for AI

Wendy Zhu, McKinsey & Co.

2:10 pm - 2:20 pm

SEMI Smart Data-AI Initiative Overview

Pushkar Apte

2:20 pm - 3:35 pm

Chair/Moderator: Jim Sexton, IBM

Evgeni Gousev, Senior Director, Qualcomm; and Chair, Board of Directors, TinyML Foundation

Mirko Prezioso, CEO, Mentium

Wilfred Gomes, CEO, Mueon

Chloe Jian Ma, Vice President, Arm

3:35 pm - 3:45 pm

Coffee Break

3:45 pm - 5:00 pm

Chair/Moderator: Pushkar Apte, SEMI

JP Fricker, Founder and Chief System Architect, Cerebras

Cliff Young, Software Engineer, Google DeepMind

Nuwan Jayasena, AMD Fellow

John Hu, Director of Advanced Technology, Nvidia

5:00 pm - 5:05 pm

Wrap up and Next Steps, Pushkar Apte

5:05 pm - 6:45 pm

Networking and Reception

Smart MFG Smart Data & AI MSIG

THIS EVENT IS SOLD OUT

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REGISTRATION

Registration is free.

United States ESDA Webinar - SEMI License Server Certification Protocol Business

SEMI License Server Certification Protocol

The SEMI Server Certification Protocol was developed to minimize the unauthorized use (piracy) of licensed software. Developed by a partnership of companies in the Electronic Design Automation (EDA) industry and managed by the Electronic System Design Alliance, a SEMI Technology Community, the protocol is applicable to many high-value software solutions. The protocol achieves this by being able to uniquely identify license servers – closing a loophole that is often exploited to enable unauthorized software use.

Later this year, SEMI will begin offering licenses to the protocol to companies wishing to strengthen their software license management systems against unauthorized usage. 

On Wednesday, September 27th, the ESD Alliance will be presenting a webinar on the protocol including:

  • How software piracy impacts both software vendors and their customers
  • An overview of how the protocol is used to prevent license server duplication
  • A description of the protocol and its scope
  • How the protocol can be integrated into a software license management system
  • Additional background on use cases and how the protocol can be applied in different environments

The webinar will be presented by the chair of the joint development team that developed the protocol and will include a Q&A session.

United States

Wednesday, September 27, 2023 | 10:00-11:30am Pacific Time

10:00 am - 10:15 am
Bob Smith
Bob Smith
Executive Director, ESDA,
SEMI

Welcome and Impact of Software Piracy

10:15 am - 11:00 am
Sashi Subramanian, Cadence
Chair, SEMI/ESDA License Management and Anti-Piracy Committee
Sashi Subramanian
Senior Group Director, Licensing, Downloads and Release Operations,
Cadence

Introduction to the SEMI Server Certification Protocol

11:00 am - 11:30 am

Q&A

ESD Alliance

Are you involved in managing your company’s software licensing practices and infrastructure? If so, this free webinar is for you!

Register today for this informative webinar presented by the Electronic System Design (ESD) Alliance.

10:00 am - 11:30 am Off Add to Calendar 2023-09-27 10:00:00 2023-09-27 11:30:00 SEMI License Server Certification Protocol Webinar Are you involved in managing your company’s software licensing practices and infrastructure? If so, this free webinar is for you! Register today for this informative webinar presented by the Electronic System Design (ESD) Alliance. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
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REGISTRATION

Registration is free.

United States Business Executive

Leveraging the CHIPS Act: Texas Semiconductor Industry Incentives & Initiatives

Texas is the top state in the nation for semiconductor manufacturing, according to Business Facilities Magazine, and has led the nation for 12 years in a row in the exporting of semiconductors and other electronic components. Join SEMI and the Texas Economic Development & Tourism Office (EDT) for an overview of the Lone Star State’s plan to continue leading the nation in the research, design and production of semiconductors. 
 
Significant industry investments announced in Texas in the last two years will accelerate domestic semiconductor manufacturing, reducing reliance on foreign production and supply chains and further ensuring our national security. Texas has the innovation, the infrastructure and the talent to continue to lead the American resurgence in critical semiconductor manufacturing and the technologies of tomorrow. 

This webinar will provide the opportunity to learn more about the state’s new incentives and initiatives that leverage the federal CHIPS Act, including the Texas Semiconductor Innovation Consortium and the Texas Semiconductor Innovation Fund. 

Join us to learn more about how Texas is focused on the future of semiconductor industry development!

 

Meet the Speakers

John Cooney

John Cooney
VP, Global Advocacy & Public Policy
  SEMI

Biography

 

Adriana Cruz

 

Adriana Cruz
Executive Director
  Texas Economic Development & Tourism

Biography

Larry McManus

Larry McManus
Director for Business & Community Development
  Texas Economic Development & Tourism

Biography

 

Tune in for the complimentary virtual webinar on August 7, 2023 from 1:00–2:00pm Central Time!

 

Co-Sponsors

                        

semi logo

                                    TexasEDT

 

United States

 

Co-sponsored by SEMI and Texas Economic Development & Tourism Office (EDT)

 

1:00 pm - 2:00 pm Off Add to Calendar Disabled America/Indiana/Marengo 2 Register Now
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Registration

Registration is free 

United States Business Executive

Arizona CHIPS Act Support: Leveraging State Government Incentives

SEMI has invited the Arizona Commerce Authority (ACA) to discuss Arizona state services and programs that can be leveraged in alignment with current and upcoming CHIPS Funding opportunities. The Arizona Commerce Authority is Arizona’s leading economic development organization and provides comprehensive, customized support to companies of all sizes across the entire semiconductor value chain. 

Arizona leads the nation for semiconductor investments, with more than $60 billion invested since 2020. Webinar participants will learn why Arizona is a premier location for semiconductor operations and what government incentives are available to strategically complement competitive CHIPS proposals. Following a short presentation, there will be an opportunity for Q&A. 

 

 

Meet the Speakers 

 

Joe Stockunas

 

Joe Stockunas
President
  SEMI Americas

 

 

Michael GOBiz

 

 Vic Narusis
     Executive Vice President, Business Development
         Arizona Commerce Authority

 

 

 

 

Co-sponsored by 

                        

semi logo

                                    Go Biz

 

This Virtual Forum is 10:00–11:00am Pacific Time

United States

 

Co-sponsored by SEMI and Arizona Commerce Authority

The Arizona CHIPS Act webinar will outline the customized support and advantageous programs that companies can leverage for more competitive CHIPS Act applications.

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles 2 Register Now
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REGISTRATION

Registration
  • Early-bird Registration Close: 5 pm, Tuesday, August 29(KST)

Registration Fee

  • Pre-Registration (Until August 29)
Price SEMI Members Non Members
1 Session KRW 120,000 KRW 150,000
2 Sessions KRW 200,000 KRW 240,000

 

  • On Site
Price SEMI Members Non Members
1 Session KRW 150,000 KRW 180,000
2 Sessions KRW 240,000 KRW 290,000
Registration
South Korea Register Now APS_Banner_2023.06.14_squre2.jpg Business Technical

OVERVIEW

  • Date: September 5(Tue), 2023
  • Time: 09:00 – 17:30
  • Venue: Hall 3, Suwon Convention Center
  • Language: Korean / English (Simultaneous interpretation will be provided)
  • Organizer: SEMI

 

SPONSORS

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asprotAPS_sponsor_tel_0.jpg   

 

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NOTICE

  • The agenda will be subject to change without notice.
  • Presentation files agreed by speakers will be provided to attendees.

 

CONTACT

Suwon Convention Center
South Korea

Session 1: High-Performance Computing

9:00 am - 9:30 am
1_Xin Wu_AMD
Xin Wu
Corporate Vice President, Silicon Technology
AMD

Hetero Integration, High Performance Computing and AI

Xin Wu received PhD and MSc from University of California Berkeley USA and Peking University, China, respectively. Since 1993, he has worked in Xilinx (acquired by AMD in 2022) from 0.6um till 2nm generations of technologies and products, from many foundries and suppliers. His responsibilities include silicon, hetero-integration, advanced packaging, thermal mechanical solutions and many other technologies development.

※ Abstract

9:30 am - 10:00 am
2_KI ILL MOON.jpg
Ki Ill Moon
VP, Head of PKG Tech. Development
SK hynix

PKG Interconnection Technology for HBM

Mr. Moon is currently working as a technical leader (VP) for package technology development, in SK hynix. He has more than 25 years’ experience in semiconductor package development including wafer level, flip chip and 2.5D/ 3D packaging as well as conventional package.

He previously served as package development project manager for package material, process and equipment until assuming his current role in 2022. And he has been involved in the development and mass production of NAND Flash, DRAM/ Mobile, MCP, RDL, Flip chip, WLCSP and TSV.

He received degree in chemistry from Sogang University in Seoul, Korea.

※ Abstract

10:00 am - 10:30 am
그림1.png
Donghan Kim
Sr Staff / Head of SCSD
Synopsys

The next wave of Semiconductor Innovation – Multi-die system solution

Donghan Kim is a leader of Strategy Collaboration Solution Development at Synopsys Korea. He is responsible for leading 2.5D and 3D multi-die system solution business aiming to offer a complete end-to-end solution for efficient multi-die system integration.
He has more than 20 years of experience in semiconductor industry and has worked extensively on SOC mobile chip designs such as Exynos series at Samsung Electronics. He had a strong track record of successfully developing modem, WiFi and Bluetooth chipset products.
He received MS degree in electronic engineering from Sogang university in Seoul Korea where he did research topics on wireless communications and Semiconductor.

10:30 am - 11:00 am
Stefan CHITORAGA_Yole.jpg
Stefan Chitoraga
Technology and Market Analyst, Packaging and Assembly
Yole Group

Status of High-End Performance Packaging (2.5D & 3D) - Technology and Market Trends

Stefan Chitoraga is a Technology and Market Analyst specializing in Packaging and Assembly at Yole Intelligence, part of Yole Group. Within the Semiconductor, Memory & Computing division at Yole, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is involved daily in the production of technology & market reports and custom consulting projects.

Prior to Yole, Stefan served as a Package Design Engineer at Teledyne E2V for 4 years, where he was in charge of the ceramic package and glass lid development for image sensors, developing mechanical design, routing, electrical and thermal simulations.

Stefan holds a Bachelor’s in Electronics and Computer Science for Industry Applications from the Polytech Grenoble (France).

※ Abstract

11:00 am - 11:20 am

Break

11:20 am - 12:30 pm

Panel Discussion

Session 2: Interconnection Technology for HPC

2:00 pm - 2:30 pm
5_JongsooChoi_Samsung Electronics.jpg
Jongsoo Choi
Principal Professional
Samsung Electronics

Advanced Heterogeneous Integration

Jongsoo Choi, Ph.D. was appointed as head of marketing strategy part at Business Development Team of AVP Business, Samsung Electronics in December 2022, after completing Advanced PKG Task Force for six months. Before his new role, Dr. Choi was responsible for SoC product marketing as a director at System LSI Business from 2014.

Prior to joining the System LSI, Dr. Choi was Principal Engineer, and has led 4G mobile communication standards project at DMC R&D Center (now Samsung Research) since he joined Samsung Electronics in 2005, where he contributed to the 3rd Generation Partnership Project (3GPP) specifications which cover cellular telecommunications technologies, and also served as a vice chairman of 3GPP TSG GERAN from 2007 to 2011.

Dr. Choi received a Ph.D. degree in Electrical Engineering from the University of Ottawa, Ontario, Canada, where he focused research topics on wireless communications and adaptive signal processing.

※ Abstract

2:30 pm - 3:00 pm
6_Biography_Vikas Dubey_Advanced Packaging Summit 2023.jpg
Vikas Dubey
Senior Scientist Systems Packaging
Fraunhofer ENAS

Interconnect via scaling and challenges with hybrid bonding

Dr. Vikas Dubey, is a senior scientist at Fraunhofer ENAS since 2021 with system packaging department. He is into advanced system packaging for more than 10 years. He is currently leading the research activities related to hybrid bonding, collective die to wafer bonding and several other wafer bonding technologies for MEMS/NEMS integration. Besides, in his current role he is directly responsible for project acquisition, managing public and industrial projects and related to advance system integration, hybrid wafer bonding and assembly.
Prior to joining Fraunhofer ENAS he worked as a technology manager at national nanofabrication center (NNFC) at Indian Institute of Sciences, Bangalore. During his time at APTIV services located in hungary, he was responsible for several six sigma projects which lead to million of euros in earnings.
Dr. Dubey received his PhD degree from materials engineering department from KU Leuven, where he worked at imec with his research focused on self-aligned assembly for fine pitch integration.

3:00 pm - 3:30 pm
7_Biography-Advanced Packaging Summit.jpg
Dongshun Bai
Senior Technologist & Business Development Director
Brewer Science

Novel Materials for Advanced Packaging

Dongshun Bai, Ph.D. has been with Brewer Science, Inc. since 2007. Dongshun works as the Senior Technologist & Business Development Director in the Packaging Solutions Business Unit, in charge of technology roadmap direction of new material development for advanced packaging. He also leads the Business Development team and oversees the global business activities for advanced packaging materials.

Dongshun spent his first 10 years at Brewer Science in its Advanced Technologies R&D group. Working as Senior Program Manager and Senior Scientist, he led an R&D team focused on material design and development for advanced packaging. Many materials developed by his team went to commercialization and became the major products in the portfolio.

Dongshun earned a Ph.D. degree in Chemical Engineering from Vanderbilt University, Nashville, TN, USA and a Master of Engineering degree in Chemical Engineering from the National University of Singapore. Dongshun has published numerous papers and patents and delivered many talks, including invited talks at international conferences. He currently serves as a technical committee member for IMAPS and EPTC.

※ Abstract

3:30 pm - 4:00 pm
8_SeokHo Na.jpg
SeokHo Na
Master, Sr. Director, R&D
Amkor Technology Korea

Laser Assisted Bond (LAB) Technology Overview

SeokHo Na joined Amkor Technology Korea in 1996 and worked for R&D engineer until now with responsibility of semiconductor material & process development. Major work is chip to substrate interconnection technology development such as wire bonding, Material Characterization, Flip Chip package CIP (chip to package interaction) and LAB (Laser Assisted Bonding) technology.

Prior to joining Amkor Technology Korea, Na received a bachelor’s degree and master’s’ degree in Material Science & Technology from Yeungnam University, Korea

※ Abstract

4:00 pm - 4:20 pm

Break

4:20 pm - 5:30 pm

Panel Discussion

APHI

The Advanced Packaging Summit is a conference dedicated to exploring the latest advancements in packaging technology for high-performance computing (HPC) and interconnection. The summit brings together leading experts, researchers, and industry professionals to share their insights and experiences on advanced packaging solutions that enable high-density, high-bandwidth, and low-latency interconnects for HPC systems. Topics covered at the summit include 3D packaging, hybrid bonding, LAB(Laser Assisted Bonding), heterogeneous integration, supply chain management, and more. Attendees will gain valuable insights and have the opportunity to network with experts in the industry.

9:00 am - 5:30 pm Off Add to Calendar 2023-09-05 09:00:00 2023-09-05 17:30:00 Advanced Packaging Summit 2023 The Advanced Packaging Summit is a conference dedicated to exploring the latest advancements in packaging technology for high-performance computing (HPC) and interconnection. The summit brings together leading experts, researchers, and industry professionals to share their insights and experiences on advanced packaging solutions that enable high-density, high-bandwidth, and low-latency interconnects for HPC systems. Topics covered at the summit include 3D packaging, hybrid bonding, LAB(Laser Assisted Bonding), heterogeneous integration, supply chain management, and more. Attendees will gain valuable insights and have the opportunity to network with experts in the industry. Suwon Convention Center South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul DISCOVER APS 2025
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Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #4.

Taylor Zhao
Manager, Programs & Committees
[email protected]

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United States Register Now Business Technical

SiC—Silicon Carbide Webinar #4: Understanding Sic Chip Cost, the Impact of Defects, and the Case of Price Parity With Si at the System Level

Silicon devices are dominating power electronics due to their excellent starting material quality, streamlined fabrication, low-cost volume production, proven reliability and ruggedness, and design/circuit legacy. Although Si power devices continue to make progress, they are approaching their operational limits primarily due to their relatively low bandgap and critical electric field that result in high conduction and switching losses, and poor high temperature performance.

SiC power chips are gaining significant market share and are projected to capture over 30% of the power chip market by 2029. Their cost, however, remains above that of similarly rated silicon chips and increases disproportionately with area. In this presentation, various elements of SiC chip cost will be qualitatively analyzed including contributions of substrate, epitaxy, and chip manufacturing. Material defects will be discussed in terms of their impact on chip area scalability and yields, and wafer test maps will be presented to elucidate their correlation. Finally, the case of system-level price parity between Si and SiC will be made, achieved primarily through reduced mass and volume of magnetic components, and simplified thermal management

 

View other webinars in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology 
  • Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity With Si at the System Level 
  • Webinar #5—SiC Edge Termination Technology

 

Meet the Speaker

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Now Available On-Demand!

Join us online for the fourth webinar in the Silicon Carbide Series—Understanding SiC chip cost, the impact of defects, and the case of price parity with Si at the system level.

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Sponsorship Opportunities

Become a sponsor at this webinar to get sponsors' benefits and logo acknowledgement.
For more information, contact fseetoh@semi.org.

Highlighted content

With the focus on Smart Data-AI and Smart Manufacturing, this conference will delve into 4 tracks:

Track 1: AI Market Trends and Future AI Potential

Track 2: AI Adoption and Deployment in Manufacturing

Track 3: Cybersecurity Threats and Solutions Associated with AI

Who Should Attend:

  • Leadership and professionals in the semiconductor and electronics industry
  • Companies utilizing Artificial Intelligence Solutions in their product offerings
  • MNCs and SMEs seeking AI solutions or big data analytics in their workplace
  • Smart manufacturing practitioners, advocates and consultants
  • Academics and higher learning research institutions

PRICING

*Above rates are quoted in Singapore Dollars (SGD) and are subjected to 8% GST.
*Above rates are inclusive of coffee/tea breaks and luncheon for both days of the conference.
*Student rate is only applicable with a valid student pass.

 

 

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*Malaysian Companies - HRDC Claimable for ASTC 2023 November (subject to T&C, please contact HRDC for more information).
For HRDC claims, please refer to the following links on the claiming matrix and guidelines:

REGISTER NOW!


 

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Andaz Singapore
The Glasshouse @ Level 3
5 Fraser Street
189354
Singapore

12:30 pm

Registration and Lunch

1:30 pm
Image of Mr. Travers Lim
Mr. Travers Lim

Welcome Speech

Mr. Travers Lim | Director, Program and Business Development, SEMI Southeast Asia

1:35 pm
MarvinLee
Dr. Marvin Lee

Opening Keynote: Harnessing opportunities at the convergence of Semiconductors and Emerging Digital Tech

Dr. Marvin Lee | Director, Smart Nation and Digital Economy, National Research Foundation (NRF)

1:55 pm
ChinKokPoh_deloitte
Mr. Chin Kok Poh

Generative AI – It’s time to get on-board

Mr. Chin Kok Poh | Director, AI & Data, Deloitte Consulting

2:15 pm
LiXiaoli
Dr. Li Xiaoli

Revolutionizing Semiconductors: The Transformative Power of AI

Dr. Li Xiaoli | Department Head (Machine Intellection), A*STAR Institute of Infocomm Research (I2R)

2:35 pm
RandeepKapur
Mr. Randeep Kapur

Unlocking Innovation in Manufacturing with Emerging Technologies

Mr. Randeep Kapur | Chief Technology Officer Ambassador and Field Director, Global Industries, APJ & China, DELL Technologies

2:55 pm

Break and Networking

3:10 pm
SajKumar_Microsoft
Mr. Saj Kumar

The Future of Manufacturing with the AI Revolution

Mr. Saj Kumar | Regional Business Lead, Microsoft

3:30 pm
EhsanulIslam_Qualcomm
Mr. Ehsanul Islam

Harmonizing Precision and Intelligence – The Artistry of AI in Manufacturing

Mr. Ehsanul Islam | VP Engineering and Regional Head of SEA, Qualcomm

3:50 pm
Massimo Alioto
Prof. Massimo Bruno Alioto

Enabling Next-Generation Attentive & Intelligent AI Systems - At the Edge, at Scale

Prof. Massimo Bruno Alioto | Area Director, Integrated Circuits & Embedded Systems, National University of Singapore

4:10 pm

Panel Discussion: Impact and Future Potential of AI

Moderator: Mr. Chin Kok Poh | Director, AI & Data, Deloitte Consulting

Panelists:
Mr. Saj Kumar, Mr. Randeep Kapur, Dr. Li Xiaoli, Mr. Ehsanul Islam

4:55 pm

Plaque Presentation and Photo-taking

5:00 pm

Lucky Draw

9:30 am

Registration | Coffee and Tea

10:00 am
TakahitoMatsuzawa
Mr. Takahito Matsuzawa

AI Adoption for Semiconductor Manufacturing World

Mr. Takahito Matsuzawa | Vice President, Tokyo Electron Limited

10:20 am
Ms. Wint Kyi Phyu
Ms. Wint Kyi Phyu

Harnessing AI and Machine Learning in Operations for Quality and Efficiency Improvement

Ms. Wint Kyi Phyu | Manager, Operation Engineering-Data Analyst and Manufacturing System, Kulicke & Soffa

10:40 am
Dr. ArulMurugan Ambikapathi
Dr. Arulmurugan Ambikapathi

"AI Era" for End-to-End Process Development

Dr. Arulmurugan Ambikapathi | Data Science Manager, LAM Research

11:00 am

Break & Networking

11:20 am
VishalSingh
Mr. Vishal Singh

Digitalization at Infineon, Powered by Data & AI : Fostering Process Efficiency and Productivity

Mr. Vishal Singh | Head of Centre of Competence Analytics and Director, IT, Infineon Technologies

11:40 am
Mr. Oh Theng Cheng
Mr. Oh Theng Cheng

Applying artificial intelligence and machine learning for optimization in increasingly complex semiconductor manufacturing processes

Mr. Oh Theng Cheng | Senior Director, Innovation Engineering, Smart Manufacturing & AI, Micron Semiconductor Asia Pte Ltd

12:00 pm
Ms. Ice Li
Ms. Ice Li

Boosting Productivity by Using AI for Semiconductor Chip Design

Ms. Ice Li | Application Engineering Director, DSG SEA, Cadence

12:20 pm
SabryAly
Dr. Mohamed M. Sabry Aly

EMASS: Towards Algorithm-to-silicon ultra-low power Edge AI devices

Dr. Mohamed M. Sabry Aly |CEO & Founder, EMASS

12:40 pm

Plaque Presentation and Photo-taking

12:45 pm

Lunch & Networking

1:40 pm
JulianTan
Mr. Julian Tan

The Advancements of Quantum Computing and What this Means for Cybersecurity

Mr. Julian Tan | IBM Digital Supply Chain Transformation Leader (AI, Analytics and Quantum), IBM Singapore

2:00 pm
Dr. Khin Mi Mi Aung
Dr. Khin Mi Mi Aung

Emerging Digital Trust Technologies for Big Data Value Capture

Dr. Khin Mi Mi Aung | Senior Principal Scientist, Cybersecurity Department, Institute for Infocomm Research, 12R (A*STAR)

2:20 pm
HarisJavaid_AMD
Dr. Haris Javaid

Architectures for AI-Based Network Security

Dr. Haris Javaid | Director & Principal Researcher, AMD Singapore

2:40 pm
MartinSaerbeck
Dr. Martin Saerbeck

From Wafers to Firewalls: How AI Just Flipped Your Script

Dr. Martin Saerbeck | Chief Technology Officer - Digital Services, TUV SUD Asia Pacific Pte Ltd

3:00 pm

Break & Networking

3:20 pm
Ms. Veronika Indirawati
Ms. Veronika Indirawati

Secure from Start to Finish - Cybersecurity Integration Across the Semiconductor Manufacturing Process Lifecycle

Ms. Veronika Indirawati | Portfolio Consulting Professional, Siemens

3:40 pm
AkankshaJagwani
Ms. Akanksha Jagwani

Revolutionizing Manufacturing: Unleashing AI's Visual Inspection Power

Ms. Akanksha Jagwani | CEO and Founder, SixSense.ai

4:00 pm

Panel Discussion: Business Considerations in AI Strategy

Moderator: Mr. Julian Tan | IBM Digital Supply Chain Transformation Leader (AI, Analytics and Quantum), IBM Singapore

Panelists:
Dr. Haris Javaid, Dr. Martin Saerbeck, Ms. Akanksha Jagwani, Asst. Prof. Mohamed M. Sabry Aly

4:45 pm

Plaque Presentation & Lucky Draw

5:00 pm

End of ASTC 2023 November

6:00 pm - 9:00 pm

Members' Networking Night (by Invitation only)

Agenda is subject to change

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The remarkable advancements in Artificial Intelligence (AI) have spurred extraordinary expansion and creative innovation within the industry. This has paved the way for the SEMI Southeast Asia ASTC Conference & Exhibition of this year, which aims to delve into the Potential of AI and Cybersecurity associated in Manufacturing sector.

Off Add to Calendar 2023-11-16 00:00:00 2023-11-17 00:00:00 Advanced Semiconductor Technology Conference (ASTC) 2023 November The remarkable advancements in Artificial Intelligence (AI) have spurred extraordinary expansion and creative innovation within the industry. This has paved the way for the SEMI Southeast Asia ASTC Conference & Exhibition of this year, which aims to delve into the Potential of AI and Cybersecurity associated in Manufacturing sector. Andaz Singapore The Glasshouse @ Level 3 5 Fraser Street 189354 Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now!
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United States

Jennifer Braggin
Moderator
Jennifer Braggin
Director, Technology
Entegris
Soley Ozer, Intel
Dr. Soley Ozer
Strategic Assistant to Logic Technology Department GM
Intel
Stallar Jardine
Dr. Stallar Lufrano-Jardine
Sustainability & Supplier Diversity Program Manager
JSR Micro
EMG

In recent years, sustainability has emerged as a critical aspect of global development, demanding increased attention across industries. The semiconductor industry has a pivotal role to play in promoting environmental responsibility.

In this webinar we will hear the successes, challenges, and ongoing efforts from both a semiconductor device manufacturer and a semiconductor material supplier and how efforts across the supply chain influence each other. Join us as we foster knowledge sharing and collaborations to create a sustainable future for the semiconductor industry and the planet as a whole.

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles Register
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