Virtual, Online
United States
Contact
Member Price: $49
Non-Member Price: $99
Registration is final. No refunds provided. No substitutions.
Krish Raghunath
Email: [email protected]
Phone: +1.408.943.6982
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Contact Shane Poblete, +1.202.847.5983 or Eric Rude, +408.943.7047 to learn about available sponsorship opportunities.
Environmental Sustainability—Semiconductor Industry Challenges
High demand for semiconductor chips is driving significant growth and increased visibility of the industry. At the same time, the world is becoming more environmentally conscious and the topic of sustainability of semiconductor manufacturing is coming to the forefront. This requires the entire semiconductor value chain to concurrently support this growing demand while minimizing waste, toxic chemicals and gas emission to produce these chips.
Join us for a Virtual Webinar on March 18, 2022 as the SEMI Silicon Valley Chapter presents “Environmental Sustainability—Semiconductor Industry Challenges” for a great line-up of industry leaders from their own perspectives.
Topics include:
- SEMI’s Sustainability Initiative
- Sustainability trends in the industry
- Smart sustainable semiconductor chips
- Lowering utilities consumption, reducing carbon footprint
- Addressing chemicals and materials of concern
- Increasing fabrication/production energy efficiency
- Net Zero Strategy; multiple company perspectives
United States
Virtual Forum | Friday, March 18, 2022 | Pacific Time
Welcome Remarks
Introduction to SEMI Sustainability Initiative
Searching for Sustainability in the Microelectronics and AI World
S3: Startups for Semiconductor Sustainability
Make Possible a Better Future ESG from OEM Perspective – Applied Materials
ESG Strategy from Materials Manufacturer's Perspective – Entegris
Decarbonization Priorities in the Semiconductor Value Chain
Q&A - Moderated by James Amano
Closing Remarks
The SEMI Silicon Valley Chapter Presents:
ENVIRONMENTAL SUSTAINABILITY—Semiconductor Industry Challenges
REGISTRATION
Traffic Reminder
Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan City, Guangdong Province)
- Venue to Humen Railway Station 22 miles, 45 minutes’ drives.
- Venue to Shenzhen Bao'an International Airport 55 miles, 65 minutes’ drive.
China
Registration
Opening Remark
Key Technologies for Mass Manufacturing of MicroLEDs
Application and Developing Trend for Patterned Sapphire Substrate
Applications and Prospects of 3DIC Technology in Compound Semiconductor Devices
Latest Progress and Challenges on High-quality and Large-size AlN Single Crystals Grown by the PVT Method
Micro&Nano Fabrication Platform of Compound Semiconductor Materials and Devices
Break
Processing and Application Prospectives of Large-Scale Compound Semiconductors
Industrialization Analysis of Ultra-wide Bandgap Semiconductor Material Gallium Oxide and Its Devices
HVPE Growth of 4 Inch GaN Freestanding Wafer
Analysis of SiC Single Crystal Growth Technology and Application Prospect of SiC Materials
Large Scale Deposition Technology of AlN and AlScN for SMR BAW
The Latest Progress in The Industrialization of Diamond Wafer and Diamond Heat Sink
Compound Semiconductor Materials Technology Forum
Time: TBD
Location:Dongguan, Guangdong, China
Event Contact information:
Cassie Li
SEMI China
Email: [email protected]
Phone: 86.21.6027.7645
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509
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