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Belgium France Germany Ireland Italy United States REGISTER NOW 800x800 tile MSIG Jan 2023 Business Technical Featured Speakers
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Wafer Fabricated Atomic Reference Cells

Tom Kornack, Chief Scientist, Twinleaf LLC

Abstract: Quantum sensing often uses atomic systems in vapor phase. This talk will briefly review Twinleaf’s wafer-scale atomic vapor cell fabrication capabilities and some of the applications that have been addressed.

Speaker Bio: Dr. Kornack is an expert in the design, fabrication and operation of atomic magnetometers. At Twinleaf, he has commercialized a wide variety of high performance magnetic field sensors. As a graduate student and a postdoctoral research assistant working with the magnetometer research group at Princeton University, he developed the first laser zero-field SERF magnetometer. He has also developed co-magnetometers for use as a sensitive gyroscope and as a probe into fundamental laws of physics.



Laser Based Magnetic Field Sensor Formation for GMR / TMR Sensor Arrays

Dr. Dirk Lewke, Team Leader Technology Innovation Management

 

Abstract:  This presentation provides a deep inside into a laser-based annealing technology for GMR/TMR sensors, which enables the programming of advanced sensor structures at wafer level. The key feature is the combination of reaching the Curie-Temperature by applying a selective laser spot and an in-situ rotatable magnetic field while wafer travelling at high speed. Unique single sensor field programming enables high quality sensor read-out repeatability.

Speaker Bio:  Dr. Dirk Lewke studied mechatronic engineering at the University of Erlangen-Nuremberg. He received his doctorate in 2017. From 2011 to 2017 he worked at Fraunhofer IISB in the field of semiconductor manufacturing equipment as a scientist. Since 2017, Dr. Lewke has been working working at 3D-Micromac as a team leader for process development and technology manager for laser production equipment for semiconductor and photovoltaic industry.

Online, Virtual
United States

Tom Kornack
Dr. Thomas Kornack
Chief Scientist
Twinleaf LLC
Dirk Lewke
Dr. Dirk Lewke
Team Leader Technology Innovation Management
3D-Micromac
MSIG

We continue our Advanced Sensor webinar series with dual webinar presentations from technical leads at Twinleaf and 3D-Micromac, covering advanced magnetic sensor design and fabrication.  

These amazing devices play a critical role in measuring what we cannot see by their ultra-sensitivity to magnetic currents. Thinking about adding a magnetic sensor to extend the functionality of your device?  Then this is the webinar series for you.  

Join these technology experts to see how magnetic sensors work, are built and how to utilize them in your products or research.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles

Registration

Member Price: $49

Non-Member Price: $99

Registration is final. No refunds provided. No substitutions.

Lin Tso
Email: [email protected]
Phone: +1.408.943.7920

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Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley & Northeast Virtual Forum.

Contact Lin Tso, [email protected] or Paul Cohen, [email protected] to learn about available sponsorship opportunities.

Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession

Businesses across the globe faced a host of new challenges during the recent pandemic. As the pandemic wanes, we are now faced with recession as high inventories and low demand could mean trouble for semiconductor chip manufacturers.      

Join us to hear industry leaders and market experts discuss the outlook and the impact on semiconductor design and manufacturing supply chain in the near and long term, including regional and global economies, and the CHIPS Act.     

Speakers will discuss strategies for mitigating the impact and how to capture value.   

Topics include:

  • Market Trends & Forecast & Outlook    

  • Accessing Chips Act Funding and Roll out of Incentives  

  • Geopolitical Impact    

  • Advanced Packaging & Chiplets     

  • Emerging and Expanding Markets    

 

This Virtual Forum is 8:30–11:00am Pacific Time, 11:30am–2:00pm Eastern Time

United States

Virtual Forum | Thursday, March 16, 2023 | Pacific Time

8:30 am - 8:35 am
Joe Stockunas, President, SEMI Americas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:35 am - 8:55 am
John Cooney
John Cooney
Vice President, Global Public Policy & Advocacy
SEMI

An Update on the CHIPS Act and How to Apply for Funding

8:55 am - 9:20 am
Jay Vleeschhouwer, Griffin Securities
Jay Vleeschhouwer
Software Research
Griffin Securities

The State of EDA: A View from Wall Street

9:20 am - 9:45 am
Dan_Hutcheson_VLSIresearch
Dan Hutcheson
Vice Chair
TechInsights

New Perspectives in Semiconductors: Cycles & Outlooks

9:45 am - 10:10 am
Jean-Christophe Eloy, Yole Développement
Jean-Christophe Eloy
President and CEO
Yole Développement

Status of the Advanced Packaging Industry: How the Chiplet Revolution is Impacting the Industry?

10:10 am - 10:35 am
Lita Shon-Roy
Lita Shon-Roy
President/CEO
TECHCET

The Impact on Supply Chains - Materials & Equipment Consumables

10:35 am - 11:00 am
Joe Stockunas, President, SEMI Americas
Joe Stockunas
President
SEMI Americas

Q&A and Closing Remarks

The SEMI Silicon Valley and Northeast Chapters Present:

Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession

8:30 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles 2
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This year’s theme for the International Trade Partners Conference—ITPC—will guide an exploration of geopolitics, contentious trade and national security concerns, and our deep-rooted ambitions to maintain the global footprints we have created. Our manufacturing infrastructures, trade connections, and supply chains are now part of the geopolitical state – something few could have anticipated. We are finally witnessing governments, the media, and the general public taking notice of semiconductors and their critical importance.

United States P.Kaufman Thumbnail_690x448 Business Executive

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Become a Sponsor

Meet your branding and marketing objectives with a customized sponsorship package. Become a sponsor and brand your company to an influential audience of executives at ESDA/CEDA Phil Kaufman Awards.

Contact Tim Janes, [email protected],   +1.720.939.4992 to learn more.

Electronic System Design Alliance—ESDA and IEEE Council on EDA—CEDA are proud to honor

LIP-BU TAN

CEO, Intel and Former CEO, Cadence Design Systems with the

2025 Phil Kaufman Award


Lip-Bu Tan, Intel

2025 Award Recipient

Lip-Bu Tan is receiving this honor for his leadership and business impact on the Electronic Design Automation industry, a critical part of the global semiconductor supply chain.

Lip-Bu Tan’s influence shaped the direction of the semiconductor industry through his visionary leadership and strategic initiatives. Lip-Bu has an exceptional ability to spot important technology trends years before others see them. His ability to set a clear technical direction and inspire teams has had a lasting impact on the broader technology landscape.

Lip-Bu Tan will be honored at the 2025 Phil Kaufman Award Ceremony and Banquet on November 6, 2025 in San Jose, CA.

 

 

Sponsorship opportunities are available! (View the brochure.)
For information, contact Tim Janes, [email protected].

View Past Phil Kaufman Award Recipients

 

Hosted by

SEMI ESDA                        IEEE CEDA

Hayes Mansion
200 Edenvale Avenue
San Jose, CA 95136
United States

Phil Kaufman Honoree

Lip-Bu Tan, Intel
Lip-Bu Tan
Chief Executive Officer, Intel
Former Chief Executive Officer, Cadence Design Systems

Master of Ceremonies

Ed Sperling, Semiconductor Engineering
Ed Sperling
Editor in Chief
Semiconductor Engineering

Tribute Presenters

Alberto Sangiovanni-Vincentelli, UC Berkeley
2001 Phil Kaufman Award Recipient
Alberto Sangiovanni-Vincentelli, PhD
Edgar L. and Harold H. Buttner Chair of Electrical Engineering and Computer Sciences
University of California, Berkeley
ESD Alliance

The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers.

6:30 pm - 9:00 pm Off Add to Calendar Disabled America/Los_Angeles 1
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Registration

Sponsor tile for Jan workshops

Registration covers all 3 days of Workshops.  No discounts given for partial attendance.  Full refunds through December 17, 2022.  December 18-January 19 - substitutions only.

SEMI, FlexTech, NBMC & NextFlex Members:  $199

Non-Members:  $499

If you have any questions, please contact Gity Samadi, [email protected].

Sponsor tile for Jan workshops
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Hotel Information

SEMI has secured a Group Rate at the Staybridge Suites at 321 Cypress Drive, Milpitas, CA, at the special rate of $202/night with breakfast included.  

To reserve the rate visit Staybridge Suite website and follow these steps:

Step 1 – Enter your dates

Step 2 – Choose Rate Preference, then group rate, type in SJ1

Alternatively, you may email the General Manager at [email protected]

HEALTH AND SAFETY

Your health and safety are our top priority.  We monitor developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events.  For international attendees arriving from outside of the United States, please review the government travel guidance to confirm eligibility and requirements for travel.

FACE COVERINGS 

  • Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.

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SEMI FlexTech FHE Technical Gap Analysis Workshop  - Tues. 1/17 - 8 am-12 noon
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

During this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop.

SEMI NBMC Technical Gap Analysis Workshop - Tues. 1/17 - 1:00-5:00 pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

Attendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives.  A networking reception will follow the workshop.

SEMI FlexTech - FHE Standards Workshop - Wed 1/18 - 8:00am - 1:00pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

Many topics and paths were identified at the previous, very successful workshop in July 2022.  This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components.  This workshop includes a continental breakfast and lunch.

NextFlex - Hybrid Electronics for Advanced Packaging Workshop - Wed 1/18 2:00 - 7:00 pm & Thurs 1/19 - 8:00 am - 5:00 pm
@NextFlex, 2244 Blach Place, Suite 150, San Jose, CA

As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act, NextFlex is hosting a workshop to align the ecosystem’s vision on how additive hybrid electronics manufacturing can shape the future of domestic advanced semiconductor packaging. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing, proposal concept refinement, and formation of proposal teams.

Breakout topics include:

  • Direct Write Interconnects
  • Substrates and Buildup Layers
  • Interposers, Bridges & Architectures
  • Circuitization

SEMI & NEXTFLEX
Milpitas & San Jose, CA
United States

Tuesday, January 17 @ SEMI Milpitas

8:00 am - 8:30 am

Continental Breakfast

SEMI FlexTech FHE Technical Gap Analysis Workshop

8:30 am - 8:45 am
Melissa Grupen-Shemansky, SEMI
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI

Introduction

8:45 am - 9:00 am
Eric Forsythe, PhD
Program Manager
ARL

RFP Process and Background

9:00 am - 9:15 am
Bob Pranio, CHASM
Robert Praino
Chief Innovation Officer & Co-Founder
CHASM Advanced Materials

A Look Back and The Path Ahead & RFP Process

9:15 am - 10:45 am

Breakout Sessions for Technical Gap Analysis

10:45 am - 11:00 am

Break

11:00 am - 11:45 am

Break out Review & Summary

11:45 am

Wrap-Up

12:00 pm - 1:00 pm

Lunch

CHASM Technologies Logo

NBMC Technical Gap Analysis Workshop

1:00 pm - 1:15 pm
Melissa Grupen-Shemansky, SEMI
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI

Introduction

1:15 pm - 1:30 pm
Gina Tollefson
Program Manager
AFRL

NBMC 2023

1:30 pm - 1:45 pm
Azar Alizadeh
Principal Scientist
GE Research

RFP Process & Insights

1:45 pm - 2:00 pm

Break

2:00 pm - 4:00 pm

NBMC Break Out Sessions

4:00 pm - 4:45 pm

Final Review & Summary

4:45 pm - 5:00 pm

Wrap-Up

5:00 pm - 7:00 pm

Reception & Networking

CMU Logo

Wednesday, January 18, 2022

FHE Standards Workshop

8:00 am - 8:30 am

Continental Breakfast

8:30 am - 8:45 am
Gity Samadi
Gity Samadi
Sr. Director of R&D Programs
SEMI
PT
Paul Trio
Director, SEMI Standards
SEMI

Introduction of Project & Status

8:45 am - 9:15 am
Randall Parker
Randall Parker
American Semiconductor

The Need for Standards in Flexible & Printed Electronics

Bayflex logo
9:15 am - 10:45 am

Breakout Session on Selected Topics

10:45 am - 11:00 am

Break

11:00 am - 11:45 am

Review and Summaries from Breakouts

11:45 am - 12:00 pm

Wrap-Up

12:00 pm - 1:00 pm

Lunch

UW SoEngineering logo
1:00 pm - 2:00 pm

Travel Time to NextFlex -

For a detailed program agenda for this workshop visit NextFlex.us

- FlexTech MSIG Standards

Join us for three-days of technology assessments, updates, discovery and planning workshops focused on the development of the electronics ecosystem and flexible, hybrid electronics, medical monitoring sensors, and their application to driving development in new electronics packaging approaches.

Industry experts and leaders will come together to focus on identifying gaps in technology development, including in design, manufacturing, standards and environmental sustainability. 

8:00 am - 5:00 pm Off Add to Calendar Disabled America/Los_Angeles

Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

United States Harvey Kauget with Title Business Technical
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Harvey Kauget practices in the firm's Corporate Practice Group with a focus on intellectual property litigation and prosecution.

Harvey serves a wide-range of clients in the areas of patent, trademark and trade secret litigation, patent and trademark prosecution, IP risk management, portfolio licensing, and client counseling.

Harvey’s litigation and patent prosecution background consists of dealing with matters related to technologies such as: semiconductor processing, plasma dicing, welding systems, lighting and LEDs, hot plates, software, computer integration and networking, satellites, solar power, hydrogen fuel cells, biodiesel, gaming, jewelry, gift cards, cups, davit lift, suntan lotions, power tools, paint rollers, flow systems, nuclear control rods, shirt pressers, air filters, hot water systems, fans, contact lenses, blood plasma expander, disposable blood measuring device, urine analysis, teeth whitening, suture anchors, and medical devices. In addition, he also has experience in a wide-range of other areas including firearms, speakers, waste fuel flare stacks, furniture, exercise equipment, recycling equipment, cement materials, fence posts, and tidal gates.

Mr. Kauget has experience presenting cases before the Court of Appeals for the Federal Circuit and Eleventh Circuit. He is also a registered patent attorney admitted to practice before the U.S. Patent and Trademark office. Before Harvey began his legal career, he worked as an engineer and as a product manager in the semiconductor industry as well as a certified high school chemistry and physics teacher.

Honors & Recognitions

  • Listed in The Best Lawyers in America®️, "Lawyer of the Year," Trademark Law, Tampa, Florida (2022 & 2023)
  • Listed in The Best Lawyers in America®️, Information Technology Law since 2008, Litigation - Intellectual Property since 2011, Litigation - Patent since 2011, Patent Law since 2011, Technology Law since 2010, Trademark Law since 2011, Trade Secrets Law since 2021
  • Named, Chambers USA, Intellectual Property (2021-2022)
  • Listed in The Best Lawyers in America®️, "Lawyer of the Year," Patent Law, Tampa, Florida (2015, 2018, 2019, & 2021)
  • Florida Trend, "Legal Elite," Intellectual Property Rights (2005, 2007-2008, 2010-2016, 2018, 2020-2021)
  • Florida Super Lawyers, Intellectual Property (2009, 2011-2021)

United States

CAST EMG ESD Alliance FlexTech MSIG SOI

Receive practical information on designing, writing and protecting your patents from an experienced and knowledgeable source. This course will review the latest thinking in what is a patentable invention and how to protect your invention. You will learn the basics of disclosing your invention for maximizing your protection, with an opportunity for Q&A at the end.  A course useful to inventors at every stage of your careers and every stop in our industry ecosystem.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
Event format

Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

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Bio

Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that combines the best of conventional and printed circuitry. By enabling flexibility and digital manufacturing without compromising on processing capability, it promises to remove the constraints of rigid PCBs while reducing costs and hence enable new applications.

This webinar from Dr Matthew Dyson of IDTechEx provided the status of FHE, including examples that are already commercialized.

Standards and other attributes required for mass manufacturing was outlined, and the scope for FHE to be used for novel applications (including harsh environments) assessed. Finally, a roadmap covering the near, medium, and long term was presented, including how FHE development fits with the ongoing development of heterogeneous integration.

ABOUT THE SPEAKER

Matthew is a Senior Technology Analyst at IDTechEx, specializing in printed/organic/flexible/hybrid electronics and sensors. He has an MRes and PhD in Physics from Imperial College London, which aimed to better establish processing/structure/property relationships in organic semiconductors. This was followed by two years post-doctoral researcher at Eindhoven Technical University in the Netherlands, focusing primarily on organic photodetectors (OPDs). His academic research, which has been cited over 500 times, also included work on perovskite photovoltaics and aggregation induced emission materials.

At IDTechEx, Matthew analyses technical innovations and applications across the printed/flexible/hybrid landscape, attending multiple conferences and interviewing companies to establish a clear picture of the technical and commercial landscape. This analysis is published in reports on topics such as 3D electronics and printed/flexible sensors, and applied to consulting projects evaluating commercialization opportunities across printed/flexible electronics. He also manages a team of analysts covering wearable technologies, AR/VR, and emerging photovoltaics.
 

United States

Matt Dyson ID TechEX
Dr. Matthew Dyson
Sr. Technology Analyst
ID TechEx
Gity Samadi
Dr. Gity Samadi
Director, R&D Programs
SEMI
FlexTech

This webinar featured Dr. Matthew Dyson of IDTechEx outlining the status of FHE, including examples that are already commercialized. Standards and other attributes required for mass manufacturing were discussed, and the scope for FHE to be used for novel applications (including harsh environments) assessed. In addition, he presented a roadmap covering the near, medium, and long term will be presented, including how FHE development fits with the ongoing development of heterogeneous integration.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format

Registration

Members: $49

Non-Members: $99

United States Register Now NEF 2022 Future Infrastructure Business

Forum Host

Teradyne

FUTURE INFRASTRUCTURE—The Impact on the Semiconductor Industry

The SEMI Northeast Forum will bring together industry leaders from the semiconductor supply chain to discuss their vision of the impact of new technologies and applications on the semiconductor industry.

Although we often hear about the end of Moore’s law, expanding markets such as 5G, autonomous vehicles, AI, medical technologies, and improving the energy infrastructure have provided new challenges that foster new innovations. Technologies such as heterogenous integration allowed the industry to migrate from chip scaling to system scaling to address these new applications. These new technologies and applications bring new challenges to the entire ecosystem. 

Hear Linx Consulting, Breker, and Teledyne give their insight on: 

  • Heterogeneous Integration
  • Supply Chain Impact
  • Verification and Packaging Challenges

Join your colleagues on October 27 to hear industry experts outline a new playbook for innovation that can propel the industry into the next wave of growth.

Teradyne
600 Riverpark Drive
North Reading, MA 01864
United States

THURSDAY, OCTOBER 27, 2022 | EASTERN TIME

10:00 am - 10:05 am
Mark Kahwati, Teradyne
Northeast Regional Chair
Mark Kahwati
Senior Director of Product Marketing
Teradyne

Welcome

10:05 am - 10:35 am
Mark Thirsk, Linx Consulting
Mark Thirsk
Managing Partner
Linx Consulting

Supply Chain Impact

10:35 am - 11:05 am
Dave Kelf, Breker Verification Systems
Dave Kelf
Chief Executive Officer
Breker Verification Systems

Changing Product Requirements

11:05 am - 11:35 am
Eric Shoemaker, Teradyne
Eric Shoemaker
Director of Marketing, Test Interface Solutions
Teradyne

Future Testing Challenges

11:35 am - 12:05 pm
Christy Tyberg
Christy Tyberg
Sr. Manager, Quantum Hardware Technology Development
IBM

Quantum Computing

12:05 pm - 12:45 pm

Lunch

12:45 pm

Closing Remarks

The SEMI Northeast Chapter Presents

10:00 am - 1:00 pm Off Add to Calendar 2022-10-27 10:00:00 2022-10-27 13:00:00 [Northeast Forum 2022] Future Infrastructure—The Impact on the Semiconductor Industry The SEMI Northeast Chapter Presents— Teradyne 600 Riverpark Drive North Reading, MA 01864 United States SEMI.org [email protected] America/New_York public America/New_York