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United States

Registration

Registration Fee

  • Member: $199
  • Non-Member: $299
  • Non-Member for Government, Military, and Academia: $249
    • Contact Michelle Fabiano at [email protected] for discount code. Must have a valid .gov, .mil or .edu email address.

Group Registrations

  • Register 5: 20% discount
  • Register 10: 25% discount
  • Register 15: 30% discount

For group discounts, contact Michelle Fabiano at [email protected] 

Late registrations may result in delayed conference access.
We recommend registering at least 10 minutes before the event to allow enough time for the system to process your registration, in order to access the first session on time.

Cancellations received on or before September 21, 2020 will be fully refunded (less $30 cancellation fee).

Michelle Fabiano 
[email protected] 

+
United States LOGIN VIRTUAL MSEC Register Now Virtual MSEC 2020 Social Media Graphic Business Executive

Platinum

EV Group
SPTS

Gold

Event

STMicroelectronics
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Sponsorship Contact

Eric Rude
Sr. Sales Manager, SEMI
Tel: +1.408.943.7047 
Email: [email protected]

Virtual MSEC 2020 Event Guide

Virtual MSEC 2020 Event Guide Cover


The Next Wave of Sensorization: Solving Our Shared Challenges

Industry economic, business updates will be covered from different aspects of the ecosystem, together with forward-looking strategic and technology trends. The opportunities and challenges brought about by key technologies and markets in the areas of medical, sensors for entertainment and augmented reality, virtual reality, environmental, food/agriculture, ultrasonic applications, and wearable devices will be explored. The growth in existing and emerging MEMS and sensors markets, together with the resulting new components, software, and systems needs, will also be discussed. 

Take advantage of MSEC 2020 as a Virtual Event. Although we will not meet in person this year, it may be the only time you'll get this amazing content at a fraction of the cost.

  • SAVE $1,500+ attending the Virtual Event. Registration is only $199 Member / $299 Non-Member.
  • HEAR industry experts and connect virtually with executives in the comfort of your office or home.
  • ACCESS the presentations On-Demand 24/7 until November 15, 2020.
  • MINUS all the travel time and expenses!

Key Session Topics

  • October 6 » Session 1—Sensors for Entertainment & Augmented Reality
  • October 7 » Session 2—Emerging Business Strategies
  • October 8 » Session 3—Business Strategies & Opportunities in 2020
     
  • October 13 » Session 4—Emerging Technologies & Manufacturing Trends
  • October 14 » Session 5—Product Showdown: Ultrasonic Transducers
  • October 15 » Session 6—Market Trends
     

Join [LIVE] at 8-10:30am PDT from October 6-8 and 13-15, 2020 to watch all presentations.
Most are available On-Demand. Some are only available during [LIVE] stream (e.g. Disney Keynote).

 

Who Should Attend?

CEO  ●  Chairmen  ●  Presidents  ●  Senior Executives  ●  Executive Vice Presidents  ●  CTO  ●  Startup Founders  ●  Financial Analysts  ●  Market Researchers  ●  Consulting Firms


2020 MSEC Executive Planning Committee

Speaker Resource Center

United States

Thursday, October 15, 2020 | MSEC Session 6—Market Trends

8:00 am - 8:05 am
Craig Ensley, CalTexan Technologies
Craig Ensley
CEO, CalTexan Technologies

Welcome/Session Chair

8:05 am - 8:30 am
Igor Ikink, Xsens
Igor Ikink
Director Technology, Xsens

Sensory Motion Tracking - The Future of Human Digital Interaction

Biography

Sensory motion tracking enabled by smart sensors is at the forefront of our fourth industrial age, pushing the boundaries of artificial intelligence and machine learning further than we could have imagined. Already widely used in animation productions, elite athletes now use motion sensors to enhance their performance and sports enthusiasts to improve their tennis serve or golf swing. In healthcare, motion tracking is helping people to monitor their heart rates, sleep patterns and fitness levels. Motion tracking technology is opening the possibilities for entrepreneurs and innovators to transform their own industries. Our physical, biological and technological worlds are merging like never before, and the potential of sensory motion capture is only restricted by the extent of our imagination.

8:30 am - 8:55 am
Ian Chen, Maxim Integrated
Ian Chen
Executive Director, Maxim Integrated

The Trouble with Innovative Sensing Applications

Biography

Individualized digital health monitors benefit wearers with chronic illness or those at risk of acute infectious diseases with rapid onsets. As technology leaders are making vital sign sensors convenient and affordable for mobile and fitness applications, US Centers for Medicaid and Medicare Services and other healthcare policy makers, have adopted reimbursement policies to encourage remote patient monitoring practices. The global pandemic has only further accelerated these initiatives.

Even with these economic tailwinds, addressing novel use cases can face many hurdles. Conventional medical diagnoses rely, in part, on a few test results taken under sterile clinical settings. Getting ground truth on subjects in natural settings, finding relevant longitudinal clinical studies, collecting large datasets congruent with actual form factors and workflows, and correlating all that back to clinical diagnoses often require innovative solutions.

This presentation illustrates this using two case studies of individualized, continuous health monitoring solutions. It provides an overview of their use cases and hurdles to provide a discussion on how technical communities could help to accelerate more innovation.

8:55 am - 9:25 am

Networking with Sponsors

9:25 am - 9:30 am
Dave Thomas, SPTS
Dave Thomas, PhD
VP Product Management
SPTS Technologies

Platinum Sponsor—SPTS Technologies

SPTS
9:30 am - 10:00 am
Jens Fabrowsky, Robert Bosch GmbH
Jens Fabrowsky
Executive Vice President Automotive Electronics, Robert Bosch GmbH

Keynote—The Next 10 Years of MEMS: An Outlook on Opportunities and Challenges

Biography

2020 has been a challenging year in many aspects and the consequences of the pandemic are expected to further impact the upcoming years, possibly even decade. Also the MEMS industry is experiencing multiple challenges: Firstly, development costs for new generations of MEMS sensors are increasing and hence wider, diverse markets are required to compensate the growing development expenses and to lower the risks. Secondly, a sole focus on hardware is not sufficient anymore. End-device manufacturers more and more frequently want to differentiate themselves by new features and functionalities which have to be enabled by software to remain cost-efficient. Such software competence was traditionally not available in most hardware-focused companies, creating a need to develop new competencies in our organizations. Finally, customers increasingly demand complete solutions instead of single components. Plug-and-play solutions such as development boards and reference designs created with partners are increasingly expected by our customers and partners. All along, digital tools and services need to be offered to reach a growing, increasingly diverse target group to offer a positive user experience.

In his talk, Jens Fabrowsky, Executive Vice President Automotive Electronics at Bosch, will explore the opportunities and challenges of the MEMS industry in the upcoming ten years and provide an outlook on possible solutions based on specific examples. Jens will also give a call to action for the industry on how it can embrace and contribute to the changes.

10:00 am - 10:30 am
Tim Brosnihan, SEMI-MSIG
Tim Brosnihan, PhD
Executive Director, SEMI-MSIG

MSIG Report Card, Hall of Fame Award, Emerging Leaders Award & Product Showdown Award

MSIG

Virtual MSEC—Conference Overview

The MEMS and Sensors Executive Conference is designed for senior executives across the MEMS and sensors supply chain and adjacent industries. 

Join us online for Session 6—Market Trends

8:00 am - 10:30 am Off Add to Calendar Disabled America/Los_Angeles
Event format

Registration

Registration Fee

  • Member: $199
  • Non-Member: $299
  • Non-Member for Government, Military, and Academia: $249
    • Contact Michelle Fabiano at [email protected] for discount code. Must have a valid .gov, .mil or .edu email address.

Group Registrations

  • Register 5: 20% discount
  • Register 10: 25% discount
  • Register 15: 30% discount

For group discounts, contact Michelle Fabiano at [email protected] 

Late registrations may result in delayed conference access.
We recommend registering at least 10 minutes before the event to allow enough time for the system to process your registration, in order to access the first session on time.

Cancellations received on or before September 21, 2020 will be fully refunded (less $30 cancellation fee).

Michelle Fabiano 
[email protected] 

+
United States LOGIN VIRTUAL MSEC Register Now Virtual MSEC 2020 Social Media Graphic Business Executive

Platinum

EV Group
SPTS

Gold

Event

STMicroelectronics
Blank

Sponsorship Contact

Eric Rude
Sr. Sales Manager, SEMI
Tel: +1.408.943.7047 
Email: [email protected]

Virtual MSEC 2020 Event Guide

Virtual MSEC 2020 Event Guide Cover


The Next Wave of Sensorization: Solving Our Shared Challenges

Industry economic, business updates will be covered from different aspects of the ecosystem, together with forward-looking strategic and technology trends. The opportunities and challenges brought about by key technologies and markets in the areas of medical, sensors for entertainment and augmented reality, virtual reality, environmental, food/agriculture, ultrasonic applications, and wearable devices will be explored. The growth in existing and emerging MEMS and sensors markets, together with the resulting new components, software, and systems needs, will also be discussed. 

Take advantage of MSEC 2020 as a Virtual Event. Although we will not meet in person this year, it may be the only time you'll get this amazing content at a fraction of the cost.

  • SAVE $1,500+ attending the Virtual Event. Registration is only $199 Member / $299 Non-Member.
  • HEAR industry experts and connect virtually with executives in the comfort of your office or home.
  • ACCESS the presentations On-Demand 24/7 until November 15, 2020.
  • MINUS all the travel time and expenses!

Key Session Topics

  • October 6 » Session 1—Sensors for Entertainment & Augmented Reality
  • October 7 » Session 2—Emerging Business Strategies
  • October 8 » Session 3—Business Strategies & Opportunities in 2020
     
  • October 13 » Session 4—Emerging Technologies & Manufacturing Trends
  • October 14 » Session 5—Product Showdown: Ultrasonic Transducers
  • October 15 » Session 6—Market Trends
     

Join [LIVE] at 8-10:30am PDT from October 6-8 and 13-15, 2020 to watch all presentations.
Most are available On-Demand. Some are only available during [LIVE] stream (e.g. Disney Keynote).

 

Who Should Attend?

CEO  ●  Chairmen  ●  Presidents  ●  Senior Executives  ●  Executive Vice Presidents  ●  CTO  ●  Startup Founders  ●  Financial Analysts  ●  Market Researchers  ●  Consulting Firms


2020 MSEC Executive Planning Committee

Speaker Resource Center

United States

Wednesday, October 14, 2020 | MSEC Session 5—Product Showdown: Ultrasonic Transducers

8:00 am - 8:05 am
Marcellino Gemelli, Bosch Sensortec
Marcellino Gemelli
Sr. Director, Business Development, Bosch Sensortec

Welcome/Session Chair

8:05 am - 8:30 am
David Horsley, TDK-Chirp Microsystems
David Horsley, PhD
Co-Founder, TDK-Chirp Microsystems

A Wearable Social Distancing Solution Based on Ultrasonic Time-of-Flight Sensors

Biography

Ensuring safe social distancing in the workplace is one piece of the puzzle to enable people to work safely in the age of COVID-19. One means of ensuring safe social distancing is via wearables that continuously measure the distance between personnel. While providers of existing tracking technology based on Bluetooth low-energy (BLE) or RFID trackers are attempting to position their solutions for social distancing, finer accuracy requirements narrow down the options to ultrasonic and ultrawideband (UWB), with ultrasonic delivering a greater accuracy of < 1 cm versus < 10 cm for UWB. Relative to UWB, MEMS ultrasonic time-of-flight (ToF) range sensors consume much less power: a Chirp ToF solution can operate at 1% of the power required by UWB chips, enabling a coin-cell tag to operate for an entire workweek. In addition, electromagnetic range sensing solutions such as UWB have a critical failing for social distancing solutions: UWB cannot natively determine whether people are separated by a barrier, such as a door, window, wall, or partition. Because ultrasound propagates through air, only ultrasonic sensing can natively determine whether people are safely separated in the workplace. In this presentation, I will describe how tracking solution-providers are using Chirp’s MEMS ultrasonic ToF range sensors to create social-distancing solutions that respect an individual’s privacy but also permit an automated contact tracing capability to notify affected individuals and their emergency contact or direct management, providing a cost-effective way to minimize workforce disruption and stop chains of infection from propagating.

8:30 am - 8:55 am
Gioel Molinari, Butterfly Network
Gioel Molinari
President, Butterfly Network

Semiconductor Based Ultrasound & Democratization of Medical Imaging

Biography

In this presentation we will introduce the technology behind Butterfly iQ, the worlds first and only handheld ultrasound system. Enabled by Butterfly's Transducer-on-CMOS, iQ is 10x less expensive than any comparable traditional ultrasound and provides less expert users witha connected and easy-to-use diagnostic solution.

8:55 am - 9:25 am

Topic Discussion Breakouts

9:25 am - 9:50 am
Dan Goehl, Ultrasense Systems
Dan Goehl
Co-Founder & Chief Business Officer, Ultrasense Systems

Ultrasound as a Touch User Interface to Bring Surfaces to Life

Biography

In this presentation, we will explore how ultrasound and UltraSense’ TouchPoint technology can be used to replace mechanical buttons and why certain markets are ready or need to transform rapidly from mechanical to seamless virtual buttons.

9:50 am - 10:30 am

Networking with Sponsors

10:30 am - 12:00 pm

ASU SensMach Event

MSIG

Virtual MSEC—Conference Overview

The MEMS and Sensors Executive Conference is designed for senior executives across the MEMS and sensors supply chain and adjacent industries. 

Join us online for Session 5—
Product Showdown: Ultrasonic Transducers

8:00 am - 10:30 am Off Add to Calendar Disabled America/Los_Angeles
Event format

Registration

Registration Fee

  • Member: $199
  • Non-Member: $299
  • Non-Member for Government, Military, and Academia: $249
    • Contact Michelle Fabiano at [email protected] for discount code. Must have a valid .gov, .mil or .edu email address.

Group Registrations

  • Register 5: 20% discount
  • Register 10: 25% discount
  • Register 15: 30% discount

For group discounts, contact Michelle Fabiano at [email protected] 

Late registrations may result in delayed conference access.
We recommend registering at least 10 minutes before the event to allow enough time for the system to process your registration, in order to access the first session on time.

Cancellations received on or before September 21, 2020 will be fully refunded (less $30 cancellation fee).

Michelle Fabiano 
[email protected] 

+
United States LOGIN VIRTUAL MSEC Register Now Virtual MSEC 2020 Social Media Graphic Business Executive

Platinum

EV Group
SPTS

Gold

Event

STMicroelectronics
Blank

Sponsorship Contact

Eric Rude
Sr. Sales Manager, SEMI
Tel: +1.408.943.7047 
Email: [email protected]

Virtual MSEC 2020 Event Guide

Virtual MSEC 2020 Event Guide Cover


The Next Wave of Sensorization: Solving Our Shared Challenges

Industry economic, business updates will be covered from different aspects of the ecosystem, together with forward-looking strategic and technology trends. The opportunities and challenges brought about by key technologies and markets in the areas of medical, sensors for entertainment and augmented reality, virtual reality, environmental, food/agriculture, ultrasonic applications, and wearable devices will be explored. The growth in existing and emerging MEMS and sensors markets, together with the resulting new components, software, and systems needs, will also be discussed. 

Take advantage of MSEC 2020 as a Virtual Event. Although we will not meet in person this year, it may be the only time you'll get this amazing content at a fraction of the cost.

  • SAVE $1,500+ attending the Virtual Event. Registration is only $199 Member / $299 Non-Member.
  • HEAR industry experts and connect virtually with executives in the comfort of your office or home.
  • ACCESS the presentations On-Demand 24/7 until November 15, 2020.
  • MINUS all the travel time and expenses!

Key Session Topics

  • October 6 » Session 1—Sensors for Entertainment & Augmented Reality
  • October 7 » Session 2—Emerging Business Strategies
  • October 8 » Session 3—Business Strategies & Opportunities in 2020
     
  • October 13 » Session 4—Emerging Technologies & Manufacturing Trends
  • October 14 » Session 5—Product Showdown: Ultrasonic Transducers
  • October 15 » Session 6—Market Trends
     

Join [LIVE] at 8-10:30am PDT from October 6-8 and 13-15, 2020 to watch all presentations.
Most are available On-Demand. Some are only available during [LIVE] stream (e.g. Disney Keynote).

 

Who Should Attend?

CEO  ●  Chairmen  ●  Presidents  ●  Senior Executives  ●  Executive Vice Presidents  ●  CTO  ●  Startup Founders  ●  Financial Analysts  ●  Market Researchers  ●  Consulting Firms


2020 MSEC Executive Planning Committee

Speaker Resource Center

United States

Wednesday, October 7, 2020 | MSEC Session 2—Emerging Business Strategies

8:00 am - 8:05 am
Ian Chen, Maxim Integrated
Ian Chen
Executive Director, Medical New Business Development, Maxim Integrated

Welcome/Session Chair

8:05 am - 8:30 am
Andreas Breiter, McKinsey
Andreas Breiter, PhD
Partner, McKinsey & Company

Future Mobility Enabled by Sensorization

Biography

Disruptions from technology trends are shaping the mobility of the future. We will discuss our perspective on the role of sensorization (future) mobility, and the supply chain impact for the semiconductor sector.

8:30 am - 8:55 am
Dimitrios Damianos, Yole Développement
Dimitrios Damianos, PhD
Technology and Market Analyst, Imaging & MEMS, Yole Développement

MEMS Tug-of-War: COVID-19 vs Emerging Trends

Biography

From the smartphones and cars we daily use, to the airplanes we occasionally take, MEMS’ reach is ever-expanding. Wearables are becoming increasingly sensitive, packing more inertial sensors and microphones. The popularity of voice personal assistants (VPA) like Siri, Alexa, etc have pushed audio technologies into new systems that are adopting VPA as a new human-machine interface and MEMS microphones are playing a vital role in this business. And the list keeps getting longer.
Covid-19 is continuously making headlines on its negative effects on markets and the economy, and of course the MEMS market is no different. However, there are some MEMS devices that have gained a lot of attention and experienced a spike in demand, because they help in the combat against the pandemic.

In this presentation, we will address these key elements. Furthermore, we will show the latest market data and MEMS ecosystem, and we will explore emerging market and technology trends, focusing on how the sensor manufacturers can squeeze out more value, overcoming current challenges.

8:55 am - 9:25 am

Networking with Sponsors

9:25 am - 9:50 am
Manuel Tagliavini, Omdia
Manuel Tagliavini
Principal Analyst, MEMS & Sensors, Omdia

MEMS & Sensors Market: The Effects of the 2020 Pandemic

Biography
Sensors are found today in a wide range of end applications, spreading from Consumer Electronics & Mobile to Industrial and Automotive, resulting in a sensor market in a good health overall. Even if sensor adoption in Consumer and Mobile applications can quickly skyrocket and then fade, the market is still growing and often reshaping and renewing itself. While Smartphones still represent a huge market, commoditization has left it saturated in value terms and growth is still relevant with the proliferation of multiple image sensors and at the same time it has recently moved to other accessories like smart watches or wireless earbuds from leading suppliers like Apple. Other mainstays like Automotive and Industry on the other hand are subject to longer term trends like Electrification and Robotization of the Car, as well as Smart Manufacturing, Big Data and Condition Monitoring. The presentation looks at the impacts of the major market changes on MEMS and other silicon sensors, focusing on the effects of the Covid-19 pandemic on the sensor shipments and end products forecasts. Which are the sensor families most affected by the lockdowns implemented in several countries worldwide? Are the major effects caused by disruptions in the supply chains or by unexpected changes in the end product demand? Insights and examples of resilience and required market changes will be provided, with predictions of the opportunities for the years ahead.

9:50 am - 10:30 am

Networking with Sponsors

MSIG

Virtual MSEC—Conference Overview

The MEMS and Sensors Executive Conference is designed for senior executives across the MEMS and sensors supply chain and adjacent industries. 

Join us online for Session 2—Emerging Business Strategies

8:00 am - 10:30 am Off Add to Calendar Disabled America/Los_Angeles
Event format

Registration

webinar

Open to all — FREE.

Not able to attend? Register anyway. We'll send you a link to the webinar archive so you can view it at your own convenience.

 

webinar
United States Save Your Seat SEMI CSP Back to Work Session 2 Business Executive

The U.S. Department of Commerce issued a new rule for shipments destined for China, Russia or Venezuela, which enables it to more closely monitor exports, re-exports and in-country transfers of certain items. The rule broadens the scope of export-controlled items to include electronic and telecommunications equipment (i.e. PC’s, mobile devices and similar items), even if there is no military end use. In this webinar, DHL will explain how companies can comply with the new rule and answer questions about international shipping.

United States

10:00 am - 10:05 am
Darryl Buck
MODERATOR
Darryl Buck
Head of SEMI’s Cost Saving Program, Group Purchasing Solutions (GPS)

Opening Remarks

10:05 am - 10:20 am
Caroline Cunningham
Caroline Cunningham
Director of Strategic Sales, DHL

Biography: Caroline Cunningham has 23 years of International Shipping Experience with DHL Express, she originally started her career in the UK supporting a diverse customer base but since then has moved internationally with DHL two times. Her first move was to Belgium and she covered 23 countries as the European Sales Training Manager, she moved to the US 14 years ago to head up International Training in US but is now based in UT where she supports Strategic Partners like England Logistics in selling DHL Express to their end customers. Caroline has a passion for making customers more successful and is looking forward to speaking to our industry to provide us with a better understanding of Export Compliance to help expedite your shipments with speed.

DHL
10:20 am - 10:25 am
Sharon McWilliams
Sharon McWilliams
Agent / Sales Manager, England Logistics

Biography: Sharon McWilliams is an agent and sales manager with England Logistics. She has been in the transportation industry for 13 years helping businesses minimize transportation related costs to increase their market competitiveness. Sharon’s committed personalized service helps companies manage their transportation programs. Her alliances with the transportation industry's most elite carriers, including DHL and FedEx ensure that her customers receive the best service available.

England Logistics
10:25 am - 10:30 am

Q&A

FOA
semi logo
10:00 am - 10:30 am Off Add to Calendar 2020-09-15 10:00:00 2020-09-15 10:30:00 Navigating New International Shipping Rules – SEMI CSP Back to Work Session 2 United States SEMI.org [email protected] America/Los_Angeles public
Event format

MILPITAS, Calif. – August 24, 2020 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement in response to the new export control rule changes announced by the United States Commerce Department.

SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export control regulations issued on August 17, 2020, by the U.S. Department of Commerce will ultimately undermine U.S. national security interests by harming the semiconductor industry in the U.S. and creating substantial uncertainty and disruption in the semiconductor supply chain. On July 14, in public comments on the May 15 regulations, SEMI cautioned that those relatively narrow actions created unique disincentives to purchase U.S.-origin semiconductor equipment and design software and had already resulted in $17 million lost sales of U.S-origin items to firms unrelated to Huawei.

Commerce’s decision to significantly expand these unilateral restrictions will likely lead to more lost sales, eroding the customer base for U.S-origin items. The new restrictions will also fuel a perception that the supply of U.S. technology is unreliable and lead non-U.S. customers to call for the design-out of U.S. technology. Meanwhile, these actions further incentivize efforts to supplant these U.S. technologies.

SEMI respectfully requests Commerce immediately extend to 120 days the savings clause for items in production before August 17, ensure predictable and timely license decisions for all items and significant flexibility for licenses unrelated to 5G items. We also urge the administration to pursue policies with fewer unintended consequences and damage to U.S. technology leadership. Revenue from global sales is a major source of U.S. research and development (R&D) funding in these technologies; lost global revenue will lead to a decrease in R&D, undermining U.S. semiconductor innovation and thereby harming national security.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

MILPITAS, Calif. — August 20, 2020 — North America-based manufacturers of semiconductor equipment posted $2.60 billion in billings worldwide in July 2020 (three-month average basis), according to the July Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 11.8 percent higher than the final June 2020 level of $2.32 billion, and is 27.6 percent higher than the July 2019 billings level of $2.03 billion.

“The second half of 2020 has started strong with double-digit billings growth for North America-based semiconductor equipment manufacturers,” said Ajit Manocha, SEMI president and CEO. "The strength reflects the semiconductor industry's criticality in today's world and the driving forces in place for long-term industry growth."

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg.)

Year-Over-Year

February 2020

$2,374.6

27.1%

March 2020

$2,213.1

21.2%

April 2020

$2,281.3

18.7%

May 2020

$2,343.3

13.5%

June 2020 (final)

$2,317.7

14.4%

July 2020 (prelim)

$2,591.9

27.6%

Source: SEMI (www.semi.org), August 2020

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is September 17, 2020 at 3:00pm Pacific.
For information on SEAJ Billings Express Report, visit www.seaj.or.jp.

Registration

Webinar - The Future of Work: Leading Remote Teams

Open to all.

Not able to attend? Register anyway. We'll send you a link to the webinar so you can view it at your own convenience. 

Webinar - The Future of Work: Leading Remote Teams
United States Save your seat From Our CEO Webinar: Developing the Talent Needed to Achieve the Next Level
Applied Materials
ENERGETIQ
KLA.jpg
Lam Research
TEL

With COVID-19 speeding up elements of digital transformation and requirements for the workforce of the future, SEMI President and CEO Ajit Manocha welcomes you to join us as we explore the implications of current labor and workforce development trends for organizations and the broader electronics manufacturing and design supply chain. We will focus in on developing the workforce required to secure the semiconductor industry’s path to $1 Trillion, with data analysis of industry trends and a look at strategies and practices to action the insights.

United States

8:00 am - 8:02 am
Shari Liss
MODERATOR
Shari Liss
Executive Director, SEMI Foundation

Welcome Remarks

8:02 am - 8:10 am
Ajit Photo 190 x 200 pixels
Ajit Manocha
President and CEO, SEMI

Opening Remarks and SEMI Workforce Development Update

8:10 am - 8:30 am
Rob Sentz, Emsi
Rob Sentz
Chief Information Officer, Emsi

Microelectronics Industry Labor Statistics and Hiring Trends

Biography: Rob Sentz is the chief innovation officer at Emsi, where he leads in furthering Emsi’s vision through new and updated products for higher education, economic development, workforce planning, and human resources.

Prior to his current position, he served as Emsi’s vice president of marketing from 2006 to 2014, managing a staff of writers and designers in producing newsletters, articles, white papers, and other materials on a broad range of economic and labor market topics. Sentz is a Forbes contributor and has taught as an adjunct faculty member at NYU School of Professional Studies in New York City.

8:30 am - 8:50 am
Dawn Lang
Dawn Lang
Senior Vice President for Partnerships, CAEL

Strategies for Developing the Microelectronics Workforce of the Future

Biography: As Senior Vice President for Partnerships, Dawn Lang oversees partnership development driving enhanced value for CAEL's clients and stakeholder community in higher education, workforce development and corporate environments. She leads a dedicated team of professionals who deliver on CAEL's promise and value proposition, passionately supporting adult learners as they pursue education and career goals.

Lang's background includes over 20 years of sales, business development and marketing experience working with Fortune 500s to startups in life science, higher education, consumer packaged goods, technology and non-profits.

8:50 am - 9:10 am

Q&A

9:10 am - 9:15 am

Closing Remarks

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8:00 am - 9:15 am Off Add to Calendar 2020-09-16 08:00:00 2020-09-16 09:15:00 CEO Webinar Series: Developing Talent Needed to Achieve the Next Level United States SEMI.org [email protected] America/Los_Angeles public
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HSINCHU, Taiwan – August 18, 2020 –SEMI today announced the formation of a new standards committee that aims to develop global standards for flexible hybrid electronics (FHE) spanning design, materials, manufacturing, packaging and systems and to drive industry growth. Unanimously endorsed by members of the SEMI North America Regional Standards Committee (NARSC) and approved by the SEMI International Standards Committee (ISC), the technical committee is the world’s first to focus on flexible hybrid electronics standards. The SEMI Standards Flexible Hybrid Electronics Global Technical Committee has established its first chapter in Taiwan.

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“The SEMI Standards Flexible Hybrid Electronics Global Technical Committee sets out to clear development bottlenecks facing the industry and establish unified measurement standards for flexible smart textile, automotive, Internet of Things (IoT) and related devices,” saidTerry Tsao, SEMI Chief Marketing Officer and president of SEMI Taiwan. “The Taiwan chapter looks forward to kicking off the development of international industry standards that help Taiwan's FHE sector promote industry growth by reducing costs and increasing competition.”

Initial work of the SEMI Standards Flexible Hybrid Electronics Global Technical Committeewill include establishing working groups to draft measurement standards; building industry consensus on the need for materials, equipment and manufacturing standards; and developing standards to accelerate the introduction of related FHE technologies into diverse consumer end markets.

“We are very pleased to see the establishment of the SEMI Standards Flexible Hybrid Electronics Global Technical Committee and are proud to be part of the working committee to draft the standards,” said Steve Huang, executive director of Taipei-based AiQ Smart Clothing, an innovator with a significant pool of smart textile IP. “As a pioneer in smart textile applications, we are keenly aware of the challenges posed by an absence of standards and how it stifles mass adoption of new technologies.”

The SEMI International Standards Program is in its 47th year, with the 1,000th SEMI Standard published last year. SEMI Standards cover fields including semiconductors, displays, photovoltaics, microelectromechanical systems (MEMS) and smart manufacturing.

For more information, visit the SEMI Standards web page.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Irene Huang/SEMI Taiwan
Phone: 886.03.560.1777, ext. 205
Email: [email protected]