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United States save your seat What's Driving Automotive Electronics Assembly and Packaging Technical

The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. The changes we will all experience include the nature of car ownership, how the car is powered, increased safety, and driver automation. Each of these changes is only possible with advances in electronics hardware and systems, electronics assembly, and semiconductor packaging. Indium Corporation’s Dr. Andy Mackie will discuss the impact of these changes on electronics assembly and packaging, and the impact of mission profiles on component and systems level reliability.

United States

Sep 17, 2020

What's Driving Automotive Electronics Assembly and Packaging

8:00 am - 9:00 am Off Add to Calendar 2020-09-17 08:00:00 2020-09-17 09:00:00 What's Driving Automotive Electronics Assembly and Packaging United States SEMI.org [email protected] America/Los_Angeles public Aug 24, 2020

REGISTRATION

This webinar is free of charge. 

REGISTER

Belgium France Germany Ireland Italy Russia United States REGISTER About Smart Manufacturing Business Technical

For sponsorship opportunities, please contact:

Cassandra Melvin, Director of Operations at [email protected]
Adi Hodorov, Manager, Sales and Key Accounts at [email protected] 

PRESS AND MEDIA

If you are interested in partnering with us or have any questions about press and media, please contact us.

Serena Brischetto, Senior Manager, Marketing and Communications at [email protected]

The SEMI SMART Manufacturing Initiative is a global effort to promote awareness and interest about smart manufacturing and industry 4.0. Through their collaborative efforts, the members of the SEMI SMART Manufacturing Regional Chapters meet regularly, both virtually and in person, to facilitate discussions for solving challenges and issues that impact manufacturing.  

The webinar will provide an update on pressing critical topics derived from key players across the supply chain and is recommended to semiconductor professionals interested in the European smart manufacturing trends and market.

Topics include:

• a summary of stakeholder-identified activities aligned to Industry 4.0
• key initiatives and emerging roadmaps
• standards
• best practices for improved process quality
• market updates
• overview of current Smart Manufacturing activities

Online, Central European Time
Germany

Dec 9, 2020 FOA

Free Webinar

European Collaborations Driving Smart Manufacturing Excellence
 

 

European Collaborations Driving Smart Manufacturing Excellence

4:00 pm - 5:30 pm Off Add to Calendar 2020-12-09 16:00:00 2020-12-09 17:30:00 Webinar - European Collaborations Driving Smart Manufacturing Excellence Free Webinar European Collaborations Driving Smart Manufacturing Excellence     Online, Central European Time Germany SEMI.org [email protected] Europe/Berlin public Jan 15, 2021 Europe/Berlin

United States Go FLEX Website Get Connected for Latest Updates https://flex.semi.org/ Business Executive Expositions Technical

FLEX CALL FOR ABSTRACTS—IS NOW CLOSED 

For late submissions please contact:
Michelle Fabiano
[email protected]

 

20 Years of Driving Innovation to Make the World Safer

You'll hear experts highlight the latest technical breakthroughs, unique electronics applications, and business strategies giving insight into the future of next-generation Integration beyond Moore's law era. Key technologies and markets in the areas of Smart Medical, Smart Mobility, Smart Manufacturing, Data, AI, and Displays will be explored throughout each technical track presented each day of FLEX week. 

Flexible hybrid electronics (FHE) present unique heterogeneous integration capabilities with unprecedented continuity with us and our world. This softer side of electronics represents high performance integrated devices that are curved and variable in form factor. Electronics that augment our daily activities and interact with our surroundings like no personal computing device ever has are emerging in new and varied application spaces. 

KEY TOPICS 

• February 22 » Session 1—FHE Systems 

• February 23 » Session 2—Materials Processing 

• February 24 » Session 3—Sensors & MEMS   

• February 25 » Session 4—Sustainability & Power 

• February 26 » Industry Virtual Tours 

ON-DEMAND AVAILABILITY

• February 15–21 
  Prepare and preview the On-Demand presentations in order to join each day ready for the interactive panel discussions and luminary keynote discussions.  

• February 26–March 26
  All content will be available for 30 days On-Demand in case you missed anything during FLEX week. 

WHO ATTENDS? 

Celebrating its 20th year, the online event will gather executives, product managers, business development professionals, and engineering directors as well as leading industry analysts and media for the latest developments, trends, and innovations in flexible hybrid electronics (FHE). More than 400 companies, universities, R&D labs, and government agencies from around the world have participated in FLEX conferences each year. 

Please fill out the FLEX Interest Form to stay updated on FLEX 2021 Conference & Expo.
 

Online, PST
United States

Feb 22, 2021 - Feb 26, 2021 FlexTech

FLEX IS GOING VIRTUAL!
This is the 20^th Anniversary of the FLEX Conference & Expo.
Thank you to the entire FLEX community, committee members, sponsors, attendees, and exhibitors, for your support. We are proud to have you with us on the journey into the next 20 years and beyond.

Organizers 

 

 

FLEX 20th Anniversary— Conference & Expo 2021

Virtual Event

Off Add to Calendar Disabled Nov 5, 2020

Call for abstracts

FLEX 2021

TOPICS & SUBMISSION FORM

America/Los_Angeles

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

The course explores how reliability testing plays a critical role for Flexible Hybrid Electronics throughout the development process. The presentation highlights how it is essential to create a reliability test plan that covers the requirements for EV, DV and finally though PV, in order to insure product reliability and performance.

The instructors discuss how the Molex design process is used to identify risks and challenges for custom FHE applications and how the various reliability test are used evaluate and eliminate the potential risk and challenges.

AGENDA

• Overview of Molex Printed Circuits Solutions
• FHE challenges & requirements
• Overview of reliability testing development process
• Reliability test standards
• Reliability lab set up
• Q&A

The various industry standards related to HMI, FHE, PE, Printed Sensors and other applications are also reviewed in conjunction with usage in reliability testing related to FHE.

Instructors Tom Seputis, Lab Manager, and Dave Rasmussen. Director, PCS Engineering, as they provide an overview of Molex Printed Circuit Solutions and the reliability testing and challenges related to Flexible Hybrid Electronics.

This Master Class is 4th in a series of 4 classes. Classes 1-3, and the series are also available On Demand at the following links:  

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#3 Integration Techniques for Flexible Electronics

Read more about the full Master Class Series

United States

Dave Rasmussen

Director of PCS Engineering

Molex

Tom Seputis

Lab Manager

Molex

Oct 21, 2020 - Jul 31, 2021

Flexible Electronics Master Class #4 explores best practices for ensuring reliability of FHE devices throughout the production process. The course is taught by experts from Molex's Printed Circuit Solutions Division which has been successfully building complex and reliable flexible circuits for many advanced applications.

Flexible Electronics Reliability Testing and Challenges

A Flexible Electronics Master Class

12:00 am - 12:00 am Off Add to Calendar Disabled Nov 2, 2020 America/Vancouver

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

This Master Class is 3rd in a series of 4 classes.  Classes 1 and 2 are available On Demand.  Class 4 will be announced shortly.

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#4 Reliability Measurement and Test for Flexible Electronics

United States

Robert Street

Fellow, Palo Alto Research Center

Sep 24, 2020

The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

 

HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS

A Flexible Electronics Master Class

10:00 am - 12:00 pm Off Add to Calendar 2020-09-24 10:00:00 2020-09-24 12:00:00 Flexible Electronics Master Class#3: Integration The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.   United States SEMI.org [email protected] America/Vancouver public Aug 31, 2020 America/Vancouver

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

This Master Class is 3rd in a series of 4 classes.  Classes 1 and 2 are available On Demand.  Class 4 will be announced shortly.

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#4 Reliability Measurement and Test for Flexible Electronics

United States

Robert Street

Fellow, Palo Alto Research Center

Sep 24, 2020

The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

 

HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS

A Flexible Electronics Master Class

10:00 am - 12:00 pm Off Add to Calendar 2020-09-24 10:00:00 2020-09-24 12:00:00 Flexible Electronics Master Class#3: Integration The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.   United States SEMI.org [email protected] America/Vancouver public Aug 31, 2020 America/Vancouver

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

Specific topics covered in this course include:

• printing interconnects
• printing fine lines, pads and pad pitches with < 100um
• logic circuits and resistors
• bonding integrated circuits
• integrating sensors of different types on flexible substrates without significant performance degradation
• pick and place with micron-level accuracy

MASTER CLASS SERIES

This Master Class is 3rd in a series of 4 classes.  Classes 1 and 2 are available On Demand.  Class 4 will cover Building in Reliability Testing and is now available for registration.

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#4 Overview of FHE Reliability Testing and Challenges 

Read more about the full Master Class Series

United States

Robert Street

Fellow, Palo Alto Research Center

Sep 24, 2020 - Jul 31, 2021

The 1-hour class describes techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS

A Flexible Electronics Master Class

12:00 am - 12:00 am Off Add to Calendar Disabled Nov 2, 2020 America/Vancouver

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States SEMI Standards PV and PV Materials China Joint TC Chapter Spring Meeting 2020 Business Technical Featured Speakers

This course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

Cornell University has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano ElectroMechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. This presentation highlights that, as well as a decision tree based AI model for predicting lithography outcomes.

The AI work used as the basis for the course has been applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience have been developed.

The course provides a useful basis upon which to formulate AI strategies for all thin film manufacturing sites.

United States

Robert Street

Fellow, Palo Alto Research Center

Chris Ober

Cornell University

Peter Doerschuk

Cornell University

Benyamin Davaji

Cornell University

Garry Bordonaro

Cornell NanoScale Facility

Jeremy Clark

Cornell NanoScale Facility

Aug 18, 2020 FlexTech

This on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

Artificial Intelligence in Thin Film Manufacturing

A Flexible Electronics Master Class

10:00 am - 12:00 pm Off Add to Calendar 2020-08-18 10:00:00 2020-08-18 12:00:00 Flexible Electronics Master Class#2: AI in Mfg This on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability. United States SEMI.org [email protected] America/Vancouver public Aug 20, 2020 America/Vancouver

Registration Includes: 

• Live access to one webinar (register separately for each in series)
• Post-webinar access to recording

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States SEMI Standards PV and PV Materials China Joint TC Chapter Spring Meeting 2020 Business Technical Featured Speakers

This course describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

The team from Cornell has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano ElectroMechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. We report on a decision tree based AI model for predicting lithography outcomes.

This work is being applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience are developed.

Read more about the full Master Class Series

United States

Robert Street

Fellow, Palo Alto Research Center

Chris Ober

Cornell University

Peter Doerschuk

Cornell University

Benyamin Davaji

Cornell University

Garry Bordonaro

Cornell NanoScale Facility

Jeremy Clark

Cornell NanoScale Facility

Aug 18, 2020 - Jul 31, 2021 FlexTech

This course describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

Originally recorded August, 2020, this course is now offered On-Demand.

Artificial Intelligence in Thin Film Manufacturing

A Flexible Electronics Master Class

12:00 am - 12:00 am Off Add to Calendar Disabled Jul 25, 2022

Registration

Open to all. 

Register Now

United States save your seat Supply Assurance During Times of Shortages – SEMI CSP Back to Work Session 1 V1

The COVID Pandemic has caused a worldwide shortage of many consumable supplies that SEMI members require.  Increased safety and PPE usage by new industries have strained the supply chain, forcing buyers to identify and establish relations with new providers, as many providers are in allocation mode working only with established customers. Thomas Scientific is hosting this session to provide insights into how to address this current predicament.  

United States

Jul 28, 2020 FOA

Session 1

Supply Assurance During Times of Shortages – SEMI CSP Back to Work

10:00 am - 10:30 am Off Add to Calendar 2020-07-28 10:00:00 2020-07-28 10:30:00 Supply Assurance During Times of Shortages – SEMI CSP Back to Work Session 1 Session 1 United States SEMI.org [email protected] America/Los_Angeles public Jul 20, 2020