MILPITAS, Calif. – August 24, 2020 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement in response to the new export control rule changes announced by the United States Commerce Department.

SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export control regulations issued on August 17, 2020, by the U.S. Department of Commerce will ultimately undermine U.S. national security interests by harming the semiconductor industry in the U.S. and creating substantial uncertainty and disruption in the semiconductor supply chain. On July 14, in public comments on the May 15 regulations, SEMI cautioned that those relatively narrow actions created unique disincentives to purchase U.S.-origin semiconductor equipment and design software and had already resulted in $17 million lost sales of U.S-origin items to firms unrelated to Huawei.

Commerce’s decision to significantly expand these unilateral restrictions will likely lead to more lost sales, eroding the customer base for U.S-origin items. The new restrictions will also fuel a perception that the supply of U.S. technology is unreliable and lead non-U.S. customers to call for the design-out of U.S. technology. Meanwhile, these actions further incentivize efforts to supplant these U.S. technologies.

SEMI respectfully requests Commerce immediately extend to 120 days the savings clause for items in production before August 17, ensure predictable and timely license decisions for all items and significant flexibility for licenses unrelated to 5G items. We also urge the administration to pursue policies with fewer unintended consequences and damage to U.S. technology leadership. Revenue from global sales is a major source of U.S. research and development (R&D) funding in these technologies; lost global revenue will lead to a decrease in R&D, undermining U.S. semiconductor innovation and thereby harming national security.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

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MILPITAS, Calif. — August 20, 2020 — North America-based manufacturers of semiconductor equipment posted $2.60 billion in billings worldwide in July 2020 (three-month average basis), according to the July Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 11.8 percent higher than the final June 2020 level of $2.32 billion, and is 27.6 percent higher than the July 2019 billings level of $2.03 billion.

“The second half of 2020 has started strong with double-digit billings growth for North America-based semiconductor equipment manufacturers,” said Ajit Manocha, SEMI president and CEO. "The strength reflects the semiconductor industry's criticality in today's world and the driving forces in place for long-term industry growth."

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is September 17, 2020 at 3:00pm Pacific.
For information on SEAJ Billings Express Report, visit www.seaj.or.jp.

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HSINCHU, Taiwan – August 18, 2020 –SEMI today announced the formation of a new standards committee that aims to develop global standards for flexible hybrid electronics (FHE) spanning design, materials, manufacturing, packaging and systems and to drive industry growth. Unanimously endorsed by members of the SEMI North America Regional Standards Committee (NARSC) and approved by the SEMI International Standards Committee (ISC), the technical committee is the world’s first to focus on flexible hybrid electronics standards. The SEMI Standards Flexible Hybrid Electronics Global Technical Committee has established its first chapter in Taiwan.

“The SEMI Standards Flexible Hybrid Electronics Global Technical Committee sets out to clear development bottlenecks facing the industry and establish unified measurement standards for flexible smart textile, automotive, Internet of Things (IoT) and related devices,” saidTerry Tsao, SEMI Chief Marketing Officer and president of SEMI Taiwan. “The Taiwan chapter looks forward to kicking off the development of international industry standards that help Taiwan's FHE sector promote industry growth by reducing costs and increasing competition.”

Initial work of the SEMI Standards Flexible Hybrid Electronics Global Technical Committeewill include establishing working groups to draft measurement standards; building industry consensus on the need for materials, equipment and manufacturing standards; and developing standards to accelerate the introduction of related FHE technologies into diverse consumer end markets.

“We are very pleased to see the establishment of the SEMI Standards Flexible Hybrid Electronics Global Technical Committee and are proud to be part of the working committee to draft the standards,” said Steve Huang, executive director of Taipei-based AiQ Smart Clothing, an innovator with a significant pool of smart textile IP. “As a pioneer in smart textile applications, we are keenly aware of the challenges posed by an absence of standards and how it stifles mass adoption of new technologies.”

The SEMI International Standards Program is in its 47^th year, with the 1,000^th SEMI Standard published last year. SEMI Standards cover fields including semiconductors, displays, photovoltaics, microelectromechanical systems (MEMS) and smart manufacturing.

For more information, visit the SEMI Standards web page.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Irene Huang/SEMI Taiwan
Phone: 886.03.560.1777, ext. 205
Email: [email protected]

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