David A. Horsley is co-founder and CTO of Chirp Microsystems Inc., a TDK Group company pioneering the use of MEMS technology for ultrasonic sensing. Dr. Horsley is also a Professor of Mechanical and Aerospace Engineering at the University of California, Davis, and Adjunct Professor of Mechanical Engineering at the University of California, Berkeley. Since 2004, he has been Co-Director of the Berkeley Sensor and Actuator Center (BSAC), the National Science Foundation’s Industrial/University Collaborative Research Center (I/UCRC) focused on MEMS research.
Dr. Horsley was Co-Chair of the 2016 IEEE Sensors Conference, Co-Chair of the 2017 Transducers Research Foundation Napa Microsystems Workshop, and he is the Co-Chair of the 2020 IEEE MEMS Conference. Dr. Horsley is a recipient of the National Science Foundation’s CAREER Award, the Outstanding Junior Faculty Award at UC Davis, the 2016 NSF I/UCRC Association’s Schwarzkopf Award for Technological Innovation, and has authored or co-authored over 150 scientific papers and holds over 20 patents.