HSINCHU, Taiwan – September 10, 2020 – Advanced, smart and green manufacturing will take center stage on-site and online September 23-25 as SEMICON Taiwan 2020 gathers industry visionaries and experts for the latest market trends, business opportunities and innovations across the semiconductor supply chain. Bringing together 550 exhibitors across 2,000 booths at the Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1), the hybrid event will also feature a virtual platform with an expo hall, live streaming forums and virtual reality (VR) technology for an immersive online experience accessible around the world. SEMICON Taiwan 2020 registration is now open.

The event coincides with the emergence of work from home, cloud services and telemedicine merged as drivers of semiconductor industry growth. Enabling technologies artificial intelligence (AI) and 5G are also key forces at play. The three technology areas – critical bulwarks in the world’s continuing battle against the COVID-19 pandemic – will contribute to a record US$67.7 billion in global fab equipment spending, an increase of 24%, next year, according to SEMI.  

SEMICON Taiwan 2020 Highlights

• Master Forum – High-technology thought leaders from TSMC, Foxconn, STMicroelectronics, Micron, FET, and Lam Research will explore how the semiconductor industry can leverage AI and 5G to fuel the next wave of innovation.
• Hi-Tech Corporate Growth & Innovation Forum – Taiwan Tech Arena (TTA) and Taiwania Capital will join SEMI for the first time to discuss how more corporations can make strategic investments to drive sustainable innovation. In addition, more than 10 semiconductor startups will introduce cross-discipline technologies designed to drive innovation.
• SMART Mobility Forum – Industry experts from IBM, Renesas Electronics, NXP Semiconductors, STMicroelectronics and Jaguar Land Rover will share the latest automotive technologies and market trends.
• SMART MedTech Forum – Experts from the Ministry of Science Technology (MOST), National Yang-Ming University and Powerchip Semiconductor Manufacturing will introduce cutting-edge medical technologies for the COVID-19 era and beyond.
• SMART Workforce Pavilion – To help build the electronics industry’s talent pipeline, SEMICON Taiwan 2020 will feature the Talent Cultivation Symposium, Women-in-Tech Forum and Talent Forum. In addition, talent-matching events will connect microelectronics companies with students to help them take an early step in launching their careers in high technology.
• Theme Pavilions & Innovation Zone – The event’s 15 theme pavilions and innovation zones will focus on critical areas of chip industry innovation and growth ranging from heterogeneous integration to compound and opto semiconductors, testing and materials while targeting macro issues such as circular economy and green power.
• 5 Concurrent Events – SEMICON Taiwan is co-located with FLEX Taiwan, ITC-Asia, Strategic Materials Conference Taiwan, SiP Global Summit, and SMART Manufacturing Taiwan.

Visitor Safety at SEMICON Taiwan 2020

The safety and well-being of visitors to all SEMI events is SEMI’s top priority. To help protect attendees at the on-site SEMICON Taiwan 2020, SEMI encourages all visitors to wear face masks. Attendees can also take advantage of hand sanitizers and body temperature checks at the event. In addition, contact-tracing information will be gathered.

For more event information, visit SEMICON Taiwan 2020.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts
Jo-ann Su
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 202

Irene Huang
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 205

• Read more about SEMICON Taiwan 2020 Hybrid to Lead the Way in AI and 5G Era

Kalispell, MT – Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice® LT electroplating system to Jenoptik for manufacturing semiconductor material for high-power diode lasers at its semiconductor production facility in Berlin-Adlershof, Germany. High-power diode lasers play an important role in optical pumping of solid-state lasers as well as in direct use applications such as material processing, sensing as well as in healthcare & life science. The dual-chambered Solstice LT is specially configured for high-performance gold processing. The announcement was made jointly by ClassOne CEO, Byron Exarcos, and Dr. Juergen Sebastian, plant manager of the Jenoptik facility in Berlin.

"The new Solstice LT will replace a manual plating wet bench," explained Dr. Sebastian. “This will significantly improve process stability, plating quality as well as reduce our metallization step costs. That’s important because at Jenoptik, we build all the semiconductors that go into our diode lasers in-house. The new Solstice LT electroplating system thus ensures very high quality, performance and service life of our end products. Moreover, the new system also promotes Jenoptik’s policy of sustainability thanks to the new electrolyte technology.”

“The Solstice LT for Jenoptik is specially configured with our GoldPro™ processing chamber,” said Exarcos. “GoldPro can deliver unprecedented levels of repeatability – wafer-to-wafer, die-to-die, within-die, and within-feature. The bottom line is exceptional uniformity and reproducibility, along with reduced cost of ownership.”

With the new electroplating system, Jenoptik is now able to process different GaAs wafers sizes to accommodate different customer requirements. Another reason for selecting Solstice was the flexibility of its design, which readily allows the handling of multiple wafer sizes on the same tool.

“We’re proud to be on the Jenoptik team because their semiconductor lasers are industry leaders,” said Exarcos. “Their quality is based on advanced manufacturing, with strict quality controls and state-of-the-art process technologies. It's an environment in which Solstice can play an integral role, and we're looking forward to the next generations of Jenoptik diode lasers!”

ClassOne Solstice systems provide high-performance electroplating specifically for ≤200mm wafer processing. The Solstice series includes fully-automated 8-chamber and 4-chamber systems with up to 75-wph throughput as well as a 2-chamber semiautomated configuration that can be used both for process development and production. In addition to electroplating, the unique Plating-Plus™ capabilities of the Solstice platform enable it to handle many other important functions, such as wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch, and more. Solstice’s class-leading performance and flexibility consistently make it the tool of choice for ≤200mm plating.

• Read more about ClassOne’s Solstice LT Plating System Selected by Jenoptik for Producing High-Power Diode Lasers

MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging electronic and photonic chips, and wafer-level packaging.

This advanced die bonder is based upon MRSI’s field proven high-speed HVM die bonder platform for high-volume manufacturing of integrated photonics that requires ultimate accuracy at the submicron level. It has inherited the speed using multiple levels of parallel processing from the HVM platform. It also has the HVM’s high level of flexibility for multiple die applications using auto-tool changing and multiple process applications with eutectic, epoxy stamping and dispensing in one machine.

The MRSI-S-HVM flexibility is elevated to another level with the capability to switch automatically between two modes of accuracies - 0.5 micrometer and 1.5 micrometer. The 0.5 micrometer mode uses a real-time alignment mechanism facilitated by the on-axis z-force bonding for the best possible co-planarity and final accuracy. For flip-chip bonding, it aligns the features on the bonding surfaces of the die and the carrier. This eliminates the expensive step for the customer to make alignment fiducials on both top and bottom sides of a chip during wafer fabrication, and it also eliminates the subsequent die bonder alignment step in order to calibrate the top and bottom surface of the chip. All these advantages are essential for volume manufacturing capability for those emerging applications.

The MRSI-S-HVM die bonder is capable of chip-on-wafer (CoW) process with dies from III-V wafer being picked, placed, and bonded onto a silicon wafer (12 inches) including fine lateral motions. It can also be applied to chip-on-interposer (CoI) and chip-on-substrate (CoS). Three heating options are available including high-density top heating eutectic bonding, bottom thermal heating, and MRSI’s proprietary bottom laser soldering solution, avoiding secondary reflow of adjacent chips, and improving UPH.

“The addition of this new submicron die bonder product family re-enforces MRSI’s industry-leading position in the field of manufacturing automation for advanced optoelectronics devices. We look forward to working with customers to help them to scale at this improved level of accuracy without compromising speed or flexibility,” said Dr. Yi Qian, VP & GM MRSI Systems, Mycronic.

To schedule an appointment and discuss a prototype demonstration, please contact us at [email protected].

For additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems
Tel: +86 135 0289 9401, e-mail: [email protected]
Time Zone: CST – China Standard Time

About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high- volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic AB (publ) is listed on NASDAQ Stockholm. www.mycronic.com

• Read more about MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

MILPITAS, Calif. – September 8, 2020 – Soaring pandemic-fueled demand for chips that power everything from communications and IT infrastructures to personal computing, gaming and healthcare electronics will drive an 8% increase in global fab equipment spending in 2020 and a 13% increase in 2021, SEMI announced today in its World Fab Forecast report. Rising demand for semiconductors for datacenter infrastructures and server storage along with the buildup of safety stock as U.S.-China trade tensions intensify are also contributing to this year’s growth.   

The bullish trend for overall fab equipment investments comes as the semiconductor industry recovers from a 9% decline in fab spending in 2019 and navigates a roller-coaster 2020 with actual and projected spending drops in the first and third quarters mixed with second- and fourth-quarter increases. See figure below.

Of all chip sectors, memory will see the largest spending increase in 2020, growing US$3.7 billion, or 16% year-over-year (YoY), to US$26.4 billion, and tack on an 18% increase to reach US$31.2 billion in 2021. 3D NAND spending will log the largest percentage surge this year, expanding 39%, and register modest growth of 7% in 2021. DRAM is expected to see 4% growth after a slowdown in the second half of 2020 before jumping 39% percent next year.

Equipment spending forecasts for other semiconductor sectors:

• Foundry, the next largest sector in equipment spending for 2020, is forecast to rise US$2.5 billion, or 12% YoY, to US$23.2 billion and edge up 2% to US$23.5 billion in 2021.
• MPU equipment spending will decline US$1.2 billion, or 18%, in 2020 and rise 9% to US$6 billion in 2021.
• Analog spending will grow a robust 48% in 2020 and rise 6% in 2021, an expansion chiefly driven by equipment investments for mixed-signal/power fabs.
• Image sensors equipment spending is expected to rise 4% to US$3 billion in 2020 and jump 11% to US$3.4 billion in 2021.

The SEMI World Fab Forecast report covers more than 1,300 fabs and lines and includes capacity and technology by fab and construction investments. The report shows 21 new construction projects – ranging from R&D to volume and including high- and low-probability parameters – starting in 2020. China accounts for the most (nine) of the new projects; followed by Taiwan at five; Southeast Asia and the Americas at two each; and Japan, Korea, and Europe/Mideast at one each. The report also tracks 18 new construction projects planned to begin next year – 10 in China, four in the Americas, three in Taiwan, and one in Europe/Mideast.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI
Phone: 1.408.943.7940
Email: [email protected]  

• Read more about COVID-19 Drives Rise in Global Fab Equipment Spending, SEMI Reports

MILPITAS, Calif. – September 8, 2020 – Second quarter 2020 global billings for semiconductor manufacturing equipment jumped 26% year-over-year and 8%, to US$16.8 billion, from the first quarter of the year, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

SEMI, the global industry association representing the electronics design and manufacturing supply chain, and the Semiconductor Equipment Association of Japan (SEAJ) gathered the data from more than 80 global equipment companies that report billings figures monthly. Following are quarterly billings data in billions of U.S. dollars quarter-over-quarter and year-over-year change by region:

Source: SEMI (www.semi.org) and SEAJ (www.seaj.or.jp), September 2020

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Second Quarter 2020 Global Semiconductor Equipment Billings Up 26% Year-Over-Year, SEMI Reports

ESPOO, Finland, 31st August 2020 – Picosun Group’s growth strategy is based on strong expansion into industrial ALD markets. To support this strategy, special emphasis has been placed on strengthening the Group’s global service organization. The investment has paid itself back in the form of high level of customer satisfaction, despite the challenges caused by the global covid-19 pandemic especially in traveling and logistics.

“Due to the reinforced localization of our service and support units, our service engineers’ utilization level has been more than 85% in the past six months, and with the latest remote service and support tools we have gained advantage to manage our customers’ PICOSUN® ALD system commissionings online and in time. ALD tool maintenances, process development, spare parts and other critical deliveries are also provided locally with maximum safety precautions in place, to ensure customers continuous operation of their PICOSUN® ALD equipment,” states Mr. Timo Malinen, Customer Experience Director of Picosun Group.

During the last months, Picosun Group has hired and trained several new service engineers and sales and support personnel to provide local support at the Group’s US, Asian, and European locations. Remote diagnostics, control, and data logging features for remote troubleshooting and process optimization of customers’ PICOSUN® ALD tools are a routine approach in the Group’s ALD solution deliveries. Augmented and/or virtual reality solutions for even more efficient service operations and remote learning/e-training possibilities are also under development and will be introduced in all Picosun’s operations later on.

“Our principle of ‘AGILE ALD’ and our position as the technological forerunner in our field obligate us to provide the best possible services and solutions to our customers. As a globally operating company, pandemic risk scenarios are an integral part of our continuous risk planning. Against the backdrop of the current covid-19 outbreak, our service operations are continuously being adapted to mitigate potential impacts. Picosun Group follows a holistic management process that enables constant development of our customer service unit to ensure the best possible response even in an emergency situation,” continues Malinen.

For Picosun, the health of employees and customers is the highest priority. In order to closely monitor and manage the covid-19 situation, Picosun follows all the safety regulations provided by WHO, CDC, ECDC, and Finnish Institute for Health and Welfare, and provides the necessary information timely to all employees, customers, and other stakeholders.

Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Timo Malinen
Customer Experience Director, Picosun Group
Tel. +358 40 5011 860
Email: [email protected]
Web: www.picosun.com

• Read more about High customer satisfaction with Picosun’s new service and support model

MILPITAS, Calif. – August 31, 2020 – Staged for the first time in virtual format, MEMS and Sensors Executive Conference (MSEC 2020) will gather industry visionaries and experts October 6-15 for the latest trends and innovations in sensorization for growth markets including medical, entertainment, augmented and virtual reality, the environment, food production, smart cities, ultrasonics and wearables.

Themed The Next Wave of Sensorization: Solving our Shared Challenges, the event will focus on solving technology challenges in vital areas such as health and safety while fueling the experience economy with advances in virtual and augmented reality. Components, software, and systems critical to MEMS and sensors innovations will come into sharp focus at the conference. Registration is open.

MSEC Keynotes

	Michael Tschanz, Director, Engineering Technology and Analysis Disney’s extensive use of sensors including for rides, animatronics and sensorization of the world’s largest micro transportation system
	Jens Fabrowsky, executive vice president, Automotive Electronics MEMS market opportunities and technology challenges over the next 10 years
	Dale Zimmerman, director for Photonics Devices MEMS-enabled display for Hololens augmented reality, including applications and market progress

MSEC 2020 will also feature sessions on key industry topics including the following:

• MedTech Considerations for Resolving the Trouble with Innovative Sensing Applications – Ian Chen, executive director for Medical New Business Development, Maxim Integrated,
• Opportunities in Biotech and Related Markets Due to COVID-19 –Ross Bundy, co-founder, Cardea
• MEMS Tug-of-war: COVID-19 vs Emerging Trends – Dimitrios Damianos, technology and market analyst for Imaging and MEMS, Yole Développement,
• A Wearable Social Distancing Solution Based on Ultrasonic Time-of-Flight Sensors – David Horsley, co-founder, TDK-Chirp Microsystems,
• tinyML: Massive Opportunity When Machine Intelligence Meets the Real World of Billions of Sensors – Evgeni Gousev, senior director, Qualcomm AI Research
• AI for Ultrasound Medical Imaging – Janusz Bryzek, executive chairman and CTO, eXo Systems,
• Future Mobility Enabled by Sensorization – Andreas Breitner, Partner, McKinsey & Company

Premier Sponsors

• Platinum Sponsor: EV Group, SPTS Technologies, a KLA Company
• Gold Sponsors: Applied Materials, Infineon, LAM Research, Okmetic, TEL

Event sponsors include Microtech Ventures. 

MSEC 2020 is hosted by MEMS & Sensors Industry Group (MSIG), a SEMI technology community. Learn more at Virtual MSEC 2020.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about Virtual MSEC 2020 to Spotlight MEMS and Sensors Innovations for Medical, Smart Cities, Other Growth Markets