At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position in the die bonding industry offering customers multiple application solutions in one machine. This new configuration offers an innovative horizontal turret feature to significantly increase the speed and throughput from the machine without sacrificing its renowned flexibility, accuracy, or reliability.

The new MRSI proprietary design delivers an “on-the-fly” tool change with up to 12 tools with zero tool changeover downtime, which has been an integral part of MRSI’s popular high-speed product lines MRSI-HVM and MRSI-H. This leads to increased machine efficiency, higher production output, and lower manufacturing costs.

This flexible 5 micrometer die bonder retains its comprehensive appeal across a wide range of applications including photonic packaging, microwave modules, RF power amplifiers, and infrared sensors.

“The addition of this new high-speed 5 micrometer die bonder re-enforces MRSI’s industry-leading position in the field of manufacturing automation for advanced microelectronic and optoelectronic devices. We look forward to working with customers to help them to scale their production,” said Dr. Yi Qian, VP & GM MRSI Systems, Mycronic.

To schedule an appointment and discuss a prototype demonstration, please contact us at [email protected].

For additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems
Tel: +86 135 0289 9401, e-mail: [email protected]
Time Zone: CST – China Standard Time

About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high- volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. www.mrsisystems.com

About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic AB (publ) is listed on NASDAQ Stockholm. www.mycronic.com

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• Read more about MRSI launches MRSI-705 high-volume configuration

Santa Clara – Sept. 29, 2020 – Picarro Inc., a leading provider of trace gas analyzers for a variety of air monitoring applications, is expanding its presence in Asia by opening a customer service and support office in Hwaseong, South Korea. Having sales staff, repair services, and replacement parts available locally will allow the company to better support its growing customer base there.

“Our portfolio of extremely sensitive and accurate analyzers enables semiconductor and equipment manufacturers to identify and mitigate airborne molecular contamination in the fab faster, resulting in better yield,” said John Park, General Manager at Picarro. “With several key semiconductor fabs and equipment manufacturers located in South Korea, and increasing adoption of our scientific instruments in other industries, it’s important that we have a robust presence there.”

John Park will head up the Korea office. Park has more than 20 years of experience in the semiconductor equipment and materials business in Korea. Prior to joining Picarro, he led successful sales teams at Tosoh SMD Korea and UnitTest Inc. and has established relationships with leading electronics and semiconductor companies there. He earned a B.A. in metallurgical engineering at Ulsan University in Korea.

About Picarro
Picarro provides industry leading solutions for real-time AMC monitoring. Their cavity ring-down spectroscopy (CRDS) technology offers significant advantages compared with incumbent AMC measurement techniques, such as ion-mobility spectrometry (IMS) and ion chromatography. Picarro’s SI Series analyzers enable fast response to contaminants in the cleanroom in seconds, not hours. With real-time continuous parts-per-trillion (ppt) level analysis, Picarro analyzers provide early warning of contamination events for AMC monitoring in cleanrooms, FOUP, and fab equipment.

For additional information, please visit semi.picarro.com

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Contact:
Siiri Hage
Director of Marketing Communications
Picarro, Inc.
[email protected]

• Read more about Picarro Expands Presence in Asia with New Customer Service and Support Office in South Korea

ESPOO, Finland, 24th September 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology, reports excellent results in UVC (ultraviolet-C) LED performance, achieved with the company’s ALD solutions.

Excellent reliability and lifetime improvements of UVC LEDs have been obtained at Picosun’s customer and collaboration partner site, National Chiao Tung University (NCTU), Taiwan, using passivation and barrier films deposited with PICOSUN® ALD equipment(*). ALD passivation layer could potentially replace the expensive hermetic seal package of the LEDs and thus lower the costs of the final device.

“We have used Picosun’s ALD technology already for years with great success. Our PICOSUN® ALD equipment yields superior quality films which has helped us to achieve several breakthroughs in our LED research. Picosun has local presence in Taiwan and we appreciate the prompt response of their customer support if we ever have any issues. At the phase when R&D results are to be ramped up to industrial-level production, the scalability of Picosun’s ALD technology is a huge benefit,” comments Professor Hao-Chung Kuo from NCTU.

In order to reach maximum light output and long operating lifetime, LED chips require surface passivation to eliminate parasitic currents caused by traps and defects. Also barrier coating is typically needed as LED materials are sensitive to moisture. ALD is an ideal technique to manufacture both the passivation and barrier films – and when the LED size diminishes to micrometer dimensions, the only coating method capable of producing high enough quality films on the required minuscule scale. Ultra-thin, pinhole-free ALD films do not suppress the LED light intensity and they provide reliable protection against ambient conditions, whereas their superior conformality ensures no thickness variations between the facets of the LED chip. Thickness variations, typical side effect of other coating methods, can potentially lead to uneven distribution of film stress or thermal expansion behavior and risk physical damage of the chip.

Short-wavelength UVC radiation destroys bacteria and viruses so UVC LED technology is particularly topical now during the still ongoing COVID-19 pandemic. Small, lightweight LEDs enable versatile design of portable, compact disinfecting equipment, they consume less power than other UVC sources, they are durable, and they pose no risk of hazardous material leaks such as e.g. mercury lamps.

“We are happy of the achievements of Professor Kuo’s group at NCTU, and how Picosun’s ALD technology has helped them to achieve their goals in UVC LED development. Our long-term collaboration and networking with both the academia and prominent industries in this field gives us the perfect synergy advantage to facilitate implementation of these solutions in industrial manufacturing,” says Mr. Edwin Wu, CEO of Picosun Asia Pte. Ltd.

(*) UVC LED with 50 nm ALD Al2O3 passivation and normal LED packaging (no hermetic seal) maintained 80% of its original efficiency even after 500 hours environmental test at 85% humidity and 85 oC temperature.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Edwin Wu
CEO, Picosun Asia Pte. Ltd.
Tel: +358 40 480 3449
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun’s ALD technology boosts UVC LED performance

MILPITAS, Calif. – September 23, 2020 – SEMI Nano-Bio Materials Consortium (NBMC) today released a Request for Proposals (RFP) for innovations in ambulatory monitoring, wearable technologies for cognitive assessment, and innovative power sources for wearable monitors. Proposals are also welcome for new concepts to advance mobile human monitoring and diagnostic capabilities. Projects will be awarded with cash budgets ranging from $500,000 to $2 million. The RFP is funded by the U.S. Air Force Research Laboratory (AFRL).

SEMI-NBMC focuses on innovation challenges and opportunities during research and development (R&D) to increase the technology and manufacturing readiness levels (TRL/MRL) of nanotechnologies and biotechnologies. The SEMI-NBMC program and committee encourages submission of novel technical approaches that carry significant risk as well as those that represent evolutionary improvements on existing technical capabilities, which tend to be less risky and involve shorter development and delivery times.

Industry experts on the NBMC RFP Review Committee selected the RFP topics based on an analysis of strategic market gaps and will evaluate all white paper submissions against that gap analysis. To learn more about the aeromedical mission and the status of biomarkers and sensors for telemedicine, watch the SEMI-NBMC and AFRL August MedTech Workshop Series.

After evaluating white papers, the committee will invite select organizations to submit full proposals that will be rigorously evaluated on criteria including budget, collaboration value, dual-use (commercial and military/aerospace) applicability, relevance to the digital healthcare ecosystem, relevance to advancing nano-bio materials for human monitoring, schedule and milestones, deliverables, and overall proposal quality. See the complete SEMI-NBMC 2020 Request for Proposals for more details on the evaluation process.   

The consortium strongly encourages partnerships among industrial companies, R&D organizations and university teams. SEMI-NBMC funding will be matched with funds provided by grant recipients to cover total project cost. Development partners retain ownership of intellectual property developed under a SEMI NBMC contract.

White paper responses, the first step in responding to the RFP, are due October 20, 2020. SEMI-NBMC staff will review the RFP topics and submission and review process during a live webinar on October 2, 2020 at 10:00am PDT. Registration is open to anyone considering submitting a proposal. A recording of the webinar will be available for those unable attend the live event.

About SEMI-NBMC

SEMI-NBMC was founded in 2013 to bring together scientists, engineers and business development professionals from industry, government and universities to collaboratively initiate research and development of electronic technologies to improve human performance monitoring and performance augmentation capabilities. To date, over 25 industry partners have advanced the state-of-the-art in human-performance monitoring in 26 projects. Advancements include subsystems designed for ECG, functionalized biomarker sensors, and hydration sensors.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI-NBMC Invites White Paper Proposals for Funding of Human Monitoring Innovations

HSINCHU, Taiwan – September 22, 2020 – SEMICON Taiwan 2020 Hybrid opens tomorrow with advanced, smart and green manufacturing in the spotlight on-site and online as industry visionaries and experts gather for the latest market trends, business opportunities and innovations across the semiconductor supply chain. The first hybrid SEMICON ever, the September 23-25 exhibition at the Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1), will feature a virtual platform with an exposition hall, live streaming forums, networking opportunities and virtual reality (VR) technology offering an immersive online experience accessible around the world. SEMICON Taiwan 2020 registration is open.

Entering its 25th year, SEMICON Taiwan features 15 theme pavilions and innovation zones as well as 19 international forums as in-show experience. For the first time, Smart Manufacturing Taiwan, Compound Semiconductor Innovation Zone, Heterogeneous Integration Innovation Zone, and Smart Workforce Pavilion will go virtual.

After registering for SEMICON Taiwan 2020 Hybrid online, attendees can log in to the virtual platform and find all exhibition information on the front page for easy navigation of the event. Key online features include:

1. Virtual Exhibition Hall: See the latest technologies and solutions from key exhibitors. View a sneak peek video of the hybrid experience.
2. 1-on-1 Chat: Connect with exhibitors and visitors in real time.
3. Networking Lounge: Exchange opinions with industry experts worldwide and uncover potential business opportunities and technical solutions.
4. SEMICON Taiwan Live Tour: Explore exciting activities and behind-the-scenes highlights of SEMICON Taiwan from an exclusive online perspective.
5. Forum Live Broadcast: Get insights from industry opinion leaders firsthand via live broadcasts of international forums. Visit the SEMICON Taiwan 2020 website for the forum schedule.
6. Virtual Reality (VR) Experience: For a better, faster visual experience, enter the virtual exhibition hall using a VR device and your smartphone’s screen.

For more information, visit the SEMICON Taiwan 2020 website.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Jo-ann Su
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 202

Irene Huang
SEMI Taiwan
Email: [email protected]
Phone: 886.03.560.1777 ext. 205

• Read more about SEMICON Taiwan 2020 Hybrid Opens Tomorrow With Advanced, Smart and Green Manufacturing in Spotlight

MILPITAS, Calif. — September 17, 2020 — North America-based manufacturers of semiconductor equipment posted $2.65 billion in billings worldwide in August 2020 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 3.0 percent higher than the final July 2020 level of $2.57 billion, and is 32.5 percent higher than the August 2019 billings level of $2.00 billion.

“August billings of North America-based semiconductor equipment manufacturers demonstrate solid performance and strong year-over-year growth,” said Ajit Manocha, SEMI president and CEO. “Semiconductor equipment demand remains robust despite supply chain uncertainties and new regulatory constraints.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), September 2020

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is October 22, 2020 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp. 

• Read more about North American Semiconductor Equipment Industry Posts August 2020 Billings