TAIPEI, Taiwan – October 13, 2020 – Energy Taiwan today hosts a pre-show press conference with government and industry opinion leaders sharing the latest perspectives on domestic policies, energy industry trends, corporate energy consumption, and domestic green energy transformation goals and opportunities. The largest renewable energy event in Taiwan, Energy Taiwan connects the global green energy supply chain for three days of technology demonstrations, theme forums, business networking, and expert insights into the latest technologies and business opportunities in PV, wind energy, hydrogen energy, smart energy storage, and green finance and insurance.
Hosted by SEMI and the Taiwan External Trade Development Council (TAITRA), Energy Taiwan is expected to draw more than 10,000 visitors from Taiwan and abroad to the Taipei Nangang Exhibition Center, Hall I (TaiNEX 1), October 14-16, 2020.
Today’s press conference features insights on Taiwan’s renewable energy development, promoting renewable energy in Taiwan, environmental sustainability, revitalization of the domestic economy and other topics addressing how Taiwan can establish its green energy competitive edge and become the Asia-Pacific green energy center. Speakers at the press conference include:
- Ms. Leonor F. M. Lin, President and CEO, TAITRA
- Mr. Terry Tsao, Global Chief Marketing Officer & President of Taiwan, SEMI
- Mr. Wen-Sheng Tseng, Vice Minister, Ministry of Economic Affairs, R.O.C.
- Dr. Wen-Whe Pan, CEO, United Renewable Energy Co., Ltd.
- Ms. Christy Wang, General Manager of Ørsted in Taiwan
Energy Taiwan Theme Forums
Energy Taiwan features 15 theme forums on renewable energy to promote industry dialogue and business matching opportunities. The forums include the following:
- PV Executive Summit
- PV Technology Symposium
- Global Renewable Energy Supply Chain Summit
- International Forum on Offshore Wind Talent Training and Underwater Technology Trends
- Smart Energy Storage and System Integration Forum
- Offshore Wind Industry Summit
- Hydrogen Energy Industry Trend Forum
Industry Powerhouses to Showcase Latest Green Energy Technologies
- PV – AUO, Motech, TSEC, URE, Win Win Precision Technology and YSOLAR
- Wind energy – Copenhagen Infrastructure Partners (CIP), EnBW Asia Pacific, Hai Long Offshore Wind Farm Project, Formosa 3 (Haiding) Offshore Wind Farm Project, Ørsted, RWE, Swancor and WPD
- Energy Storage Products – Billion Watts, Mobiletron, Samsung, Siemens, Sysgration and Yulon Motor
“We have seen impressive growth in the renewable energy industry in Taiwan the past four years,” said Wen-Sheng Tseng, Vice Minister, Ministry of Economic Affairs, R.O.C., emphasizing the government’s determination to develop renewable energy. “To echo the goal of promoting renewable energy highlighted by President Tsai Ing-wen in her second-term inaugural speech this year, the government, the industry, and the private sector need to work together to seek a consensus and strive to reach the milestone of green energy sources in electricity generation share by 20% in 2025. Looking to the future, the government will try to do its best to create diverse green energy applications, build industry clusters, develop a comprehensive green power system, and attract more international talent to help Taiwan transform into a smart green energy technology island.”
“According to the latest survey of PV Policy Position Paper from the SEMI PV Public Advocacy Committee, nearly 75% of the people support the energy transition, 2.5% higher than last year, while up to 80% of the people hope to see acceleration of the development of the PV industry,” said Terry Tsao, Global Chief Marketing Officer and President of SEMI Taiwan. “SEMI has long been committed to fostering communication between the government and the industry and has been deeply involved in the PV industry for 14 years through exhibitions, forums, policy advocacy and various business matching events. Last year, we joined hands with eight offshore wind energy developers to launch the Taiwan Offshore Wind Industry Association (TOWIA) that vows to promote sound development of the energy industry and assist Taiwan’s renewable energy industry to reach the next level.”
“We see a lot of growth momentum for renewable energy due to policy support and rising
domestic demand,” said Leonor F. M. Lin, President and CEO of TAITRA. “Taiwan's goal is to raise its offshore wind energy capacity to 5.7 GW by 2025. Investments up to NT$1 trillion (US$34.8 billion) as well as 20,000 new jobs are expected. Energy Taiwan 2020 is joined by top players in PV, wind energy, and energy storage from home and abroad. Through technology exchanges with international counterparts and immersion in the latest Internet of Things (IoT) and artificial intelligence (AI) related application technologies, we believe the industry can find a way to maintain its flexibility while adjusting to the rapidly changing energy world, and create more comprehensive renewable energy solutions.”
“PV is an important alternative source of energy that Taiwan government has been promoting to reach its goal of becoming a less coal-use and nuclear free country,” said Dr. Wen-Whe Pan, CEO, United Renewable Energy Co., Ltd. “However, policy inconsistency and implementation gaps of different government agencies and the pushback from environmental groups make it difficult to acquire the lands needed, and the consequences of failing to carry out the green energy policy will be shared by the government, developers and environment groups. To make abolition of nuclear energy and reduction of coal power possible, all stakeholders from different sectors of society must work together. Moving forward, the government must take the lead in solving issues concerning land acquisition and distribution feeders. Only by doing so is there a chance for us to achieve 20GW of PV installations by 2025 and accomplish the energy transition goal in Taiwan.”
“As one of the global leaders in offshore wind energy, Ørsted really appreciates the opportunity to be working with Taiwan to make our shared green energy vision possible, and to facilitate sustainable development of Taiwan's offshore wind energy industry,” said Christy Wang, General Manager of Ørsted in Taiwan. “We started to proactively invest in wind energy in Taiwan in 2016 and committed to supporting the development of the local supply chain and nurturing and hiring local talent. Our Asia-Pacific team has grown from only two members to 140! It is vital for Taiwan to maintain its growth momentum and launch the next stage of bidding as early as possible next year to secure its leading position in the Asia-Pacific market and ensure that key industrial resources such as regional talent and shipping and supplier capacity are in place. More importantly, local suppliers should be given sufficient time for preparation. Only by doing so can Taiwan sustain its competitive edge in Asia-Pacific. Ørsted will continue to deepen its relationship with the local community and work with the industry, government and academia partners to turn the green energy vision into reality.”
Most foreign buyers are unable to visit to Taiwan due to travel restrictions stemming from the pandemic. To overcome that challenge, Energy Taiwan offers a variety of virtual platforms to ensure continued exchanges between exhibitors and international buyers. Online trade meetings will include buyers from Spain, Poland, Romania, Bulgaria, the United Arab Emirates (UAE) and Singapore. International buyers plan to work with Taiwanese companies to develop more energy products during the post-COVID-19 pandemic era. In addition, a live tour will guide international buyers through the show in English, exploring the latest services and solutions at Energy Taiwan 2020.
Renewable Energy Week, organized by the Bureau of Energy, Ministry of Economic Affairs, R.O.C. is co-located with Energy Taiwan this year.
For more information about Energy Taiwan, please visit the event website.
About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Association Contacts
Jo-ann Su
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 202
Connie Lin
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 211
MILPITAS, Calif. ─ October 13, 2020 ─ Global silicon wafer shipments are set to increase 2.4% year-over-year in 2020, with growth continuing in 2021 and shipments reaching a record high in 2022, SEMI reported today in its annual silicon shipment forecast for the semiconductor industry.
“Silicon wafer shipments are recovering this year despite pressure from geopolitical tensions, the shifting global semiconductor supply chain and the COVID-19 pandemic," said Clark Tseng, director of Industry Research and Statistics at SEMI. “With the pandemic accelerating digitization to transform businesses and their delivery of services worldwide, we expect continued growth over the next two years.”
2020 Silicon* Shipment Forecast (MSI = Millions of Square Inches)
|
|
Actual |
Forecast |
|||||
|
|
2018 |
2019 |
2020 |
2021 |
2022 |
2023 |
|
|
MSI |
12,541 |
11,677 |
11,957 |
12,554 |
13,220 |
13,761 |
|
|
Annual Growth |
8.0% |
-6.9% |
2.4% |
5.0% |
5.3% |
4.1% |
|
*Total Electronic Grade Silicon Slices – Excludes Non-Polished Wafers
*Shipments are for semiconductor applications only and do not include solar applications
Source: SEMI (www.semi.org), September 2020
Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or chips are fabricated.
All data cited in this release includes polished silicon wafers such as virgin test wafers and epitaxial silicon wafers shipped by the wafer manufacturers to the end-users but not non-polished or reclaimed wafers.
For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.
About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]
ESPOO, Finland, 6th October 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, strengthens its position in power electronics market with several cluster ALD system sales to prominent manufacturers in Europe, USA and Asia.
“Power electronics is an important, fast growing market for Picosun. ALD has potential to solve various challenges manufacturers are facing in this field, and our solutions have enabled our customers to create significant added value in terms of device quality and throughput. At Picosun, we have developed several turn-key production ALD solutions specifically for 4-8 inch wafer markets such as power devices. Especially our cluster ALD systems, such as the PICOSUN® Morpher which we launched last year, have been extremely well received by our customers,” says Juhana Kostamo, Head of Customer Solutions/Deputy CEO of Picosun.
Power components are crucial in a wide range of applications from consumer electronics to transportation, energy production and distribution, including renewables such as wind and solar power generation. These components are typically manufactured on 4-8 inch compound semiconductor wafers such as GaN and SiC. These materials provide various benefits compared to pure silicon, for example higher electron mobility, higher threshold voltage, and ability to operate at higher temperatures. Challenges do exist, however, as GaN and SiC power devices are prone to high interface trap density (leading to parasitic currents and reduced electron mobility) and gate leakage current, and poor threshold voltage stability.
Interface trap density can be reduced by combining pre-cleaning methods with high permittivity, large bandgap insulators. High quality, defect-free high-k dielectric layers such as Al2O3, AlN or ZrO2 etc. are key in reducing power devices’ gate leakage current and to improve electron mobility and threshold voltage stability. A good example here are GaN-based HEMTs (high electron mobility transistors), which are important in various large scale practical applications, and which require efficient gate insulation and surface passivation to achieve optimal functionality.
ALD stands as a superior deposition method here compared to other thin film coating technologies such as PECVD, as ALD produces the most conformal, uniform, and defect-free films with accurate, digitally repeatable thickness control and sharp interfaces. With the right selection of ALD deposition equipment, even multilayer processing is possible i.e. various functional material layers and/or stacked films/nanolaminates can be manufactured in one process run.
PICOSUN® Morpher is a disruptive ALD production platform designed for up to 8 inch wafer industries such as power electronics, MEMS, sensors, LEDs, lasers, optics, and 5G components. Morpher’s operational agility makes the system adaptable to various and changing manufacturing needs, on all business verticals from corporate internal R&D to production and foundry manufacturing, where both the end products and/or customers’ requirements may change rapidly. Morpher can handle several substrate materials, batch and substrate sizes, and ALD materials with leading process quality. Multilayer deposition is possible, and cluster design allows integration of also other processing units such as pre-clean, RIE etc. for fully automated, high throughput continuous vacuum operation.
“In its versatility and transformability, Morpher is the epitome of our principle ‘Agile ALD’. Innovation, constant development and improvement of our ALD solutions to enable our customers’ success is our driving force at Picosun. This applies also to Morpher platform and we have some truly exciting additions to this product family coming in the near future,” summarizes Kostamo.
About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.
More information:
Juhana Kostamo
Head of Customer Solutions/Deputy CEO, Picosun Group
Tel: +358 50 3699 565
Email: [email protected]
Web: www.picosun.com
MILPITAS, Calif. — October 6, 2020 — Aiming to accelerate the adoption of smart manufacturing across the worldwide microelectronics supply chain, the first SEMI Global Smart Manufacturing Conference will gather Industry 4.0 experts October 20-23 to share best known methods (BKMs) for improving data capture and analysis in microelectronics manufacturing. Registration for the virtual conference featuring keynotes, case studies and tutorials is open.
Smart manufacturing practices could increase productivity by as much as 12% through line efficiency gains, quality improvements, and reductions in energy and direct labor costs, according to Deloitte. Industry 4.0 is also a significant driver of IC devices, accounting for $49 billion in sales in 2020, according to Gartner.
Smart manufacturing is the science of digitizing manufacturing data to maximize microelectronics yield and production efficiencies while increasing return on investment in equipment, processes and people. Members of the SEMI SMART Manufacturing initiative collaborate to drive advances and a higher return on investment faster.
The SEMI Global Smart Manufacturing Conference will feature six sessions on three topics – sensing, connecting and predicting – and experts from companies including BisTEL, Bosch, Broadcom, Deloitte, Doople, Micron, Schneider Electric, Texas Instruments, TDK and Yamaha. With two live sessions each day, the virtual conference will be easy to access during working hours in the major microelectronics manufacturing regions.
“There is a growing need across the world for more insights on effective smart manufacturing strategies and tools that lead to high ROI,” said Dr. Bobby Mitra, IEEE Fellow, worldwide director of Smart Manufacturing at Texas Instruments, and chair of the SEMI Smart Manufacturing Americas Chapter. “The first SEMI Global Smart Manufacturing Conference will bring together global experts with real-world experience who will outline the critical concepts in each smart manufacturing domain with best practices and returns.”
“The microelectronics industry’s urgency to drive greater manufacturing efficiencies has never been greater as foundational production technologies remain key enablers of advances in artificial intelligence (AI), 5G, machine learning and other smart technologies that promise to help the world overcome some of its greatest challenges including the current COVID-19 pandemic,” said Tom Salmon, vice president of Collaborative Technology Platforms and lead of the Smart Manufacturing Initiative at SEMI. “With the sharp reductions in worldwide air travel, SEMI is taking the lead with a virtual conference that will connect microelectronics manufacturing customers with solution providers via a new AI engine to provide a novel method of information sharing and networking that could be more effective than a face-to-face event.”
The global SEMI Smart Manufacturing Technology Community, which includes Smart Manufacturing committees in the Americas, China, Europe, Japan, Korea, Southeast Asia and Taiwan, identified the industry experts who will present as speakers and instructors at the conference.
The SEMI Global Smart Manufacturing Conference programs committee consists of representatives from Applied Materials, Arizona State University, Inficon/FPS, IBM, Lam Research, Veracity Protocol, Rockwell Automation, Sapphire Automation, TEL, and Texas Instruments.
SEMI launched its Smart Manufacturing Initiative in 2016 to explore strategies and share best implementation practices among its members while meeting the needs of SEMI International Standards committees for data sharing.
For more information on the SEMI Global Smart Manufacturing Conference, please visit its website.
About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]
Industry Reports 12.6% Revenue Growth Overall; Most Categories Log Double-Digit Increases
MILPITAS, Calif. — October 5, 2020 — Electronic Design Automation (EDA) industry revenue increased 12.6% in Q2 2020 to $2,783.9 million, compared to $2,472.1 million in Q2 2019, with most categories logging double-digit increases, the Electronic System Design (ESD) Alliance Market Statistics Service (MSS) announced today. The four-quarter moving average, which compares the most recent four quarters to the prior four quarters, increased by 6.7%. The ESD Alliance is a SEMI Technology Community.
“The EDA industry reported a double-digit revenue increase for Q2 2020, compared to Q2 2019,” said Walden C. Rhines, Executive Sponsor, SEMI EDA Market Statistics Service. “Individually, Computer Aided Engineering (CAE), IC Physical Design and Verification, and Semiconductor IP (SIP) reported double-digit increases in Q2. Further, all geographic regions reported revenue increases.”
The companies tracked in the MSS report employed 46,579 people in Q2 2020, a 5% increase over the Q2 2019 headcount of 44,372 and up 1.4% compared to Q1 2020.
The quarterly MSS report containing detailed revenue information with category and geographic breakdowns is available to ESD Alliance members.
Revenue by Product Category in Q2 2020
- CAE revenue increased 16.1% to $922 million compared to Q2 2019. The four-quarter CAE moving average increased 7.1%.
- IC Physical Design and Verification revenue increased 16.8% to $584.1 million compared to Q2 2019. The four-quarter moving average for the category rose 4.8%.
- Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue decreased 0.3% to $243.5 million compared to Q2 2019. The four-quarter moving average for PCB and MCM increased 12.4%.
- SIP revenue increased 13.6% to $948.2 million compared to Q2 2019. The four-quarter SIP moving average grew 8.5%.
- Services revenue decreased 12.8% to $86.2 million compared to Q2 2019. The four-quarter Services moving average decreased 14.3%.
Revenue by Region in Q2 2020
- The Americas, the largest reporting region by revenue, purchased $1,155.6 million of EDA products and services in Q2 2020, an 11.4% increase compared to Q2 2019. The four-quarter moving average for the Americas increased 4.6%.
- Europe, the Middle East, and Africa (EMEA) revenue increased 5.2%, to $377.5 million compared to Q2 2019. The four-quarter moving average for EMEA grew 12.2%.
- Japan revenue increased 9% to $240.4 million compared to Q2 2019.
- APAC revenue increased 18.1% to $1,010.3 million compared to Q2 2019. The four-quarter moving average for APAC increased 6.3%.
About the MSS Report
The ESD Alliance Market Statistics Service reports EDA, IP and services industry revenue data quarterly and is available to Alliance members. Both public and private companies contribute data to the report. Each quarterly report is published approximately three months after quarter close. MSS report data is segmented as follows:
- Revenue type (product licenses and maintenance, services, and SIP)
- Application (CAE, PCB/MCM Layout, and IC Physical Design & Verification)
- Region (the Americas, Europe Middle East and Africa, Japan, and Asia Pacific)
In addition, the report provides many subcategories of detail and lists total employment of the tracked companies.
About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.
About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.
Press Contacts
Paul Cohen
ESD Alliance
A SEMI Strategic Technology Community
978-769-2106
Jack Taylor
Mentor, a Siemens Business
512-560-7143
At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position in the die bonding industry offering customers multiple application solutions in one machine. This new configuration offers an innovative horizontal turret feature to significantly increase the speed and throughput from the machine without sacrificing its renowned flexibility, accuracy, or reliability.
The new MRSI proprietary design delivers an “on-the-fly” tool change with up to 12 tools with zero tool changeover downtime, which has been an integral part of MRSI’s popular high-speed product lines MRSI-HVM and MRSI-H. This leads to increased machine efficiency, higher production output, and lower manufacturing costs.
This flexible 5 micrometer die bonder retains its comprehensive appeal across a wide range of applications including photonic packaging, microwave modules, RF power amplifiers, and infrared sensors.
“The addition of this new high-speed 5 micrometer die bonder re-enforces MRSI’s industry-leading position in the field of manufacturing automation for advanced microelectronic and optoelectronic devices. We look forward to working with customers to help them to scale their production,” said Dr. Yi Qian, VP & GM MRSI Systems, Mycronic.
To schedule an appointment and discuss a prototype demonstration, please contact us at [email protected].
For additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems
Tel: +86 135 0289 9401, e-mail: [email protected]
Time Zone: CST – China Standard Time
About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high- volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. www.mrsisystems.com
About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic AB (publ) is listed on NASDAQ Stockholm. www.mycronic.com
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Santa Clara – Sept. 29, 2020 – Picarro Inc., a leading provider of trace gas analyzers for a variety of air monitoring applications, is expanding its presence in Asia by opening a customer service and support office in Hwaseong, South Korea. Having sales staff, repair services, and replacement parts available locally will allow the company to better support its growing customer base there.
“Our portfolio of extremely sensitive and accurate analyzers enables semiconductor and equipment manufacturers to identify and mitigate airborne molecular contamination in the fab faster, resulting in better yield,” said John Park, General Manager at Picarro. “With several key semiconductor fabs and equipment manufacturers located in South Korea, and increasing adoption of our scientific instruments in other industries, it’s important that we have a robust presence there.”
John Park will head up the Korea office. Park has more than 20 years of experience in the semiconductor equipment and materials business in Korea. Prior to joining Picarro, he led successful sales teams at Tosoh SMD Korea and UnitTest Inc. and has established relationships with leading electronics and semiconductor companies there. He earned a B.A. in metallurgical engineering at Ulsan University in Korea.
About Picarro
Picarro provides industry leading solutions for real-time AMC monitoring. Their cavity ring-down spectroscopy (CRDS) technology offers significant advantages compared with incumbent AMC measurement techniques, such as ion-mobility spectrometry (IMS) and ion chromatography. Picarro’s SI Series analyzers enable fast response to contaminants in the cleanroom in seconds, not hours. With real-time continuous parts-per-trillion (ppt) level analysis, Picarro analyzers provide early warning of contamination events for AMC monitoring in cleanrooms, FOUP, and fab equipment.
For additional information, please visit semi.picarro.com
###
Contact:
Siiri Hage
Director of Marketing Communications
Picarro, Inc.
[email protected]
Interested to learn how COVID-19 and other macroeconomic factors affect the semiconductor equipment and materials markets? Hear more about these insights and outlook for 2021 from analysts of the SEMI Market Data team. This webinar will also provide an overview of the market report offerings available to SEMI members with a live demo of two recently released reports - Global Semiconductor Packaging Materials Outlook Report and Silicon Wafer Market Monitor.
United States
8:00 am
Introduction
8:05 am
Ed Hall
Sr. Manager, Information Products (Market Reports/Standards)
SEMI
Overview of SEMI Market Data Resources
8:15 am
Demo
- Global Semiconductor Packaging Materials Outlook (GSPMO) Report
- Silicon Wafer Monitor Report
8:30 am
Clark Tseng
Director, Industry Research & Statistics
SEMI
Semiconductor Equipment/Materials Market Outlook
8:45 am
Q&A
8:55 am
Closing Remarks
Event format
ESPOO, Finland, 24th September 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology, reports excellent results in UVC (ultraviolet-C) LED performance, achieved with the company’s ALD solutions.
Excellent reliability and lifetime improvements of UVC LEDs have been obtained at Picosun’s customer and collaboration partner site, National Chiao Tung University (NCTU), Taiwan, using passivation and barrier films deposited with PICOSUN® ALD equipment(*). ALD passivation layer could potentially replace the expensive hermetic seal package of the LEDs and thus lower the costs of the final device.
“We have used Picosun’s ALD technology already for years with great success. Our PICOSUN® ALD equipment yields superior quality films which has helped us to achieve several breakthroughs in our LED research. Picosun has local presence in Taiwan and we appreciate the prompt response of their customer support if we ever have any issues. At the phase when R&D results are to be ramped up to industrial-level production, the scalability of Picosun’s ALD technology is a huge benefit,” comments Professor Hao-Chung Kuo from NCTU.
In order to reach maximum light output and long operating lifetime, LED chips require surface passivation to eliminate parasitic currents caused by traps and defects. Also barrier coating is typically needed as LED materials are sensitive to moisture. ALD is an ideal technique to manufacture both the passivation and barrier films – and when the LED size diminishes to micrometer dimensions, the only coating method capable of producing high enough quality films on the required minuscule scale. Ultra-thin, pinhole-free ALD films do not suppress the LED light intensity and they provide reliable protection against ambient conditions, whereas their superior conformality ensures no thickness variations between the facets of the LED chip. Thickness variations, typical side effect of other coating methods, can potentially lead to uneven distribution of film stress or thermal expansion behavior and risk physical damage of the chip.
Short-wavelength UVC radiation destroys bacteria and viruses so UVC LED technology is particularly topical now during the still ongoing COVID-19 pandemic. Small, lightweight LEDs enable versatile design of portable, compact disinfecting equipment, they consume less power than other UVC sources, they are durable, and they pose no risk of hazardous material leaks such as e.g. mercury lamps.
“We are happy of the achievements of Professor Kuo’s group at NCTU, and how Picosun’s ALD technology has helped them to achieve their goals in UVC LED development. Our long-term collaboration and networking with both the academia and prominent industries in this field gives us the perfect synergy advantage to facilitate implementation of these solutions in industrial manufacturing,” says Mr. Edwin Wu, CEO of Picosun Asia Pte. Ltd.
(*) UVC LED with 50 nm ALD Al2O3 passivation and normal LED packaging (no hermetic seal) maintained 80% of its original efficiency even after 500 hours environmental test at 85% humidity and 85 oC temperature.
About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.
More information:
Mr. Edwin Wu
CEO, Picosun Asia Pte. Ltd.
Tel: +358 40 480 3449
Email: [email protected]
Web: www.picosun.com
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