ESPOO, Finland, 19th October 2020 – The Chairman of the Board and founder of Picosun Group, Mr. Kustaa Poutiainen, has been awarded as Finland’s Entrepreneur of the Year 2020. Mr. Poutiainen received the National Entrepreneur Award in the annual meeting of the Federation of Finnish Enterprises in Jyväskylä on 17th October. The award is given every year to four Finnish entrepreneurs as a recognition of exceptional entrepreneurship.

Picosun provides ALD (Atomic Layer Deposition) thin film coating solutions to global microelectronics and other industries. ALD was invented in Finland in 1974 by Picosun Board Member Dr. Tuomo Suntola, who in 2018 received the Millennium Technology Prize in recognition of his invention. ALD is a mature, key enabling technology in today’s semiconductor manufacturing, realizing the development of modern microelectronics according to the Moore’s Law. ALD is expanding rapidly to other fields of industry as well, and it is expected to bring a fundamental disruption especially to healthcare technologies, where Picosun’s PicoMEDICAL™ solutions have already enabled several new innovations.

“Even if we had great premises to start manufacturing ALD equipment, not everyone believed in us in the beginning. Our personnel did and showed what they are capable of. It has taken us to a path of excellent growth,” says Poutiainen.

Picosun’s first customers, when the company entered the ALD business in 2004, were universities and research institutes. Now, the world’s leading electronics manufacturers and other companies turn to Picosun when they need the most advanced thin film coating technology to stay spearheading their own industries. Even in the middle of the global pandemic, Picosun’s turnover is expected to grow 50%, which is remarkably higher than the market’s average of 15%.

“Since day one, our vision was to be the best in the world. We have already achieved this with our R&D ALD tools, and now we are heading further. We invest a significant amount of our turnover in development of our ALD solutions and our personnel so that we can always exceed the expectations of our customers. It is an honor to receive the National Entrepreneurship Award of Finland, and it is an honor to be a part in steering Picosun towards the future, which looks very bright indeed,” continues Poutiainen.

“The whole Picosun team wants to congratulate our Chairman, Kustaa Poutiainen, on this prestigious award. We are very proud of his significant contributions and role in enabling the international breakthrough of Finnish originated ALD technology. I am sure that the entire global ALD community appreciates his efforts and joins our congratulations,” summarizes Mr. Jussi Rautee, CEO of Picosun Group.

More information:
Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun’s success brings Chairman of the Board Kustaa Poutiainen the National Entrepreneur Award of Finland 2020

• Total income for the third quarter was EUR 3.0 million (2019: EUR 3.1 million)
• Cash position maintained at a good level
• Book-to-bill ratio was above one for the third quarter

Deventer, 15th October 2020 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the third quarter of 2020. The total income for the quarter was EUR 3.0 million, which is in line with the total income for the third quarter of 2019. COVID-19 is still impacting the business of RoodMicrotec, but the short-term demand from our customers is back to the level of last year. The leading indicator, the book-to-bill ratio, was above one for the third quarter after a drop in the second quarter. For the first 9 months of 2020, the total book-to-bill ratio is above one.

“We are continuing our tight control of operational expenses and are pleased to see that the cash position at the end of the third quarter is maintained at a good level," says Martin Sallenhag, CEO of RoodMicrotec. “These measures along with the level of total income have generated a quarter with break-even net result which is very encouraging.”

RoodMicrotec is maintaining a very tight control of the personnel expenses through short-time work when appropriate and possible, as well as a temporary salary waiver of the management. All operational expenses are reviewed in detail and only absolutely necessary costs for delivering our high-quality services to the customers are approved. There is still sufficient capacity within the operational departments, so no additional capital investments are necessary.

Outlook:
At this stage, it is still not possible to forecast either the duration of the COVID-19 disruption or the impact of the currently increasing number of new COVID-19 infections in Europe. If there are no further lock-downs, RoodMicrotec expects to generate a total income in the range of EUR 3.2 million to EUR 3.6 million in the fourth quarter of 2020, thus offsetting the temporary drop in total income compared to 2019. The second-half of the year is then expected to generate a positive net result.
 
About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions, the English version shall prevail.

• Read more about Trading Update: RoodMicrotec announces total income for the third quarter of 2020

• Read more about SEMI is More: Learn How Our Market Data Enables Customers to Make Confident Business Decisions

TAIPEI, Taiwan – October 13, 2020 – Energy Taiwan today hosts a pre-show press conference with government and industry opinion leaders sharing the latest perspectives on domestic policies, energy industry trends, corporate energy consumption, and domestic green energy transformation goals and opportunities. The largest renewable energy event in Taiwan, Energy Taiwan connects the global green energy supply chain for three days of technology demonstrations, theme forums, business networking, and expert insights into the latest technologies and business opportunities in PV, wind energy, hydrogen energy, smart energy storage, and green finance and insurance.

Hosted by SEMI and the Taiwan External Trade Development Council (TAITRA), Energy Taiwan is expected to draw more than 10,000 visitors from Taiwan and abroad to the Taipei Nangang Exhibition Center, Hall I (TaiNEX 1), October 14-16, 2020.

Today’s press conference features insights on Taiwan’s renewable energy development, promoting renewable energy in Taiwan, environmental sustainability, revitalization of the domestic economy and other topics addressing how Taiwan can establish its green energy competitive edge and become the Asia-Pacific green energy center. Speakers at the press conference include:

• Ms. Leonor F. M. Lin, President and CEO, TAITRA
• Mr. Terry Tsao, Global Chief Marketing Officer & President of Taiwan, SEMI
• Mr. Wen-Sheng Tseng, Vice Minister, Ministry of Economic Affairs, R.O.C.
• Dr. Wen-Whe Pan, CEO, United Renewable Energy Co., Ltd.
• Ms. Christy Wang, General Manager of Ørsted in Taiwan

Energy Taiwan Theme Forums

Energy Taiwan features 15 theme forums on renewable energy to promote industry dialogue and business matching opportunities. The forums include the following:  

• PV Executive Summit
• PV Technology Symposium
• Global Renewable Energy Supply Chain Summit
• International Forum on Offshore Wind Talent Training and Underwater Technology Trends
• Smart Energy Storage and System Integration Forum
• Offshore Wind Industry Summit
• Hydrogen Energy Industry Trend Forum

Industry Powerhouses to Showcase Latest Green Energy Technologies

• PV – AUO, Motech, TSEC, URE, Win Win Precision Technology and YSOLAR
• Wind energy – Copenhagen Infrastructure Partners (CIP), EnBW Asia Pacific, Hai Long Offshore Wind Farm Project, Formosa 3 (Haiding) Offshore Wind Farm Project, Ørsted, RWE, Swancor and WPD
• Energy Storage Products – Billion Watts, Mobiletron, Samsung, Siemens, Sysgration and Yulon Motor

“We have seen impressive growth in the renewable energy industry in Taiwan the past four years,” said Wen-Sheng Tseng, Vice Minister, Ministry of Economic Affairs, R.O.C., emphasizing the government’s determination to develop renewable energy. “To echo the goal of promoting renewable energy highlighted by President Tsai Ing-wen in her second-term inaugural speech this year, the government, the industry, and the private sector need to work together to seek a consensus and strive to reach the milestone of green energy sources in electricity generation share by 20% in 2025. Looking to the future, the government will try to do its best to create diverse green energy applications, build industry clusters, develop a comprehensive green power system, and attract more international talent to help Taiwan transform into a smart green energy technology island.”

“According to the latest survey of PV Policy Position Paper from the SEMI PV Public Advocacy Committee, nearly 75% of the people support the energy transition, 2.5% higher than last year, while up to 80% of the people hope to see acceleration of the development of the PV industry,” said Terry Tsao, Global Chief Marketing Officer and President of SEMI Taiwan. “SEMI has long been committed to fostering communication between the government and the industry and has been deeply involved in the PV industry for 14 years through exhibitions, forums, policy advocacy and various business matching events. Last year, we joined hands with eight offshore wind energy developers to launch the Taiwan Offshore Wind Industry Association (TOWIA) that vows to promote sound development of the energy industry and assist Taiwan’s renewable energy industry to reach the next level.”

“We see a lot of growth momentum for renewable energy due to policy support and rising
domestic demand,” said Leonor F. M. Lin, President and CEO of TAITRA. “Taiwan's goal is to raise its offshore wind energy capacity to 5.7 GW by 2025. Investments up to NT$1 trillion (US$34.8 billion) as well as 20,000 new jobs are expected. Energy Taiwan 2020 is joined by top players in PV, wind energy, and energy storage from home and abroad. Through technology exchanges with international counterparts and immersion in the latest Internet of Things (IoT) and artificial intelligence (AI) related application technologies, we believe the industry can find a way to maintain its flexibility while adjusting to the rapidly changing energy world, and create more comprehensive renewable energy solutions.”

“PV is an important alternative source of energy that Taiwan government has been promoting to reach its goal of becoming a less coal-use and nuclear free country,” said Dr. Wen-Whe Pan, CEO, United Renewable Energy Co., Ltd. “However, policy inconsistency and implementation gaps of different government agencies and the pushback from environmental groups make it difficult to acquire the lands needed, and the consequences of failing to carry out the green energy policy will be shared by the government, developers and environment groups. To make abolition of nuclear energy and reduction of coal power possible, all stakeholders from different sectors of society must work together. Moving forward, the government must take the lead in solving issues concerning land acquisition and distribution feeders. Only by doing so is there a chance for us to achieve 20GW of PV installations by 2025 and accomplish the energy transition goal in Taiwan.”

“As one of the global leaders in offshore wind energy, Ørsted really appreciates the opportunity to be working with Taiwan to make our shared green energy vision possible, and to facilitate sustainable development of Taiwan's offshore wind energy industry,” said Christy Wang, General Manager of Ørsted in Taiwan. “We started to proactively invest in wind energy in Taiwan in 2016 and committed to supporting the development of the local supply chain and nurturing and hiring local talent. Our Asia-Pacific team has grown from only two members to 140! It is vital for Taiwan to maintain its growth momentum and launch the next stage of bidding as early as possible next year to secure its leading position in the Asia-Pacific market and ensure that key industrial resources such as regional talent and shipping and supplier capacity are in place. More importantly, local suppliers should be given sufficient time for preparation. Only by doing so can Taiwan sustain its competitive edge in Asia-Pacific. Ørsted will continue to deepen its relationship with the local community and work with the industry, government and academia partners to turn the green energy vision into reality.”

Most foreign buyers are unable to visit to Taiwan due to travel restrictions stemming from the pandemic. To overcome that challenge, Energy Taiwan offers a variety of virtual platforms to ensure continued exchanges between exhibitors and international buyers. Online trade meetings will include buyers from Spain, Poland, Romania, Bulgaria, the United Arab Emirates (UAE) and Singapore. International buyers plan to work with Taiwanese companies to develop more energy products during the post-COVID-19 pandemic era. In addition, a live tour will guide international buyers through the show in English, exploring the latest services and solutions at Energy Taiwan 2020.

Renewable Energy Week, organized by the Bureau of Energy, Ministry of Economic Affairs, R.O.C. is co-located with Energy Taiwan this year.

For more information about Energy Taiwan, please visit the event website.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts
Jo-ann Su
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 202

Connie Lin
SEMI Taiwan
Email: [email protected]
Phone: 886.3.560.1777 ext. 211

• Read more about Energy Taiwan 2020 Opens Tomorrow with Leading-Edge Smart Green Energy Technologies in the Spotlight

MILPITAS, Calif. ─ October 13, 2020 ─ Global silicon wafer shipments are set to increase 2.4% year-over-year in 2020, with growth continuing in 2021 and shipments reaching a record high in 2022, SEMI reported today in its annual silicon shipment forecast for the semiconductor industry.

“Silicon wafer shipments are recovering this year despite pressure from geopolitical tensions, the shifting global semiconductor supply chain and the COVID-19 pandemic," said Clark Tseng, director of Industry Research and Statistics at SEMI. “With the pandemic accelerating digitization to transform businesses and their delivery of services worldwide, we expect continued growth over the next two years.”

2020 Silicon* Shipment Forecast (MSI = Millions of Square Inches)

*Total Electronic Grade Silicon Slices – Excludes Non-Polished Wafers
*Shipments are for semiconductor applications only and do not include solar applications
Source: SEMI (www.semi.org), September 2020

Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or chips are fabricated.

All data cited in this release includes polished silicon wafers such as virgin test wafers and epitaxial silicon wafers shipped by the wafer manufacturers to the end-users but not non-polished or reclaimed wafers.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports

ESPOO, Finland, 6th October 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, strengthens its position in power electronics market with several cluster ALD system sales to prominent manufacturers in Europe, USA and Asia.

“Power electronics is an important, fast growing market for Picosun. ALD has potential to solve various challenges manufacturers are facing in this field, and our solutions have enabled our customers to create significant added value in terms of device quality and throughput. At Picosun, we have developed several turn-key production ALD solutions specifically for 4-8 inch wafer markets such as power devices. Especially our cluster ALD systems, such as the PICOSUN® Morpher which we launched last year, have been extremely well received by our customers,” says Juhana Kostamo, Head of Customer Solutions/Deputy CEO of Picosun.

Power components are crucial in a wide range of applications from consumer electronics to transportation, energy production and distribution, including renewables such as wind and solar power generation. These components are typically manufactured on 4-8 inch compound semiconductor wafers such as GaN and SiC. These materials provide various benefits compared to pure silicon, for example higher electron mobility, higher threshold voltage, and ability to operate at higher temperatures. Challenges do exist, however, as GaN and SiC power devices are prone to high interface trap density (leading to parasitic currents and reduced electron mobility) and gate leakage current, and poor threshold voltage stability.

Interface trap density can be reduced by combining pre-cleaning methods with high permittivity, large bandgap insulators. High quality, defect-free high-k dielectric layers such as Al2O3, AlN or ZrO2 etc. are key in reducing power devices’ gate leakage current and to improve electron mobility and threshold voltage stability. A good example here are GaN-based HEMTs (high electron mobility transistors), which are important in various large scale practical applications, and which require efficient gate insulation and surface passivation to achieve optimal functionality.

ALD stands as a superior deposition method here compared to other thin film coating technologies such as PECVD, as ALD produces the most conformal, uniform, and defect-free films with accurate, digitally repeatable thickness control and sharp interfaces. With the right selection of ALD deposition equipment, even multilayer processing is possible i.e. various functional material layers and/or stacked films/nanolaminates can be manufactured in one process run.

PICOSUN® Morpher is a disruptive ALD production platform designed for up to 8 inch wafer industries such as power electronics, MEMS, sensors, LEDs, lasers, optics, and 5G components. Morpher’s operational agility makes the system adaptable to various and changing manufacturing needs, on all business verticals from corporate internal R&D to production and foundry manufacturing, where both the end products and/or customers’ requirements may change rapidly. Morpher can handle several substrate materials, batch and substrate sizes, and ALD materials with leading process quality. Multilayer deposition is possible, and cluster design allows integration of also other processing units such as pre-clean, RIE etc. for fully automated, high throughput continuous vacuum operation.

“In its versatility and transformability, Morpher is the epitome of our principle ‘Agile ALD’. Innovation, constant development and improvement of our ALD solutions to enable our customers’ success is our driving force at Picosun. This applies also to Morpher platform and we have some truly exciting additions to this product family coming in the near future,” summarizes Kostamo.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Juhana Kostamo
Head of Customer Solutions/Deputy CEO, Picosun Group
Tel: +358 50 3699 565
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun’s cluster ALD solutions enable next generation power electronics

MILPITAS, Calif. — October 6, 2020 — Aiming to accelerate the adoption of smart manufacturing across the worldwide microelectronics supply chain, the first SEMI Global Smart Manufacturing Conference will gather Industry 4.0 experts October 20-23 to share best known methods (BKMs) for improving data capture and analysis in microelectronics manufacturing. Registration for the virtual conference featuring keynotes, case studies and tutorials is open.

Smart manufacturing practices could increase productivity by as much as 12% through line efficiency gains, quality improvements, and reductions in energy and direct labor costs, according to Deloitte. Industry 4.0 is also a significant driver of IC devices, accounting for $49 billion in sales in 2020, according to Gartner.

Smart manufacturing is the science of digitizing manufacturing data to maximize microelectronics yield and production efficiencies while increasing return on investment in equipment, processes and people. Members of the SEMI SMART Manufacturing initiative collaborate to drive advances and a higher return on investment faster.

The SEMI Global Smart Manufacturing Conference will feature six sessions on three topics – sensing, connecting and predicting – and experts from companies including BisTEL, Bosch, Broadcom, Deloitte, Doople, Micron, Schneider Electric, Texas Instruments, TDK and Yamaha. With two live sessions each day, the virtual conference will be easy to access during working hours in the major microelectronics manufacturing regions.

“There is a growing need across the world for more insights on effective smart manufacturing strategies and tools that lead to high ROI,” said Dr. Bobby Mitra, IEEE Fellow, worldwide director of Smart Manufacturing at Texas Instruments, and chair of the SEMI Smart Manufacturing Americas Chapter. “The first SEMI Global Smart Manufacturing Conference will bring together global experts with real-world experience who will outline the critical concepts in each smart manufacturing domain with best practices and returns.”

“The microelectronics industry’s urgency to drive greater manufacturing efficiencies has never been greater as foundational production technologies remain key enablers of advances in artificial intelligence (AI), 5G, machine learning and other smart technologies that promise to help the world overcome some of its greatest challenges including the current COVID-19 pandemic,” said Tom Salmon, vice president of Collaborative Technology Platforms and lead of the Smart Manufacturing Initiative at SEMI. “With the sharp reductions in worldwide air travel, SEMI is taking the lead with a virtual conference that will connect microelectronics manufacturing customers with solution providers via a new AI engine to provide a novel method of information sharing and networking that could be more effective than a face-to-face event.”

The global SEMI Smart Manufacturing Technology Community, which includes Smart Manufacturing committees in the Americas, China, Europe, Japan, Korea, Southeast Asia and Taiwan, identified the industry experts who will present as speakers and instructors at the conference.  

The SEMI Global Smart Manufacturing Conference programs committee consists of representatives from Applied Materials, Arizona State University, Inficon/FPS, IBM, Lam Research, Veracity Protocol, Rockwell Automation, Sapphire Automation, TEL, and Texas Instruments.

SEMI launched its Smart Manufacturing Initiative in 2016 to explore strategies and share best implementation practices among its members while meeting the needs of SEMI International Standards committees for data sharing.

For more information on the SEMI Global Smart Manufacturing Conference, please visit its website.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Virtual Conference Aims to Speed Smart Manufacturing Adoption Across Global Microelectronics Supply Chain

Industry Reports 12.6% Revenue Growth Overall; Most Categories Log Double-Digit Increases

MILPITAS, Calif. — October 5, 2020 — Electronic Design Automation (EDA) industry revenue increased 12.6% in Q2 2020 to $2,783.9 million, compared to $2,472.1 million in Q2 2019, with most categories logging double-digit increases, the Electronic System Design (ESD) Alliance Market Statistics Service (MSS) announced today. The four-quarter moving average, which compares the most recent four quarters to the prior four quarters, increased by 6.7%. The ESD Alliance is a SEMI Technology Community.

“The EDA industry reported a double-digit revenue increase for Q2 2020, compared to Q2 2019,” said Walden C. Rhines, Executive Sponsor, SEMI EDA Market Statistics Service. “Individually, Computer Aided Engineering (CAE), IC Physical Design and Verification, and Semiconductor IP (SIP) reported double-digit increases in Q2. Further, all geographic regions reported revenue increases.”

The companies tracked in the MSS report employed 46,579 people in Q2 2020, a 5% increase over the Q2 2019 headcount of 44,372 and up 1.4% compared to Q1 2020.

The quarterly MSS report containing detailed revenue information with category and geographic breakdowns is available to ESD Alliance members.

Revenue by Product Category in Q2 2020

• CAE revenue increased 16.1% to $922 million compared to Q2 2019. The four-quarter CAE moving average increased 7.1%.
• IC Physical Design and Verification revenue increased 16.8% to $584.1 million compared to Q2 2019. The four-quarter moving average for the category rose 4.8%.
• Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue decreased 0.3% to $243.5 million compared to Q2 2019. The four-quarter moving average for PCB and MCM increased 12.4%.
• SIP revenue increased 13.6% to $948.2 million compared to Q2 2019. The four-quarter SIP moving average grew 8.5%.
• Services revenue decreased 12.8% to $86.2 million compared to Q2 2019. The four-quarter Services moving average decreased 14.3%.

Revenue by Region in Q2 2020

• The Americas, the largest reporting region by revenue, purchased $1,155.6 million of EDA products and services in Q2 2020, an 11.4% increase compared to Q2 2019. The four-quarter moving average for the Americas increased 4.6%.
• Europe, the Middle East, and Africa (EMEA) revenue increased 5.2%, to $377.5 million compared to Q2 2019. The four-quarter moving average for EMEA grew 12.2%.
• Japan revenue increased 9% to $240.4 million compared to Q2 2019.
• APAC revenue increased 18.1% to $1,010.3 million compared to Q2 2019. The four-quarter moving average for APAC increased 6.3%.

About the MSS Report
The ESD Alliance Market Statistics Service reports EDA, IP and services industry revenue data quarterly and is available to Alliance members. Both public and private companies contribute data to the report. Each quarterly report is published approximately three months after quarter close. MSS report data is segmented as follows:

• Revenue type (product licenses and maintenance, services, and SIP)
• Application (CAE, PCB/MCM Layout, and IC Physical Design & Verification)
• Region (the Americas, Europe Middle East and Africa, Japan, and Asia Pacific)

In addition, the report provides many subcategories of detail and lists total employment of the tracked companies.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts
Paul Cohen
ESD Alliance
A SEMI Strategic Technology Community
978-769-2106

Jack Taylor
Mentor, a Siemens Business
512-560-7143

• Read more about ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q2 2020