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United States Understanding Semiconductor Technology and Business (Asia)
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Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

Singapore

- SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing
  • Members: $645
  • Non-Members: $745

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

9:00 am - 1:00 pm Off Add to Calendar 2025-03-10 09:00:00 2025-03-11 13:00:00 Understanding Semiconductor Technology and Business (Virtual Training, Asia) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $645Non-Members: $745* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Sold Out
Event format
United States Overview of Semiconductor 4/21 Training
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Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and ecosystem of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing:
    • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
    • Etching and Cleaning Processes: Plasma and wet etching processes
    • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
    • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
    • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
    • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
    • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Dates and Times

April 21 7:30 - 3:00 PT

April 22 7:30 - 1:30 PT

Pricing

Early Bird Special! $100 off

  • Members: $995 $895
  • Non-Members: $1,095 $995

 * Group pricing for up to 20+ attendees: $12,900
Any questions, please contact [email protected]

7:30 am - 3:00 pm Off Add to Calendar 2026-04-21 07:30:00 2026-04-22 15:00:00 Overview of Semiconductor Manufacturing (Americas) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.Dates and TimesApril 21 7:30 - 3:00 PTApril 22 7:30 - 1:30 PTPricingEarly Bird Special! $100 offMembers: $995 $895Non-Members: $1,095 $995 * Group pricing for up to 20+ attendees: $12,900Any questions, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
Event format
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Off
United States Laser Annealing Graphic Featured Speakers
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Laser Annealing: Revolutionizing Sensor and Semiconductor Manufacturing

 

3D-Micromac, a leader in high-precision laser-based semiconductor processing and micromachining, has consistently adapted to meet evolving market demands. As the need for greater precision and efficiency in semiconductor and sensor technology grows, traditional production methods began to show their limitations. To address these challenges, 3D-Micromac has applied its laser technology expertise to develop selective laser annealing, offering innovative solutions that enhance both production quality and efficiency while also enabling the creation of entirely new products.

Laser annealing offers a transformative alternative to conventional annealing methods, particularly in the production of Giant Magnetoresistance (GMR) and Tunneling Magnetoresistance (TMR) sensors. Traditional techniques, such as large magnetic annealing furnaces, significantly limit the throughput for complex sensor designs and increase production costs. The furnace approach also introduces potential yield losses due to its inherent processing complexity.

In contrast, selective laser annealing enables heating only illuminated wafer areas and not the entire wafer to provide extremely precise process control and enable closer placement of sensors to logic elements, laying the foundation for an integrated, monolithic sensor design (Fig. 1). This laser-based sensor programming enables a one-step process, eliminating the need for additional production steps such as dicing or chip transfer, which results in higher throughput and reduced costs.

Another semiconductor processing application that benefits from laser annealing is ohmic contact formation, which is a critical and challenging step in manufacturing silicon carbide (SiC)-based power devices. Traditionally, rapid thermal processing (RTP) has been used to generate well-controlled silicide interfaces because of its small thermal budget, but even RTP limitations become evident as SiC devices become thinner. Pulsed laser sources offer extremely small thermal budgets which enable ohmic contact formation on thinned SiC substrates resulting in superior device performance.

Both of these applications have already been successfully implemented in industrial machining solutions by 3D-Micromac. This webinar will provide in-depth insights into the processes and results (Fig. 2), while also exploring potential new applications of selective laser annealing. This innovative approach enhances device quality and streamlines manufacturing, marking a significant shift towards more efficient and cost-effective production methods in the sensor and semiconductor industries.

 

Fig. 1. Comparison traditional approach vs. selective laser annealing approach in magnetic sensor annealing

 

Fig. 2. Result of backside annealing for ohmic contact formation: SEM of NixSiy interface showing outstanding homogeneity

 

 

 

FEATURED SPEAKER

 

Maurice Clair | Team Lead Technology & Innovation Management

Maurice Clair

Maurice Clair studied Mechanical Engineering at the University of Technology Chemnitz (Germany). He joined 3D-Micromac in 2005 as a development engineer and is now team leader of the technology and innovation management department. In his current role, he serves as the technical lead for ohmic contact formation on SiC (silicon carbide) materials, a critical area in advancing semiconductor technologies.

Through his expertise in laser technologies, he has been instrumental in the development of innovative laser micromachining processes, including: laser trimming techniques for fine-tuning electronic components with both digital and analogue approaches and beam shaping for ultra-short pulsed lasers.

 

 

 

 

United States

MSIG Off Add to Calendar 2024-12-04 00:00:00 2024-12-04 00:00:00 Laser Annealing: Revolutionizing Sensor and Semiconductor Manufacturing United States SEMI.org [email protected] America/Los_Angeles public Register
Event format
United States Plasma Etching, ALE, & Rie
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Course Description

The instructor discusses the applied aspects of plasma-assisted etching from a general point of view. The emphasis is on mechanistic understanding. The etching of Si and its compounds is covered in detail. The chemistries used in the etching of other technology-related materials such as Al, organics, and III-V compounds are summarized. Other topics presented include selectivity, loading, ARDE and feature scale problems, damage, and issues associated with high-density plasma RIE. A section on plasma diagnostics and ion-beam based etching methods is briefly discussed. 

Learning Objectives

  • Understand the fundamentals of dry etching and the basic concepts of plasma etching
  • Understand the physics of rf glow discharges (both high and low density)
  • Understand the surface science aspects of RIE including the role of energetic ions
  • Recognize the factors which influence etching anisotropy
  • Define the steps of plasma-surface chemistry leading to etching

Topics Covered

  • Fluorocarbon plasma etching of Si and its compounds
  • Selectivity, loading effects, and aspect ratio dependent etching
  • Uniformity of etching, damage, feature charging issues, and particles
  • Etching of other materials (Al, organics, III-V compounds, etc)
  • Plasma diagnostics such as optical emission spectroscopy with actinometry, mass spectrometry and laser-induced fluorescence
  • Issues in high density plasma etching, wall effects, and ion beam-based methods
  • Deep Reactive Ion Etching (DRIE)
  • Applications and processing etching using ALE
  • End point detection

Who Should Attend

This course is intended for scientists, technicians and others working with or interested in the dry etching of materials in reactive gas glow discharges, particularly those who do not have extensive experience in the field. 

Instructor

Richard Beaudry

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

- SEMI U

This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. 

Pricing
  • Members: $845
  • Non-Members: $945

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:00 am - 12:00 pm Off Add to Calendar 2025-02-04 08:00:00 2025-02-05 12:00:00 Plasma Etching, ALE, & RIE (Virtual Training, US & EU) This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. PricingMembers: $845Non-Members: $945* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Closed
Event format

Registration

For questions or inquiries, please contact: 

Elle Liang

[email protected]

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Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam 360x317_Event_Calendar_Ad_DAI_Analyzing AI_Driven_v1@2x Business Executive
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The wide adoption of Artificial Intelligence is profoundly impacting many industries, perhaps none more so than the semiconductor industry. Beyond serving as a growth driver for chips across a diverse range of applications, AI and semiconductors are beginning a virtuous cycle where AI is helping to design more powerful chips that in turn enable more advanced AI. The semiconductor industry’s path to $1 trillion in annual revenue by the end of the decade is promising, thanks in large part to AI, but what will that journey actually look like?

This webinar will examine the industry’s AI-driven growth opportunities in depth, while looking at the technological innovation needed to fuel the market expansion. Dr. Handel Jones, CEO of IBS, and author of When AI Rules the World, will share his analysis of how AI will shape the outlook for semiconductor end-markets and segments – along with the race to achieve 1.0nm technology nodes and accelerate the virtuous AI-semiconductor development cycle. He will also cover the future of semiconductor market growth in the AI era as well as areas of opportunities.

About IBS

United States

10:00 am - 10:05 am
Ajit Manocha, SEMI
Ajit Manocha
CEO
SEMI

Welcome Remarks

10:05 am - 10:10 am
Pushkar Apte
Pushkar Apte
Strategic Technology Advisor, Smart Data-AI
SEMI

SEMI Smart Data-AI Initiative and Future of Computing Update

10:10 am - 11:00 am
Handel Jones
Dr. Handel Jones
CEO
IBS

Why AI Will Propel the Semiconductor Market to $1 Trillion and Achieve 1.0nm by 2030

11:00 am - 11:15 am

Q&A

Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments.

10:00 am - 11:15 am Off Add to Calendar 2024-11-20 10:00:00 2024-11-20 11:15:00 Analyzing AI-Driven Growth: $1T and Beyond Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On-demand
Event format
Adv. Packaging and Material Characterizations for Microelectronics
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Course Description 

The principles of Microelectronics packaging range from Electronics, Mechanical, and Material to Chemical Engineering. Due to this multi-discipline nature, many industry professionals don’t know what they don’t know as they do not undergo multi-discipline training to understand these principles. This course provides the necessary technical knowledge for industry professionals. 

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Directors
  • Managers
  • Process Engineers
  • R&D Engineers
  • Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

  • Understand the principles in the evolution of IC packaging and how the semiconductor industry has evolved with time.
  • Understand the principles of Interconnections ranging from TAB, and Wirebond to various Flip Chip bonding, such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development.
  • Review the interposer of leadframe, ceramic, flex to BT substrates for Microelectronics packaging.
  • Explain the assembly flow and new assembly techniques from backgrinding to singulation.
  • Describe the material characterization from bulk to interfaces to reduce stress and enhance interfacial adhesion for reliability enhancement.

Course Topics

  • Advanced packaging and material characterization.
  • Packaging principles and how packaging evolves into heterogeneous packaging.
  • Packaging concepts such as Fan-in, Fan-out WLP, Embedded packaging technology, 3D packaging, TSV.
  • Wirebond and Flip chip interconnect technologies inclusive of interposer technologies, such as leadframe, ceramic, flex and substrate.
  • Assembly processes from backgrinding to singulation for QFP and FBGA packages.
  • Material characterization to select materials to reduce stress and strengthen the interface for reliability enhancement.

Instructor

Dr. Lee Teck Kheng

Institue of Technical Education

Instructor Bio

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

Singapore

- SEMI U

Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 of this course focuses on the design in electrical and thermal which are used to enhance the electrical, thermal, and reliability performance of the package. 

Pricing
  • Members: $599
  • Non-Members: $649

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

2:00 pm - 6:00 pm Off Add to Calendar 2025-02-24 14:00:00 2025-02-25 18:00:00 Advanced Packaging and Material Characterization for Microelectronics (Virtual Training, Asia & EU) Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 of this course focuses on the design in electrical and thermal which are used to enhance the electrical, thermal, and reliability performance of the package. PricingMembers: $599Non-Members: $649* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] Singapore SEMI.org [email protected] America/Los_Angeles public Closed
Event format
United States Understanding Semiconductor Technology and Business
Highlighted content

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

United States

- SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing
  • Members: $845
  • Non-Members: $945

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:00 am - 12:00 pm Off Add to Calendar 2025-02-10 08:00:00 2025-02-11 12:00:00 Understanding Semiconductor Technology and Business (Virtual Training, US & EU) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $845Non-Members: $945* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Closed
Event format
United States Overview of Semiconductor Manufacturing
Highlighted content

Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing:
    • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
    • Etching and Cleaning Processes: Plasma and wet etching processes
    • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
    • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
    • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
    • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
    • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Pricing
  • Members: $995
  • Non-Members: $1,095

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:00 am - 12:00 pm Off Add to Calendar 2025-01-27 08:00:00 2025-01-29 12:00:00 Overview of Semiconductor Manufacturing (Virtual Training, US & EU) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingMembers: $995Non-Members: $1,095* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Closed
Event format
Belgium France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Register Now (8-9am PT) Register Now (5-6pm PT) [email protected] Business Executive Featured Speakers
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In today’s fast-paced and interconnected world, the electronics industry faces unprecedented challenges from global disruptions, geopolitical uncertainties, and supply chain vulnerabilities. To remain competitive and resilient, organizations must adopt robust risk management frameworks that proactively identify and mitigate risks.


This webinar is brought to you by the Resiliency Working Group, part of the SEMI Supply Chain Management Initiative. We will explore the creation and implementation of an industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Attendees will learn how to assess potential risks, develop mitigation strategies, and leverage cutting-edge tools to improve visibility and responsiveness across their supply networks.

Key topics include:


•     The critical risks impacting electronics supply chains and how to address them.
•     Best practices for building a resilient and adaptable risk management framework.
•     Strategies for real-time risk monitoring, supplier risk assessments, and scenario planning.
•     How to align your supply chain with industry standards for business continuity and operational stability.

Who should attend:


•    Supply chain managers
•    Risk officers
•    Operations executives
•    Anyone involved in supply chain planning and resilience in the electronics sector

Join us to discover actionable insights and practical approaches to future-proof your electronics supply chain, ensuring it remains resilient, efficient, and prepared for any disruption.
 

Speaker bio:

Austin Evans is the Director of Supply Chain Risk Management at Intel.  He is responsible for overseeing risk management for Intel’s supply chain as well as Intel’s Contingent Workforce Program Office.  His organization is responsible for business continuity, governance, resilience, supply chain security and compliance. 

United States

Austin Evans.jpg
Austin Evans
Director of Supply Chain Risk Management
Intel
Standards

Join us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring.

Off Add to Calendar 2024-10-24 00:00:00 2024-10-24 00:00:00 Building Resilient Supply Chains Join us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

REGISTRATION

PRICING

  • Member: $49
  • Non-Member: $99

STUDENTS

  • Must have a valid Student ID.
  • Contact Michelle Fabiano, [email protected]
    for a student registration code.
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SEMI SustainabilityBuilding a Sustainable $1T Industry 

Join us for an insightful exploration of the semiconductor industry's pivotal role in advancing sustainability, including emissions, water, waste, climate equity and achieve net zero emissions. This forum will bring together leading experts, industry pioneers, and sustainability advocates to across the electronic supply chain to discuss innovative strategies, emerging technologies, and collaborative efforts driving the semiconductor sector toward a greener future.

Topics Include—

  • Industry Perspectives—Hear from top executives and/or leaders about the current state of sustainability in the semiconductor industry and the challenges and opportunities they face on the journey to net zero.
  • Innovative Technologies—Discover cutting-edge technologies and practices that reshape how semiconductor companies approach climate equity, energy efficiency, waste reduction, and resource management.
  • Case Studies—Learn from real-world examples of successful sustainability initiatives within the semiconductor sector and how these practices can be adapted across the industry.
  • Collaborative Solutions—Engage in discussions on how various stakeholders can collaborate to drive meaningful change and achieve collective sustainability goals.
  • Future Outlook—Gain insights into future trends and strategies that will influence the semiconductor industry's path to net zero, including regulatory developments and advancements in green technologies.

Whether you are a semiconductor industry professional, a sustainability enthusiast, or someone interested in the intersection of technology and environmental stewardship, this event promises valuable takeaways and actionable knowledge.

Participate in a U.S. Time Zone:

  • Pacific: 9am–10:45am
  • Mountain: 10am–11:45am
  • Central: 11am–12:45pm
  • Eastern: 12pm–1:45pm

Register now to be part of this important conversation and contribute to shaping a sustainable future for the semiconductor industry!
 

United States

WEDNESDAY, NOVEMBER 13

9:00 am - 9:05 am

Welcome & Opening Remarks​

9:05 am - 9:25 am

SEMI Members Leading the Way to Sustainability

9:25 am - 9:40 am
Sebastian Goke, McKinsey & Company
Sebastian Göke, PhD
Associate Partner
McKinsey & Company

Decarbonizing Scope 3 Upstream Emissions

9:40 am - 9:55 am

Achieving Sustainability in a Diversified Supply Chain Network

9:55 am - 10:10 am

Striving Toward Sustainability and the First Steps Along the Path to Net Zero

10:10 am - 10:25 am
Kara Sherman, KLA
Kara Sherman
Director, Semi PC and ESG Product Lead
KLA

The Power of Innovation

10:25 am - 10:40 am

Building the Path to Sustainability

10:40 am - 10:45 am

Closing Remarks

Workforce Development

The SEMI Arizona & Texas Chapters Present
SEMI SustainabilityBuilding a Sustainable $1T Industry

9:00 am - 10:45 am Off Add to Calendar Disabled America/Los_Angeles 2
Event format