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Breker Verification Systems and Moores Lab AI Partner to Create First AI-Driven SoC Verification Solution
• Test Suite Synthesis, agentic AI integration will enable automated specification test generation across range of SoC designs on varied verification platforms
• AI-driven synthesis verification flow prototype to be demonstrated during DVCon U.S. in March
• Joint Breker, Moores Lab AI reception at DVCon U.S. Monday evening followed by AI in verification panel
SAN JOSE, CALIF.––February 26, 2026––Breker Verification Systems and Moores Lab AI today formalized a partnership to create the first AI-driven SoC verification flow integrating Breker’s Trek Test Suite Synthesis with Moores Lab agentic AI technology.

The solution leverages Breker’s vast experience in test generation for complex system design scenarios with the agentic AI VerifAgent™ product from Moores Lab AI. It seamlessly enables automated multicore, multitool, C or transaction level modeling (TLM) test generation for complex SoC scenarios from manually composed specifications.

The flow uses agentic AI to read a specification and generate appropriate scenario models for test synthesis that will produce combined C and SystemVerilog tests that can be run on simulation and emulation platforms targeting high-coverage SoC scenarios.

A prototype of the AI-driven verification flow will be demonstrated in Breker’s Booth (#203) and the Moores Lab AI Booth (#101) during DVCon U.S. March 2 through March 4 at the Hyatt Regency in Santa Clara.

“SoC verification requires highly complex scenario tests that find unpredictable corner cases across advanced, multi-core architectures,” says David Kelf, CEO of Breker Verification Systems. “The Moores Lab AI VerifAgent technology is an excellent complement to our proven Trek synthesis products that leverages our deep verification experience to drive the first AI SoC verification solution.”

“Breker has long been a pioneer in portable stimulus and system-level verification innovation,” notes Shelly Henry, CEO of Moores Lab AI. “Integrating VerifAgent with the Breker solutions creates a powerful synergy that enables engineering teams to verify increasingly complex silicon much faster and with greater confidence. We’re excited to partner with Breker to bring AI-driven transformation to SoC-level verification workflows.”

Combining Test Suite Synthesis with Agentic AI
Test Suite Synthesis generates high coverage tests efficiently for complex SoC-specific scenarios using various verification approaches, while agentic AI can accelerate the understanding of specifications to automatically derive verification plans and scenario models.

Combining the two can drive an automated verification solution that enables test generation for complex SoC scenarios from a manually composed specification that may be applied across a broad range of designs on varied verification platforms.

Availability
The AI-driven verification flow will be developed throughout 2026.

For more information, visit: http://www.breker.com or [email protected], or www.mooreslab.ai or [email protected].

Breker and Moores Lab AI at DVCon U.S.
In addition to the AI-driven verification flow prototype, Breker will exhibit and demonstrate its RISC-V CoreAssurance and SoCReady SystemVIP and Trek Test Suite Synthesis solutions at DVCon U.S. To arrange a demonstration or private meeting, send email to [email protected].

Moores Lab AI will showcase the VerifAgent product and discuss its product roadmap for agentic AI-driven silicon engineering at DVCon U.S. Email [email protected] to schedule an on-site meeting.

On Monday, March 2, Breker and Moores Lab AI will host an evening reception at DVCon in the Hyatt Regency Hotel Cypress room beginning at 6:30 p.m. and followed by a panel discussion on AI-driven SoC verification.

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: https://www.brekersystems.com/
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
X: @BrekerSystems

About Moores Lab AI
Moores Lab AI is building the next generation of AI tools for semiconductor design and verification. Its agentic AI platform transforms the chip development lifecycle by drastically reducing engineering time and cost, without changing existing flows, tools, or documentation. Moores Lab AI is headquartered in Austin, Texas, and proudly develops its products entirely in the United States.

For more information, visit www.mooreslab.ai or on social media:
LinkedIn: https://www.linkedin.com/company/mooreslabai/
X: @MooresLabAI

China India Japan Malaysia Singapore Taiwan Vietnam Chiplet & Heterogeneous 6/30 Training

Course Description 

This workshop reviews the needs of the packaging solution to meet the demand for digitalization through the artificial intelligent and Internet-of-things from urbanization, sustainability to industry. The course provides an overview of the fabrication process of IC carriers of leadframe, ceramics, substrate and flex and how they have to evolve to meet the heterogeneous integration. With these foundations, various stacking and integration technologies through wirebonding, flip chip and 3D interconnect from interconnect to system level will be shared. Packaging innovation of TSV, fan-in, fan-out wafer level packaging and its challenges will also be shared for chiplet and heterogeneous integration. It ends off by sharing the embedded technologies and embedded multi-die interconnect bridge for chiplet and heterogeneous integration.

The course looks into the R&D development as well as the dynamics changes of heterogeneous integration technologies in the Semiconductor packaging arena. This workshop curates the technologies development to date and provides the necessary information for professionals in the manufacturing and R&D environment to perform their tasks.

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Directors
  • Managers
  • Process Engineers
  • R&D Engineers
  • Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

  • Understand why chiplet and heterogeneous integration for advanced packaging
  • Review of IC carriers
  • Summarize 3D and TSV for Chiplet and Heterogeneous Integration
  • Explain Fan-in and Fan-out wafer-level packaging for chiplet and heterogeneous integration
  • Describe chiplet, embedded, and embedded multi-die interconnect beam for chiplet and glass substrate for heterogenous integration 

Instructor

Dr. Lee Teck Kheng

Institue of Technical Education

Instructor Bio

Testimonials 

See what previous course participants had to say about this training!

  • "All the necessary information are neatly fitted into a few slides prepared by Dr. Lee"
  • "I found the review of the material between sessions and the slides to follow along with to be the most beneficial aspects of the training."
  • "Much thanks to Dr. Lee & SEMI University for giving me a chance to study all my unclear items in the past."

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

Singapore

SEMI U

Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging, Through Silicon Via (TSV), and Fan-out wafer level packaging (Fo-WLP) technologies into a system in the package for applications. Chiplet, EMIB, and glass substrate will also be shared in this course. 

Pricing
  • Members: $599
  • Non-Members: $649

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

8:30 am - 5:00 pm Off Add to Calendar 2026-06-30 08:30:00 2026-06-30 17:00:00 Chiplet and Heterogeneous Integration for Microelectronics Packaging (Asia) Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging, Through Silicon Via (TSV), and Fan-out wafer level packaging (Fo-WLP) technologies into a system in the package for applications. Chiplet, EMIB, and glass substrate will also be shared in this course. PricingMembers: $599Non-Members: $649* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now
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Registration Details

Registration is required for this event as it is likely to reach maximum room capacity, at which point interested attendees will be waitlisted.

SEMI Members:  $150

Non-Members of SEMI:  $200

Refunds possible before May 1, 2026.  Substitutions allowed up to May 20.

Questions? Contact James Amano at [email protected].

Belgium China France Germany India Ireland Italy Japan Singapore South Korea Taiwan United States 2026 EHS Summit Banner Business Executive Technical

The Summit includes strategic business and technical information for many levels and sectors of the ecosystem, including:

  • Government relations/advocacy staff
  • EHS regulatory professionals
  • Senior executives
  • Business development
  • Device manufacturers
  • Equipment suppliers
  • Materials suppliers
  • Component suppliers
  • Fab and facility systems construction companies

SEMI
673 South Milpitas Blvd.
Milpitas, CA 95035
United States

8:30 am

Badge Pickup and Networking

9:00 am
Joe Stockunas
Joe Stockunas
President, SEMI Americas
SEMI

Welcome and Introduction

9:05 am
James Amano
James Amano
Senior Director, EHS
SEMI

SEMI EHS Overview

9:20 am
Russ Lamotte
K. Russell LaMotte
Principal
Beveridge & Diamond, PC

US Regulatory Landscape: PFAS, PIP, TTR, and more

9:50 am
Iranda Chaki
Iranda Chaki
Senior Policy Coordinator
SEMI Europe

Europe: PFAS Restriction, POPs, F-Gas, GENESIS, REACH

10:15 am

Break

10:45 am
Michael Golden
Michael Golden
Director, Navy Programs & Microelectronics Initiatives
Office of the Deputy Assistant Secretary of War for Product Support

US Department of War Perspective on Semiconductor Supply Chain Risks

11:15 am
Patrick Gottsacker
Patrick Gottsacker
Supply Chain Regulatory Compliance Program Manager
Intel

US EPA: TSCA New Substances of Concern

11:45 am

Morning Session Q&A

12:15 pm

Lunch & Networking

1:15 pm
James Amano
James Amano
Senior Director, EHS
SEMI

Review of afternoon agenda

1:20 pm
Andrew Petraszak
Andrew Petraszak
Tokyo Electron
Patrick Gottsacker
Patrick Gottsacker
Intel

PFAS Transparency

1:50 pm
Masahide Yodogawa
Masahide Yodogawa
Director, Technology Co-Creation Promotion Group
AGC, Inc.

PFAS Recycling

2:15 pm
Ben Kallen
Ben Kallen
Sr. Manager, Public Policy & Advocacy
SEMI
Andrew Petraszak
Andrew Petraszak
Tokyo Electron

SEMI Washington DC Update: Federal and State-level Advocacy

2:40 pm

Afternoon Q&A

3:00 pm - 3:30 pm

Networking

EHS Sustainability Standards

Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California at the 2026 SEMI EHS Summit.

Industry experts will present on the regulatory matters that will impact the industry in 2026 and beyond, followed by discussions on taking collective action to strengthen semiconductor manufacturing. 

Topics:

  • US Regulatory Landscape under second Trump Administration
  • US State-level legislation
  • Europe: PFAS restriction, REACH restriction, Packaging and Packaging Waste Regulation, GENESIS Consortium, etc.
  • US Department of War Perspective on Semiconductor Supply Chain Risks
  • Stockholm Convention
  • Emerging regulations in Asia
  • Supply Chain Transparency
  • US EPA Technology Transition Rule (HFC Phasedown)
  • US EPA TSCA New Substances of Concern

Attend, network and strategically prepare your company.  This is an in-person event only.

8:30 am - 3:30 pm Off Add to Calendar 2026-05-28 08:30:00 2026-05-28 15:30:00 2026 EHS Summit Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California at the 2026 SEMI EHS Summit.Industry experts will present on the regulatory matters that will impact the industry in 2026 and beyond, followed by discussions on taking collective action to strengthen semiconductor manufacturing. Topics:US Regulatory Landscape under second Trump AdministrationUS State-level legislationEurope: PFAS restriction, REACH restriction, Packaging and Packaging Waste Regulation, GENESIS Consortium, etc.US Department of War Perspective on Semiconductor Supply Chain RisksStockholm ConventionEmerging regulations in AsiaSupply Chain TransparencyUS EPA Technology Transition Rule (HFC Phasedown)US EPA TSCA New Substances of ConcernAttend, network and strategically prepare your company.  This is an in-person event only. SEMI 673 South Milpitas Blvd. Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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SEMI Japan
26F, xLINK Marunouchi-Eiraku Bldg.
1-4-1 Marunouchi, Chiyoda-ku
Chiyoda-ku, Tokyo
1000005
Japan

Standards

Traceability Japan TC Chapter Meeting


Date: Friday, March 27, 2026

Time: 10:00AM - 11:30AM JST

Location: SEMI Japan Office/ Official Virtual TC Chapter Meeting (Hybrid)

 


AGENDA

 

Standards Contact Information:

Nahoko Koga
Coordinator, Standards & EHS, SEMI Japan
E-mail: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend SEMI Standards meetings.

If you are not a Program Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress. Complete an application form today!

Questions? Contact your local staff coordinator: Click here

 

10:00 am - 11:30 am Off Add to Calendar 2026-03-27 10:00:00 2026-03-27 11:30:00 Traceability Japan TC Chapter Meeting Traceability Japan TC Chapter MeetingDate: Friday, March 27, 2026Time: 10:00AM - 11:30AM JSTLocation: SEMI Japan Office/ Official Virtual TC Chapter Meeting (Hybrid) AGENDA Standards Contact Information:Nahoko KogaCoordinator, Standards & EHS, SEMI JapanE-mail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend SEMI Standards meetings.If you are not a Program Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress. Complete an application form today!Questions? Contact your local staff coordinator: Click here  SEMI Japan 26F, xLINK Marunouchi-Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku Chiyoda-ku, Tokyo 1000005 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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The Challenge

Ayar Labs’ engineering teams faced challenges ingesting and analyzing non-standard test data across electro-optical and final test flows while scaling to meet aggressive go-to-market timelines. They sought a test analytics partner capable of loading, validating, and extracting insights from diverse datasets while supporting real-time alerting, yield recovery, and deep engineering analytics.

The Implementation

Week 1–2: Connecting the Pipes

Within the first two weeks, a secure cloud instance of yieldWerx was deployed, and raw data files were streaming in. The platform’s flexible pipelines ingested test data without custom code. The yieldWerx team went further, helping refine business rules, improve data quality, and enrich the information for greater downstream impact.

Week 3: First Insights

By week three, live dashboards were operational. Engineers could view wafer maps, outlier signatures, and correlations that previously required manual effort and scripting. Instead of working across multiple spreadsheets, they now had traceable, drill-down analytics at their fingertips.

Week 4: Real Results

In less than a month, the system was already supporting real yield decisions. Lots that previously required lengthy reviews were dispositioned in hours. Engineers trusted the analytics, and leadership recognized the tangible impact on quality and time-to-market. Ayar Labs is now preparing to onboard additional data formats, including qualification, reliability, and characterization.

The Outcome

The 30-Day Challenge demonstrated that yieldWerx is not just another analytics solution. In weeks, not months, yieldWerx moved from fragmented data to a unified platform that drives yield improvement, accelerates ramps, and reduces risk.

About yieldWerx

yieldWerx, an industry leader in semiconductor yield management, provides a platform that enables manufacturers to collect, validate, and act on production data across the entire semiconductor manufacturing lifecycle.

About Ayar Labs

Ayar Labs, a leader in optical engines for co-packaged optics, is transforming AI infrastructure by accelerating data movement in scale-up networks. Its industry-first optical I/O solution enables customers to maximize compute efficiency and performance while reducing costs, latency, and power consumption. Based on open standards and optimized for AI training and inference, Ayar Labs’ optical interconnect solutions are backed by a robust ecosystem to easily integrate into AI systems at scale. Ayar Labs was founded in 2015 and is funded by domestic and international venture capital firms, as well as strategic investors including AMD, Applied Ventures, GlobalFoundries, Hewlett Packard Pathfinder, Intel Capital, and NVIDIA.

Statements from Leadership

“Our collaboration with yieldWerx gave us measurable results in just 30 days. Their platform ingested
our complex photonics data, and the insights have accelerated how we make yield and quality decisions.”

— Garth Thompson, CIO, Ayar Labs

“Partnering with Ayar Labs has been both inspiring and validating. Photonics test data is some of the most complex in the industry, spanning electrical, optical, and multi-dimensional signatures that traditionally take months to integrate. Delivering measurable results in just 30 days shows the power of a unified, modern analytics platform. We’re proud that yieldWerx is helping Ayar Labs accelerate their roadmap, improve yields, and bring truly groundbreaking optical I/O technology to market faster and with higher confidence. “

— Aftkhar Aslam, CEO, yieldWerx
For further information, please visit https://www.yieldWerx.com or https://ayarlabs.com/.

Japan standards Technical
Highlighted content

SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi, Chiyoda-ku
Chiyoda-ku, Tokyo
1000005
Japan

Standards

FPD Materials & Components Japan TC Chapter and FPD Metrology Japan TC Chapter Joint Meeting


Date: Thursday, March 19, 2026

Time: 2:00PM - 5:00PM JST

Location: SEMI Japan Office/ Official Virtual TC Chapter Meeting (Hybrid)

 


AGENDA

 

Standards Contact Information:

Nahoko Koga
Coordinator, Standards & EHS, SEMI Japan
E-mail: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend SEMI Standards meetings.

If you are not a Program Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress. Complete an application form today!

Questions? Contact your local staff coordinator: Click here

 

2:00 pm - 5:00 pm Off Add to Calendar 2026-03-19 14:00:00 2026-03-19 17:00:00 FPD Materials & Components Japan TC Chapter and FPD Metrology Japan TC Chapter Joint Meeting FPD Materials & Components Japan TC Chapter and FPD Metrology Japan TC Chapter Joint MeetingDate: Thursday, March 19, 2026Time: 2:00PM - 5:00PM JSTLocation: SEMI Japan Office/ Official Virtual TC Chapter Meeting (Hybrid) AGENDA Standards Contact Information:Nahoko KogaCoordinator, Standards & EHS, SEMI JapanE-mail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend SEMI Standards meetings.If you are not a Program Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress. Complete an application form today!Questions? Contact your local staff coordinator: Click here  SEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku Chiyoda-ku, Tokyo 1000005 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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SEMI Japan
26F, xLINK Marunouchi-Eiraku Bldg.
1-4-1 Marunouchi, Chiyoda-ku
Chiyoda-ku, Tokyo
1000005
Japan

Standards

Flexible Hybrid Electronics (FHE) Japan TC Chapter Meeting


Date: Friday, March 13, 2026

Time: 3:00PM - 5:00PM JST

Location: SEMI Japan Office/ Official Virtual TC Chapter Meeting (Hybrid)

 


AGENDA

 

Standards Contact Information:

Nahoko Koga
Coordinator, Standards & EHS, SEMI Japan
E-mail: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend SEMI Standards meetings.

If you are not a Program Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress. Complete an application form today!

Questions? Contact your local staff coordinator: Click here

 

3:00 pm - 5:00 pm Off Add to Calendar 2026-03-13 15:00:00 2026-03-13 17:00:00 Flexible Hybrid Electronics Japan TC Chapter Meeting Flexible Hybrid Electronics (FHE) Japan TC Chapter MeetingDate: Friday, March 13, 2026Time: 3:00PM - 5:00PM JSTLocation: SEMI Japan Office/ Official Virtual TC Chapter Meeting (Hybrid) AGENDA Standards Contact Information:Nahoko KogaCoordinator, Standards & EHS, SEMI JapanE-mail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend SEMI Standards meetings.If you are not a Program Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress. Complete an application form today!Questions? Contact your local staff coordinator: Click here  SEMI Japan 26F, xLINK Marunouchi-Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku Chiyoda-ku, Tokyo 1000005 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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Belgium China France Germany India Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Watch the recording ICP 2026 2 Business Executive Technical
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United States

Sustainability

SEMI Sustainability, in collaboration with STX Group, hosted a webinar on Internal Carbon Pricing (ICP) for the semiconductor value chain. The session was anchored in a new industry report developed with input from members of SEMI’s Carbon Pricing Workgroup and will feature speakers from ASML, Delta Electronics, and Lam Research.  The webinar  highlighted the 5 key steps in creating and implementing your own ICP plan, and understand the process, its benefits and the opportunities offered.

The presentations explored key insights from the report alongside SEMI member perspectives, with speakers sharing practical examples and lessons learned—from early exploration to applied approaches—across the semiconductor value chain. 

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SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.,
1-4-1 Marunouchi,
Chiyoda-ku,, Tokyo
1000005
Japan

Standards

Physical Interfaces & Carriers Japan TC Chapter Meeting 

Date: Wednesday, March 4, 2026

Time: 9:00 am - 11:00 am JST

Venue: Room 1@SEMI Japan office + OVTCCM (Hybrid)

 

AGENDA

 

Standards Contact Information:

Takeaki Hirabara

Standards & EHS, SEMI Japan

Email: [email protected]

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

9:00 am - 11:00 am Off Add to Calendar 2026-03-04 09:00:00 2026-03-04 11:00:00 Physical Interfaces & Carriers Japan TC Chapter Meeting Physical Interfaces & Carriers Japan TC Chapter Meeting Date: Wednesday, March 4, 2026Time: 9:00 am - 11:00 am JSTVenue: Room 1@SEMI Japan office + OVTCCM (Hybrid) AGENDA Standards Contact Information:Takeaki HirabaraStandards & EHS, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click here SEMI Japan 26F, xLINK Marunouchi Eiraku Bldg., 1-4-1 Marunouchi, Chiyoda-ku,, Tokyo 1000005 Japan SEMI.org [email protected] America/Los_Angeles public
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Oxford Instruments, a leading provider of advanced plasma processing solutions, today announced a plasma equipment supply agreement with Applied Optoelectronics Inc. (AOI) (Nasdaq: AAOI), a leading provider of advanced optical and hybrid fibre-coaxial networking products that power the internet, for several etch and deposition cluster systems at their facility in Sugar Land, Texas.

The agreement will support AOI’s transformative expansion and technological advancements in indium phosphide (InP) for optoelectronic device manufacturing, as the company rapidly scales to increase production capacity within the U.S.

As AOI undergoes a significant growth phase, the company is upgrading its production capabilities to meet increasing demand for high-performance InP optoelectronic devices. Oxford Instruments’ advanced plasma etch and deposition processing systems will play a key role in this transformation by supporting AOI with fully automated 3-4-6-inch capable production systems for InP processes.

“AOI is expanding its U.S. manufacturing capacity in Texas to support demand for our optical transceivers in AI datacentres, and key suppliers like Oxford Instruments will help us continue to upgrade our fully automated production line,” said Fred Chang, Senior Vice President and North American General Manager at AOI. “With our combined technology, we can speed the processing of multiple wafer sizes, ranging from 3 to 6 inches, while improving overall quality and reducing costs.”

“AOI has been a valued long-term partner, and we are thrilled to have earned their trust as the chosen supplier for their production expansion and technology upgrades. Our unique high-temperature Electrostatic Chuck (ESC) design, which enables advanced processing capabilities, was a key factor in their decision. AOI also conducted an extensive vendor qualification process, including a visit to our brand-new purpose-built manufacturing facility in Bristol, UK, where we received high praise for our technology and production capabilities,” said Emiel Thijssen, Vice President of Sales and Business Development USA, Oxford Instruments Plasma Technology. “We are also investing significantly to ensure we continue to deliver world-class service capability in the Texas region, focusing on the availability of spares and expanding our field service and process engineering teams, to support the rapid expansion of leading manufacturers in the region such as AOI.”

###


For media enquiries, please contact:
Grant Baldwin, Head of Marketing
Oxford Instruments Plasma Technology
E: [email protected]
About Oxford Instruments plc
Oxford Instruments provides academic and commercial organisations worldwide with market-leading scientific technology and expertise across its key market segments: Materials Analysis, Healthcare & Life Science and Semiconductors. Innovation is the driving force behind Oxford Instruments' growth and success, supporting its core purpose to accelerate the breakthroughs that create a brighter future for our world. The vigorous search for new ways to make our world greener, healthier and more productive is driving unprecedented levels of R&D investment in new materials and techniques to support productivity and decarbonisation worldwide, creating a significant opportunity for Oxford Instruments to grow.

Oxford Instruments holds a unique position to anticipate global drivers and connect academic researchers with commercial applications engineers, acting as a catalyst that powers real world progress. Founded in 1959 as the first technology business to be spun out from Oxford University, Oxford Instruments is now a global company listed on the FTSE250 index of the London Stock Exchange (OXIG).

For more information, visit www.oxinst.com

About AOI 
Applied Optoelectronics, Inc. (AOI) is a leading developer and manufacturer of advanced optical and HFC networking products that are the building blocks for AI datacentres, CATV and broadband fibre access networks around the world. AOI supplies this critical infrastructure to tier-one customers across cloud computing, CATV broadband, telecom, and FTTH markets. The company has R&D facilities in Atlanta, GA, and engineering and manufacturing facilities at its corporate headquarters in Sugar Land, TX, as well as in Taipei, Taiwan and Ningbo, China. For additional information, visit www.ao-inc.com.