Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
2:00 pm - 4:00 pm
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Add to Calendar2025-10-06 14:00:002025-10-06 16:00:003D Packaging & Integration Japan TC Chapter Meeting3D Packaging & Integration Japan TC Chapter Meeting Date: Monday, October 6, 2025Time: 2:00 PM - 4:00 PM JSTvia OVTCCM/ SEMI Japan Office (Hybrid) AGENDA Standards Contact Information:Akiko YoshidaSenior Cooordinator, SEMI JapanEmail: [email protected] NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click hereSEMI Japan 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi Chiyoda-ku, Tokyo 1010005 JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo
PEER Group webinar helps OEMs know how to comply with SEMI Cybersecurity Standard E187
Kitchener, Ontario, July 8, 2025 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, is hosting a webinar that will provide critical information to help equipment suppliers comply with the new SEMI® Cybersecurity Standard E187: Specification for Cybersecurity of Fab Equipment.
“SEMI E187 is one of a growing group of cybersecurity standards that have been developed to help secure the semiconductor manufacturing supply chain and build resilience in the face of an increasing threat of cyberattacks,” says Doug Suerich, PEER Group’s Director of Marketing and Governing Council member of the Semiconductor Manufacturing Cybersecurity Consortium (SMCC), “this webinar will provide OEMs with a crash course on the new cybersecurity standards and detail best practices on how to comply with E187.”
A popular speaker at a variety of industry conferences and tradeshows, Suerich will be the main speaker during the webinar, titled SEMI Cybersecurity Standard E187: Are you ready? During the 45-minute presentation, Suerich will delve into the history, development, and industry-wide collaboration that has resulted in the publication of SEMI’s new cybersecurity standards. This will be followed by an in-depth break down of SEMI E187, with Suerich explaining what equipment makers must do to achieve compliance and meet the factory specification.
Mike Barrett, Vice President, Global Sales at PEER Group will host the webinar. “As a software supplier to both semiconductor OEMs and fabs, we have deep knowledge and experience helping our customers meet the strict requirements outlined in factory specifications,” shares Barrett, while noting: “One thing we’re starting to see is that factories are beginning to require SEMI Cybersecurity Standards compliance as part of the factory purchase specification. Considering the risk and financial damages that come with a cyberattack, we expect to only see this requirement increase.”
The webinar is free to attend but requires registration. It will take place live on July 24, 2025, at 1:00 p.m. EDT.
About PEER Group PEER Group® is the leading global supplier of innovative factory and tool automation and connectivity software for the semiconductor industry. Since our founding in 1992, we have been committed to developing best-in-class solutions that help OEMs and factories reduce their time to market, risk, and costs by solving their most challenging automation, connectivity, and SEMI Standards compliance problems. Follow PEER Group on. Follow PEER Group on LinkedIn.
EUV Tech Advances Semiconductor Manufacturing with the Launch of FALCON
Martinez, CA—EUV Tech (EUVT), a global leader in designing and manufacturing at-wavelength EUV metrology equipment, is excited to announce the release of the FALCON Photoresist Flood Exposure Tool. As our next-generation EUV resist characterization and diagnostics tool, FALCON allows photoresist manufacturers to rapidly and accurately test EUV resist sensitivity, as well as providing patterning materials developers critical insights into exposure mechanisms.
Built upon EUV Tech’s proven resist tool technology, FALCON is a fully automated tool that supports high-throughput contrast curves on EUV-patterning materials and radiation chemistry diagnostics by integrating a wide variety of optional add-on analysis and processing modules.
Enhancing FALCON’s platform is an array of in-situ analysis and process modules, including Fourier Transform Infrared (FTIR) Spectroscopy, Atomic Mass Spectrometry, Total Electron Yield (TEY), Photo-Electron Spectroscopy (PES), environmental and vacuum bake module with additional diagnostics, and a scanner-environment exposure module.
Key to FALCON’s effectiveness is its highly uniform exposure spot size of 6 mm, supporting high-sensitivity chemical analysis and over 1,000 exposures for a 300 mm wafer in a single recipe run. Built-in data visualization tools make it possible to analyze this rich data. Combining uniformity, high configurability, and deep data collection and analysis makes FALCON a highly efficient, cost-effective tool for advanced photoresist development.
For more information on the enhanced FALCON Flood Exposure Tool or any of EUV Tech’s at-wavelength metrology tools, please visit euvtech.com.
About EUV Tech
EUV Tech enables technology advancement in the frontiers of semiconductor manufacturing and material science through the development of world-leading EUV and soft-x-ray instrumentation and techniques.
For further information, contact:
EUV Tech, Inc. [email protected]
+1 (925) 229-4388
Agileo Automation Announces Future Expansion Of A²ECF-SEMI Automation Framework With SEMI EDA Standards
Integration of EDA empowers OEMs to deliver structured, high-bandwidth data to semiconductor fabs and drive efficiencies for competitive advantage
CEA LID World Summit, Grenoble, France, June 17, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, today announced the future expansion of its A²ECF-SEMI automation framework to include SEMI’s EDA (Equipment Data Acquisition) standards suite. This integration that already includes Agil’GEM and Agil’GEM300 will empower OEMs to deliver structured, high-bandwidth data to manufacturing facilities and drive process improvements with artificial intelligence (AI) by leveraging large amounts of reliable, actionable data. EDA standards, built on the legacy of SECS/GEM and GEM300, are transforming equipment communication and enabling high-speed, data-driven manufacturing. As semiconductor fabs become more connected and automated, the ability of OEM equipment to integrate seamlessly and deliver high-quality, structured data has become a competitive differentiator.
Agileo Automation has carried out EDA Freeze 2 client and server tests with equipment manufacturers already supporting EDA and is working with these early adopters on the integration on their equipment using A²ECF-SEMI, Agil'GEM, and Agil'GEM300. The company will soon be providing a comprehensive offer for OEMs in need of EDA Freeze 2 or 3. EDA is increasingly required in RFQs that equipment manufacturers must address.
“EDA is going to enable fabs to realize superior yields, faster innovation cycles, and a sustainable competitive advantage in an ever-accelerating market,” explains Marc Engel, CEO of Agileo Automation. “Agileo is proud to be a major contributor to this global effort and pleased to support OEMs in all market segments with a complete and scalable product suite.”
About Agileo Automation
Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo Automation is a key contributor to the development and integration of industry standards such as SEMI standards and OPC Unified Architecture (OPC UA). For more information, please visit our web site or follow us on LinkedIn.
Nordson Electronics Solutions develops panel-level packaging solution for Powertech Technology, Inc. that achieves yields greater than 99% for underfilling during semiconductor manufacturing
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson.
PTI, one of the world’s top OSAT (Outsourced Semiconductor Assembly and Test) companies, worked with the Nordson applications team to set up a comprehensive PLP demonstration that achieved high-quality, void-free underfill results at scale, using the industry-leading ASYMTEK Vantage® Series fluid dispensing system, equipped with the ASYMTEK IntelliJet® Jetting system. Nordson’s precision technology mitigated warpage and optimized fluid flow while decreasing cycle time by almost 30%.
PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency as the semiconductor industry transitions from 300-mm wafers to panels. PTI is enabling PLP applications that are designed to meet the semiconductor industry’s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures.
Underfill has been pivotal in semiconductor packaging since the adoption of flip-chips in the 1990s. As applications have become more demanding, particularly in high-performance CPUs, GPUs, and advanced architectures like flip-chip and 2.5D/3D ICs, the importance of underfilling to enhance mechanical reliability and thermal performance has grown. Since the beginning, Nordson developed innovations for underfill processes as the industry evolved from PC board, substrate, wafer, and now panel applications.
Nordson’s distributor, Jetinn Global Equipment Ltd., supported the advancements discussed in this case study by investing in demonstration equipment and providing expert technical support.
Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing
In the semiconductor industry where we routinely pattern sub-wavelength structures and require atomic-layer precision in our manufacturing processes, it’s easy to assume that we can simply measure everything we’re doing and all the structures we create. In reality, though, metrology and inspection have the challenging task of not just keeping up with device technology but staying far enough ahead that we can actually “see” our results and confirm the progress we’re making.
In this webinar, co-hosted with the Electronics business of Merck KGaA, Darmstadt, Germany; we will explore the metrology and inspection space to learn more about technological advances driving this vital segment of semiconductor manufacturing.
The webinar will feature presentations by Eric Beyne, PhD, Senior Fellow, VP R&D and Director of 3D System Integration Program for imec, and Dario Alliata, PhD, Senior Application Director for Metrology & Inspection at the Electronics business of Merck KGaA, Darmstadt, Germany.
Following the presentations, an interactive Q&A segment will allow attendees a chance to deepen their understanding of how materials innovation and advanced metrology intersect at the leading edge of manufacturing.
Join us to engage with peers and pioneers working at the forefront of materials science and semiconductor innovation!
United States
Dario Alliata, PhD
Senior Director of Applications
The Electronics business of Merck KGaA, Darmstadt, Germany
The Role & the Challenge of Metrology and Inspection in Advanced Packaging of AI Chips
The massive adoption of social networking and artificial intelligence has pushed the semiconductor industry to develop devices capable of supporting the required infrastructures. Increasingly powerful computer process units (CPU) are used to allow data centers to process trillions of information exchanges, while faster graphic process units (GPU) enable virtual and assisted reality.
Cost leveraging is now reachable with the integration of multiple dies in the same package, each one fabricated to handle specific functionalities with the most cost-effective technology node, which is a form of heterogeneous integration. This session highlights some examples of metrology and inspection solutions aimed at securing the manufacturability of devices for High Computing Power fundamental for AI applications. More in detail, it explores the challenge of the fabrication of chip-to-chip interconnections that are key for the heterogeneous integration of active components with vertical stacking like DRAM for High Bandwidth memories, where process tolerances are increasingly narrow and conditions to measure more and more extremes.
Biography
Dr. Dario Alliata joined Unity-SC, now part of the Electronics business of Merck KGaA, Darmstadt, Germany in the U.S. and Canada. In 2016 as product manager and is now Sr. Director of Applications with focus on Advanced packaging and Specialty substrates & devices.
He worked in the semiconductor industry for more than 25 years, initially in R&D centers and later in equipment makers. He spent his entire career developing process control solutions for securing the manufacturing chain in the semiconductor industry.
He received a MD in Physics from the University of Milan (Italy) and hold a Ph.D. in Physics & Chemistry from the University of Berne (Switzerland).
Eric Beyne, PhD
VP R&D / Program Director 3D System Integration Program / Senior Fellow
imec
Sub-Micron Pitch Scaling of Hybrid Bond Interconnects: Metrology Challenges
Advanced 3D integration technology will increasingly rely on hybrid bonding technology for both wafer-to-wafer and die-to-wafer bonding. This allows for micrometer and sub-micrometer pitch interconnects, resulting in very high 3D interconnect densities, compatible with the back-end-of -line interconnect layers of active logic and memory die. The results are “seamlessly” interconnected die. Off-chip interconnects become equivalent (or better) than on-chip interconnects.
These great system-level benefits however come at some challenges. Small overlay errors or surface imperfections can prevent defects, resulting in yield loss. Critical process, steps, such as CMP, wafer dicing and surface cleaning steps, need to be monitored with higher accuracy to maintain a good process. New parameters, such as wafer shape, distortion, surface profile slopes, and copper pad recess levels need to be measured and continuously monitored. This poses significant challenges to metrology related to hybrid bonding. The presentation will highlight these needs and show some practical solutions.
Biography
Eric Beyne obtained a degree in electrical engineering in 1983 and the Ph.D. in Applied Sciences in 1990, both from the Katholieke Universiteit Leuven, Belgium. Since 1986 he has been with IMEC in Leuven, Belgium where he has worked on advanced packaging and interconnect technologies. Currently, he is imec senior fellow, VP R&D and program director of imec’s 3D System Integration program.
Michael Weigand
Senior Application Manager
Brewer Science
Moderator
Biography
I'm a seasoned Senior Application Manager at Brewer Science with over two decades of experience in Semiconductor industry. I lead application teams at Brewer Science Inc, focusing on advanced materials for the semiconductor industry. With a background in Material Science, I enjoy tackling technical challenges, from optimizing critical processes to finding creative ways to characterize materials.
Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany
Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing
10:00 am - 11:00 am
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Add to Calendar2025-09-17 10:00:002025-09-17 11:00:00Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
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As world leaders act to secure access to these minerals, companies come under pressure to follow due diligence guidelines to promote ethical sourcing of these materials for their supply chains. Regulations such as the US Dodd-Frank Wall Street Reform and Consumer Protection Act (Section 1502), EU Regulation 2017/821 and the EU Corporate Sustainability Due Diligence Directive require companies to trace materials through their supply chains and report to the public about their use of conflict minerals.
Several industry associations, including the Responsible Business Alliance’s Responsible Minerals Initiative, were created to help companies with their due diligence efforts. Reports such as those issued by the US Government Accountability Office on Conflict Minerals offer insights into the efficacy of these regulations and suggest improved approaches for industry engagement.
The SEMI Responsible Supply Chain (RSC) working group was recently formed to host discussions on these topics. This webinar will provide insights from speakers Jennifer Peyser, Responsible Business Alliance Senior Vice President of Responsible Sourcing, and Kimberly Gianopoulos, Managing Director for the International Affairs and Trade team at the U.S. Government Accountability Office (GAO).
United States
8:00 am
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8:05 am
Dr. Kimberly Harrison, Ph.D
Senior MEMS Engineer
AMFitzgerald & Associates
Welcome and Introductions of RSC working group
Dr. Harrison is a MEMS Engineer with AMFitzgerald & Associates, a design firm located in the Bay Area California. She has a doctoral degree in mechanical engineering from Stanford University, and has worked as a designer and process engineer in the semiconductor industry for 10 years. She was nominated as a 2022 MEMS & Sensors Industry Group Emerging Leader. As a founding member and leader of the SEMI Responsible Supply Chain Working Group, she hopes to bring SEMI members together to discuss solutions to human rights issues in the semiconductor supply chain.
Conflict Minerals Supply Chain Overview
8:05 am
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8:35 am
Kimberly Gianopoulos
Managing Director for the International Affairs and Trade
U.S. Government Accountability Office (GAO)
Report Review
Director Gianopoulos oversees a 140-person team that reviews a wide variety of federal government oversight issues, including International Security Assistance, Bilateral and Multilateral Foreign Assistance, International Trade and Finance, and U.S. Diplomatic Presence and Management. She serves as a facilitator in GAO’s Learning Center and participates in recruiting activities. Ms. Gianopoulos has received several awards, including a Distinguished Service Award, a Meritorious Service Award, a Client Service Award, and several Results Through Teamwork awards. Ms. Gianopoulos earned a Bachelor’s degree in Mathematics and a Master’s degree in Public Analysis and Administration from the State University of New York at Binghamton. She is a Certified Government Financial Manager and a member of Pi Alpha Alpha, the Global Honor Society for Public Affairs and Administration.
Jennifer Peyser
Executive Director
Responsible Minerals Initiative
RMI Activity Overview
“The RMI supports over 500 downstream, midstream, and upstream member companies with a suite of due diligence standards and tools, data, guidance, training, and other resources for global responsible sourcing and regulatory compliance. Our facility and supply chain due diligence standards are rooted in longstanding international norms while reflecting emerging corporate and stakeholder priorities for regulatory compliance, managing sustainability risks and impacts, and fostering responsible mineral supply chains.”
Critical Minerals, Due Diligence and the Semiconductor Supply Chain
8:00 am - 9:00 am
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Add to Calendar2025-07-09 08:00:002025-07-09 09:00:00Critical Minerals, Due Diligence and the Semiconductor Supply ChainUnited StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register for On-demand
In this engaging two-hour Masterclass organized by SEMI, we explore the groundbreaking role of magnetic materials, particularly magnetic nanoparticles (MNPs), in biomedical fields. The session commences with an in-depth review of the physics and synthesis of MNPs, including comprehensive discussions on fundamental theories, synthesis methods, and advanced MNP surface functionalization strategies. Attendees will gain insights into the characterization techniques used to analyze the physicochemical properties of MNPs.
The Masterclass transitions to the applications of MNPs in therapeutic and diagnostic contexts. We will review cutting-edge MNP-based therapies, such as magnetic hyperthermia therapy, targeted drug and gene delivery, and magnetic neurostimulation. In addition, we will discuss various MNP-based diagnostic techniques, including magnetoresistive (MR) sensing, nuclear magnetic resonance (NMR), magnetic particle spectroscopy (MPS), magnetic resonance imaging (MRI), and magnetic particle imaging (MPI). A critical focus of this Masterclass will be on safety and biocompatibility issues associated with the use of MNPs in vivo, examining the toxicity of MNPs, immune responses, and their circulation time in the human body.
The latter part of the session will introduce participants to the innovative field of micromagnetic neural stimulation, an infant yet extremely promising field. We will delve into the design and efficacy of micromagnetic devices, such as the Magnetic Pen (MagPen) and Magnetic Patch (MagPatch) Array, which utilize micrometer-sized coils (μcoils) for targeted neural activation. This is particularly for patients with spinal cord injuries (SCI) and for reducing opioid dependency, with insights drawn from current research supported by the NIH Blueprint Medtech Program. By the end of the Masterclass, attendees will have a comprehensive understanding of the potential clinical applications of MNPs and MEMs-based micromagnetic neurostimulators.
ABOUT THE SPEAKER
Dr. Renata Saha, Senior Scientist, Dupont
Dr. Renata Saha is a Senior Scientist at DuPont located in Wilmington, DE. She holds a PhD in Electrical and Computer Engineering from the University of Minnesota, Twin Cities, which she earned in August 2023. Her undergraduate degree in Electronics & Communication Engineering was obtained from the National Institute of Technology in Durgapur, India. During the summer of 2017, she was an undergraduate research intern at Conseil européen pour la Recherche Nucléaire (CERN), located in Geneva, Switzerland working on the ALICE experiment upgrade.
Dr. Saha is the recipient of 3-year College of Science & Engineering Fellowship, Women in Technology Scholarship 2021-2022 from Cadence Design Systems, and the Graduate Neuromodulation Research Fellowship 2022-2023 from MnDRIVE. She was also elected an iREDEFINE Fellow in 2022 by ECEDHA and was named a Rising Star in EECS. She has published over 30 journal articles, 3 US patents, and 2 book chapters.
Her expertise and research interests involve designing and developing microelectromechanical systems (MEMs) devices for neuromodulation and cardiovascular monitoring, characterizing magnetic nanoparticles (MNPs) for potential biomarkers. Outside of her research and work, Dr. Saha is trained in Indian classical dance form, Odissi, and enjoys performing and choreographing the art form.
In this two-hour Masterclass, Dupont Senior Scientist Renata Saha delves into the biomedical applications of magnetic nanoparticles (MNPs), covering their manufacturing, functionalization as well as therapeutic and diagnostic uses including safety considerations such as biocompatability and toxicology.
Innovations in Magnetic Materials: Application in Biomedical Engineering
Flexible Electronics Master Class #26
10:00 am - 12:00 pm
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Add to Calendar2025-10-29 10:00:002025-10-29 12:00:00FEMC #26 Innovations in Magnetic Materials: Applications in Biomedical EngineeringIn this two-hour Masterclass, Dupont Senior Scientist Renata Saha delves into the biomedical applications of magnetic nanoparticles (MNPs), covering their manufacturing, functionalization as well as therapeutic and diagnostic uses including safety considerations such as biocompatability and toxicology. United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
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Leverage SEMI U learning offerings to wrap up your 2025 professional development journey! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.
Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "SEMI University - 2025 and beyond." This webinar promises to be an informative session where you'll gain insights into the latest updates, exciting live trainings at SEMICON West and virtually the remainder of this year and beyond.
During this webinar, you can expect to:
Discover the latest updates and enhancements to SEMI U's course catalog.
Learn about the exciting live, in-person training courses scheduled for SEMICON West.
Review upcoming virtual instructor-led trainings.
Gain access to a special 10% discount on ALL on-demand courses.
Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value).
8:00 am - 8:30 am
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Add to Calendar2025-09-25 08:00:002025-09-25 08:30:00SEMI University - 2025 & BeyondJoin us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value). Choose your session:US/EU: 8:00 AM – 8:30 AM PT [Register Now]Asia/US: 5:00 PM – 5:30 PM PT [Register Now]United StatesSEMI.org[email protected]America/Los_AngelespublicRegister Now
TRI and Bosch Partner on AI Solution for MEMS Packaging
Test Research, Inc. (TWSE: 3030), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging.
Bosch has recognized TRI's valuable contribution to their success in MEMS packaging in 2025 with a Certificate of Appreciation. The certificate acknowledges the successful completion of the AI visual check for MEMS packaging, highlighting the strong cooperation and partnership between the two companies.
This collaboration demonstrates TRI's expertise in AI-driven inspection solutions and its commitment to providing valuable solutions for the electronics manufacturing industry. TRI's AI-powered solutions include the AI Defect Detection, AI Smart Programming, AI Verify Host, AI training tool, AI Station, and more.
TRI (TWSE: 3030), offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.
