RENA Technologies marks a new milestone in the semiconductor industry with the launch of Vanguard, a state-of-the-art, fully automated single-wafer platform designed for wet chemical cleaning, etching, and drying of 200mm and 300mm wafers. Engineered for performance, efficiency, and scalability, Vanguard offers new possibilities for advanced semiconductor manufacturing.

Broaden the Possibilities in Wafer Wet Processing

Vanguard is purpose-built to address the rising demands of next-generation semiconductor substrates and materials. Supporting 4 to 8 independent processing chambers within a compact footprint, the system delivers high throughput without compromising cleanroom space. Its advanced chemical cleaning and double-sided processing—handling up to five distinct chemistries—minimizes contamination, substrate damage, and defects, ensuring wafers meet the stringent yield and quality requirements of cutting-edge chip manufacturing.

"With the launch of our new semiconductor wet processing platform, we are entering a new aera in precision, efficiency, and reliability for advanced chip manufacturing. This machine embodies our commitment to innovation—delivering not only superior process control but also the flexibility our customers need to stay ahead in a rapidly evolving industry. It represents a decisive step in enabling the next generation of semiconductor technologies for both high-volume manufacturing lines and R&D fabs." Emphasizes Peter Schneidewind, CEO of RENA Technologies.

Scalable, Modular Design 

Vanguard’s modular architecture grows with customer needs. Fabs can easily adjust chamber count and process configurations to match evolving requirements, from R&D to high-volume production.
The platform integrates internal chemistry preparation for precise formulation control, ensuring consistent process delivery and minimizing chemical consumption. This reduces operating costs and environmental impact—key considerations for sustainable fabs.

Serviceability is also built-in: each chamber operates independently, allowing maintenance without halting production. Combined with AI-assisted process control, and the digital service platform RENA Connect Hub, customers gain maximum uptime and efficiency.

Next-Level Automation and Compatibility

With its digital twin simulation, customers can model system integration, test interfaces, and even simulate throughput with real process data—well before installation. Training and upgrades can be conducted seamlessly during live production.

Fully GEM300 compatible, Vanguard is integration-ready from day one. Operating within a Class 1 mini environment, it guarantees ultra-clean wafer handling, while its advanced drying ensures residue-free, pristine surfaces for downstream processing.

Key Features at a Glance

• Fully automated wet processing for 200mm / 300mm wafers
• Scalable from 4 to 8 single-wafer chambers
• Double-sided cleaning with up to 5 chemicals
• Internal chemistry preparation system
• AI-assisted software with predictive maintenance
• Advanced drying technology
• Class 1 mini environment for ultra-clean operation
• Compact footprint with high-throughput capability
• GEM300 factory-integration ready
• Low chemical usage for reduced cost and environmental impact 

Availability

Vanguard is officially available as of today. Semiconductor fabs and foundries seeking to modernize their wet processing capabilities now have access to a solution that combines performance, scalability, and sustainability—delivered today for the challenges of tomorrow.

• Read more about Introducing Vanguard: The New Single-Wafer Cleaning and Etching Tool from RENA Technologies

OXFORD INSTRUMENTS PROVIDES COHERENT WITH STATE-OF-THE-ART, FULLY AUTOMATED PROCESSING EQUIPMENT, FOR 6” INP WAFER MANUFACTURING, ENABLING NEXT GENERATION AI APPLICATIONS

Oxford Instruments (OXIG), a leading provider of advanced plasma processing solutions for the compound semiconductor industry, announces the key role it is playing to support the industry’s first fully automated 6-inch indium phosphide (InP) wafer fabrication capability for photonic devices, led by Coherent Corp. (NYSE: COHR), a global leader in compound semiconductors and high-performance optical networking solutions.

Oxford Instruments’ cutting-edge plasma processing equipment is central to Coherent’s groundbreaking achievement of ramping up 6-inch InP fabs in Sherman, Texas, and Järfälla, Sweden. These fabs will play a pivotal role in driving advancements in AI datacentre, telecommunications, and sensing applications. Coherent’s transition to 6-inch wafers is set to deliver significant benefits, including a substantial increase in capacity, lower die cost and more than four times the number of devices per wafer.

Oxford Instruments has supplied fully automated, high-throughput 6-inch InP processing equipment, enabling Coherent to achieve these remarkable productivity gains. This advanced equipment is designed to support the transition from 800G to 1.6T products, a key requirement to meet the growing demands of AI interconnects and optical communications.

“We have been the leading supplier of InP plasma etch equipment to the datacom market, and Coherent, for many years. Our technology, with the quality, throughput and reliability that we have developed alongside excellent service, is ideally positioned to support the current device demand inflection we are seeing with the release of generative AI applications. We are delighted to be partnering with Coherent during this exciting period of market expansion and look forward to continuing to develop and release innovative and valuable plasma processing solutions.” Matt Kelly, Managing Director, Oxford Instruments Plasma Technology.

"Coherent’s move to 6-inch InP wafer fabrication marks a transformative milestone for the industry. Oxford Instruments’ expertise in plasma processing has been essential in enabling our Sherman and Järfälla fabs to reach world-class performance,” said Dr. Beck Mason, Executive Vice President – Semiconductor Devices at Coherent. “Together, we are advancing InP technology to support faster networks, greater efficiency, and the new applications that will define the future of connectivity."

The joint efforts of Oxford Instruments and Coherent have culminated in a manufacturing platform that sets the stage for the next generation of InP optoelectronic devices. These devices are critical enablers for applications ranging from AI datacentres and datacom transceivers to advanced sensing in consumer electronics and automotive technologies.

• Read more about Enabling AI with Fully Automated Equipment for 6” InP Wafer Processing