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  • Non-Member: $35
United States Register Now Business Featured Speakers

ESD Alliance Webinar

Understanding Export Regulations Affecting the Electronic System Design Ecosystem

The world of export compliance is increasingly complex and perplexing. No one in the electronic system design ecosystem knows this better than Larry Disenhof, ESD Alliance Export Committee Chair and Group Director of Cadence's Export Compliance and Government Relations. 

Join us on Wednesday, September 15, 2021 at 9am PDT to:

  • Hear Larry's perspective and invaluable insights into today's export climate. 
  • Learn how to navigate export regulations.

Larry's expertise on behalf of ESD Alliance's Export Committee is a valued resource for our members. The committee represents the electronic system design ecosystem in Washington, D.C., with agencies overseeing export regulations and other regulatory organizations. Its goal is to educate government agencies about our products and how they are classified in the Commerce Control List to ensure the correct level of export controls are applied. It also serves to educate our members on export and other government regulatory issues affecting our industry and each company's ability to sell and support its products. 

Attendees can expect Larry to present up-to-the-minute and easily understood information about the changeable export landscape, followed by a live Q&A session. 

United States

Larry Disenhof New
ESD Alliance Export Committee Chair
Larry Disenhof
Director, Cadence Export Compliance and Government Relations
Cadence Design Systems, Inc.
ESD Alliance

Join us at the ESD Alliance webinar to hear Larry Disenhof's perspective and invaluable insights into today's export climate and learn how to navigate export regulations. Free registration for members.

9:00 am - 10:00 am Off Add to Calendar 2021-09-15 09:00:00 2021-09-15 10:00:00 ESD Alliance Webinar - Understanding Export Regulations Affecting the Electronic System Design Ecosystem Join us at the ESD Alliance webinar to hear Larry Disenhof's perspective and invaluable insights into today's export climate and learn how to navigate export regulations. Free registration for members. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

Registration

Pricing

  • Member: Free
  • Non-Member: $35
United States Register Now CEO Outlook 2021 Update Business Executive Featured Speakers

2021 ESD Alliance CEO Outlook

This year’s informative event, featuring eight prominent industry CEOs, will be conducted as a virtual event.

Ed Sperling, Editor in Chief of Semiconductor Engineering, will moderate this year’s panel, which includes:

  • Arm—Simon Segars
  • Cadence—Lip-Bu Tan
  • IC Manage—Dean Drako
  • PDF Solutions—John Kibarian
  • Real Intent—Prakash Narain
  • Siemens IC EDA—Joseph Sawicki
  • Silvaco—Babak Taheri
  • Synopsys—Aart de Geus

The panelists will discuss the state of the Electronic System Design industry along with their views of the outlook for the coming years.

United States

Simon Segars, Arm
Simon Segars
CEO, Arm
Lip-Bu Tan, Cadence Design Systems
Lip-Bu Tan
CEO, Cadence Design Systems
Dean Drako, IC Manage
Dean Drako, IC Manage
President and CEO, IC Manage
John Kibarian
John Kibarian
CEO, PDF Solutions
Prakash Narain, Real Intent
Prakash Narain
President and CEO, Real Intent
Joe Sawicki, Siemens IC EDA
Joseph Sawicki
Executive Vice President, Siemens IC EDA
Babak Taheri, CEO/CTO, Silvaco
Babak Taheri
CEO/CTO, Silvaco
Aart de Geus, Synopsys
Aart de Geus
Chairman and Co-CEO, Synopsys
ESD Alliance

Join us online May 18 from 2–3pm PDT for the 2021 ESD Alliance CEO Outlook! Free registration for members.

2:00 pm - 3:00 pm Off Add to Calendar 2021-05-18 14:00:00 2021-05-18 15:00:00 ESD Alliance CEO Outlook Join us online May 18 from 2–3pm PDT for the 2021 ESD Alliance CEO Outlook! Free registration for members. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

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Abstract

Fabrication in the cleanroom, and in the newer printed electronics tools, are often a function of time-varying parameters of the equipment, environment, and materials. The parameters often have co-dependencies across different process steps and tool sets. Physics based models and linear regression have been used traditionally, which are often not sufficient to learn the underlying variabilities.

This course will teach the material needed to connect cleanroom and printed electronics science and technology to that of advanced data processing capabilities enabled by Artificial Intelligence and Machine Learning. Cleanroom tools inherently can have millions of internal variables and can learn from the datasets, providing a powerful and complementary approach to traditional feedback control and process stabilization approaches.

Learning models are developed on images (CD-SEMS, optical images), time history data (Optical Emission Spectroscopy), and textual process information. A subset of the class will include: (1) Approaches to preprocess image data and create learning-based models, (2) model verification, (3) application to nanomechanical switch fabrication, and (4) cloud based implementation, data security, and data standardization.

 Course Outline:

1.      Introduction – The need for AI in microfabrication and printed electronics

a.      Microfabrication: Tool variability, process variations

b.      Printed Electronics: Inkjet variations, spatial variations

2.      Fabrication and data collection

a.      Metrology

b.      Fabrication equipment data

c.       Cleanroom data

3.      Data and image processing

a.      Types of data

b.      Time-dependent data

c.       Spatially varying data

d.      Size of data

e.      Computational capabilities

4.      AI and machine learning algorithms

a.      Regression

b.      Binary trees

c.       Random forests

d.      Deep Neural Nets (e.g. Image to Image translation using Pix2Pix)

5.      Results and outlook

a.      Improvement in linewidths

b.      Cloud based implementations

 

About the Instructors

Amit Lal
Amit Lal is the Robert M. Scharf 1977 Professor in the School of Electrical and Computer Engineering at Cornell University, Ithaca, NY. His work has resulted in new fabrication approaches and architectures in Micro/Nano-Electromechanical Systems, Physical Acoustics and Ultrasonics, Inertial Sensors, Biomedical MEMS, Analog Circuit Design, Solid-State Electronics, Radioactive Thin Films for Autonomous Microsystems, and Nanofabrication. The current focus of his research is on: (1) Gigahertz Ultrasonic for chip-scale communications, sensing, and computation, (2) Near zero power sensors for long-lifetime IoT, (3) Ultrasonic inertial sensors based on surface acoustic waves.

Peter C. Doerschuk
Peter C. Doerschuk is a professor in the School of Electrical and Computer Engineering and the Meinig School of Biomedical Engineering at Cornell University in Ithaca NY.  His interests in signal and image understanding have resulted in new algorithms for a variety of problems from microfabrication to single-particle cryo electron microscopy of biological particles.

Benyamin Davaji
Benyamin Davaji is a postdoctoral research associate in the School of Electrical and Computer Engineering at Cornell University. Ben works with Prof. Amit Lal at SonicMEMS Laboratory on developing solid-state acoustic wave inertial sensors, ultrasound neuromodulation microdevices, event-powered sensors, and methods to use machine learning and artificial intelligence to enhance micro and nanosystem design and manufacturing. He is the recipient of the 2019 Cornell achievement award for excellence in mentoring and the 2016 MEMS shark pub tank prize at the Hilton Head Conference. Before joining Cornell, Ben worked with Prof. Chung Hoon Lee on microthermal analysis and thermal microfluidic systems at Nanodevices Laboratory at Marquette University and received a Ph.D. in electrical engineering. During his Ph.D., he received the 2014 IEEE Larry Hause award and the 2014 College of Engineering outstanding TA award. 

Flexible Hybrid Master Classes are offered on many topics!  Visit this page for entire list and links to more detailed information on each one.

United States

Amit Lal
Dr. Amit Lal
Professor
Cornell University
Peter Doerschuk
Dr. Peter Doerschuk
Professor
Cornell University
Benyamin Davaji
Benyamin Davaji
Postdoctoral Research Associate
Cornell University
FlexTech

This course was recorded on May 27, 2021.  Registering now gives you access to listen to the recording.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
Event format

Registration Details

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

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The course coverage includes:

  • Flexible power

    • Flexible batteries

    • Printed batteries

    • Thin batteries

  • Flexible batteries and sustainability

  • Flexible battery chemistry

    • Non-toxic flexible batteries

    • Materials for flexible batteries

    • Solid electrolytes for flexible batteries

  • Batteries for on-body electronics

  • Flexible battery testing

  • Flexible battery safety

  • Flexible battery specifications

  • Flexible battery power density

  • Flexible battery energy density

About the Instructor

J. Devin MacKenzie is the Washington Research Foundation Professor of Clean Energy and an Associate Professor of Materials Science and Engineering and Mechanical Engineering at UW.  Dr. MacKenzie is also the director of the Washington Clean Energy Testbeds, an open access laboratory with world-class printed electronics, flexible electronics and energy device fabrication and testing capabilities.  Dr. MacKenzie has 20 years of experience co-founding or leading startups in novel fabrication including as a co-founder and CEO of Imprint Energy commercializing printed  flexible batteries, as CTO of Add-Vision, a printed flexible OLED display company that was acquired in 2011, and as a VP at Kovio, an MIT spin out, leading printed Si RF device integration.  Devin also co-founded the world’s first printed electronics company, Plastic Logic Ltd. in the United Kingdom.  Previously Dr. MacKenzie was a researcher at AT&T Bell Laboratories. Prior to entering the start-up world, Devin was a postdoc in Physics at the University of Cambridge and earned PhD, MS, and BS degrees from the University of Florida and MIT. Dr. MacKenzie has over 220 patents and publications and has been cited over 10,000 times.

United States

J. Devin MacKenzie
J. Devin MacKenzie
Professor
University of Washington
- FlexTech

The Master Class covers the basics of battery terminology, chemistry and structures relevant to flexible electronics. The unique challenges related to the practical use and manufacturing of flexible batteries is discussed, as well as a summary of the current state of the art and emerging flexible battery technologies.  The presentation is 90 minutes with 30 minutes of Q&A and discussion from the participants who attended the live recording on April 20, 2021.

Flexible Hybrid Master Classes are offered on many topics!  Visit this page for entire list and links to more detailed information on each one.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
Event format
United States https://www.questteam.com/classroom/fpmoe.html Business
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United States

- Off Add to Calendar 2021-07-08 00:00:00 2021-08-09 00:00:00 Fundamentals of Product Marketing for the Semiconductor Equipment and Materials Industry, Online Edition United States SEMI.org [email protected] America/Los_Angeles public
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Registration

Webinar

Member Price: $0

Non-Member Price: $99

Can't attend? Register anyway and receive an archive of this webinar on-demand to watch at your own convenience.

Please send all questions, comments and feedback to: [email protected] 

Webinar
United States SAVE YOUR SEAT Memory and Materials in the 3rd Dimension
SEMI EMG Logo

 

 

 

Device scaling has brought about a great increase in the diversity of materials used in semiconductor fabrication. While planar (horizontal) scaling continues to drive great improvements in device density and performance, it has been joined by vertical scaling, adding to the palette of options in the race to develop novel architectures, particularly around device memory.

2DNAND is giving way to 3DNAND, with 3DNAND structures reaching and exceeding 100 layers. This, in turn, creates new challenges for fab equipment, processes, and the materials used to form these novel structures. In this webinar, we will explore trends in material requirements for new generations of device architecture, with special focus on the evolution of 3DNAND devices and the impact of the 3rd dimension on these materials. Mark Thirsk, Managing Partner of Linx Consulting, will address trends impacting the overall materials industry and discuss the significance of 3DNAND to the materials market. He will be followed by Scotten Jones, Founder and President of IC Knowledge, who will review the evolution of 3DNAND devices and the impact of these devices on key materials.

United States

10:00 am
Mike Corbett
MODERATOR
Mike Corbett
Managing Partner
Linx Consulting

Session Introduction

10:03 am
Mark Thirsk
Mark Thirsk
Managing Partner
Linx Consulting

Structure and Evolution of Materials Landscape and Importance of 3DNAND

Biography

The continued strong growth of the semiconductor industry has led to increased demand for wafer fab materials. This talk will assess relevant trends impacting key materials segments, overall wafer fab materials landscape. It will also review key suppliers and importance of 3DNAND to the overall materials industry.

10:26 am
Scotten Jones
Scotten Jones
President & Owner
IC Knowledge

The Evolution of 3D NAND and the Impact on Materials

Biography

Over 90% of NAND bits shipped today are fabricated with a 3D NAND process. 3D NAND is evolving with structural and material changes that will have significant impact on the material types and usages. 3D NAND has two major approaches in production: Floating Gate, a gate-first process with an oxide/poly memory stack was introduced by Intel-Micron, and continues to be used by Intel with SK Hynix set to take over from Intel. And, Charge Trap, a gate-last process with an oxide/nitride stack is in use at Kioxia, Micron, SK Hynix, Samsung, and others. Charge trap uses tungsten as the replacement word line material after etching out the nitride in the memory stack, whereas Floating gate uses poly that is retained as the word-line from the original memory stack. In addition to these high-level distinctions, changes in the placement of the peripheral CMOS, slot fill, word line and channel materials and others will all impact the materials needs. In this talk I will present the 3D NAND family tree and explore the structural changes by company and time, and the impact on material types and usage.

10:47 am

Q&A + Audience Input

10:55 am

EMG Overview & Wrap up

EMG 10:00 am - 11:00 am Off Add to Calendar 2021-03-31 10:00:00 2021-03-31 11:00:00 Memory and Materials in the 3rd Dimension United States SEMI.org [email protected] America/Los_Angeles public
Event format

Registration Details

Member Price: $99.00

Note:  Use company email address to log in for automatic recognition as a member.  Members must be current SEMI Members for member discounts.

Non-Member Price: $199.00

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Advanced Energy
AMSC
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During the workshop recording, you will hear perspectives from the key stakeholder segments and develop a greater understanding of the overall efforts and progress of the task force.

The workshop is focused on diagnosing and improving SEMI F47, Specification for Semiconductor Processing Equipment Voltage Sag Immunity, widely adopted across the industry, the governing standard that defines voltage sag test levels and requirements for semiconductor tools.

Since the implementation of SEMI F47, the vulnerability of semiconductor manufacturing to single-phase and two-phase voltage sags has improved greatly. However, semiconductor manufacturers continue to experience significant product loss and downtime due to voltage sag events.

Given the ongoing issues with semiconductor plant downtime, a new SEMI Voltage Sag Immunity Task Force was formed to take a fresh look at the issue. The workshop and the task force:

  • Reviews the characteristics of the power quality events that cause downtime.
  • Takes a new look at the sensitivities in the process equipment.
  • Determines any potential adjustments to equipment design, facility design, utility systems, or SEMI Standards to further reduce voltage sag induced losses by the semiconductor industry.

Speaker Biographies

United States

10:00 am - 10:05 am
James Amano
James Amano
Sr. Director, Standards
SEMI

Welcome

10:05 am - 10:25 am
Mark Stephens EPRI
Mark Stephens
Principal Project Manager & Leader, Voltage Sag Immunity Task Force
EPRI

Introduction to the SEMI Voltage Sag Immunity Task Force Effort

A review of the key objectives of the voltage sag task force will be discussed along with the characteristics of the power quality events that are still causing semiconductor plant process downtime. A new look at the sensitivities in the tooling and process equipment is required to determine any potential adjustments to equipment design, facility design, utility systems or standards to further reduce voltage sag induced losses by the semiconductor industry. This important work will help utilities, semiconductor manufacturers, and tool equipment providers to better understand the tolerance and susceptibility of today’s generation of semiconductor processing tools and then to develop effective strategies to improve uptime and lower product losses due not only to single-phase (Type I) and two-phase (Type II) voltage sag events but for three-phase (Type III) events as well.

10:25 am - 10:50 am
Clay Burns
Clayton Burns
Principal Engineer
National Grid

Regional Voltage Sags- Importance of Addressing Three-Phase Voltage Sags in SEMI F47

A review of voltage sags at a National Grid substation which were produced by two lightning-caused three-phase transmission faults at locations fairly remote to the substation.  This will show the regional effect of transmission level faults on voltage.  The voltage sags will be compared to the existing SEMI-F47 standard and the accepted sag definition.  Additionally, a proposed regional voltage sag study will be considered in light of the changing make-up of the future electric system and the influx of large inverter-based resources.

10:50 am - 11:15 am
Ed McGann
Ed McGann
Manager of Engineering
VELCO

Utility Dynamic VAR device fault response, fault mitigation techniques, and power quality measures addressed with protection design

Co- presenters:
Greg Rieder, GlobalFoundries
Josh Burroughs, VELCO
John Fiske, VELCO

VELCO recently conducted a refurbishment of its STATCOM facility as part of a planned controls system upgrade. The system planning need for this facility is to provide area voltage support during transmission system contingencies. The refurbishment project team recognized the benefits of the STATCOM’s ability to provide voltage support during system faults and specified fault performance requirements in the vendor specifications. This presentation will discuss those performance requirements, review pre and post project upgrade system fault record’s and review project lessons learned. The second half of the presentation will cover utility fault mitigation design strategies for substation and transmission line assets as well as protective relaying techniques to improve power quality

11:15 am - 11:50 am
Michael Noth Austin Energy
Michael Noth
Power System Managing Engineer
Austin Energy

Seeing it from both sides: The importance of Power Quality Metering at the utility and inside the Fab Distribution System.

In this presentation we will discuss the importance of having power quality-based metering on both sides of the point of connection and other parts of the distribution system.  Mike will share some examples and stories of how important that can be.

11:50 am - 12:15 pm
Tony Sabin DAn Hunt
Dan Sabin & Tony Hunt
Schneider Electric

Waveform captures of voltage sag events can be automatically analyzed by software to determine their source and impact

This presentation will summarize efforts to categorize events automatically that exceed SEMI F47 limits, and to determine the source of those disturbances. It will also present recent efforts to analyze the impact of voltage sags automatically on electrical loads. This research has resulted in automatic algorithms to determine which voltage sags caused downtime and which ones did not. Combining all of this information together provides a means to more precisely and effectively diagnose, manage, and mitigate voltage sag disturbances.

12:15 pm - 12:25 pm
Christopher "Dale" Moffitt
Electrical Systems Engineering
HP

Power Quality and Monitoring, What Does the Data Tell Us?

Power Quality (PQ) has a long and diverse history dating back to the first power grids in the United States. Impacts and concerns about PQ events have evolved and will continue to evolve as our usage of electricity changes. Recent natural disasters have highlighted the importance of a robust power grid and the changing landscape of power generation presents new PQ challenges. As power consumers, a key element in any PQ strategy is adequate power monitoring. This provides the data that can drive conversation with the utility, discover opportunities in our infrastructure and deliver to our facilities the power quality necessary to sustain our businesses.

12:25 pm - 12:50 pm
Willem Meijs ASML
Willem Meijs & Giel Croonen
Low Voltage expert in electrical engineering on supply distribution system for machines
ASML

SEMI F47 and Power Quality Perspectives and Considerations from a Tool OEM

This presentation will address power quality perspectives and consideration from the point of a lithographic tools manufacture. Effect of different test methods on the sag immunity, test strategy on systems, sub-systems and components. How to divide a large installation up in to testable units and maintaining performance integrity. 3 phase type III test generator topology and the impact on harmonic emission and immunity in relation to voltage sag immunity.

12:50 pm - 1:15 pm
Josh Pankratz Advanced Energy
Josh Pankratz
Director of Engineering
Advanced Energy, Inc.

Power Supply Considerations and Standards for Voltage Sag Ride Through

Disturbances in utility power during semiconductor manufacturing can result in loss of revenue, productivity, production yields, and product quality. Focus on power quality continues to grow as new fabs are built in developing regions, which historically suffer from poor infrastructure. Highly automated fabs have driven a demand for systems that can ride through power glitches without shutting down tools and production lines. This presentation examines how power quality, most typically resulting in voltage sag events, affects semiconductor manufacturing and how industry standards and guidelines for tool immunity to those events affect the design of power supplies.

1:15 pm - 1:40 pm
Steve Lewis, Lam Research, square
Steve Lewis
Lam Research

Round Table Discussion & Q&A

1:40 pm - 1:55 pm
Mark Stephens EPRI
Mark Stephens
Principal Project Manager
EPRI

Next Steps for SEMI Voltage Sag Immunity Task Force

Based on the initial findings from utility and fab power quality data, the task force is poised to move forward to re-evaluate semiconductor tools against voltage sag additional characteristics that are indicative of measured events still causing downtime. Utilities, semiconductor fabs and equipment OEMs will be invited to actively participate in this effort to obtain the required test data.

1:55 pm - 2:00 pm

Closing Remarks & Adjourn

James Amano, SEMI

CAST FlexTech FOA ITL MSIG SCIS SE&A Standards EPRI and SEMI logos

SEMI & EPRI invite you to view a workshop held on April 21, 2021, to hear perspectives from all stakeholders on a persistent and difficult issue in microelectronics manufacturing - uncertain power quality. As work on SEMI Standard F47, the Specification for Semiconductor Processing Voltage Sag Immunity, continues this is the opportunity to hear from distinct parts of the supply chain. 

10:00 am - 2:00 pm Off Add to Calendar 2021-04-21 10:00:00 2021-04-21 14:00:00 Voltage Sag Workshop for Manufacturing Fabs SEMI & EPRI invite you to view a workshop held on April 21, 2021, to hear perspectives from all stakeholders on a persistent and difficult issue in microelectronics manufacturing - uncertain power quality. As work on SEMI Standard F47, the Specification for Semiconductor Processing Voltage Sag Immunity, continues this is the opportunity to hear from distinct parts of the supply chain.  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

Registration

Registration

REGISTRATION

  • Registration Close: 6 pm, Friday, July 2(KST)
  • Registration Fee
    • SEMI Members / Students: KRW 250,000
    • Non-members: KRW 300,000
Registration
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SPONSORS

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NOTICE

  • The agenda will be subject to change without notice.
  • Presentation files agreed by speakers will be provided to attendees.
  • Presentations will be provided 24/7 during the event period(July 7-13)

 


 

CONTACT

 

Virtual
South Korea

Keynote

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Dragos Maciuca
Executive Technical Director,
Ford

Automotive Sensors and Applications (English)

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Denis Marcon
Senior Business Development Manager,
imec

The Power of Nanoelectronics to Bring Disruptive Innovation in Healthcare (English)

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Manuel Tagliavini
Principal Analyst,
Omdia

MEMS & Sensors: How the Market Changed after the Year of the Global Pandemic (English) [Cancelled]

Session 1: Life Science/Healthcare

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Seong-Hyok Kim
Seong-Hyok Kim,
LG Electronics

AI Sensing for Home Appliance (Korean)

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Kyung-Hak Choi
Chief Technology Officer,
OPTOLANE Technologies

Digital Real-Time PCR: A Next Generation Nucleic Acid Amplification and Quantification (Korean)

Session 2: Environmental

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Jeff Hawkins
Senior Product Manager
Amphenol Sensors

Trends and Technologies in Indoor Air Quality Sensing (English)

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Cees Draijer
Business Line Director Infrared Imaging,
Teledyne Digital Imaging

Microbolometer Based Thermal Imaging for Automotive Applications: Benefits, Limitations and Trends (English)

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Dohoon Kim
Executive Director, R&D center,
Samyoung S&C

Application of Environmental Sensors for Timely Ventilation of Indoor Air (Korean)

Session 3: Mobility

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Wanil Kim
Executive Director / Head of R&D,
Mando-Hella Electronics

Smart Tire Monitoring Sensor – Enhancing the Safety of ADAS and AD (Korean)

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Tim Wong
Director of Technical Marketing- Autonomous Technology,
NVIDIA

Solution & Platform for ADAS (English)

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Saptarshi Saradindubasu
Head of Program New Mobility Business and Non-Automotive,
Continental AG

Future of Urban Mobility & Impact to City Infrastructure (English)

Session 4: Industrial

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Dave Horsley
CTO,
Chirp Microsystems(a TDK Group Company)

A Wearable Social Distancing Solution Based on Ultrasonic Time-of-Flight Sensors (English)

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Byeng Dong Youn
Ph.D. / CEO & Professor
OnePredict / Seoul National University

Digital Transformation and Beyond for Smart Plants (Korean)

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Greg Nagler
Director OEM,
FLIR Systems

Benefits of Thermal Sensors (LWIR) with Intelligent Analytics for Commercial and Defense Products (English)

Session 5: Core Technologies

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Stanley Park
Sensor systems technical marketing, lead principal engineer,
Infineon

Smart Sensors & Smart Ears (Korean)

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Jeongpyo Kim
CEO,
Cesign

Circuit Consideration in Sensor Application (Korean)

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Bill Grube
Senior Product Marketing Manager,
Energetiq

Advances in Testing and Calibration of Modern Optical Sensors (English)

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Michelle Bourke
Senior Director of Strategic Marketing, Customer Support Business Group (CSBG),
Lam Research

Bridging the Gap Between 200mm and 300mm Manufacturing to Enable Manufacturing Solutions for CMOS Image Sensors and Advanced Inertial MEMS (English)

-

[NOTICE] Due to the Social Distancing for preventing COVID-19, MEMS & Sensor Forum 2021 will be held as a Virtual Conference.

 

Sensors: Transforming How We Live and Work

The age of sensorization is upon us as the world becomes more connected with more devices that monitor our surroundings to transform how we work and live.  
Industry leaders and visionaries will gather at the SEMI MEMS & Sensors Forum 2021, a premier business and technology event in Korea, to provide insights into the latest MEMS and sensors technologies, innovation challenges and opportunities, market trends and new business opportunities. 
Join us to meet speakers, industry leaders and peers as the event features 18 presentations accessible on-demand 24/7.

Off Add to Calendar 2021-07-07 00:00:00 2021-07-13 00:00:00 MEMS & Sensor Forum 2021 [NOTICE] Due to the Social Distancing for preventing COVID-19, MEMS & Sensor Forum 2021 will be held as a Virtual Conference.   Sensors: Transforming How We Live and Work The age of sensorization is upon us as the world becomes more connected with more devices that monitor our surroundings to transform how we work and live.   Industry leaders and visionaries will gather at the SEMI MEMS & Sensors Forum 2021, a premier business and technology event in Korea, to provide insights into the latest MEMS and sensors technologies, innovation challenges and opportunities, market trends and new business opportunities.  Join us to meet speakers, industry leaders and peers as the event features 18 presentations accessible on-demand 24/7. Virtual South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul

Registration

Registration

REGISTRATION

  • Registration Close: 6 pm, Friday, May 7(KST)
  • Registration Fee
    • SEMI Members / Students: KRW 280,000
    • Non-members: 330,000
Registration
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SPONSORS

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Air_0.png SK M_0.pngEntergris_1.pngLinx_1.png KC Tech_0.png 

 

NOTICE

  • The agenda will be subject to change without notice.
  • Presentation files agreed by speakers will be provided to attendees.
  • Live session will be live streamed on Afternoon, Wednesday, May 12(KST).
  • On-demand Session will be provided 24/7 during the event period(May 12-18)

 


 

CONTACT

South Korea

[LIVE] Collaboration – May 12(Wed)

2:00 pm - 2:05 pm

Welcome

2:05 pm - 2:35 pm
Hyun-Goo Kang.jpg
Hyun-Goo Kang
Team Leader of C&C Material Development Team of R&D Center,
SK hynix

Advanced Material Development in Perspectives of CMP & Cleaning Process for Semiconductor (Korean)

2:35 pm - 3:05 pm
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Yun-Ho Kim
Material Technology Group Leader (Foundry Division),
Samsung Electronics

Special Singularity beyond Material; Winter but Opportunity is Coming (Korean)

[On-demand] Keynote (Translation provided)

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Christoph Adelmann
Scientific Director,
imec

Materials for Sub-5-nm Semiconductor Devices (English)

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Bruce Tufts
Vice President, Fab Materials Organization, Global Supply Chain,
Intel

Trends and Observations in Materials Quality at Advanced Process Nodes (English)

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Jijen Vazhaeparambil
Senior Vice President and General Manager, Surfscan and ADE,
KLA

Cost-Effective Fab Material Qualification with Un-patterned Wafer Inspection (English)

[On-demand] Session 1: Emerging Materials and Patterning

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Myoung-Kuy Lee
Manager of Strategic Business Development Field Marketing,
ASML

0.33 NA EUV Systems for High Volume Manufacturing (Korean)

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Takanori Kawakami
General Manager at Lithography Materials Lab. of Fine Electronic Materials Research Laboratories
JSR Corporation

Stochastic Effects on EUV CAR Systems: Investigation of Materials Impact (English)

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Kazuma Yamamoto
Associate Manager, Global R&D,
Merck KGaA, Darmstadt, Germany

Mitigation of Pattern Collapse in EUVL (English)

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Ashutosh Bhabhe
Global Wet Etch and Cleans Applications Manager,
Entegris

Removal of Trace Metals from High Temperature Isopropyl Alcohol (IPA) (English)

[On-demand] Session 2: Materials Integration and Challenges

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Young Hun Kim
Epi. Technical Engineering Team Leader,
SK Siltron

Current Demands on Wafers for CIS (Korean)

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Youngwoo Park
EVP/Senior Technology GM,
Tokyo Electron

Gate-All-Around Transistors: Fundamentals & Structures (Korean)

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Andreas Fischer
Technical Director
Lam Research

Thermal Atomic Layer Etching – An Emerging and Enabling Etching Technology (English)

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Mihaela Balseanu
Sr. Technology Director
Applied Materials

Selective ALD in a Continuous World, New Techniques and Advancements (English)

[On-demand] Session 3: New Waves in Materials

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JinSuk Jeong
Director / Project Leader,
Amkor Technology

Advanced Packaging : Trends, Technologies and Challenges (Korean)

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Luis Andia
RF Business Development Senior Manager,
Soitec

Engineered Substrates for New Waveforms and New Applications (English)

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Marco Arnold
Global R&D Manager,
BASF

Next Generation Metallization Solutions for Advanced Packaging (English)

[On-demand] Session 4: Market Trends

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Bob Johnson
VP Analyst
Gartner

Semiconductor Market Outlook: Strong Growth Ahead (English)

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Brandon Prior
Senior Consultant
Prismark

Advanced Packaging Growth: Focus on New Package Approaches (English)

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Mark Thrisk
Managing Partner,
Linx Consulting

Materials Demand in the Next Supercycle (English)

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[NOTICE] Due to the Social Distancing for preventing COVID-19, SMC Korea 2021 will be held as a Virtual Conference.

 

Materials: Driving a New Leap Forward 

Reshoring, the trade war and mergers and acquisitions have reshaped the global semiconductor supply chain, presenting new challenges. Join us at SMC Korea 2021, May 12-18, for insights into the latest technology trends and how the chip ecosystem can tackle these challenges and uncover new opportunities.  

SMC Korea 2021, a virtual event, will highlight developments across more topics than ever including EUV, packaging, foundry and materials.  

Off Add to Calendar 2021-05-12 00:00:00 2021-05-18 00:00:00 SMC Korea 2021 [NOTICE] Due to the Social Distancing for preventing COVID-19, SMC Korea 2021 will be held as a Virtual Conference.   Materials: Driving a New Leap Forward  Reshoring, the trade war and mergers and acquisitions have reshaped the global semiconductor supply chain, presenting new challenges. Join us at SMC Korea 2021, May 12-18, for insights into the latest technology trends and how the chip ecosystem can tackle these challenges and uncover new opportunities.   SMC Korea 2021, a virtual event, will highlight developments across more topics than ever including EUV, packaging, foundry and materials.   South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
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Join Us Today

Save your seat by registering with the link below.

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SEMI Professional Development Seminar—Connecting College Students to the Semiconductor Industry 

Learn about career opportunities in high tech and acquire valuable, practical information that will help you choose career directions and plan for your success.

Come learn about careers in the semiconductor industry at the SEMI Professional Development Seminar hosted by Arizona State University.

  • Listen to professionals in the industry talk about their roles and find out how to prepare for jobs in the Semiconductors Industry. 
  • Discover semiconductor job opportunities you didn't know existed (internship and entry-level) and how you can prepare for them through job searches, interviews, resumes, and more.
  • Meet with professionals and executives during our speed mentoring, mock interview, and networking sessions.

All majors are welcome! Students with a background in Engineering, Computer Science, Chemistry, Physics, Math, Data Science, and Business are strongly encouraged to attend.

  • Enjoy free food, free swag, and giveaways.
  • Students can come and go.

EVENT is FREE but registration is required. Register now to save your seat! 

Arizona State University
AZ
United States

TUESDAY, MARCH 18, 2025 (Times in MST)

9:00 am - 9:30 am

Check-In

9:30 am - 9:35 am
Chase Farnsworth
Chase Farnsworth
Project Development Executive
Mortenson

Welcome & SEMI Arizona Chapter Introduction

9:35 am - 9:45 am
Kyle Squires
Kyle D. Squires, Ph.D.
Dean, Ira A. Fulton Schools of Engineering
Arizona State University

ASU Welcome

9:45 am - 10:05 am
Kyle Squires
Kyle D. Squires, Ph.D.
Dean, Ira A. Fulton Schools of Engineering, Senior Vice Provost - Engineering, Computing & Technology, Vice Provost - Polytechnic Campus, Founding CEO, Southwest Advanced Prototyping (SWAP) Hub, Foundation Professor, Mechanical & Aerospace Engineering
Arizona State University

Evolution of the Semiconductor Industry in Arizona & Opportunities with the CHIPS Act

10:05 am - 10:20 am
Binil Starly
Professor Binil Starly
SWAP-Hub Consortium Workforce Development Lead & School Director and Professor, School of Manufacturing Systems & Networks (MSN)
Ira A. Fulton Schools of Engineering at Arizona State University

Microelectronics Workforce Development

10:20 am - 10:40 am
Randy Tully
Randy Tully
Chief Executive Officer
ROI Analysis Management Systems

Semiconductors 101: A Brief History of the Semiconductor Industry

10:40 am - 11:00 am
Arlene Lanz
Arlene Lanz
Account Manager - Semiconductors
Hitachi Energy

Your Career Journey in the Industry

11:00 am - 11:20 am
Erin Martin
Erin Coté Martin
Manager, Recruiting & Office Management
Amkor Technology

Personal Branding + Resume Best Practices

11:20 am - 11:40 am
Summer Miller
HR Manager
EVG Group

Interview Like a Pro: Perfect Your Pitch

11:40 am - 11:55 am

Students Pick Up Boxed Lunches

11:55 am - 12:40 pm
Francesca Domingo
Moderator
Francesca Domingo
EMD Electronics
KaylieLam
Kaylie Lam
Senior Engineer, FlipChip Products
Amkor Technology
AlexLee
Alex Lee
Machine Learning Engineer
EMD Electronics
HaidynMoroz
Haidyn Moroz
Systems Engineer
Intel
NateBradford
Nate Bradford
Project Engineer
JE Dunn
Victoria Lanz
Victoria Lanz
General Sales & Marketing Specialist Professional
Hitachi
Thomas Peters
Thomas Peters
ASML

Ask Me Anything Panel Discussion—A Day in the Life of a Former Sun Devil

Bring your questions to the Ask Me Anything PANEL! Moderated by Francesca Domingo, EMD Electronics, panelists will discuss life as a Semiconductor engineer and their transition from Academia to the Semiconductor workforce.

12:40 pm - 1:00 pm

Job & Internship Opportunities; SEMICON West Workforce Pavilion

1:00 pm - 2:00 pm

Network with Exhibiting Industry Leaders

2:00 pm
Francesca Domingo
University/Community Relations, Lead
EMD Electronics

Closing Remarks

Workforce Development

[PDS] Professional Development Seminar
—Organized by SEMI Arizona Chapter
—Collaboration with Arizona State University

This IN-PERSON seminar features an agenda that will help students meet the demands of today's high tech workforce and be successful in their careers. 

9:00 am - 2:00 pm Off Add to Calendar Disabled America/Phoenix
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