The course explores how reliability testing plays a critical role for Flexible Hybrid Electronics throughout the development process. The presentation highlights how it is essential to create a reliability test plan that covers the requirements for EV, DV and finally though PV, in order to insure product reliability and performance.
The instructors discuss how the Molex design process is used to identify risks and challenges for custom FHE applications and how the various reliability test are used evaluate and eliminate the potential risk and challenges.
AGENDA
Overview of Molex Printed Circuits Solutions
FHE challenges & requirements
Overview of reliability testing development process
Reliability test standards
Reliability lab set up
Q&A
The various industry standards related to HMI, FHE, PE, Printed Sensors and other applications are also reviewed in conjunction with usage in reliability testing related to FHE.
Instructors Tom Seputis, Lab Manager, and Dave Rasmussen. Director, PCS Engineering, as they provide an overview of Molex Printed Circuit Solutions and the reliability testing and challenges related to Flexible Hybrid Electronics.
This Master Class is 4th in a series of 4 classes. Classes 1-3, and the series are also available On Demand at the following links:
Flexible Electronics Master Class #4 explores best practices for ensuring reliability of FHE devices throughout the production process. The course is taught by experts from Molex's Printed Circuit Solutions Division which has been successfully building complex and reliable flexible circuits for many advanced applications.
Flexible Electronics Reliability Testing and Challenges
A Flexible Electronics Master Class
12:00 am - 12:00 am
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#4 Reliability Measurement and Test for Flexible Electronics
United States
Robert Street
Fellow, Palo Alto Research Center
The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS
A Flexible Electronics Master Class
10:00 am - 12:00 pm
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Add to Calendar2020-09-24 10:00:002020-09-24 12:00:00Flexible Electronics Master Class#3: IntegrationThe presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
United StatesSEMI.org[email protected]America/Vancouverpublic
America/Vancouver
#4 Reliability Measurement and Test for Flexible Electronics
United States
Robert Street
Fellow, Palo Alto Research Center
The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS
A Flexible Electronics Master Class
10:00 am - 12:00 pm
Off
Add to Calendar2020-09-24 10:00:002020-09-24 12:00:00Flexible Electronics Master Class#3: IntegrationThe presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
United StatesSEMI.org[email protected]America/Vancouverpublic
America/Vancouver
printing fine lines, pads and pad pitches with < 100um
logic circuits and resistors
bonding integrated circuits
integrating sensors of different types on flexible substrates without significant performance degradation
pick and place with micron-level accuracy
MASTER CLASS SERIES
This Master Class is 3rd in a series of 4 classes. Classes 1 and 2 are available On Demand. Class 4 will cover Building in Reliability Testing and is now available for registration.
The 1-hour class describes techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS
A Flexible Electronics Master Class
12:00 am - 12:00 am
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America/Vancouver
This course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
Cornell University has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano ElectroMechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. This presentation highlights that, as well as a decision tree based AI model for predicting lithography outcomes.
The AI work used as the basis for the course has been applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience have been developed.
The course provides a useful basis upon which to formulate AI strategies for all thin film manufacturing sites.
This on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
Artificial Intelligence in Thin Film Manufacturing
A Flexible Electronics Master Class
10:00 am - 12:00 pm
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Add to Calendar2020-08-18 10:00:002020-08-18 12:00:00Flexible Electronics Master Class#2: AI in MfgThis on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.United StatesSEMI.org[email protected]America/Vancouverpublic
America/Vancouver
This course describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
The team from Cornell has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano ElectroMechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. We report on a decision tree based AI model for predicting lithography outcomes.
This work is being applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience are developed.
This course describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
Originally recorded August, 2020, this course is now offered On-Demand.
Artificial Intelligence in Thin Film Manufacturing
The COVID Pandemic has caused a worldwide shortage of many consumable supplies that SEMI members require. Increased safety and PPE usage by new industries have strained the supply chain, forcing buyers to identify and establish relations with new providers, as many providers are in allocation mode working only with established customers. Thomas Scientific is hosting this session to provide insights into how to address this current predicament.
United States
10:00 am
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10:05 am
MODERATOR
Darryl Buck
Head of SEMI’s Cost Saving Program, Group Purchasing Solutions (GPS)
Welcome and Intro
Biography: As Business Director in Supply Chain, Darryl helped Lam Research’s found CapOneSource (later named GPS), an Semi industry trade group supporting the business needs of the capital equipment suppliers. Darryl held various Sales, Marketing, and Supply chain roles at both Applied Materials and Lam Research before moving to SEMI in 2013. Darryl held executive Sales and Marketing roles in the aerospace industry after receiving his MBA from Cal Berkley and double DB from Carnegie Mellon.
10:05 am
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10:10 am
Kareem Dossa
Senior Vice President, Thomas Scientific
Problem Statement - PPE Shortage
Biography: Kareem Dossa cultivated his expertise in leadership, sales, business development, and general management through 20 years of professional experience in start-ups and Fortune 500 distribution, product, technology and service companies in life science, clinical trials, healthcare markets, cleanroom, and industrial markets. Kareem has held Senior VP positions at BioCision, VWR International and Merch KGaA and has an MBA from Pepperdine and a BS from Washington State.
10:10 am
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10:15 am
Problem Impact
10:15 am
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10:20 am
John Westland
Vice President, Sales and Marketing, Thomas Scientific (American CleanStat)
Steps Procurement Individuals Can Take to Secure Supplies
Biography: John Westland brings 37 years of industry experience in the distribution and sales of cleanroom and static safe assembly products and supplies experience to Thomas Scientific CE Cleanroom Solutions.
John started as a technical field salesrep for American Scientific Products and Baxter Scientific Products in the 1980’s. In 1988 John was the founder and President of Eastwater Scientific Products which was a cleanroom and static control supplies distributor which was acquired by Cintas Cleanroom Resources in 1998. In 2000 he started a Microstat Labs, a cleanroom products and materials test lab John was also the founder and President of American Cleanstat from 2003 through 2018 until it was acquired by the Carlyle Private Equity Group in 2018. American Cleanstat was coupled together with Thomas Scientific and now represents the new CE Cleanroom Solutions Division of Thomas Scientific. John is the current director of CE Technology for Thomas Scientific CE Cleanroom Solutions Division.
John has also been a contributing member of the Safety Marketing Group of North America for PPE products and has been a participating past member of the IEST. John holds a BS in Business Administration - Finance Degree from the University of Southern California and is married to Shannon Needham. He has two sons, Jack 28 and Nick Westland 24, a professional free-ride skier and a stepson, Nikolas Needham who is an NFL football player playing defensive back with the Miami Dolphins.
10:20 am
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10:25 am
Q&A
10:25 am
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10:30 am
Darryl Buck
Head of SEMI’s Cost Saving Program, Group Purchasing Solutions (GPS)
Supply Assurance During Times of Shortages – SEMI CSP Back to Work
10:00 am - 10:30 am
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Add to Calendar2020-07-28 10:00:002020-07-28 10:30:00Supply Assurance During Times of Shortages – SEMI CSP Back to Work Session 1Session 1United StatesSEMI.org[email protected]America/Los_Angelespublic
As new materials and process emerge to enable the integration of high performance micro-electronics into paper-thin, flexible hybrid electronics (FHE), there is an increasing demand for new power sources that also support the goals of ultra-thin and flexible.
Among the key challenges is the ability to achieve high energy densities as the battery thickness decreases to a point where the packaging becomes an increasing fraction of the total volume. The challenge is further complicated by the demanding duty cycles for many FHE systems that require both high power (periodic, large current bursts) and high energy (operation across many years in some cases).
At the same time, the new power sources must meet the typical high standards for safety, durability, compatibility with a wide range of storage and operation temperatures, and the needs to support effective integration into the FHE platforms.
The session reviews the challenges and progress for new power supplies that are emerging to meet the needs of the FHE community.
Course provided by Brian Berland, Chief Technology Officer, ITN Energy Systems
#2 AI in Thin-Film Manufacturing (2 hours)
This session describes how machine learning and AI-based approaches to research, development, and production brings advantages to clean room processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
The team from Cornell University has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano Electro Mechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. The work is applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience are developed and explained in this session.
Course instructors includes Amit Lal, Chris Ober, Peter Doerschuk, Banyamin Davaji from Cornell University, and Garry Bordonaro and Jeremy Clark with the Cornell NanoScale Facility.
#3 Hybrid Integration Techniques for Flexible Electronics (1.5 hours)
The 1-hour class describes techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
Specific topics covered in this session include:
printing interconnects
printing fine lines, pads and pad pitches with < 100um
logic circuits and resistors
bonding integrated circuits
integrating sensors of different types on flexible substrates without significant performance degradation
pick and place with micron-level accuracy
Course instruction given by Robert Street, Palo Alto Research Center
#4 Flexible Electronics Reliability Testing and Challenges (1.5 hours)
This online Reliability Engineering Master class is for people with an engineering or science background, who want to learn and use methods and techniques to conduct reliability analysis and improvement. This course is intentionally structured to show you a wide variety of reliability engineering knowledge and important applications.
This session outlines the foundation reliability engineering concepts and methods, and how to apply fundamental failure investigation techniques. You will also learn a range of effective workplace improvement solutions and risk analyses used to implement reliability engineering strategies.
Course Instruction given by Dave Rasmussen and Tom Seputis, Molex.
Flexible Hybrid Master Classes for 2021 are offered on many additional topics! Visit this page for entire list and links to more detailed information on each one.
SEMI FlexTech organizes this series of Flexible Electronics Master Classes on topics proving most challenging to the design, manufacture and use of flexible and printed electronics. The series enables product designers, integrators, and others new to the fields to evaluate technologies and components and make the best choices for their product.
The courses were offered to a live audience July-October, 2020, and are now available on-demand.
Flexible Electronics Master Class Series
Power Sources, Integration & AI and Reliability in Thin-Film Manufacturing
Master Class Abstract:As new materials and process emerge to enable the integration of high performance micro-electronics into paper-thin, flexible hybrid electronics (FHE), there is an increasing demand for new power sources that also support the goals of ultra-thin and flexible.
Among the key challenges is the ability to achieve high energy densities as the battery thickness decreases to a point where the packaging becomes an increasing fraction of the total volume. The challenge is further complicated by the demanding duty cycles for many FHE systems that require both high power (periodic, large current bursts) and high energy (operation across many years in some cases).
At the same time, the new power sources must meet the typical high standards for safety, durability, compatibility with a wide range of storage and operation temperatures, and the needs to support effective integration into the FHE platforms.
The webinar will review challenges and progress for new power supplies that are emerging to meet the needs of the FHE community.
SEMI FlexTech offers a series of Flexible Electronics Master Classes on topics proving most challenging to the use of flexible and printed electronics. The series enables product designers, integrators, and others new to the fields to evaluate technologies and components and make the best choices for their product.
The first course in the series is on Flexible Power Sources: Challenges, Progress and Integration. This course was offered to a live audience on July 29, 2020, and is now available on-demand.
Flexible Power Sources: Challenges, Progress, and Integration
The first in the FlexTech Master Class Series
11:00 am - 12:00 pm
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America/Vancouver
Master Class Abstract:As new materials and process emerge to enable the integration of high performance micro-electronics into paper-thin, flexible hybrid electronics (FHE), there is an increasing demand for new power sources that also support the goals of ultra-thin and flexible.
Among the key challenges is the ability to achieve high energy densities as the battery thickness decreases to a point where the packaging becomes an increasing fraction of the total volume. The challenge is further complicated by the demanding duty cycles for many FHE systems that require both high power (periodic, large current bursts) and high energy (operation across many years in some cases).
At the same time, the new power sources must meet the typical high standards for safety, durability, compatibility with a wide range of storage and operation temperatures, and the needs to support effective integration into the FHE platforms.
The webinar reviews challenges and progress for new power supplies that are emerging to meet the needs of the FHE community.
SEMI FlexTech offers a series of Flexible Electronics Master Classes on topics proving most challenging to the use of flexible and printed electronics. The series enables product designers, integrators, and others new to the fields to evaluate technologies and components and make the best choices for their product.
The first course in the series is on Flexible Power Sources: Challenges, Progress and Integration. This course was offered to a live audience on July 29, 2020, and is now available on-demand.
Flexible Power Sources: Challenges, Progress, and Integration
The first in the FlexTech Master Class Series
12:00 am - 12:00 am
Off
Add to Calendar Disabled
America/Vancouver
