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- Off Add to Calendar 2020-09-08 00:00:00 2020-10-15 00:00:00 Fundamentals of Product Marketing 2.0 United States SEMI.org [email protected] America/Los_Angeles public
Open to all.
Not able to attend? Register anyway. We'll send you a link to the webinar so you can view it at your own convenience.
With COVID-19 speeding up elements of digital transformation and requirements for the workforce of the future, SEMI President and CEO Ajit Manocha welcomes you to join us as we explore the implications of current labor and workforce development trends for organizations and the broader electronics manufacturing and design supply chain. We will focus in on developing the workforce required to secure the semiconductor industry’s path to $1 Trillion, with data analysis of industry trends and a look at strategies and practices to action the insights.
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Biography: Rob Sentz is the chief innovation officer at Emsi, where he leads in furthering Emsi’s vision through new and updated products for higher education, economic development, workforce planning, and human resources.
Prior to his current position, he served as Emsi’s vice president of marketing from 2006 to 2014, managing a staff of writers and designers in producing newsletters, articles, white papers, and other materials on a broad range of economic and labor market topics. Sentz is a Forbes contributor and has taught as an adjunct faculty member at NYU School of Professional Studies in New York City.
Biography: As Senior Vice President for Partnerships, Dawn Lang oversees partnership development driving enhanced value for CAEL's clients and stakeholder community in higher education, workforce development and corporate environments. She leads a dedicated team of professionals who deliver on CAEL's promise and value proposition, passionately supporting adult learners as they pursue education and career goals.
Lang's background includes over 20 years of sales, business development and marketing experience working with Fortune 500s to startups in life science, higher education, consumer packaged goods, technology and non-profits.
Pre-registration period: Sep 1 (Tue) - Oct 15 (Tue), 2020
Registration fee
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Sponsorship Opportunities: JoAnn Lee([email protected])
Sera Jung(+82-2-531-7831 / [email protected])
Room 401, COEX, Seoul
Gangnam-gu
Seoul
South Korea
Materials Driving Transformation of Industry
With advanced materials now a critical enabler of semiconductor growth applications, industry leaders have emphasized significance of innovation in materials. SMC Korea 2020, the premier conference on electronic materials, will gather top executives from every segment of semiconductor manufacturing to provide the most up-to-date developments in areas of advanced materials.
Join us at SMC Korea 2020 to advance your knowledges and network with the global leaders and professionals.
The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. The changes we will all experience include the nature of car ownership, how the car is powered, increased safety, and driver automation. Each of these changes is only possible with advances in electronics hardware and systems, electronics assembly, and semiconductor packaging. Indium Corporation’s Dr. Andy Mackie will discuss the impact of these changes on electronics assembly and packaging, and the impact of mission profiles on component and systems level reliability.
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Biography: Dr. Mackie is the Senior Product Manager for Indium Corporation’s Semiconductor and Advanced Assembly Materials. He is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. Andy’s professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. Dr. Mackie also has responsibility for the development of Indium Corporation’s Applied Technology Roadmap.
Dr. Mackie has been an invited International keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation.
For sponsorship opportunities, please contact:
Cassandra Melvin, Director of Operations at [email protected]
Adi Hodorov, Manager, Sales and Key Accounts at [email protected]
If you are interested in partnering with us or have any questions about press and media, please contact us.
Serena Brischetto, Senior Manager, Marketing and Communications at [email protected]
The SEMI SMART Manufacturing Initiative is a global effort to promote awareness and interest about smart manufacturing and industry 4.0. Through their collaborative efforts, the members of the SEMI SMART Manufacturing Regional Chapters meet regularly, both virtually and in person, to facilitate discussions for solving challenges and issues that impact manufacturing.
The webinar will provide an update on pressing critical topics derived from key players across the supply chain and is recommended to semiconductor professionals interested in the European smart manufacturing trends and market.
Topics include:
Online, Central European Time
Germany
Registration Includes:
Member Price: $25
Non-Member Price: $49
Non-Member Price for Government, Military, and Academia Non-Members: $35
To receive this price, contact Michelle Fabiano at [email protected] for discount code. Must have a valid .gov, .mil or .edu email address
Students: $0
To receive this price, contact Gity Samadi at [email protected] for discount code. Must have a valid student ID card.
The course explores how reliability testing plays a critical role for Flexible Hybrid Electronics throughout the development process. The presentation highlights how it is essential to create a reliability test plan that covers the requirements for EV, DV and finally though PV, in order to insure product reliability and performance.
The instructors discuss how the Molex design process is used to identify risks and challenges for custom FHE applications and how the various reliability test are used evaluate and eliminate the potential risk and challenges.
AGENDA
The various industry standards related to HMI, FHE, PE, Printed Sensors and other applications are also reviewed in conjunction with usage in reliability testing related to FHE.
Instructors Tom Seputis, Lab Manager, and Dave Rasmussen. Director, PCS Engineering, as they provide an overview of Molex Printed Circuit Solutions and the reliability testing and challenges related to Flexible Hybrid Electronics.
This Master Class is 4th in a series of 4 classes. Classes 1-3, and the series are also available On Demand at the following links:
#1 Flexible Power Sources: Challenges, Progress and Integration
#2 Artificial Intelligence in Thin Film Manufacturing
#3 Integration Techniques for Flexible Electronics
Read more about the full Master Class Series
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Flexible Electronics Master Class #4 explores best practices for ensuring reliability of FHE devices throughout the production process. The course is taught by experts from Molex's Printed Circuit Solutions Division which has been successfully building complex and reliable flexible circuits for many advanced applications.
Registration Includes:
Member Price: $25
Non-Member Price: $49
Non-Member Price for Government, Military, and Academia Non-Members: $35
To receive this price, contact Michelle Fabiano at [email protected] for discount code. Must have a valid .gov, .mil or .edu email address
Students: $0
To receive this price, contact Gity Samadi at [email protected] for discount code. Must have a valid student ID card.
This Master Class is 3rd in a series of 4 classes. Classes 1 and 2 are available On Demand. Class 4 will be announced shortly.
#1 Flexible Power Sources: Challenges, Progress and Integration
#2 Artificial Intelligence in Thin Film Manufacturing
#4 Reliability Measurement and Test for Flexible Electronics
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The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
Registration Includes:
Member Price: $25
Non-Member Price: $49
Non-Member Price for Government, Military, and Academia Non-Members: $35
To receive this price, contact Michelle Fabiano at [email protected] for discount code. Must have a valid .gov, .mil or .edu email address
Students: $0
To receive this price, contact Gity Samadi at [email protected] for discount code. Must have a valid student ID card.
This Master Class is 3rd in a series of 4 classes. Classes 1 and 2 are available On Demand. Class 4 will be announced shortly.
#1 Flexible Power Sources: Challenges, Progress and Integration
#2 Artificial Intelligence in Thin Film Manufacturing
#4 Reliability Measurement and Test for Flexible Electronics
United States
The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
Registration Includes:
Member Price: $25
Non-Member Price: $49
Non-Member Price for Government, Military, and Academia Non-Members: $35
To receive this price, contact Michelle Fabiano at [email protected] for discount code. Must have a valid .gov, .mil or .edu email address
Students: $0
To receive this price, contact Gity Samadi at [email protected] for discount code. Must have a valid student ID card.
Specific topics covered in this course include:
This Master Class is 3rd in a series of 4 classes. Classes 1 and 2 are available On Demand. Class 4 will cover Building in Reliability Testing and is now available for registration.
#1 Flexible Power Sources: Challenges, Progress and Integration
#2 Artificial Intelligence in Thin Film Manufacturing
#4 Overview of FHE Reliability Testing and Challenges
Read more about the full Master Class Series
United States
The 1-hour class describes techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
Registration Includes:
Member Price: $25
Non-Member Price: $49
Non-Member Price for Government, Military, and Academia Non-Members: $35
To receive this price, contact Michelle Fabiano at [email protected] for discount code. Must have a valid .gov, .mil or .edu email address
Students: $0
To receive this price, contact Gity Samadi at [email protected] for discount code. Must have a valid student ID card.
This course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
Cornell University has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano ElectroMechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. This presentation highlights that, as well as a decision tree based AI model for predicting lithography outcomes.
The AI work used as the basis for the course has been applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience have been developed.
The course provides a useful basis upon which to formulate AI strategies for all thin film manufacturing sites.
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This on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
