Device scaling has brought about a great increase in the diversity of materials used in semiconductor fabrication. While planar (horizontal) scaling continues to drive great improvements in device density and performance, it has been joined by vertical scaling, adding to the palette of options in the race to develop novel architectures, particularly around device memory.
2DNAND is giving way to 3DNAND, with 3DNAND structures reaching and exceeding 100 layers. This, in turn, creates new challenges for fab equipment, processes, and the materials used to form these novel structures. In this webinar, we will explore trends in material requirements for new generations of device architecture, with special focus on the evolution of 3DNAND devices and the impact of the 3rd dimension on these materials. Mark Thirsk, Managing Partner of Linx Consulting, will address trends impacting the overall materials industry and discuss the significance of 3DNAND to the materials market. He will be followed by Scotten Jones, Founder and President of IC Knowledge, who will review the evolution of 3DNAND devices and the impact of these devices on key materials.
The continued strong growth of the semiconductor industry has led to increased demand for wafer fab materials. This talk will assess relevant trends impacting key materials segments, overall wafer fab materials landscape. It will also review key suppliers and importance of 3DNAND to the overall materials industry.
10:26 am
Scotten Jones
President & Owner
IC Knowledge
The Evolution of 3D NAND and the Impact on Materials
Over 90% of NAND bits shipped today are fabricated with a 3D NAND process. 3D NAND is evolving with structural and material changes that will have significant impact on the material types and usages. 3D NAND has two major approaches in production: Floating Gate, a gate-first process with an oxide/poly memory stack was introduced by Intel-Micron, and continues to be used by Intel with SK Hynix set to take over from Intel. And, Charge Trap, a gate-last process with an oxide/nitride stack is in use at Kioxia, Micron, SK Hynix, Samsung, and others. Charge trap uses tungsten as the replacement word line material after etching out the nitride in the memory stack, whereas Floating gate uses poly that is retained as the word-line from the original memory stack. In addition to these high-level distinctions, changes in the placement of the peripheral CMOS, slot fill, word line and channel materials and others will all impact the materials needs. In this talk I will present the 3D NAND family tree and explore the structural changes by company and time, and the impact on material types and usage.
10:00 am - 11:00 am
Off
Add to Calendar2021-03-31 10:00:002021-03-31 11:00:00Memory and Materials in the 3rd DimensionUnited StatesSEMI.org[email protected]America/Los_Angelespublic
During the workshop recording, you will hear perspectives from the key stakeholder segments and develop a greater understanding of the overall efforts and progress of the task force.
The workshop is focused on diagnosing and improving SEMI F47, Specification for Semiconductor Processing Equipment Voltage Sag Immunity, widely adopted across the industry, the governing standard that defines voltage sag test levels and requirements for semiconductor tools.
Since the implementation of SEMI F47, the vulnerability of semiconductor manufacturing to single-phase and two-phase voltage sags has improved greatly. However, semiconductor manufacturers continue to experience significant product loss and downtime due to voltage sag events.
Given the ongoing issues with semiconductor plant downtime, a new SEMI Voltage Sag Immunity Task Force was formed to take a fresh look at the issue. The workshop and the task force:
Reviews the characteristics of the power quality events that cause downtime.
Takes a new look at the sensitivities in the process equipment.
Determines any potential adjustments to equipment design, facility design, utility systems, or SEMI Standards to further reduce voltage sag induced losses by the semiconductor industry.
Principal Project Manager & Leader, Voltage Sag Immunity Task Force
EPRI
Introduction to the SEMI Voltage Sag Immunity Task Force Effort
A review of the key objectives of the voltage sag task force will be discussed along with the characteristics of the power quality events that are still causing semiconductor plant process downtime. A new look at the sensitivities in the tooling and process equipment is required to determine any potential adjustments to equipment design, facility design, utility systems or standards to further reduce voltage sag induced losses by the semiconductor industry. This important work will help utilities, semiconductor manufacturers, and tool equipment providers to better understand the tolerance and susceptibility of today’s generation of semiconductor processing tools and then to develop effective strategies to improve uptime and lower product losses due not only to single-phase (Type I) and two-phase (Type II) voltage sag events but for three-phase (Type III) events as well.
10:25 am
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10:50 am
Clayton Burns
Principal Engineer
National Grid
Regional Voltage Sags- Importance of Addressing Three-Phase Voltage Sags in SEMI F47
A review of voltage sags at a National Grid substation which were produced by two lightning-caused three-phase transmission faults at locations fairly remote to the substation. This will show the regional effect of transmission level faults on voltage. The voltage sags will be compared to the existing SEMI-F47 standard and the accepted sag definition. Additionally, a proposed regional voltage sag study will be considered in light of the changing make-up of the future electric system and the influx of large inverter-based resources.
10:50 am
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11:15 am
Ed McGann
Manager of Engineering
VELCO
Utility Dynamic VAR device fault response, fault mitigation techniques, and power quality measures addressed with protection design
VELCO recently conducted a refurbishment of its STATCOM facility as part of a planned controls system upgrade. The system planning need for this facility is to provide area voltage support during transmission system contingencies. The refurbishment project team recognized the benefits of the STATCOM’s ability to provide voltage support during system faults and specified fault performance requirements in the vendor specifications. This presentation will discuss those performance requirements, review pre and post project upgrade system fault record’s and review project lessons learned. The second half of the presentation will cover utility fault mitigation design strategies for substation and transmission line assets as well as protective relaying techniques to improve power quality
11:15 am
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11:50 am
Michael Noth
Power System Managing Engineer
Austin Energy
Seeing it from both sides: The importance of Power Quality Metering at the utility and inside the Fab Distribution System.
In this presentation we will discuss the importance of having power quality-based metering on both sides of the point of connection and other parts of the distribution system. Mike will share some examples and stories of how important that can be.
11:50 am
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12:15 pm
Dan Sabin & Tony Hunt
Schneider Electric
Waveform captures of voltage sag events can be automatically analyzed by software to determine their source and impact
This presentation will summarize efforts to categorize events automatically that exceed SEMI F47 limits, and to determine the source of those disturbances. It will also present recent efforts to analyze the impact of voltage sags automatically on electrical loads. This research has resulted in automatic algorithms to determine which voltage sags caused downtime and which ones did not. Combining all of this information together provides a means to more precisely and effectively diagnose, manage, and mitigate voltage sag disturbances.
12:15 pm
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12:25 pm
Christopher "Dale" Moffitt
Electrical Systems Engineering
HP
Power Quality and Monitoring, What Does the Data Tell Us?
Power Quality (PQ) has a long and diverse history dating back to the first power grids in the United States. Impacts and concerns about PQ events have evolved and will continue to evolve as our usage of electricity changes. Recent natural disasters have highlighted the importance of a robust power grid and the changing landscape of power generation presents new PQ challenges. As power consumers, a key element in any PQ strategy is adequate power monitoring. This provides the data that can drive conversation with the utility, discover opportunities in our infrastructure and deliver to our facilities the power quality necessary to sustain our businesses.
12:25 pm
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12:50 pm
Willem Meijs & Giel Croonen
Low Voltage expert in electrical engineering on supply distribution system for machines
ASML
SEMI F47 and Power Quality Perspectives and Considerations from a Tool OEM
This presentation will address power quality perspectives and consideration from the point of a lithographic tools manufacture. Effect of different test methods on the sag immunity, test strategy on systems, sub-systems and components. How to divide a large installation up in to testable units and maintaining performance integrity. 3 phase type III test generator topology and the impact on harmonic emission and immunity in relation to voltage sag immunity.
12:50 pm
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1:15 pm
Josh Pankratz
Director of Engineering
Advanced Energy, Inc.
Power Supply Considerations and Standards for Voltage Sag Ride Through
Disturbances in utility power during semiconductor manufacturing can result in loss of revenue, productivity, production yields, and product quality. Focus on power quality continues to grow as new fabs are built in developing regions, which historically suffer from poor infrastructure. Highly automated fabs have driven a demand for systems that can ride through power glitches without shutting down tools and production lines. This presentation examines how power quality, most typically resulting in voltage sag events, affects semiconductor manufacturing and how industry standards and guidelines for tool immunity to those events affect the design of power supplies.
1:15 pm
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1:40 pm
Steve Lewis
Lam Research
Round Table Discussion & Q&A
1:40 pm
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1:55 pm
Mark Stephens
Principal Project Manager
EPRI
Next Steps for SEMI Voltage Sag Immunity Task Force
Based on the initial findings from utility and fab power quality data, the task force is poised to move forward to re-evaluate semiconductor tools against voltage sag additional characteristics that are indicative of measured events still causing downtime. Utilities, semiconductor fabs and equipment OEMs will be invited to actively participate in this effort to obtain the required test data.
SEMI & EPRI invite you to view a workshop held on April 21, 2021, to hear perspectives from all stakeholders on a persistent and difficult issue in microelectronics manufacturing - uncertain power quality. As work on SEMI Standard F47, the Specification for Semiconductor Processing Voltage Sag Immunity, continues this is the opportunity to hear from distinct parts of the supply chain.
Voltage Sag for Manufacturing Fabs - A Workshop
10:00 am - 2:00 pm
Off
Add to Calendar2021-04-21 10:00:002021-04-21 14:00:00Voltage Sag Workshop for Manufacturing FabsSEMI & EPRI invite you to view a workshop held on April 21, 2021, to hear perspectives from all stakeholders on a persistent and difficult issue in microelectronics manufacturing - uncertain power quality. As work on SEMI Standard F47, the Specification for Semiconductor Processing Voltage Sag Immunity, continues this is the opportunity to hear from distinct parts of the supply chain. United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
[NOTICE] Due to the Social Distancing for preventing COVID-19, MEMS & Sensor Forum 2021 will be held as a Virtual Conference.
Sensors: Transforming How We Live and Work
The age of sensorization is upon us as the world becomes more connected with more devices that monitor our surroundings to transform how we work and live.
Industry leaders and visionaries will gather at the SEMI MEMS & Sensors Forum 2021, a premier business and technology event in Korea, to provide insights into the latest MEMS and sensors technologies, innovation challenges and opportunities, market trends and new business opportunities.
Join us to meet speakers, industry leaders and peers as the event features 18 presentations accessible on-demand 24/7.
MEMS & Sensor Forum 2021
July 7(Wed) - 13(Tue), 2021 | Online
Off
Add to Calendar2021-07-07 00:00:002021-07-13 00:00:00MEMS & Sensor Forum 2021[NOTICE] Due to the Social Distancing for preventing COVID-19, MEMS & Sensor Forum 2021 will be held as a Virtual Conference.
Sensors: Transforming How We Live and Work
The age of sensorization is upon us as the world becomes more connected with more devices that monitor our surroundings to transform how we work and live.
Industry leaders and visionaries will gather at the SEMI MEMS & Sensors Forum 2021, a premier business and technology event in Korea, to provide insights into the latest MEMS and sensors technologies, innovation challenges and opportunities, market trends and new business opportunities.
Join us to meet speakers, industry leaders and peers as the event features 18 presentations accessible on-demand 24/7.Virtual South KoreaSEMI.org[email protected]Asia/Seoulpublic
Asia/Seoul
[NOTICE] Due to the Social Distancing for preventing COVID-19, SMC Korea 2021 will be held as a Virtual Conference.
Materials: Driving a New Leap Forward
Reshoring, the trade war and mergers and acquisitions have reshaped the global semiconductor supply chain, presenting new challenges. Join us at SMC Korea 2021, May 12-18, for insights into the latest technology trends and how the chip ecosystem can tackle these challenges and uncover new opportunities.
SMC Korea 2021, a virtual event, will highlight developments across more topics than ever including EUV, packaging, foundry and materials.
SMC (Strategic Materials Conference) Korea 2021
May 12-18, 2021 | Online Webinar
Off
Add to Calendar2021-05-12 00:00:002021-05-18 00:00:00SMC Korea 2021[NOTICE] Due to the Social Distancing for preventing COVID-19, SMC Korea 2021 will be held as a Virtual Conference.
Materials: Driving a New Leap Forward
Reshoring, the trade war and mergers and acquisitions have reshaped the global semiconductor supply chain, presenting new challenges. Join us at SMC Korea 2021, May 12-18, for insights into the latest technology trends and how the chip ecosystem can tackle these challenges and uncover new opportunities.
SMC Korea 2021, a virtual event, will highlight developments across more topics than ever including EUV, packaging, foundry and materials. South KoreaSEMI.org[email protected]Asia/Seoulpublic
Asia/Seoul
SEMI Professional Development Seminar—Connecting College Students to the Semiconductor Industry
Learn about career opportunities in high tech and acquire valuable, practical information that will help you choose career directions and plan for your success.
Come learn about careers in the semiconductor industry at the SEMI Professional Development Seminar hosted by Arizona State University.
Listen to professionals in the industry talk about their roles and find out how to prepare for jobs in the Semiconductors Industry.
Discover semiconductor job opportunities you didn't know existed (internship and entry-level) and how you can prepare for them through job searches, interviews, resumes, and more.
Meet with professionals and executives during our speed mentoring, mock interview, and networking sessions.
All majors are welcome! Students with a background in Engineering, Computer Science, Chemistry, Physics, Math, Data Science, and Business are strongly encouraged to attend.
Enjoy free food, free swag, and giveaways.
Students can come and go.
EVENT is FREE but registration is required. Register now to save your seat!
Arizona State University AZ United States
TUESDAY, MARCH 18, 2025 (Times in MST)
9:00 am
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9:30 am
Check-In
9:30 am
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9:35 am
Chase Farnsworth
Project Development Executive
Mortenson
Welcome & SEMI Arizona Chapter Introduction
9:35 am
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9:45 am
Kyle D. Squires, Ph.D.
Dean, Ira A. Fulton Schools of Engineering
Arizona State University
ASU Welcome
9:45 am
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10:05 am
Kyle D. Squires, Ph.D.
Dean, Ira A. Fulton Schools of Engineering, Senior Vice Provost - Engineering, Computing & Technology, Vice Provost - Polytechnic Campus, Founding CEO, Southwest Advanced Prototyping (SWAP) Hub, Foundation Professor, Mechanical & Aerospace Engineering
Arizona State University
Evolution of the Semiconductor Industry in Arizona & Opportunities with the CHIPS Act
10:05 am
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10:20 am
Professor Binil Starly
SWAP-Hub Consortium Workforce Development Lead & School Director and Professor, School of Manufacturing Systems & Networks (MSN)
Ira A. Fulton Schools of Engineering at Arizona State University
Microelectronics Workforce Development
10:20 am
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10:40 am
Randy Tully
Chief Executive Officer
ROI Analysis Management Systems
Semiconductors 101: A Brief History of the Semiconductor Industry
10:40 am
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11:00 am
Arlene Lanz
Account Manager - Semiconductors
Hitachi Energy
Your Career Journey in the Industry
11:00 am
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11:20 am
Erin Coté Martin
Manager, Recruiting & Office Management
Amkor Technology
Personal Branding + Resume Best Practices
11:20 am
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11:40 am
Summer Miller
HR Manager
EVG Group
Interview Like a Pro: Perfect Your Pitch
11:40 am
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11:55 am
Students Pick Up Boxed Lunches
11:55 am
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12:40 pm
Moderator
Francesca Domingo
EMD Electronics
Kaylie Lam
Senior Engineer, FlipChip Products
Amkor Technology
Alex Lee
Machine Learning Engineer
EMD Electronics
Haidyn Moroz
Systems Engineer
Intel
Nate Bradford
Project Engineer
JE Dunn
Victoria Lanz
General Sales & Marketing Specialist Professional
Hitachi
Thomas Peters
ASML
Ask Me Anything Panel Discussion—A Day in the Life of a Former Sun Devil
Bring your questions to the Ask Me Anything PANEL! Moderated by Francesca Domingo, EMD Electronics, panelists will discuss life as a Semiconductor engineer and their transition from Academia to the Semiconductor workforce.
12:40 pm
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1:00 pm
Job & Internship Opportunities; SEMICON West Workforce Pavilion
• Jeff Hanan, Chair, SEMI Northeast Committee
• Prof. Rafael Jaramillo, Materials Science and Engineering, MIT
• Prof. Mike Thompson, Materials Science and Engineering, Cornell University
• Prof. Greg Denon, UMass Lowell
4:15 pm
KEYNOTE—Your Winning Future in the Semiconductor Industry, Growth and Opportunities for Success
Debbie Gustafson, CEO, Energetiq
4:45 pm
A Day in the Life of a Semiconductor Professional
• Carlos V. Colorado, ASML: From Engineering to Corporate Strategy
• Emily Clark, Applied Materials: The Human Factor in a Data Driven Industry - How Sales Brings People Together
• Matthew Getz, Teradyne: The Ever-Changing Life of an Applications Engineer
5:15 pm
Tales from a Recent Grad
• Sophia Rogalskyj, TEL: The Expected and Unexpected: Reflections on the Transition from Undergrad Researcher to Industry R&D Process Engineer
• Akshay Dipakkumar Harlalka, ASML: A Preview of the Day-to-Day Life of a Mechanical Design Engineer
5:45 pm
Mentoring Panel
Industry professionals discuss job entry issues raised by audience
SEMI Professional Development Seminar
—Northeast Chapter
This free seminar helps students meet the demands of today's high tech workforce and be successful with in careers. This event is supported by MIT MSE, UMass Lowell, Cornell, the SEMI Northeast Chapter, and participating companies.
Professional Development Seminar
Northeast Chapter
Wednesday, June 2, 2021
4–7pm EDT
Attendance is free, but registration is required to receive the webinar link.
Learn about career opportunities in high teach and acquire valuable, practical information that will help you choose career directions and plan for success.
Industry volunteers will share what the high tech industry looks for when they recruit for new graduates.
Career Search: Know the right places to find jobs
Learn how to optimize your resume and boost interview changes
Learn technical interview tips & tricks: COVID-19 has changed the interview process, are you prepared?
Before you sign: Know how to affect offer, negotiate salary, and overall offer packages
Fulfill your curiosity: "Day in a Life" from various engineering types and other profession
United States
1:00 pm
Welcome Remarks/Introduction
1:10 pm
Global SEMI/Supply Chain Overview
1:20 pm
Semiconductor 101 - Semiconductor Manufacturing Process
1:35 pm
Developing Career Plan
1) Interview Process - How it has changed due to COVID-19 (How to prep for technical interviews)
2) How to make your Resume Stand Out - Tips and Tricks
3) Career Search - How and Where to Find Jobs
4) How to Affect Offer and Negotiate Salary
2:35 pm
A Day in the Life
1) A Day in the Life of a Customer Support Engineer/Manager
2) A Day in the Life of a Semiconductor Process Engineer
3) A Day in the Life of a Software Engineer
4) A Day in the Life of a Biomedical Engineer
5) A Day in the Life of an Applied Business Manager
The MEMS & Sensors Industry Group is offering a series of webinars where technical experts will share strategies and new approaches related to MEMS product development from prototype to production. The series will enable designers, product managers, test engineers, integrators, entrepreneurs, and investors to shorten development timelines and increase manufacturing yield while introducing robust MEMS products into the market.
This webinar series will be offered in three parts. Each webinar will be offered to a live audience and will be available to watch on-demand at your convenience.
United States
MODERATOR
Bob Smith (Webinar I)
Executive Director
ESDA Alliance
Mary Ann Maher (Webinar I)
Chief Executive Officer
SoftMEMS
Greg Lebsack (Webinar I)
General Manager
ICDS, Siemens
MODERATOR
Michelle Bourke (Webinar II)
Senior Director of Strategic Marketing
LAM Research
Dr. Alissa Fitzgerald (Webinar II)
Founder & Managing Member
A.M. Fitzgerald & Associates, LLC
Dr. Carolyn White (Webinar II)
Associate
A.M. Fitzgerald & Associates, LLC
MODERATOR
Mary Ann Maher (Webinar III)
Chief Executive Officer
SoftMEMS
Sixto Arjonilla (Webinar III)
Quality Director of Motion Sensors
NXP
Anupam Choubey (Webinar III)
Principal Technical Lead
Draper Lab
Srikanth Ganesan (Webinar III)
Senior Manager, MEMS/CMOS Reliability
TDK InvenSense
March 10th, 2021
8:00 am
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9:00 am
Webinar I: Using Digital Twins to Address The Design Gap for Sensor-Based Products
Designing next-generation sensor-based systems like those found in wearables, IoT and medical devices poses many challenges. MEMS and sensor design is challenging due to the use of unique materials, fabrication processes and packaging. The age of COVID has necessitated designers working remotely and collaborating over time zones. These factors have led to a gap in design, modeling and simulation capability for creating the billions of interconnected sensors required by future applications.
This webinar discusses MEMS and sensor design challenges and how Digital Twins can be used for facilitating the design of sensor-based products. The talk will describe how Digital Twins may be applied in many phases of the design process from materials design optimization all the way to artificial intelligence algorithm training and virtual product testing. Examples will be given illustrating the use of Digital Twins to create a Digital Factory to increase sensor manufacturing yield and how Digital Twins are being used in sensor-based medical product design.
April 7th, 2021
8:00 am
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9:00 am
Webinar II: How to Plan for Successful MEMS Product Development
Drawing on our experience in successfully executing more than 400 MEMS development projects at AMFitzgerald, we will present a practical overview on navigating the technical and business challenges of MEMS product development. We will describe helpful strategies and tactics discussed in our new book, MEMS Product Development: From Concept to Commercialization, that when practiced diligently, can shorten development timelines, help avoid common pitfalls, and improve the odds of success, especially when resources are limited. We illuminate what it really takes to develop a novel MEMS product so that innovators, designers, entrepreneurs, product managers, investors, and executives may properly prepare their companies to succeed.
May 5th, 2021
8:00 am
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9:00 am
Webinar III: The Growing Importance of MEMS Reliability
MEMS-based devices are experiencing significant market expansion in consumer, industrial, medical and automotive applications. With the expansion in the marketplace, there is a growing focus on the importance and unique challenges of MEMS reliability. This talk will explore MEMS reliability from concept and application-based customer requirements, through design and development processes with a demonstration of meeting industry reliability standards, similar to other semiconductor products. We also will consider MEMS reliability throughout semiconductor and customer manufacturing processes. In some cases, it has been found that standard manufacturing handling can result in environments for MEMS devices that are more strenuous than the final application. Through a better understanding of the factors impacting MEMS reliability, proper alignment of development and industrialization processes can help all of us introduce robust MEMS products into the market.
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Off
Add to Calendar2021-02-08 00:00:002021-03-01 00:00:00Fundamentals of Product Marketing, Online EditionUnited StatesSEMI.org[email protected]America/Los_Angelespublic
Semiconductor Components, Instruments, and Subsystems (SCIS) is a SEMI technology community chartered to address process-critical components challenges to meet the demands of high-volume manufacturing (HVM) at advanced process nodes. SCIS brings together all stakeholders that are driving yield improvements through the very last frontier of component and hardware defect reduction.
Defect prediction and defect source mitigation is critical to enabling high-volume manufacturing at all semiconductor fabs, but especially at advanced process nodes. This program will provide perspectives on:
Importance of OEM part design, cleaning & refurbishment loops for advanced node high volume manufacturing and designing for zero defects
The standards gap between cleanliness specs, measurement methods & successful predictive maintenance (PdM) in the Fab and how to enable AI based maintenance scheduling
Applicability of cleaning techniques vs OEM part designs and mitigating human variability during parts cleaning
The emerging considerations for parts designed to facilitate cleaning
Who Should Attend
IDMs, fabs, foundries; fab managers, process engineers
Semiconductor processing equipment OEMs
Critical chamber component suppliers
Semiconductor processing equipment parts clean vendors
Parts clean metrology service providers
United States
8:00 am
-
8:05 am
Paul Trio
Welcome Remarks & Moderation
Paul Trio, Senior Manager, Strategic Initiatives
SEMI
8:05 am
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8:40 am
Patrick Martin
OEM Perspective on Parts Cleaning - Cleanliness and Hardware Connectivity
Patrick Martin, Business Development, New Markets and Alliances
Applied Materials
