Breker Verification Systems today announced Nuclei System Technology deployed its System Coherency Synthesis TrekApp to ensure coherency of its configurable low-power and high-performance 32- and 64-bit RISC-V processor intellectual property (IP) designs.

“After an extensive evaluation, we choose Breker’s System Coherency TrekApp to help to ensure our design’s coherency,” remarks JianYing Peng, CEO of Nuclei System Technology. “TrekApp offers ease to use and extremely fast setup and covers broad aspect of verification from simple workload to complex scenarios that includes Dekker and Atomics tests.”

“Its flexible scaling will scale with us as we go from verifying the coherency of a few CPUs to hundreds of CPUs, matching our needs now and for our future RISC-V solution offerings.”

The System Coherency Synthesis TrekApp can generate thousands of high-coverage tests to stress cross-system coherency for a broad range of SoC platforms and processors. It is based on Breker’s Cache Coherency TrekApp and uses abstract models of common and novel algorithms to automatically generate coherency test content for complex, multi-agent system platforms based on coverage directives. The TrekApp can be configured for Arm, RISC-V and other processor configurations and broad range of storage and I/O architectures.

About Nuclei System Technology
Nuclei System Technology is a leading RISC-V processor IP vendor based in multiple locations across China. It produces a range of configurable low-power and high-performance 32/64-bit RISC-V processors and related solutions for artificial intelligence of things (AIoT) applications, an emerging technology that combines IoT and AI technologies to enable decision making and analytics. For more information, visit the Nuclei System Technology website nucleisys.com or send email to [email protected].

About Breker Verification Systems
Breker Verification Systems is a leading provider of Portable Stimulus solutions, a standard means to specify verification intent and behaviors reusable across target platforms. It is the first company to introduce graph-based verification and the synthesis of powerful test sets from intent-based, abstract scenario models based on AI planning algorithms. Breker’s Test Suite Synthesis and TrekApp library allows the automated generation of high-coverage, powerful test cases for deployment into a variety of UVM, SoC and Post-Silicon verification environments. Case studies that feature Altera (now Intel), Analog Devices, Broadcom, IBM, Huawei and other companies leveraging Breker’s solutions are available on the Breker website. Breker is privately held and works with leading semiconductor companies worldwide.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

• Read more about NucleiSys Adopts Breker’s System Coherency TrekApp

Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, is proud to introduce the new plasma etching cluster tool “Cluster H ™”.

“With our cutting-edge plasma etching technology, Cluster H™ provides the full-scale production capabilities for compound semiconductor devices such as high-frequency filters, SiC/GaN power devices, GaAs VCSELs, micro-OLED/LED, CMOS image sensors, and advanced packaging,” explains Tsukasa Kawabe, President and COO of Samco.

“We created Cluster H ™ to meet the strong demand from our valued customers for high throughput equipment. Cluster H™ with etching processes available only at Samco enables the combination of optimal materials and process technologies in advanced electronic device fabrication.” Continues Tsukasa.

■Features
Cluster H ™ is a cluster tool for etching and ashing that supports direct transfer of ø6” and ø8” diameter wafers. Centered on a hexagonal vacuum transfer platform, it is equipped with two vacuum cassette chambers and one vacuum aligner as part of the standard equipment configuration, and up to three process modules that can be attached. The ICP etching process module uses the reaction chamber of the high-end ICP etching model RIE-800iP and is backed by our extensive process library and best-known methods. In addition, the frog-leg dual-blade robot enables high wafer throughput, compact transfer chamber, and system footprint.
In addition, the revamped software incorporates useful functions with improved reliability. The standard system is equipped with a user-friendly GUI and equipment management functions such as equipment performance tracking, wafer transfer history for each module and packages, and simulation functions for higher-level communication, and supports the manufacturing execution system (MES) used at customers’ factories.

Samco announces the release of the production-worthy cluster tool, Cluster H ™. The system is ideally suited for high volume manufacturing leveraging our experience and expertise in manufacturing production-proven systems and our broad process know-how. With the advanced hardware and software features on the Cluster H ™, we are certain that it will contribute to the success in manufacturing of electronic devices for our valued customers. As a pioneer in thin film technology, Samco looks forward to continuing to provide cutting-edge solutions to the industry

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including high-frequency filters, SiC/GaN power devices, GaAs VCSELs, micro-OLED/LED, CMOS image sensors, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samco.co.jp/en/

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]

• Read more about Samco Unveils New Plasma Etching Cluster Tool for Compound Semiconductor Device Fabrication

Launched a decade ago, Technic’s specialized line of semiconductor deposition chemistry marketed under the name Elevate has become one of the most recognized brands in semiconductor fabrication and packaging around the globe. The use of Elevate processes has grown significantly in the last five years, more than quadrupling sales, with significant growth expected in the next few years.

Elevate chemistry is now in production on every major tool supplier platform and is the leading sulfite Gold process in the world. With the growing demand for safer operating conditions for workers and new regulatory demands, Elevate Ni 5950 became the first boric acid-free nickel in the industry. With a full range of products covering Gold, Gold/Tin, Copper, Tin, and Indium, Elevate continues to provide exceptional solutions for advanced processing such as FOWLP (Fan-Out Wafer Level Packaging), Fan-In WLP, Flip Chip, and 2.5/3D.

To meet the current demands of the semiconductor market and an expanding customer base, Technic has opened dedicated Elevate applications labs globally for performing demonstrations of the processes on wafers up to 300 mm.

"In the ten years since launching the Elevate brand, we have enjoyed steady growth in our market share and look forward to what the future has to offer. As with all Technic products, the Elevate line has been developed to meet the specific requirements and demands of the semiconductor industry with a dedicated and talented team of experts. Their support has helped make the Elevate brand the success it is today."

Anthony Gallegos, Global Product Manager,
Semiconductor Technology

About Technic
Technic supplies some of the most advanced solutions for semiconductor fabrication and packaging in the industry including electroplating chemistry, photoresist strippers, cleaners (post-etch residue removers), metal etchants, and high purity wet chemistry, as well as manufacturing equipment and analytical controls.

Learn More: https://www.technic.com/applications/semiconductor

• Read more about Elevate® Celebrates 10 Years of Accomplishments in Fabrication and Packaging Technology (2012-2022)

ESPOO, Finland, 18th of January 2022 – Picosun takes part as an industrial partner in QuTI, a recently launched extensive research project aiming to develop new components, manufacturing and testing solutions that are needed in quantum technology. Quantum technology has gained interest in a vast array of industries on a large scale. The remarkable performance improvements it offers enable for example powerful computing and benefits in communications, healthcare, sensors, imaging and measurement applications.

The QuTI project is coordinated by VTT Technical Research Centre of Finland, and it has a total budget of around 10 million euros. Other industrial partners of the consortium include Bluefors, Afore, IQM, Rockley Photonics, CSC, Quantastica, Saab and Vexlum. The research partners are VTT, Aalto University and the University of Tampere.

“Quantum technology is a multidisciplinary and rapidly advancing field. The QuTI consortium provides an ideal starting point for strengthening the international competitiveness of Finnish technology and industry in this fast-growing field,” says QuTI project’s coordinator, Research Professor Mika Prunnila from VTT.

“Quantum technology has already taken the step from research laboratories to commercial applications. We look forward in supporting this development trend even further and being part of creating a globally competitive industrial ecosystem in Finland around this technology,” says Dr. Jani Kivioja, CTO of Picosun Group.

“Atomic Layer Deposition, or ALD, is the advanced thin film coating method for ultra-thin, highly uniform and conformal material layers that enables the digital solutions of today. It will also play a crucial role in future innovations and in the quantum computing, communication and sensing devices that will be developed in the QuTI project”, continues Jussi Rautee, CEO of Picosun Group.

More information:
Jani Kivioja
CTO, Picosun Group
Tel: +358 46 922 8804
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

• Read more about Picosun part of extensive quantum technology development project

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Victor Huang has joined the company as its first Vice President of Legal Affairs.

Mr. Huang has served as both General Counsel for startups and Intellectual Property Counsel for some of the world’s leading technology firms, including eBay and Illumina, and has built and strategically managed patent portfolios in a variety of markets. While working to safeguard and expand YES’s intellectual property assets, he will also build the legal function and advise the company on licensing and joint development agreements, M&A activity, and a diverse range of corporate legal tasks and concerns including employment and compliance.

“Victor’s extensive experience in the strategic management of worldwide IP portfolios will be a great resource for YES as we continue our international expansion. We feel that his engineering background, coupled with his history of building scalable processes for business and legal operations in a fast-growing environment, make him an especially good fit for our team,” said Rezwan Lateef, President of YES.

Mr. Huang holds a bachelor’s degree in Electrical Engineering from the University of California at Davis, and received his JD from the University of San Francisco School of Law. He has a particular interest in issues relating to open source programs, including compliance, product security, and community relations.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, plasma etching tools, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

• Read more about Victor Huang Joins Yield Engineering Systems (YES) as VP of Legal Affairs

With previous experience in design for manufacturability, Reed McKissick has joined the team at Fit-Line Global® -- a leading component supplier for high-purity fluid processing applications in the semiconductor industry – as a new mechanical engineer. McKissick will contribute to Fit-Line’s commitment to operational excellence and on-time delivery by enhancing company products and maximizing efficiencies.

As a certified Six Sigma Black Belt and with tenured success in design and manufacturing, McKissick is well versed in the methodologies to complete projects efficiently and effectively while ensuring optimal design. McKissick will be integral in the completion of new products, testing and using techniques such as Lean and Six Sigma methodologies to improve efficiency and reduce scrap.

“At Fit-Line, we continually look to improve operations, efficiencies, and production processes – and McKissick brings fresh perspective paired with years of experience enhancing that will help take Fit-Line to the next level,” said George Alvarado, vice president and general manager at Fit-Line Global.

McKissick’s most recent position was with Jayco Interface Technology in Corona, Calif., as a design engineer, where he designed and manufactured “Man-Machine Interfaces” – including front panels for various medical, military and commercial equipment. McKissick has also developed a (NEMA 4) traffic crosswalk switch used across America designed for extreme outdoor exposure.

Today’s announcement comes on the heels of Fit-Line Global’s recent product launch, Nexus Connect®, during the 2021 SEMICON West show in San Francisco, Calif. Nexus Connect® insert fittings are made from virgin ultra-high purity PFA material cleaned in Fit-Line’s certified class 1000 cleanroom. The extensive product line features sweep elbows and is available in sizes ranging from ¼” through 1”. They are designed to handle extreme temperatures up to 392⁰F (200⁰C) and are compatible with wet-insert style fittings. Nexus Connect® fittings also work with Fit-Line Global’s industry-proven TruFASTEN® torque wrenches.

For more information, visit www.fit-lineglobal.com.

About Fit-Line Global
Fit-Line Global® is a trusted supplier, designer, research and development resource for SEMI F57-0120 compliant PFA and PVDF components. They employ efficient manufacturing processes to create products that meet the most demanding applications. Fit-Line Global has been a trusted supplier to the Semiconductor industry for more than 25 years. Headquartered in California, Fit-Line Global dedicates itself to providing quality products, with the fastest lead time in the industry, and at a fair price. The company exclusively manufactures PFA and PVDF components, which are strong choices for use in high-purity and corrosive chemical semiconductor applications. To learn more, visit www.fit-lineglobal.com.

• Read more about Reed McKissick Joins Fit-Line Global as New Mechanical Engineer

Wooptix SL, a Spanish company dedicated to developing advanced imaging solutions for the semiconductor industry, will be presenting a new technique for Patterned Wafer Geometry at the upcoming SPIE Advanced Lithography conference on February 28th, 2022, in a paper published together with Applied Materials. The flatness of the silicon wafer used to manufacture integrated circuits is controlled to tight tolerances to ensure the full wafer is sufficiently flat for lithographic processing. In recent years, a metrology tool based on double Fizeau interferometry has been used to generate wafer geometry maps to correct for process induced focus issues and overlay problems. In the upcoming paper, WFPI is used successfully on patterned silicon wafers to acquire 7.65 million data points in 5 seconds on the full 300mm patterned wafer with a lateral resolution of 96µm to generate the wafer shape.

About Wooptix
Based in La Laguna Tenerife, Canary Islands, Wooptix is founded on decades of optical research done at the astrophysics department at La Laguna University in conjunction with Teide Observatory in Tenerife, one of the world’s most important astronomy research centers. Wooptix, being a venture funded company and an Intel Capital portfolio company, has used the venture funds to develop Phemet and bring it to commercialization for semiconductor the lab market and is currently in the early stages of bringing the technique in to a fully automated fab tool.

• Read more about Wooptix introduces a patterned wafer geometry system for 300mm silicon wafers