YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Guy Shechter has joined the company as its new Vice President of Global Product Management and Global Service.

“Guy’s proven ability to manage change for rapidly growing innovative companies, ranging from start-ups to market leaders, will be a valuable resource as we implement our plans to fulfill YES’s potential,” said Rezwan Lateef, President of YES. “He has an impressive track record for building winning teams and optimizing both organizational performance and customer satisfaction. We are pleased to welcome him to our executive team.”

Mr. Shechter was formerly the Vice President and General Manager of Global Services Solutions at Veeco, where he spent 13 years in Marketing and Service leadership roles of increasing responsibility. Earlier in his career, he was Director of Marketing at Oramir (now part of Applied Materials) and Vice President of Marketing at Sagitta. Mr. Shechter holds both a bachelor’s degree in Mechanical Engineering (magna cum laude) and an MBA in Technology Development from the Technion – Israel Institute of Technology. He is a Certified Six Sigma Black Belt.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit http://www.yieldengineering.com.

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The Electronic System Design Alliance, a SEMI Technology Community, today announced the appointment of Maheen Hamid, Chief Operating Officer and Chief Financial Officer of Breker Verification Systems, to its Governing Council.

Hamid assumes the seat formerly held by Babak Taheri who was CEO/CTO of Silvaco. She will serve a two-year term that runs through 2023, joining:
• Dr. Aart de Geus, chairman and co-CEO of Synopsys, Inc.
• Dean Drako, president and CEO at IC Manage
• Aki Fujimura, D2S’ CEO
• Dr. John Kibarian, president and CEO of PDF Solutions, Inc.
• Prakash Narain, president and CEO from Real Intent
• Joe Sawicki, executive vice president of Siemens EDA
• Simon Segars, CEO of Arm, who serves as the Governing Council chair
• Bob Smith, executive director of the ESD Alliance

“The entire Governing Council welcomes Maheen,” says Smith. “She is a seasoned, accomplished executive who will offer great industry insights.”

"I am delighted to be joining the governing council of this important organization at a key moment in its history,” notes Hamid. “As Breker has grown to become an established EDA company working with semiconductor companies in the area of test suite synthesis, we have gained a wealth of experience and I hope to bring this perspective to the council.”

Maheen Hamid is Chief Operating Officer and Chief Financial Officer of Breker Verification Systems. She brings more than 15 years of financial experience in deal structuring and operations management in diverse industries including wireless telecommunications, clean energy, health, and infrastructure projects in emerging markets. Prior to Breker, she served in various roles in investment banking and management consulting.

Hamid is an occasional contributor to different business journals and forums, covering a broad range of topics related to management. She holds a BBA from North South University in Bangladesh and an MBA from the University of Texas at Austin.

About Breker Verification Systems
Breker Verification Systems is a leading provider of Portable Stimulus solutions, a standard means to specify verification intent and behaviors reusable across target platforms. It is the first company to introduce graph-based verification and the synthesis of powerful test sets from intent-based, abstract scenario models. Breker’s Test Suite Synthesis and TrekApp library allows the automated generation of high-coverage, powerful test cases for deployment into a variety of UVM, SoC and Post-Silicon verification environments. Case studies that feature Altera (now part of Intel), Analog Devices, Broadcom, IBM, Huawei and other companies leveraging Breker’s solutions are available on the Breker website. Breker is privately held and works with leading semiconductor companies worldwide.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

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Valin Corporation, a privately held, employee-owned company providing technical solutions for the technology, energy, life sciences, natural resources, and transportation industries, has engineered drop-in pneumatic manifold replacements for its customers. The upgrade kits are an effective solution for aging semiconductor tools.

As wafer yield continues to be of the utmost importance in the semiconductor industry, these manifold upgrade kits are becoming more and more popular. Unaddressed compressed dry air leaks (CDA) can lead to wafer damage. When wafers are damaged, they must be discarded. Each wafer goes through several steps carried out by various tools over the course of several weeks, depending on the complexity of the process, to reach its final stage during manufacturing (Reference: ASML). If a wafer gets discarded after all these processes, the cost is substantial and cannot be recovered. Additionally, maintenance associated with replacing failed valves to ensure that CDA leaks don’t occur can be very tedious. Before installing Valin’s Endura Slit Valve Door (SVD) retrofit kit, operators needed to shut off the complete manifold to replace a failed valve. With this new solution, each valve station can be isolated simply and effectively to perform quick maintenance. By allowing for this flexibility, the retrofit kit prevents adjacent process chamber conditions from changing, preventing wafer damage during the process. In addition to the CDA problems, various semi fabs are facing obsolescence. As these semi fab tools were deployed 20+ years ago, neither the manufacturer nor the OEMs support these old pneumatic manifolds and spares. Semi fabs are at the mercy of manufacturers and untrusted sources.

The drop-in pneumatic manifold replacements come as complete kits for ease of installation. Currently, Valin offers the upgrade kits in three different models. The AC-150-2321 is used to replace the Endura SVD Pneumatic manifolds 0010-20052 & 0010-702097. The AC-150-2444 kit model replaces Centura pneumatic manifold part 0190-09487 & 0190-02046 for both the lower gas box and upper gas box. The AC-150-2463 Centura Chamber and the AC-150-2459 Centura Ultima pneumatic manifolds replace the 0190-20124 & 0190-20148 models. The Endura and Centura manifolds are a complete drop-in solution and are pneumatically and electrically exactly compatible to the existing legacy manifolds. In addition, Valin had the manifolds fab tested and approved. Installation instructions are written by Equipment Engineers for ease of installation.

“We’ve had customers raving over our pneumatic manifold replacement kits from the time we introduced them,” said Sri Gavini, Business Development Manager at Valin Corporation. “The upgrades not only gave peace of mind to our customers in terms obsolescence and defective wafer risk, but also cut down valve maintenance time. Each kit comes complete with plug-and-play instructions, making installation a breeze. This has been one of the elements that we’ve received the most positive feedback from. Even though we have engineers on call to help guide customers through the process, the instructions are so clear, we haven’t had that many customers call for assistance.”

To learn more about Valin’s Pnuematic Manifold Retrofit Kits visit: https://www.valin.com/engineered-solutions/pneumatic-manifold-retrofit-…

About Valin Corporation
Valin Corporation is the leading technical solutions provider for the technology, energy, life sciences, natural resources, and transportation industries. For over 40 years, Valin has offered personalized order management, on-site field support, comprehensive training, and applied expert engineering services utilizing automation, fluid management, precision measurement, process heating, and filtration products.

Valin was recently recognized as the 34th Largest Private Company in Silicon Valley by the Silicon Valley Business Journal and came in at #49 on Industrial Distribution's Big 50 List.

To learn more about Valin’s solutions and capabilities, please visit www.valin.com, or to browse our product portfolio please visit www.valinonline.com.

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ESPOO, Finland, 14th of October 2021 – PICOSUN® Morpher has continued to demonstrate excellent batch process results in the latest acceptance runs the company has performed for its customers in the global semiconductor industry.
Excellent uniformities (About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

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TAIPEI, TAIWAN, October 8, 2021 – Lite-On Technology Corporation (“LITEON”) has filed a patent infringement suit against Sensor Electronic Technology, Inc. (“SETi”) September 17, 2021, in the United States District Court for the Western District of Texas, asserting infringement of LITEON’s UV LED patents and demanding a judgment that SETi has infringed and seeking an injunction and an award of damages. The claims relate to the UV LED package, LED chip, and epitaxial layer growth.

LITEON is founded in 1975 and being a worldwide leading provider of optoelectronic semiconductors. LITEON Optoelectronics Product Solution SBU (LITEON OPS) has been dedicated to R&D on LED technologies and has more than forty-five years' experience in this field. Its leading role is backed by the broadest and most widely varying product offering in Optical technologies, ranging from illumination to sensing, from low power to high power, from commodity to custom-made, from LED to Laser, from visible lights to infrared & UV. LITEON possesses a strong patent portfolio in the key markets including America, China, Taiwan, Japan, Europe, and Korea.

In response to recent press releases by SETi as a subsidiary of Seoul Viosys and the media coverage that focused on the patent lawsuits related to SETi v. LITEON, LITEON hereby clarifies that:
The patent lawsuits are still in progress. LITEON disputes SETi’s claims and will vigorously defend against them. LITEON reaffirms that we, as always, respect intellectual property rights and will devote to the protection of customers’ and shareholders’ benefits and rights.

CONTACT:Ifei Lee
　Director, OPS SBG,
　　 LITE-ON Technology Corporation
　　 [email protected]

• Read more about LITEON files complaint against Sensor Electronic Technology, Inc. (SETi) LITEON safeguards and protects the intellectual property rights and interests of its clients

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has purchased the semiconductor equipment business of Swedish heating technology provider Kanthal.

Under the terms of the agreement, which was signed on October 6, YES will take ownership of Kanthal’s semiconductor-related capital equipment portfolio, system-related upgrades, and service needs. The acquisition will add Kanthal’s high-temperature (>800°C) furnace technology as well as Low Pressure Chemical Vapor Deposition (LPCVD) processes to YES’s growing capabilities in the thermal processing area.

“We aim to be the semiconductor industry’s provider of choice for surface modification, material enhancement, and high-quality deposition,” said Rezwan Lateef, President of YES. “With this acquisition of equipment and technical expertise from a leader in industrial heating, we look forward to supporting our global customer base with new high-temperature annealing and bonding systems that leverage Kanthal heating equipment. In addition, we feel that the Kanthal LPCVD technology has potential to open exciting deposition opportunities for YES beyond our current monolayer coating systems, particularly in the areas of optical, power and microLED.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

• Read more about YES Acquires Kanthal’s Semiconductor Capital Equipment Business

The Electronic System Design Alliance, a SEMI Technology Community, today announced Metis Microsystems, a startup providing advanced memory and floating point arithmetic intellectual property (IP) to improve the energy efficiency of semiconductors, joined its growing system design community.

Metis Microsystems is also a member of SEMI, the global industry association representing the worldwide electronic product design and manufacturing supply chain.

“As a startup dedicated to enabling energy efficiency in semiconductor products, we are excited about the opportunities the ESD Alliance and SEMI offer to connect with the network of industry members,” comments Azeez Bhavnagarwala, founder of Metis Microsystems. ““Both the ESD Alliance and SEMI have initiatives and resources offered by their domain-specific Smart Initiatives, Technology Communities and Committees that can help us understand and engage with industry members as a startup on topics of common interest."

Metis Microsystems was founded in 2017. It develops advanced energy-efficient Memory and Arithmetic/Logic IP for CMOS applications ranging from energy-starved intelligent devices at the edge to networking hardware and accelerators in the data center.

“It’s a pleasure to welcome Metis Microsystems to the SEMI ESD Alliance,” says Bob Smith, its executive director. “Startups like Metis Microsystems bring new forms of innovation and creative thinking to our community and we look forward to their participation.”

About Metis Microsystems
Metis Microsystems develops semiconductor component intellectual property (IP) to improve CMOS energy efficiency in AI accelerators, networking and wireless hardware using methods and circuits to harvest on-chip transient data as an energy source with a focus on CIM, SRAM, Register File and CAM arrays. Visit www.metismicro.com

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

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