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United States

United States

Online, Pacific Time
United States

Standards

Traceability North America TC Chapter 

Fall Meeting 2021 

Date: Wednesday, November 17, 2021 

Time: 8:00 AM-1:00 PM Pacific 

Online via Virtual Meeting 

 

AGENDA

(subject to change) 

Last updated: November 15, 2021 

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

Off Add to Calendar 2021-11-17 00:00:00 2021-11-17 00:00:00 Traceability North America TC Chapter Fall Meeting 2021 Traceability North America TC Chapter  Fall Meeting 2021  Date: Wednesday, November 17, 2021  Time: 8:00 AM-1:00 PM Pacific  Online via Virtual Meeting    AGENDA (subject to change)  Last updated: November 15, 2021    NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here  Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public

SANTA ROSA, Calif. – September 28, 2021 – PNI Sensor, the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications, today announced that its proprietary magneto-inductive sensor technology is now integrated into MagCanica’s torque sensor systems for high-performance FORMULA 1 race cars. PNI’s sensor technology is used in MagCanica’s innovative driveshaft, clutch shaft, and MGUK shaft torque sensor systems to accurately measure both steady-state and transient torque levels, helping race teams optimize powertrain performance and driveability.

MagCanica designs, develops, and manufactures wireless torque sensor systems and rate-of-change-of-torque (ROC) sensor systems for high performance applications such as automotive racing powertrains, turboshaft engines and associated rotorcraft transmissions, and high speed couplings for gas compression trains and power generation trains for the energy sector.

“The team at PNI worked closely with our engineers to customize their high-performance magnetic sensors to our exacting specifications,” said Sami Bitar, President and co-founder of MagCanica. “This close collaboration supports our mission to deliver the most lightweight, compact and accurate systems for our FORMULA 1 race team customers.”

“Our team of highly experienced engineers takes a holistic approach and supports our customers’ system accuracy and long-term reliability requirements,” said Robin Stoecker, director of marketing at PNI Sensor. “We’re proud that MagCanica is using our expertise and field-tested sensor hardware and applying it to a highly specialized and demanding application like automotive racing systems.”

About PNI Sensor
With over 30 years of experience, PNI is the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications. PNI’s sensors and algorithms serve as the cornerstone of successful IoT projects and mission-critical applications where pinpoint location, accuracy, and low power consumption are essential. Building on decades of patented sensor and algorithm development, PNI offers the industry’s highest-performance geomagnetic sensor in its class, location and motion coprocessors, high-performance modules, sensor fusion algorithms, and complete sensor systems. To learn more, please visit www.pnicorp.com.

The F1 logo, F1 FORMULA 1 logo, FORMULA 1, F1, FIA FORMULA ONE WORLD CHAMPIONSHIP, GRAND PRIX, PADDOCK CLUB and related marks are trademarks of Formula One Licensing BV, a Formula 1 company. All rights reserved. Use of the Formula 1 trademark does not imply any affiliation with, or endorsement by, FORMULA 1.

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Kimihiko Matsubara has joined its senior management team and will lead its sales efforts in the Japan market, supporting the rapidly evolving semiconductor and advanced organic substrate market segments in the region.

“We welcome Matsubara-san warmly to the YES senior team. His proven management and relationship-building skills, strong record of sales growth, and deep knowledge of the country’s precision machinery and semiconductor industries will be highly valuable to YES as we build our local presence in Japan,” said Rezwan Lateef, President of YES.

Kimihiko Matsubara started his career with process equipment manufacturer Hakuto, spending three decades there in positions of increasing managerial responsibility. He subsequently held business development and senior sales management roles at TASMIT (a subsidiary of Toray, specializing in semiconductor inspection and metrology) and Faro Japan, a maker of 3D metrology and visualization systems. He earned his bachelor’s degree in Mathematics from Meijo University in Nagoya, Japan.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence.

For more information, please visit www.yieldengineering.com.

Registration

Registration is free for SEMI Members.  Use your company email when registering for the system to recognize you as a member.  

Non-Member fee = $49

Contact Paul Trio at [email protected] with any questions.

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Do you sometimes feel like you are operating in the dark when dealing with the new challenges and opportunities in process and design?  These continue to emerge in parallel to ever shrinking semiconductor device geometries.

While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.  

To detect, identify, understand the source and eliminate yield limiter defectivity are key for total wafer environment contamination characterization and control and are essential for yield enhancement to ensure the success of the latest technology nodes. 

It is more imperative than ever that the semiconductor industry works together to enable improved defect detection, speciation/characterization metrology, and as needed, hybrid analytical technology for upcoming HVM readiness.

Join us for this session for speakers and discussion on tackling some of these industry challenges.

Virtual
United States

7:30 am - 7:35 am
Paul Trio
Paul Trio
Senior Manager, Strategic Initiatives
SEMI

Welcome

7:35 am - 7:55 am
Archita Sangupta
Archita Sengupta
Sr. Technologist
Intel

IDM Perspective of Defectivity with regard to Next-Gen Metrology and Analysis Tools

Intel logo
7:55 am - 7:58 am
Robert McIntosh
Moderator
Robert McIntosh
Consultant
Enviro-Energy Solutions

Introduction to the Presentations

7:58 am - 8:13 am
Hiroyuki_Hamada_Daikin
Hiroyuki Hamada
Senior Scientist
Daikin - Chemicals Division

Contamination Control for PFA

Ashwin_Rao_Daikin
Ashwin Rao
Semiconductor Marketing Manager
Daikin - Chemicals Division

8:13 am - 8:14 am

Introduction: Ashutosh Bhabhe

8:14 am - 8:29 am
Ashutosh_Bhabhe_Entegris
Ashutosh Bhabhe
Wet Etch & Cleans Applications Manager
Entegris

Metrology: (Ideally) Enabling the What, When, How, and Where of Unknown Contamination Detection and Control

8:29 am - 8:30 am

Introduction: Fuhe Li

8:30 am - 8:45 am
Fuhe Li - Air Liquide / Balazs
Fuhe Li
Director, Advanced Materials, Thin Films and Nanoparticles
Air Liquide - Balazs

Challenges in detecting nanoparticle, NVR, native oxide, and trace metals for 5 nm and beyond processes

8:45 am - 8:46 am

Introduction: Hugh Gotts

8:46 am - 9:01 am
Hugh_Gotts_Balazs
Hugh Gotts
International Fellow, Director R&D
Air Liquide - Balazs

HMW Organic Contaminants: What, Where, How?

9:01 am - 9:02 am

Introduction: Gary Van Schooneveld

9:02 am - 9:17 am
Gary_Van_Schooneveld_CTAssociates
Gary Van Schooneveld
President
CT Associates

Advance Metrology for Particle Sizing and Identification in Ultrapure Liquids

9:17 am - 9:18 am

Introduction: Ali O Altun

9:18 am - 9:35 am
Ali_O_Altun_Unisers
Ali O Altun
Co-Founder & CEO
Unisers

On-wafer detection and characterization of organic defects with Unisers

9:35 am - 10:00 am

Open Discussion

CAST FOA SCIS Standards

New challenges and opportunities in process and design continue to emerge in parallel to ever shrinking semiconductor device geometries. While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.  

Join us for this webinar-like session to discuss best-known methods from industry leaders

7:30 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles

REGISTRATION

Webinar

Complimentary for SEMI Members.

Use your corporate email address during login to be recognized as a SEMI Member.

$99 for Non-Members.

Webinar
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The semiconductor industry is expected to reach US$1 trillion by the end of the decade.  The next big technology revolutions (AI, 5G/6G, VR/AR, qubit computing, and more) are driving the need to manage exponential amounts of data. Everything from cars to coffee machines are generating data that needs to be moved, stored, computed, secured, and converted to end-user information. To make this a vision a reality requires innovation throughout the semiconductor industry, from new materials to new and improved process equipment to new device architectures designed to perform at speeds and densities once thought unachievable. In this webinar, we will hear from industry experts on what the 10-year technology trends look like and how semiconductor material and equipment suppliers are responding to the trends.  

Dr. Todd Younkin, President and CEO of Semiconductor Research Corporation (SRC) will discuss the evolving challenges and five “seismic shifts” that are driving advancement in the semiconductor industry.

Following Dr. Younkin’s talk, David Medeiros, Senior Director, CTO Office of Entegris, Inc. will address these challenges and describe how Entegris is driving materials innovation to overcome the obstacles faced by chip manufacturers.

United States

10:00 am - 10:03 am
Darron Jurajda Brewer Science
Darron Jurajda
Director, Semiconductor Business Operations
Brewer Science

Session Introduction

Biography: Darron Jurajda is the Director of Semiconductor Business Operations at Brewer Science. He is an expert in materials and process research for anti-reflective materials, multilayer materials, and processes for lithography. He has a diverse background including photolithography, chemical operations, and laboratory research. Darron has published in several technical proceedings and publications including SPIE, IEEE, and Solid State Technology. He has been a member of multiple SEMI Committees over the last 10 years. Darron holds a BS in chemical engineering from the University of Texas at Austin.

10:03 am - 10:25 am
Dr. Todd Younkin
Todd Younkin
President and CEO
Semiconductor Research Corporation (SRC)

Biography: Dr. Todd Younkin is a talented and seasoned executive with more than 20 years of experience in technology innovation. His extensive Research and Development experience spans Intel’s 0.18um to 5nm nodes with technical contributions in novel materials, nanotechnology, integration, advanced lithography, and integrated photonics. Most recently, he engineered, launched, and led all programmatic aspects of the five-year, $240 million JUMP research initiative. It has six multi-university, multi-disciplinary innovation Centers with 133 faculty, 835 students, and 360 industrial engineering liaisons. It emphasizes the advancement of Computer Science, Electrical Engineering, and Materials to secure continued U.S. thought leadership.

Todd brings a wealth of expertise with strengths in areas such as cultivating relationships with strategic partners, entrepreneurship and investment strategies, technology innovation, operational excellence, and talent management. He has spent much of his career working alongside young minds that are aspiring to influence the ever-changing world of smart and autonomous electronics. He has built programs from the ground up, leveraging his entrepreneurial leadership to drive new business development that has generated multi-millions in funding. He has been a key contributor in introducing new technology advances and starting new global research in the U.S., Europe, and Asia.
Dr. Younkin holds a Ph.D. from the California Institute of Technology in Pasadena, California. He completed his Bachelor of Science at the University of Florida in Gainesville, Florida. He aspires to continue to influence the next generation of technology and inventors, bringing ideas and investors together to drive heterogeneous electronic solutions that will deliver a smarter, shared future.

10:25 am - 10:45 am
Dave Medeiros
Dave Medeiros
Senior Director, CTO Office
Entegris

Biography: David Medeiros joined Entegris as a Senior Director of Engineering in the office of the CTO in April of 2021. His responsibilities involve developing an enterprise-wide lithography strategy, with a primary focus on the rapidly expanding field of EUV. Previously he spent six years at GLOBALFOUNDRIES (GF), first as the Senior Director of Patterning at Fab 8 in Malta, NY, and later as the Vice President of Central Engineering. Prior to GF, he spent seventeen years at IBM, starting as a Research Staff Member at T. J. Watson Research Center and culminating as the Director of Patterning R&D in the Microelectronics Division. His career began in the semiconductor industry as a synthetic chemist at Shipley Company, which is now part of DuPont. David holds a Ph.D. in Organic Chemistry from the University of Texas, Austin, where he was an Eastman Kodak fellow, and a B.S. in Chemistry from the University of Massachusetts, Amherst.

10:45 am - 10:55 am

Q&A with Audience Input

10:55 am - 11:00 am

EMG Overview & Wrap up

EMG

EMG Logo

10:00 am - 11:00 am Off Add to Calendar 2021-10-13 10:00:00 2021-10-13 11:00:00 Throwing the Kitchen Sink at IT - Innovations Driving towards a US$1 Trillion Semiconductor Industry United States SEMI.org [email protected] America/Los_Angeles public
Event format

The Electronic System Design Alliance, a SEMI Technology Community, welcomes Aselta Nanographics, of Grenoble, France, provider of advanced software solutions for wafer and mask patterning based on e-beam technology, as its newest member.

“Joining the ESD Alliance is a great opportunity to stay connected with the EDA community and take an active part in the discussions driving the future of semiconductor manufacturing,” remarks Yorick Trouiller, Aselta Nanographics’ CEO.

“Aselta Nanographics is making its mark in the semiconductor industry, and we are pleased it is joining as a member of the ESD Alliance,” comments Bob Smith, its executive director. “Companies like Aselta are helping manage increased complexity of mask data preparation due to technology improvements such as multi-beam mask writers and EUV lithography, and the ability to measure/inspect the effects both on reticle and on wafer.”

A spin-off of CEA-Leti, Aselta Nanographics maintains strong links with cutting-edge fundamental research and applies it to deliver advanced industrial solutions to customers in the U.S., Europe and Asia. It initially developed e-beam proximity effect correction software and now offers a portfolio of products that includes mask data preparation and metrology.

As a member of the ESD Alliance, Aselta Nanographics is also a member of SEMI, the global industry association representing the worldwide electronic product design and manufacturing supply chain.

About Aselta Nanographics
Aselta Nanographics of Grenoble, France, develops software tools to improve the quality process of chip production. It operates in the IC manufacturing world providing advanced software solutions for wafer and mask patterning based on e-beam technology as well as solutions for contour-based metrology. Aselta is currently developing cutting-edge software solutions for improving wafer fab and maskshop production yield for next generation nodes. For more information, see: www.aselta.com

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

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CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-09-24 00:00:00 2021-09-24 00:00:00 SEMI China Smart Mobility Webinar China SEMI.org [email protected] America/Los_Angeles public
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ESPOO, Finland, 7th of September 2021 – Picosun Group has taken into use new facilities at its production laboratory in Kirkkonummi, Finland. The Picosun Innovation Lab will be used for the company’s own research and development projects, for demo purposes and most importantly for serving the company’s global semiconductor customers operating in the 300 mm market.

The Innovation Lab hosts Picosun’s new generation tools PICOSUN® Morpher and PICOSUN® Sprinter. Morpher was launched in 2019 and it started a completely new era in Picosun products. Its adaptive and versatile nature makes it an ideal ALD solution for to the changing needs of different business verticals in the up to 200 mm wafer industries. Sprinter was launched late 2020 for the 300 mm wafer markets to meet the ever-increasing demands of semiconductor, display and IoT component manufacturing lines. It has brought single wafer film quality and uniformity for fast batch processing and met the challenges in high volume ALD manufacturing.

The Innovation Lab increases the laboratory capacity Picosun currently has on its premises significantly. The new facilities will have the ability to host tens of ALD tool modules. The facilities also support a variety of process gases including for example N2, O2, O3, Ar, H2, NH3 and NF3. Furthermore, special attention has also been paid for the best-in-class building management and safety systems.

“The opening of the new Innovation Lab reflects our role in being the pioneer in ALD and continuing the daily work in setting the standards for future innovations in the ALD sphere. The Innovation Lab has been a big investment for the company, but we see this as an essential investment to our and our customers’ future”, says Jussi Rautee, CEO of Picosun Group.

Watch the video on Picosun Innovation Lab: https://press.picosun.com/picosun-invests-in-future-with-its-innovation…

More information:
Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

United States Standards%20.jpg

Online, Pacific Time
United States

Standards

Liquid Chemicals

North America TC Chapter

Fall Meeting

Date: Wednesday, October 6, 2021

Time: 10:00-11:30 AM Pacific 

via Virtual Meeting

 

AGENDA

(Subject to change)

Last updated: September 6, 2021

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here

 

10:00 am - 11:30 am Off Add to Calendar 2021-10-06 10:00:00 2021-10-06 11:30:00 Liquid Chemicals North America TC Chapter Fall Meeting 2021 Liquid Chemicals North America TC Chapter Fall Meeting Date: Wednesday, October 6, 2021 Time: 10:00-11:30 AM Pacific  via Virtual Meeting   AGENDA (Subject to change) Last updated: September 6, 2021   NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here   Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public