ESPOO, Finland, 14th of October 2021 – PICOSUN® Morpher has continued to demonstrate excellent batch process results in the latest acceptance runs the company has performed for its customers in the global semiconductor industry.
Excellent uniformities (About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.
Virtual, Eastern Time
United States
Society has come to depend on the rapid, predictable, and affordable scaling of computing performance for consumer electronics, the rise of ‘big data’ and data centers, scientific discovery, and national security. The approaching end of lithographic scaling threatens to hinder continued health of the $2T electronics industry, impacting many related fields that depend on computing and electronics. By some projections, within a decade, the technological underpinnings for Moore’s Law will come to an end, as lithography gets down to atomic scale. At that point, it will not be feasible to create lithographically produced devices, with dimensions nearing atomic scale, where a dozen or fewer silicon atoms are present across critical device features and will therefore represent a practical limit for implementing logic gates for digital computing. In 2019, SEMI launched a special thought leadership initiative – SEMI Think Tanks – where the leading minds of our industry gather to address the challenges and opportunities for the semiconductor and broader electronics industries with a 20-30 year horizon. SEMI is honored to be the rallying force behind bringing together the industry stalwarts and thought leaders to share their prophetic views in our pioneering Think Tank series on The Future of Computing.
United States
Welcome Remarks and Speaker Introductions
What are SEMI Think Tanks? Concept, Scope and Deliverables
"It Takes a Village" Think Tank Leadership View on the Future of Computing
Progress Report on Active and Planned Think Tank Workstreams
Q&A
Closing
TAIPEI, TAIWAN, October 8, 2021 – Lite-On Technology Corporation (“LITEON”) has filed a patent infringement suit against Sensor Electronic Technology, Inc. (“SETi”) September 17, 2021, in the United States District Court for the Western District of Texas, asserting infringement of LITEON’s UV LED patents and demanding a judgment that SETi has infringed and seeking an injunction and an award of damages. The claims relate to the UV LED package, LED chip, and epitaxial layer growth.
LITEON is founded in 1975 and being a worldwide leading provider of optoelectronic semiconductors. LITEON Optoelectronics Product Solution SBU (LITEON OPS) has been dedicated to R&D on LED technologies and has more than forty-five years' experience in this field. Its leading role is backed by the broadest and most widely varying product offering in Optical technologies, ranging from illumination to sensing, from low power to high power, from commodity to custom-made, from LED to Laser, from visible lights to infrared & UV. LITEON possesses a strong patent portfolio in the key markets including America, China, Taiwan, Japan, Europe, and Korea.
In response to recent press releases by SETi as a subsidiary of Seoul Viosys and the media coverage that focused on the patent lawsuits related to SETi v. LITEON, LITEON hereby clarifies that:
The patent lawsuits are still in progress. LITEON disputes SETi’s claims and will vigorously defend against them. LITEON reaffirms that we, as always, respect intellectual property rights and will devote to the protection of customers’ and shareholders’ benefits and rights.
CONTACT:Ifei Lee
Director, OPS SBG,
LITE-ON Technology Corporation
[email protected]
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has purchased the semiconductor equipment business of Swedish heating technology provider Kanthal.
Under the terms of the agreement, which was signed on October 6, YES will take ownership of Kanthal’s semiconductor-related capital equipment portfolio, system-related upgrades, and service needs. The acquisition will add Kanthal’s high-temperature (>800°C) furnace technology as well as Low Pressure Chemical Vapor Deposition (LPCVD) processes to YES’s growing capabilities in the thermal processing area.
“We aim to be the semiconductor industry’s provider of choice for surface modification, material enhancement, and high-quality deposition,” said Rezwan Lateef, President of YES. “With this acquisition of equipment and technical expertise from a leader in industrial heating, we look forward to supporting our global customer base with new high-temperature annealing and bonding systems that leverage Kanthal heating equipment. In addition, we feel that the Kanthal LPCVD technology has potential to open exciting deposition opportunities for YES beyond our current monolayer coating systems, particularly in the areas of optical, power and microLED.”
About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.
The Electronic System Design Alliance, a SEMI Technology Community, today announced Metis Microsystems, a startup providing advanced memory and floating point arithmetic intellectual property (IP) to improve the energy efficiency of semiconductors, joined its growing system design community.
Metis Microsystems is also a member of SEMI, the global industry association representing the worldwide electronic product design and manufacturing supply chain.
“As a startup dedicated to enabling energy efficiency in semiconductor products, we are excited about the opportunities the ESD Alliance and SEMI offer to connect with the network of industry members,” comments Azeez Bhavnagarwala, founder of Metis Microsystems. ““Both the ESD Alliance and SEMI have initiatives and resources offered by their domain-specific Smart Initiatives, Technology Communities and Committees that can help us understand and engage with industry members as a startup on topics of common interest."
Metis Microsystems was founded in 2017. It develops advanced energy-efficient Memory and Arithmetic/Logic IP for CMOS applications ranging from energy-starved intelligent devices at the edge to networking hardware and accelerators in the data center.
“It’s a pleasure to welcome Metis Microsystems to the SEMI ESD Alliance,” says Bob Smith, its executive director. “Startups like Metis Microsystems bring new forms of innovation and creative thinking to our community and we look forward to their participation.”
About Metis Microsystems
Metis Microsystems develops semiconductor component intellectual property (IP) to improve CMOS energy efficiency in AI accelerators, networking and wireless hardware using methods and circuits to harvest on-chip transient data as an energy source with a focus on CIM, SRAM, Register File and CAM arrays. Visit www.metismicro.com
About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.
Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
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Online, Pacific Time
United States
Traceability North America TC Chapter
Fall Meeting 2021
Date: Wednesday, November 17, 2021
Time: 8:00 AM-1:00 PM Pacific
Online via Virtual Meeting
AGENDA
(subject to change)
Last updated: November 15, 2021
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
Off Add to Calendar 2021-11-17 00:00:00 2021-11-17 00:00:00 Traceability North America TC Chapter Fall Meeting 2021 Traceability North America TC Chapter Fall Meeting 2021 Date: Wednesday, November 17, 2021 Time: 8:00 AM-1:00 PM Pacific Online via Virtual Meeting AGENDA (subject to change) Last updated: November 15, 2021 NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles publicSANTA ROSA, Calif. – September 28, 2021 – PNI Sensor, the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications, today announced that its proprietary magneto-inductive sensor technology is now integrated into MagCanica’s torque sensor systems for high-performance FORMULA 1 race cars. PNI’s sensor technology is used in MagCanica’s innovative driveshaft, clutch shaft, and MGUK shaft torque sensor systems to accurately measure both steady-state and transient torque levels, helping race teams optimize powertrain performance and driveability.
MagCanica designs, develops, and manufactures wireless torque sensor systems and rate-of-change-of-torque (ROC) sensor systems for high performance applications such as automotive racing powertrains, turboshaft engines and associated rotorcraft transmissions, and high speed couplings for gas compression trains and power generation trains for the energy sector.
“The team at PNI worked closely with our engineers to customize their high-performance magnetic sensors to our exacting specifications,” said Sami Bitar, President and co-founder of MagCanica. “This close collaboration supports our mission to deliver the most lightweight, compact and accurate systems for our FORMULA 1 race team customers.”
“Our team of highly experienced engineers takes a holistic approach and supports our customers’ system accuracy and long-term reliability requirements,” said Robin Stoecker, director of marketing at PNI Sensor. “We’re proud that MagCanica is using our expertise and field-tested sensor hardware and applying it to a highly specialized and demanding application like automotive racing systems.”
About PNI Sensor
With over 30 years of experience, PNI is the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications. PNI’s sensors and algorithms serve as the cornerstone of successful IoT projects and mission-critical applications where pinpoint location, accuracy, and low power consumption are essential. Building on decades of patented sensor and algorithm development, PNI offers the industry’s highest-performance geomagnetic sensor in its class, location and motion coprocessors, high-performance modules, sensor fusion algorithms, and complete sensor systems. To learn more, please visit www.pnicorp.com.
The F1 logo, F1 FORMULA 1 logo, FORMULA 1, F1, FIA FORMULA ONE WORLD CHAMPIONSHIP, GRAND PRIX, PADDOCK CLUB and related marks are trademarks of Formula One Licensing BV, a Formula 1 company. All rights reserved. Use of the Formula 1 trademark does not imply any affiliation with, or endorsement by, FORMULA 1.
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Kimihiko Matsubara has joined its senior management team and will lead its sales efforts in the Japan market, supporting the rapidly evolving semiconductor and advanced organic substrate market segments in the region.
“We welcome Matsubara-san warmly to the YES senior team. His proven management and relationship-building skills, strong record of sales growth, and deep knowledge of the country’s precision machinery and semiconductor industries will be highly valuable to YES as we build our local presence in Japan,” said Rezwan Lateef, President of YES.
Kimihiko Matsubara started his career with process equipment manufacturer Hakuto, spending three decades there in positions of increasing managerial responsibility. He subsequently held business development and senior sales management roles at TASMIT (a subsidiary of Toray, specializing in semiconductor inspection and metrology) and Faro Japan, a maker of 3D metrology and visualization systems. He earned his bachelor’s degree in Mathematics from Meijo University in Nagoya, Japan.
About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence.
For more information, please visit www.yieldengineering.com.
Registration
Registration is free for SEMI Members. Use your company email when registering for the system to recognize you as a member.
Non-Member fee = $49
Contact Paul Trio at [email protected] with any questions.
Do you sometimes feel like you are operating in the dark when dealing with the new challenges and opportunities in process and design? These continue to emerge in parallel to ever shrinking semiconductor device geometries.
While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
To detect, identify, understand the source and eliminate yield limiter defectivity are key for total wafer environment contamination characterization and control and are essential for yield enhancement to ensure the success of the latest technology nodes.
It is more imperative than ever that the semiconductor industry works together to enable improved defect detection, speciation/characterization metrology, and as needed, hybrid analytical technology for upcoming HVM readiness.
Join us for this session for speakers and discussion on tackling some of these industry challenges.
Virtual
United States
Welcome
IDM Perspective of Defectivity with regard to Next-Gen Metrology and Analysis Tools
Introduction to the Presentations
Contamination Control for PFA
Metrology: (Ideally) Enabling the What, When, How, and Where of Unknown Contamination Detection and Control
Challenges in detecting nanoparticle, NVR, native oxide, and trace metals for 5 nm and beyond processes
HMW Organic Contaminants: What, Where, How?
Advance Metrology for Particle Sizing and Identification in Ultrapure Liquids
On-wafer detection and characterization of organic defects with Unisers
Open Discussion
New challenges and opportunities in process and design continue to emerge in parallel to ever shrinking semiconductor device geometries. While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
Join us for this webinar-like session to discuss best-known methods from industry leaders
