Verific Design Automation today announced a partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to provide the DARPA community access to its electronic design automation (EDA) software in production and development use throughout the semiconductor industry.

Driven by the DARPA Electronics Resurgence Initiative (ERI) to forge collaborations among commercial electronics companies, the agreement offers the DARPA community use of Verific’s hardware description language (HDL) software for the duration of their programs.

“Our support of academic use over the years has been on an ad-hoc basis,” remarks Michiel Ligthart, president and chief operating officer of Verific. “This agreement provides DARPA-funded programs easy and streamlined access to our industry-standard SystemVerilog parsers and elaborators, cracking open ways to meet DARPA’s goal to innovate a fourth wave of electronics progress.”

Specific tools covered under the agreement are Verific's SystemVerilog parser and static and register transfer logic (RTL) elaborators, already serving as front-end for simulation, formal verification, synthesis, emulation, virtual prototyping, in-circuit debug and design for test applications worldwide. For years, Verific's Parser Platforms have given engineering groups a way to eliminate costly internal development of front-end EDA software, accelerating time to market with improved quality.

Currently, more than 20 DARPA-funded programs promote U.S. microelectronics leadership, including some using low-cost, predictably priced tools such as Verific’s software. “DARPA’s programs within the Microsystems Technology Office (MTO) are a bold accelerator of several technical and economic trends in the microelectronics sector,” says Serge Leef, who leads design automation and secure hardware programs. “Giving DARPA’s community easy access to proven, industrial-strength, best-in-class software frameworks enables the researchers to tightly focus on scientific advances while improving the path to a smooth transition of their breakthrough discoveries into commercial and defense applications.”

Verific’s SystemVerilog, VHDL and universal power format (UPF) Parser Platforms are in production and development flows at semiconductor companies worldwide, from emerging companies to established Fortune 500 vendors. Verific distributes its Parser Platforms as C++ source code and compiles on all 32- and 64-bit Unix, Linux, Mac OS and Windows operating systems.
About Verific Design Automation

About Verific
Verific Design Automation is the leading provider of SystemVerilog, Verilog, VHDL and UPF Parser Platforms that enable project groups to develop advanced electronic design automation (EDA) products quickly and cost effective worldwide. With offices in Alameda, Calif., and Kolkata, India, Verific has shipped more than 60,000 copies of its software used worldwide by the EDA and semiconductor industry since it was founded in 1999.

Engage with Verific at:
Email: [email protected]
Website: www.verific.com
LinkedIn: https://www.linkedin.com/company/verific-design-automation-inc/
Facebook: https://www.facebook.com/Verific-Design-Automation-100448363329771/

• Read more about Verific and DARPA Sign Partnership for Streamlined Access to Industry-Standard SystemVerilog EDA Software

TOKYO — December 15, 2020 — Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase 16% compared to $59.6 billion in 2019 and register a new industry record of $68.9 billion in 2020, SEMI announced today in releasing its Year-end Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan. The growth is expected to continue with the global semiconductor manufacturing equipment market reaching $71.9 billion in 2021 and $76.1 billion in 2022.

Both the front end and the back end semiconductor equipment segments are expected to power the expansion. The wafer fab equipment segment – which includes wafer processing, fab facilities, and mask/reticle equipment – is projected to rise 15% to reach $59.4 billion in 2020, followed by 4% and 6% growth in 2021 and 2022, respectively. The foundry and logic segments, which account for about half of total wafer fab equipment sales, will see a mid-teens percentage increase this year to reach $30 billion in spending driven by investments in leading-edge technologies. Spending on NAND flash manufacturing equipment will surge 30% this year, surpassing $14 billion, while DRAM is expected to lead the expansion in 2021 and 2022.

The assembly and packaging equipment segment is forecast to grow 20% to $3.5 billion in 2020, followed by 8% and 5% increases in 2021 and 2022, respectively, driven by advanced packaging applications. The semiconductor test equipment market is expected to rise 20% in 2020, reaching $6 billion, and continue to expand in 2021 and 2022 on demand for 5G and high-performance computing (HPC) applications.

China, Taiwan and Korea are projected to be the leading regions in spending in 2020. Robust foundry and memory investment in China is expected to propel the region to the top of the total semiconductor equipment market for the first time this year. In 2021 and 2022, Korea is forecast to lead the world in semiconductor equipment investments on the back of a memory recovery and increases in logic investment. Equipment spending in Taiwan will remain robust, powered by leading-edge foundry investment. Most other regions tracked will also see growth during the forecast period.

The following results reflect market size in billions of U.S. dollars:

Source: SEMI December 2020, Equipment Market Data Subscription

New equipment includes wafer fab, test, and A&P. Total equipment does NOT include wafer manufacturing equipment. Totals may not add due to rounding.

The current SEMI forecast is based on collective input from top equipment suppliers, SEMI’s Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program and SEMI's industry recognized World Fab Forecast database.

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

• Monthly SEMI NA Billings Report, an early perspective of equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments
• Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

For more information online, please visit the EMDS page.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Semiconductor Equipment Consensus Forecast – Record Growth Ahead, SEMI Reports

ST. PETERSBURG, Fla. (Dec. 3, 2020) — Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor industry, announced today the acquisition of OEM Group’s dry process equipment business.

With the acquisition, Plasma-Therm has acquired all original OEM licenses and intellectual property rights for SFI Endeavor, AG Heatpulse, MRC Eclipse, and Tegal brand equipment. Plasma-Therm will continue to support existing customers through spare parts and upgrades, while offering new and refurbished tools to the wider market.

“The acquisition allows Plasma-Therm’s award-winning customer service teams to support the large and global install base,” said Abdul Lateef, CEO of Plasma-Therm. “Additionally, PVD and RTP technologies align perfectly with our etch and deposition products and process solutions, which will further support the manufacturing and R&D needs and requirements of our customers.”

Michael Correra, CEO of OEM Group, said, “We are delighted to have had these outstanding products acquired by Plasma-Therm, ensuring a strong path to market for our newly developed Endeavor M series PVD platform, and the continued availability and support of the MRC Eclipse, AG Heatpulse, and Tegal products. This acquisition allows OEM Group to strategically focus on our wet chemical process and ion implant technologies.”

About Plasma-Therm
Established in 1974, Plasma-Therm is a manufacturer of advanced plasma processing equipment for specialty semiconductor markets, including advanced packaging, wireless communication, photonics, solid-state lighting, MEMS/NEMS, nanotechnology, renewable energy, data storage, photomask, and R&D. Plasma-Therm offers leading etch and deposition technologies and solutions for these markets. Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of Plasma-Therm’s global customer base. Visit www.plasmatherm.com for more information.

About OEM Group
Established in 1999, OEM Group is a semiconductor capital equipment manufacturer and innovator in new and remanufactured 75mm – 300mm tools, spare parts, upgrades, and services. We serve the LED, MEMS, Wireless, Power, Energy Harvesting, WLP, Data Storage, and Logic markets. OEM Group's current portfolio of products includes the Semitool & Cintillio Spray Ozone Tool, Spray Acid Tool, and Spray Solvent Tool, Spin Rinse Dryer and Storm, Varian Implant, and AMAT P5000 CVD & Etch.

• Read more about Plasma-Therm Announces Acquisition of OEM Group PVD, RTP and Etch Business

ESPOO, Finland, 2nd December 2020 – Picosun Group, leading provider of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for industrial manufacturing, presents PicoOS™, the new, full stack operating system and process control software for PICOSUN® ALD equipment.

“PicoOS™ brings PICOSUN® ALD equipment control to the modern era. It is designed for wafer fabs and industrial environments where transition to Industry 4.0 is ongoing. Data-driven PicoOS™ enables future production solutions where machine learning, artificial intelligence, internet-of-things, and other new digital inventions are utilized for optimum industrial efficiency,” says Dr. Jani Kivioja, CTO of Picosun Group.

Picosun’s proprietary PicoOS™ software combines individual ALD module, wafer handling and transfer system, and instrumentation control under one common graphical HMI (human-machine interface). This ensures easy, intuitive and user-friendly operation, maintenance, and configuration of the whole PICOSUN® ALD cluster.

PicoOS™ enables full factory integration via SECS/GEM protocol, process and system data logging down to 20 ms rate, and real-time export of all data for continuous monitoring and further analysis.

PicoOS™ operating system is specifically developed by Picosun’s own in-house software team for the company’s fully automated production ALD systems Morpher and Sprinter, and it will be implemented in all future PICOSUN® ALD tool platforms.

“PicoOS™ is designed to ensure the highest control precision and accuracy, the fastest service times, and the best user experience for our customers. Having in-house control over all features and sub-components of our PICOSUN® ALD solutions is a key part of our holistic service model,” continues Kivioja.

PicoOS™ has freely configurable and scalable editor for ALD process recipe and processing job creation and storage, and recipes can be edited or new ones created any time during the ALD system operation. Configurable user levels and safety logic, instrumentation and interlocks guarantee safe use in day-to-day operations, and allow full access for tool management in maintenance situations. Maintenance procedures are sped up by specific clean-up and maintenance sequences inbuilt in the software.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Dr. Jani Kivioja
CTO, Picosun Group
Tel: +358 50 321 1955
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun launches PicoOS™, a unified control software for PICOSUN® ALD modules and clusters

ESPOO, Finland, 2nd December 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, has launched Sprinter, a brand new, fully automated high throughput ALD production module for 300 mm wafers. Barrier, high-k and other films are deposited in Sprinter with perfect ALD for semiconductor (e.g. emerging memory, transistor, capacitor), display, and IoT component applications.

In Sprinter, single wafer film quality and uniformity are upscaled to fast batch processing with the highest reliability and repeatability(*).

Compared to vertical furnace reactors typically used for batch ALD processing, Sprinter provides higher film quality with lower thermal budget, so it is suitable also for temperature-sensitive devices.

Sprinter combines very fast process times with smaller batch sizes than in vertical furnaces, which allows greater production flexibility and minimized risk without sacrificing throughput.

The core of the Sprinter is its disruptively designed reaction chamber, where fully laminar precursor flows ensure perfect ALD deposition with no parasitic CVD growth. This minimizes the need for system maintenance.

“PICOSUN® Sprinter meets directly the challenges in high volume ALD manufacturing on 300 mm wafers. We are happy to unveil this product to our new and existing customers in 300 mm semiconductor markets, and offer them a truly disruptive, modern alternative to old technologies in batch ALD manufacturing,” says Mr. Jussi Rautee, CEO of Picosun Group.

SEMI S2/S8 certified PICOSUN® Sprinter module can be integrated to customer’s manufacturing line or cluster. It is suitable also for single wafer manufacturing lines as it does not disturb the process flow. Sprinter is run with Picosun’s new, proprietary PicoOS™ operating system and process control software.

“Together with Sprinter, we are launching also our PicoOS™ operating system. Own operating system and process control software, developed by our in-house software team, means the highest control precision and accuracy, the fastest service times, and the best reliability and quality for our customers,” continues Rautee.

Full stack PicoOS™ software allows control, operation and configuration of PICOSUN® ALD equipment – either standalone systems or full production clusters – via one unified, intuitive, and user-friendly graphical HMI and ensures smooth connection between the system and the customer’s factory automation via SECS/GEM protocol.

Sprinter is available for process demos at Picosun facilities. Sprinter module sales starts in January 2021 and full Sprinter cluster with several ALD modules, central vacuum wafer handling unit and EFEM is available later in spring 2021.

(*)PICOSUN® Sprinter ALD batch process data on 300 mm Si wafers, Al2O3 process as an example (more data available on request):

Parameter Value
Film thickness 1σ non-uniformity, within-wafer @ 200 oC About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
Web: www.picosun.com

• Read more about PICOSUN® Sprinter disrupts fast batch ALD on 300 mm wafers

ESPOO, Finland, 23rd November 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions, partners with prominent Chinese hospitals and researchers to apply medical ALD technology for safer surgical procedures.

Picosun’s biocompatible ALD coatings will be applied on electrosurgical equipment (electrotomes) to improve their performance, safety, and service life.

“It’s great to collaborate with a company such as Picosun to develop solutions for safer and more patient-friendly surgeries. Picosun is the leader in medical ALD solutions. The company has extensive process portfolio for biocompatible ALD materials and their equipment are at use at several medical equipment manufacturers around the world. In China, Picosun is the market leader with numerous PICOSUN® ALD systems installed throughout the country. We have strong trust that this collaboration will result in disruptive new innovations and novel solutions for surgical equipment,” says Longsheng Lu, Professor of South China University of Technology.

Electrotome utilizes high temperature to cut and separate tissue, with simultaneously coagulating blood, and it’s a standard equipment replacing traditional mechanical scalpels in many operations. Tissue and blood sticking and burning on the electrotome blade is a serious problem because the crusted blade risks increased bleeding, tissue damage, tearing and scarring, thus making the patient’s healing time longer. Smoke from the burning tissue may also hinder the surgeon’s vision and increase the risk for error during delicate procedures such as cardiac or neurosurgery.

This far, there hasn’t been a working solution in the market to overcome this problem. ALD technology can potentially provide this solution and thus improve patient safety, wound quality and healing time. ALD forms ultra-thin, pinhole-free coatings with unmatched conformality over the smallest microscale details of the surface, and the ALD process can be performed at moderate temperatures so the method is suitable also for sensitive materials. Deposited over special anti-adhesive micropatterning of the electrotome blade, biocompatible ALD film prevents blood and tissue from sticking to the blade.

“We are happy to extend our PicoMEDICAL™ technology to a yet new healthcare application, and to work with top tier Chinese hospitals and scientists to qualify our solutions in everyday use. ALD is revolutionizing the medical field right now, just like it did to semiconductor industries over a decade ago. We at Picosun want to use our extensive ALD know-how to develop solutions to improve people’s health and quality of life, which is why medical ALD is one of our key markets for the future,” continues Dr. Jani Kivioja, CTO of Picosun Group.

Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, China mainland and Taiwan, Singapore, Japan and South Korea, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

The project “Design of anti-adhesive surface modified with bionic microstructures and ALD coatings and its application on surgical electrotomes” is carried out in collaboration with SCUT (South China University of Technology), PLAGH (General Hospital of the People's Liberation Army), Guangdong Provincial People's Hospital, and Guangzhou First People’s Hospital. The project will start on 1st December 2020 and continue for 3 years. The project is partially funded by Business Finland.

More information:
Dr. Jani Kivioja
CTO, Picosun Group
Tel: +358 46 922 8804
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun’s medical ALD solutions enable safer surgeries

Busch Vacuum Solutions has launched the COBRA BC 1200 A, adding to large portfolio of vacuum pumps for the Semiconductor market. This water-cooled dry vacuum pump is ideal for processes that benefit from low gas temperatures inside the pump. The low 65°C internal gas temperature minimizes build-up inside the mechanism while pumping ALD precursors that react more aggressively as gas temperatures inside the pump rise.

Many new ALD process tools require more pumping speed. The VFD-controlled integrated vacuum booster provides deep ultimate pressure and up to 1200 m3/h peak pumping speed to meet this need.

The COBRA BC 1200 A is well suited for clean, light and medium semiconductor applications like Lithography, Physical Vapor Deposition Process (PVD), PVD-pre-clean and rapid thermal annealing (RTA).

In addition to high performance, the COBRA BC 1200 A offers low cost of ownership, minimal maintenance with long service intervals, high uptime and direct water-cooling. The vacuum pump’s canned water-cooled motor and direct-mounted booster result in a small footprint and low overall height while retaining performance benefits.

The COBRA 1200 A vacuum pump is based on the proven screw vacuum technology from Busch. Dry, non-contacting patented self-balancing screws and idle mode enhance energy efficiency. The vacuum pump’s canned water-cooled motors and direct water-cooling limit dust contamination in clean room air and minimize height and footprint while retaining the performance benefits of this new pump.

US Marketing
Jean Perry – November 13, 2020

• Read more about COBRA BC 1200 A Vacuum Pump: High-Pumping Speed, Low Temperature

MILPITAS, Calif. — November 19, 2020 — North America-based manufacturers of semiconductor equipment posted $2.64 billion in billings worldwide in October 2020 (three-month average basis), according to the October Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 3.7 percent lower than the final September 2020 level of $2.74 billion, and is 26.9 percent higher than the October 2019 billings level of $2.08 billion.

“Following the record-breaking September results, billings of North America-based semiconductor equipment manufacturers continue to show strong results in October,” said Ajit Manocha, SEMI president and CEO. “The coming months should reaffirm the positive momentum as industry leaders are issuing guidance for a strong fourth quarter despite continuing trade tensions and the intensifying pandemic.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), November 2020

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is December 17, 2020 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp.

• Read more about North American Semiconductor Equipment Industry Posts October 2020 Billings