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Webinar - The Future of Work: Leading Remote Teams

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Webinar - The Future of Work: Leading Remote Teams
United States SAVE YOUR SEAT SEMI MSIG logo lock up Featured Speakers

MEMS to Market: Ingredients for Success 

The MEMS & Sensors Industry Group is offering a series of webinars where technical experts will share strategies and new approaches related to MEMS product development from prototype to production. The series will enable designers, product managers, test engineers, integrators, entrepreneurs, and investors to shorten development timelines and increase manufacturing yield while introducing robust MEMS products into the market.

This webinar series will be offered in three parts. Each webinar will be offered to a live audience and will be available to watch on-demand at your convenience.

United States

Bob Smith
MODERATOR
Bob Smith (Webinar I)
Executive Director
ESDA Alliance
Mary Ann Maher
Mary Ann Maher (Webinar I)
Chief Executive Officer
SoftMEMS
Greg Lebsack
Greg Lebsack (Webinar I)
General Manager
ICDS, Siemens
Michelle Bourke, Lam Research
MODERATOR
Michelle Bourke (Webinar II)
Senior Director of Strategic Marketing
LAM Research
AMF logo
Dr. Alissa Fitzgerald (Webinar II)
Founder & Managing Member
A.M. Fitzgerald & Associates, LLC
AMF logo
Dr. Carolyn White (Webinar II)
Associate
A.M. Fitzgerald & Associates, LLC
Mary Ann Maher
MODERATOR
Mary Ann Maher (Webinar III)
Chief Executive Officer
SoftMEMS
Sixto Arjonilla
Sixto Arjonilla (Webinar III)
Quality Director of Motion Sensors
NXP
Anupam Choubey
Anupam Choubey (Webinar III)
Principal Technical Lead
Draper Lab
Srikanth Ganesan
Srikanth Ganesan (Webinar III)
Senior Manager, MEMS/CMOS Reliability
TDK InvenSense

March 10th, 2021

8:00 am - 9:00 am

Webinar I: Using Digital Twins to Address The Design Gap for Sensor-Based Products

Sponsored By

Agenda & Speaker Bios

Designing next-generation sensor-based systems like those found in wearables, IoT and medical devices poses many challenges. MEMS and sensor design is challenging due to the use of unique materials, fabrication processes and packaging. The age of COVID has necessitated designers working remotely and collaborating over time zones. These factors have led to a gap in design, modeling and simulation capability for creating the billions of interconnected sensors required by future applications.

This webinar discusses MEMS and sensor design challenges and how Digital Twins can be used for facilitating the design of sensor-based products. The talk will describe how Digital Twins may be applied in many phases of the design process from materials design optimization all the way to artificial intelligence algorithm training and virtual product testing. Examples will be given illustrating the use of Digital Twins to create a Digital Factory to increase sensor manufacturing yield and how Digital Twins are being used in sensor-based medical product design.

NXP

April 7th, 2021

8:00 am - 9:00 am

Webinar II: How to Plan for Successful MEMS Product Development

Agenda & Speaker Bios

Drawing on our experience in successfully executing more than 400 MEMS development projects at AMFitzgerald, we will present a practical overview on navigating the technical and business challenges of MEMS product development. We will describe helpful strategies and tactics discussed in our new book, MEMS Product Development: From Concept to Commercialization, that when practiced diligently, can shorten development timelines, help avoid common pitfalls, and improve the odds of success, especially when resources are limited. We illuminate what it really takes to develop a novel MEMS product so that innovators, designers, entrepreneurs, product managers, investors, and executives may properly prepare their companies to succeed.

May 5th, 2021

8:00 am - 9:00 am

Webinar III: The Growing Importance of MEMS Reliability

Agenda & Speaker Bios

MEMS-based devices are experiencing significant market expansion in consumer, industrial, medical and automotive applications.  With the expansion in the marketplace, there is a growing focus on the importance and unique challenges of MEMS reliability.  This talk will explore MEMS reliability from concept and application-based customer requirements, through design and development processes with a demonstration of meeting industry reliability standards, similar to other semiconductor products.  We also will consider MEMS reliability throughout semiconductor and customer manufacturing processes.  In some cases, it has been found that standard manufacturing handling can result in environments for MEMS devices that are more strenuous than the final application.  Through a better understanding of the factors impacting MEMS reliability, proper alignment of development and industrialization processes can help all of us introduce robust MEMS products into the market.

- MSIG

Dates

March 10th, 2021 - April 7th, 2021 - May 5th, 2021

8:00 am - 9:00 am Off Add to Calendar Disabled
Event format

HAYWARD, CA, JANUARY 06, 2021: Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and aerospace industries, announced today the appointment of Joseph Montano as President. Reporting directly to CEO Jeanne Beacham, Joe will serve a critical role in the company’s leadership team as Delphon continues to grow through new product innovations and future acquisitions.

Joe has spent more than 25 years in the electronics and electronic materials technology segments. He has an extensive technical and commercial background, with experience spanning from the R&D bench to executive management. Most recently Joe served as Sr. Vice President of Sales and Marketing at Intermolecular where he was instrumental in returning the company to profitability and orchestrating its acquisition by Merck KGaA, Darmstadt, Germany in 2019. Prior to working for Intermolecular, Joe was the Global Business Director for MacDermid Enthone’s Advanced Electronics division. Joe holds a Bachelor of Science degree in Chemical Engineering from Northeastern University in Boston.

“I am very excited to have Joe join us. As Delphon continues to grow and expand into new markets, I am confident that Joe’s extensive experience in semiconductor materials and business development will be an asset to our leadership team,” says Jeanne Beacham, Delphon CEO.

About Delphon
Delphon provides innovative polymer and adhesive solutions to the semiconductor, photonics, medical and aerospace industries. Through its Gel-Pak®, UltraTape®, and TouchMark divisions, the company has developed breakthrough products that provide solutions for manufacturing processes in a wide range of markets. Customers from around the globe know that they can trust these products even in the most critical environments.

For more information, please contact Jennifer Dossee Nunes, Sr. Director of Marketing, at [email protected] or visit www.delphon.com

Totowa, New Jersey – January 6, 2020 – ECI Technology, Inc. a leading manufacturer of chemical management systems for the semiconductor, printed circuit board (PCB), and other high-technology industries, announced today that it has received the Best Cooperation Supplier Award from one of Korea’s largest semiconductor manufacturing foundries. This award is in recognition of the development of process control for new applications and for the strategic role ECI Technology R&D and ECI Korea regional support teams play in supporting the foundry’s wafer manufacturing processes. The award recognizes companies that have made an outstanding contribution to its ability to drive superior products. ECI was measured on its best-in-class R&D technology for unique chemical metrology for new manufacturing processes. This supplier relationship between the two companies spans over 20 years and stands as testimony to the foundry’s confidence in ECI Technology and recognition of its value.

“We are dedicated to continue delivering the most advanced solutions and strategic value to our customers and this award confirms our vital relationship with a global leader in advanced semiconductor technology,” stated Marianna Rabinovitch, CEO, ECI Technology. “It is an honor to be recognized for the value our technology and service teams provide. ECI Technology strives to continue meeting and exceeding our customers’ technology advancements.”

About ECI Technology
ECI Technology is a leading provider of chemical management systems for semiconductor, PV, and PCB industries. Our technologies making possible the manufacturing of the most advanced semiconductors, flat panels, solar panels, printed circuit boards, and more. ECI has global operations and is ISO 9001 certified. It has R&D facilities, manufacturing, and customer service in the United States with regional sales and customer support teams in Japan, Korea, and Taiwan with representatives in China, Europe, Southeast Asia, and Israel. For additional information visit www.ecitechnology.com.

Totowa, New Jersey – January 6, 2021 – ECI Technology, Inc. a leading manufacturer of chemical management systems for the semiconductor, printed circuit board (PCB), and other high-technology industries, was commended and received a Certificate of Appreciation Best Partner Award from one of the world’s largest semiconductor manufacturing foundries. ECI Technology’s Taiwan office was established in 2015 and its Taichung team was honored for its prompt, high-quality service in support of ECI’s online analyzers. ECI’s tools are used to optimize bath chemistry in high-volume FinFET semiconductor manufacturing that delivers advanced chips used in critical technologies such as artificial intelligence, data centers, 5G communications, and smartphones.

ECI’s Taiwan teams are well-positioned to be responsive to customers’ process needs through scientific and engineering collaboration to develop process solutions for the most complex chemical materials – qualifying incoming chemical supplies, managing tool inputs, adjusting chamber/ bath conditions, and monitoring process waste – all critical enablers to accelerate development and production ramp.

“Our sincerest thanks for recognition from this world-leading wafer foundry. ECI has developed long-term partnerships with semiconductor manufacturers around the world, providing advanced process technologies tailored to meet customers’ precise specifications," stated Marianna Rabinovitch, CEO, ECI Technology. “As we look ahead, we are eager to continue to serve customers with process control solutions for volume production. That’s been a core philosophy of ECI throughout its 34-year history.”

About ECI Technology
ECI Technology is a world-class provider of chemical management systems for semiconductor, PV, and PCB industries. Our technologies making possible the manufacturing of the most advanced semiconductors, flat panels, solar panels, printed circuit boards, and more. ECI has global operations and is ISO 9001 certified. It has R&D facilities, manufacturing, and customer service in the United States with regional sales and customer support teams in Japan, Korea, and Taiwan with representatives in China, Europe, Southeast Asia, and Israel. For additional information visit www.ecitechnology.com.

With a sealed ball screw assembly on both sides and an upgraded lubrication concept, the new PSK precision module from Bosch Rexroth – manufactured in the United States, meets the operational requirements of semiconductor production and of the electronics industry even better than before. In this new generation, designers have increased the rigidity of the frame and cover various usage scenarios in an application-oriented way with two accuracy classes.

In most applications, the focus is on ensuring that no outside contaminants get into a mechanical system, while in controlled areas and clean room production. The revised PSK ensures that no material makes it outside into the mechanical system. The precision ball screw nut and linear carriage assembly are sealed from both sides with Rexroth ball screw assembly seals. This detail significantly reduces the risk of lubricants escaping outside.

At the same time, Bosch Rexroth has expanded its lubrication concept to include four lubrication versions. The standard version comes with conventional industrial lubricant with initial greasing. It is possible to select between two different lubricants LSS standard and LSC clean room. Another option is precision modules connected to central lubrication systems prepared with liquid grease. Automated re-lubrication increases operational reliability, ruling out human error when manual lubrication is performed. The fourth lubrication version is a simple preservation of the runner blocks and ball screw assemblies so that approved greases can be used.

The new generation PSK precision models are available in three sizes, and are mounted on a smooth, space-saving and rigid precision steel profile frame with integrated guide tracks. You can select which side to have a smoothed reference edge. This speeds up assembly and makes it easier to align the axis. The frame is more torsion-resistant compared to the previous models and offers higher planar moments of inertia.

Bosch Rexroth’s generation 2 PSK precision modules cover various mechanical requirements in clean production from various lubrication needs, optional magnetic field sensors that can be adjusted over the entire travel distance to selectable covers for extra environmental protection.

Additional information on the precision modules can be viewed in Rexroth's online tools with all options for simple configuration, and CAD download via the Rexroth eShop.

Visit www.boschrexroth-us.com/psk for more information.

About Bosch Rexroth
As one of the world’s leading suppliers of drive and control technologies, Bosch Rexroth ensures efficient, powerful and safe movement in machines and systems of any size. The company bundles global application experience in the market segments of Mobile Applications, Machinery Applications and Engineering, and Factory Automation. With its intelligent components, customized system solutions and services, Bosch Rexroth is creating the necessary environment for fully connected applications. Bosch Rexroth offers its customers hydraulics, electric drive and control technology, gear technology and linear motion and assembly technology, including software and interfaces to the Internet of Things. With locations in over 80 countries, roughly 31,000 associates generated sales revenue of roughly 6.2 billion euros ($7.3 billion) in 2019. To learn more, please visit www.boschrexroth-us.com.

United States Standards
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Online, Pacific Time
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Standards

Compound Semiconductor Materials North America TC Chapter Meeting

Date: Wednesday, November 10, 2021

Time: 09:00-11:00 AM Pacific

via Web Conference

 

AGENDA

(subject to change)

Last updated: Oct 6, 2021

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

9:00 am - 11:00 am Off Add to Calendar 2021-11-10 09:00:00 2021-11-10 11:00:00 Compound Semiconductor Materials North America TC Chapter Meeting Compound Semiconductor Materials North America TC Chapter Meeting Date: Wednesday, November 10, 2021 Time: 09:00-11:00 AM Pacific via Web Conference   AGENDA (subject to change) Last updated: Oct 6, 2021   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public
United States Standards
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Online, Pacific Time
United States

Standards

Microlithography North America TC Chapter Meeting

Date: Wednesday, July 14, 2021

Time: 02:00-04:00 PM Pacific

via Web Conference

 

AGENDA

(subject to change)

Last updated: May 25, 2021

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

2:00 pm - 4:00 pm Off Add to Calendar 2021-07-14 14:00:00 2021-07-14 16:00:00 Microlithography North America TC Chapter Meeting Microlithography North America TC Chapter Meeting Date: Wednesday, July 14, 2021 Time: 02:00-04:00 PM Pacific via Web Conference   AGENDA (subject to change) Last updated: May 25, 2021   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public

ESPOO, Finland, 16th December 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology, has established a new business area, PicoMedical, for medical and healthcare ALD segments.

The newly established business area will reinforce and streamline Picosun Group’s activities in the medical field. These activities include product and solutions development for medical ALD applications, driving the profitable growth from the medical segment, and increasing the Picosun brand awareness in the healthcare and medical industries. PicoMedical will also manage the Group’s extensive medical ALD patent portfolio of 18 patent families, and coordinate and execute research activities and collaboration projects in the medical field.

Picosun has appointed Mr. Juhani Taskinen to lead the PicoMedical business area. The appointment was made in the Picosun Board meeting. Mr. Taskinen will start in his position 5th January 2021. Mr. Taskinen has extensive international career and background in the medical field, and proven track record in driving profitable business growth and leading successful collaboration activities in these industries. He has held various leading general management, sales and marketing, and business development positions in pharma, biotech, and healthcare companies such as Johnson & Johnson, Merck KGaA, Darmstadt, Germany, and Abbott.

“Right now, ALD is disrupting healthcare technologies just like it did to microelectronics in the early 2000’s. Picosun is the trailblazer and spearhead in medical ALD solutions. I’m happy to start in my new position as the head of Picosun’s PicoMedical business area to speed this company into even greater success in the healthcare segment,” states Mr. Taskinen.

“It’s great to welcome Mr. Juhani Taskinen into our team. ALD has amazing possibilities to offer to the healthcare industries. We are sure that with Mr. Taskinen’s skills, background and expertise we can truly make several new breakthroughs in this field,” continues Mr. Jussi Rautee, CEO of Picosun Group.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
Web: www.picosun.com

Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice® S8 electroplating system to a major semiconductor foundry service based in Taiwan. This is the second S8 to be purchased by the company. The 8-chambered Solstice platform is designed specifically for ≤200mm wafer processing. The new tool will be used to produce Heterojunction Bipolar Transistors (HBTs) and Vertical Cavity Surface Emitting Lasers (VCSELs). The announcement was made by ClassOne’s CEO, Byron Exarcos, and Senior Technology Director, John Ghekiere.

“This user is a high-volume semiconductor manufacturer,” said Ghekiere. "So they are interested not only in the Solstice's superior plating performance, but also in its reliable, fully-automated high throughput. The tool is being used for wafer level packaging processes, including copper pillar and solder bump electroplating.”

“This customer has been using our Solstice S8 electroplating equipment for several years now," said Exarcos. “The tool has been fully qualified for their processes and is meeting their aggressive performance goals. Now, their business is rapidly expanding, and they've chosen to bring in a second S8 to support that growth. We're actually seeing this pattern across the industry today. As Solstice is becoming embedded into customer processes, the repeat orders are coming in with increased frequency. We're very gratified by this vote of confidence in the Solstice and in ClassOne.”

Ghekiere noted that today’s HBT devices are used in many ultrafast circuits and those requiring high power efficiency, including next-generation RF power amplifiers, 5G cellular phones, etc. VCSELs are used in 2D and 3D imaging, facial recognition, smart-glasses, fiber optic communications, LiDAR, and much more.

The ClassOne Solstice S8 is an 8-chamber system for high-performance, fully-automated electroplating and surface preparation. The Solstice series, which was specifically designed for ≤200mm wafer processing, also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, the tool’s special Plating-Plus™ capabilities enable it to handle a number of other surface preparation functions, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility serves to streamline process production and can reduce the number of different tools a user needs to purchase.

About ClassOne Technology
ClassOne Technology (classone.com) provides innovative wet-chemical equipment solutions, including electroplaters, spin-rinse-dryers, spray solvent tools and more. The company focuses on making advanced processing technology available to users of ≤200mm wafers, such as compound semiconductor and many emerging markets, who traditionally have been underserved by the larger equipment manufacturers. ClassOne Technology’s equipment has become known for its unique combination of advanced performance, flexibility and cost-efficiency Based in Kalispell, Montana, ClassOne Technology is built upon decades of experience from industry veterans creating high-performance semiconductor equipment. ClassOne Technology is a sister company to ClassOne Equipment (ClassOneEquipment.com), the industry’s premier provider of refurbished name-brand processing tools, with over 2,500 systems installed worldwide.

For more information, contact:
Byron Exarcos
ClassOne Technology
109 Cooperative Way
Kalispell, MT 59901
tel: +1 (678) 772-9086
email: [email protected]