ESPOO, Finland, 16th December 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology, has established a new business area, PicoMedical, for medical and healthcare ALD segments.

The newly established business area will reinforce and streamline Picosun Group’s activities in the medical field. These activities include product and solutions development for medical ALD applications, driving the profitable growth from the medical segment, and increasing the Picosun brand awareness in the healthcare and medical industries. PicoMedical will also manage the Group’s extensive medical ALD patent portfolio of 18 patent families, and coordinate and execute research activities and collaboration projects in the medical field.

Picosun has appointed Mr. Juhani Taskinen to lead the PicoMedical business area. The appointment was made in the Picosun Board meeting. Mr. Taskinen will start in his position 5th January 2021. Mr. Taskinen has extensive international career and background in the medical field, and proven track record in driving profitable business growth and leading successful collaboration activities in these industries. He has held various leading general management, sales and marketing, and business development positions in pharma, biotech, and healthcare companies such as Johnson & Johnson, Merck KGaA, Darmstadt, Germany, and Abbott.

“Right now, ALD is disrupting healthcare technologies just like it did to microelectronics in the early 2000’s. Picosun is the trailblazer and spearhead in medical ALD solutions. I’m happy to start in my new position as the head of Picosun’s PicoMedical business area to speed this company into even greater success in the healthcare segment,” states Mr. Taskinen.

“It’s great to welcome Mr. Juhani Taskinen into our team. ALD has amazing possibilities to offer to the healthcare industries. We are sure that with Mr. Taskinen’s skills, background and expertise we can truly make several new breakthroughs in this field,” continues Mr. Jussi Rautee, CEO of Picosun Group.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
Web: www.picosun.com

• Read more about Juhani Taskinen to lead Picosun’s new PicoMedical business area

Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice® S8 electroplating system to a major semiconductor foundry service based in Taiwan. This is the second S8 to be purchased by the company. The 8-chambered Solstice platform is designed specifically for ≤200mm wafer processing. The new tool will be used to produce Heterojunction Bipolar Transistors (HBTs) and Vertical Cavity Surface Emitting Lasers (VCSELs). The announcement was made by ClassOne’s CEO, Byron Exarcos, and Senior Technology Director, John Ghekiere.

“This user is a high-volume semiconductor manufacturer,” said Ghekiere. "So they are interested not only in the Solstice's superior plating performance, but also in its reliable, fully-automated high throughput. The tool is being used for wafer level packaging processes, including copper pillar and solder bump electroplating.”

“This customer has been using our Solstice S8 electroplating equipment for several years now," said Exarcos. “The tool has been fully qualified for their processes and is meeting their aggressive performance goals. Now, their business is rapidly expanding, and they've chosen to bring in a second S8 to support that growth. We're actually seeing this pattern across the industry today. As Solstice is becoming embedded into customer processes, the repeat orders are coming in with increased frequency. We're very gratified by this vote of confidence in the Solstice and in ClassOne.”

Ghekiere noted that today’s HBT devices are used in many ultrafast circuits and those requiring high power efficiency, including next-generation RF power amplifiers, 5G cellular phones, etc. VCSELs are used in 2D and 3D imaging, facial recognition, smart-glasses, fiber optic communications, LiDAR, and much more.

The ClassOne Solstice S8 is an 8-chamber system for high-performance, fully-automated electroplating and surface preparation. The Solstice series, which was specifically designed for ≤200mm wafer processing, also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, the tool’s special Plating-Plus™ capabilities enable it to handle a number of other surface preparation functions, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility serves to streamline process production and can reduce the number of different tools a user needs to purchase.

About ClassOne Technology
ClassOne Technology (classone.com) provides innovative wet-chemical equipment solutions, including electroplaters, spin-rinse-dryers, spray solvent tools and more. The company focuses on making advanced processing technology available to users of ≤200mm wafers, such as compound semiconductor and many emerging markets, who traditionally have been underserved by the larger equipment manufacturers. ClassOne Technology’s equipment has become known for its unique combination of advanced performance, flexibility and cost-efficiency Based in Kalispell, Montana, ClassOne Technology is built upon decades of experience from industry veterans creating high-performance semiconductor equipment. ClassOne Technology is a sister company to ClassOne Equipment (ClassOneEquipment.com), the industry’s premier provider of refurbished name-brand processing tools, with over 2,500 systems installed worldwide.

For more information, contact:
Byron Exarcos
ClassOne Technology
109 Cooperative Way
Kalispell, MT 59901
tel: +1 (678) 772-9086
email: [email protected]

• Read more about ClassOne Receives Repeat Order for its Solstice Electroplating System from Major Taiwanese Semiconductor Manufacturer

Verific Design Automation today announced a partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to provide the DARPA community access to its electronic design automation (EDA) software in production and development use throughout the semiconductor industry.

Driven by the DARPA Electronics Resurgence Initiative (ERI) to forge collaborations among commercial electronics companies, the agreement offers the DARPA community use of Verific’s hardware description language (HDL) software for the duration of their programs.

“Our support of academic use over the years has been on an ad-hoc basis,” remarks Michiel Ligthart, president and chief operating officer of Verific. “This agreement provides DARPA-funded programs easy and streamlined access to our industry-standard SystemVerilog parsers and elaborators, cracking open ways to meet DARPA’s goal to innovate a fourth wave of electronics progress.”

Specific tools covered under the agreement are Verific's SystemVerilog parser and static and register transfer logic (RTL) elaborators, already serving as front-end for simulation, formal verification, synthesis, emulation, virtual prototyping, in-circuit debug and design for test applications worldwide. For years, Verific's Parser Platforms have given engineering groups a way to eliminate costly internal development of front-end EDA software, accelerating time to market with improved quality.

Currently, more than 20 DARPA-funded programs promote U.S. microelectronics leadership, including some using low-cost, predictably priced tools such as Verific’s software. “DARPA’s programs within the Microsystems Technology Office (MTO) are a bold accelerator of several technical and economic trends in the microelectronics sector,” says Serge Leef, who leads design automation and secure hardware programs. “Giving DARPA’s community easy access to proven, industrial-strength, best-in-class software frameworks enables the researchers to tightly focus on scientific advances while improving the path to a smooth transition of their breakthrough discoveries into commercial and defense applications.”

Verific’s SystemVerilog, VHDL and universal power format (UPF) Parser Platforms are in production and development flows at semiconductor companies worldwide, from emerging companies to established Fortune 500 vendors. Verific distributes its Parser Platforms as C++ source code and compiles on all 32- and 64-bit Unix, Linux, Mac OS and Windows operating systems.
About Verific Design Automation

About Verific
Verific Design Automation is the leading provider of SystemVerilog, Verilog, VHDL and UPF Parser Platforms that enable project groups to develop advanced electronic design automation (EDA) products quickly and cost effective worldwide. With offices in Alameda, Calif., and Kolkata, India, Verific has shipped more than 60,000 copies of its software used worldwide by the EDA and semiconductor industry since it was founded in 1999.

Engage with Verific at:
Email: [email protected]
Website: www.verific.com
LinkedIn: https://www.linkedin.com/company/verific-design-automation-inc/
Facebook: https://www.facebook.com/Verific-Design-Automation-100448363329771/

• Read more about Verific and DARPA Sign Partnership for Streamlined Access to Industry-Standard SystemVerilog EDA Software

TOKYO — December 15, 2020 — Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase 16% compared to $59.6 billion in 2019 and register a new industry record of $68.9 billion in 2020, SEMI announced today in releasing its Year-end Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan. The growth is expected to continue with the global semiconductor manufacturing equipment market reaching $71.9 billion in 2021 and $76.1 billion in 2022.

Both the front end and the back end semiconductor equipment segments are expected to power the expansion. The wafer fab equipment segment – which includes wafer processing, fab facilities, and mask/reticle equipment – is projected to rise 15% to reach $59.4 billion in 2020, followed by 4% and 6% growth in 2021 and 2022, respectively. The foundry and logic segments, which account for about half of total wafer fab equipment sales, will see a mid-teens percentage increase this year to reach $30 billion in spending driven by investments in leading-edge technologies. Spending on NAND flash manufacturing equipment will surge 30% this year, surpassing $14 billion, while DRAM is expected to lead the expansion in 2021 and 2022.

The assembly and packaging equipment segment is forecast to grow 20% to $3.5 billion in 2020, followed by 8% and 5% increases in 2021 and 2022, respectively, driven by advanced packaging applications. The semiconductor test equipment market is expected to rise 20% in 2020, reaching $6 billion, and continue to expand in 2021 and 2022 on demand for 5G and high-performance computing (HPC) applications.

China, Taiwan and Korea are projected to be the leading regions in spending in 2020. Robust foundry and memory investment in China is expected to propel the region to the top of the total semiconductor equipment market for the first time this year. In 2021 and 2022, Korea is forecast to lead the world in semiconductor equipment investments on the back of a memory recovery and increases in logic investment. Equipment spending in Taiwan will remain robust, powered by leading-edge foundry investment. Most other regions tracked will also see growth during the forecast period.

The following results reflect market size in billions of U.S. dollars:

Source: SEMI December 2020, Equipment Market Data Subscription

New equipment includes wafer fab, test, and A&P. Total equipment does NOT include wafer manufacturing equipment. Totals may not add due to rounding.

The current SEMI forecast is based on collective input from top equipment suppliers, SEMI’s Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program and SEMI's industry recognized World Fab Forecast database.

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

• Monthly SEMI NA Billings Report, an early perspective of equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments
• Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

For more information online, please visit the EMDS page.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Semiconductor Equipment Consensus Forecast – Record Growth Ahead, SEMI Reports

ST. PETERSBURG, Fla. (Dec. 3, 2020) — Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor industry, announced today the acquisition of OEM Group’s dry process equipment business.

With the acquisition, Plasma-Therm has acquired all original OEM licenses and intellectual property rights for SFI Endeavor, AG Heatpulse, MRC Eclipse, and Tegal brand equipment. Plasma-Therm will continue to support existing customers through spare parts and upgrades, while offering new and refurbished tools to the wider market.

“The acquisition allows Plasma-Therm’s award-winning customer service teams to support the large and global install base,” said Abdul Lateef, CEO of Plasma-Therm. “Additionally, PVD and RTP technologies align perfectly with our etch and deposition products and process solutions, which will further support the manufacturing and R&D needs and requirements of our customers.”

Michael Correra, CEO of OEM Group, said, “We are delighted to have had these outstanding products acquired by Plasma-Therm, ensuring a strong path to market for our newly developed Endeavor M series PVD platform, and the continued availability and support of the MRC Eclipse, AG Heatpulse, and Tegal products. This acquisition allows OEM Group to strategically focus on our wet chemical process and ion implant technologies.”

About Plasma-Therm
Established in 1974, Plasma-Therm is a manufacturer of advanced plasma processing equipment for specialty semiconductor markets, including advanced packaging, wireless communication, photonics, solid-state lighting, MEMS/NEMS, nanotechnology, renewable energy, data storage, photomask, and R&D. Plasma-Therm offers leading etch and deposition technologies and solutions for these markets. Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of Plasma-Therm’s global customer base. Visit www.plasmatherm.com for more information.

About OEM Group
Established in 1999, OEM Group is a semiconductor capital equipment manufacturer and innovator in new and remanufactured 75mm – 300mm tools, spare parts, upgrades, and services. We serve the LED, MEMS, Wireless, Power, Energy Harvesting, WLP, Data Storage, and Logic markets. OEM Group's current portfolio of products includes the Semitool & Cintillio Spray Ozone Tool, Spray Acid Tool, and Spray Solvent Tool, Spin Rinse Dryer and Storm, Varian Implant, and AMAT P5000 CVD & Etch.

• Read more about Plasma-Therm Announces Acquisition of OEM Group PVD, RTP and Etch Business

ESPOO, Finland, 2nd December 2020 – Picosun Group, leading provider of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for industrial manufacturing, presents PicoOS™, the new, full stack operating system and process control software for PICOSUN® ALD equipment.

“PicoOS™ brings PICOSUN® ALD equipment control to the modern era. It is designed for wafer fabs and industrial environments where transition to Industry 4.0 is ongoing. Data-driven PicoOS™ enables future production solutions where machine learning, artificial intelligence, internet-of-things, and other new digital inventions are utilized for optimum industrial efficiency,” says Dr. Jani Kivioja, CTO of Picosun Group.

Picosun’s proprietary PicoOS™ software combines individual ALD module, wafer handling and transfer system, and instrumentation control under one common graphical HMI (human-machine interface). This ensures easy, intuitive and user-friendly operation, maintenance, and configuration of the whole PICOSUN® ALD cluster.

PicoOS™ enables full factory integration via SECS/GEM protocol, process and system data logging down to 20 ms rate, and real-time export of all data for continuous monitoring and further analysis.

PicoOS™ operating system is specifically developed by Picosun’s own in-house software team for the company’s fully automated production ALD systems Morpher and Sprinter, and it will be implemented in all future PICOSUN® ALD tool platforms.

“PicoOS™ is designed to ensure the highest control precision and accuracy, the fastest service times, and the best user experience for our customers. Having in-house control over all features and sub-components of our PICOSUN® ALD solutions is a key part of our holistic service model,” continues Kivioja.

PicoOS™ has freely configurable and scalable editor for ALD process recipe and processing job creation and storage, and recipes can be edited or new ones created any time during the ALD system operation. Configurable user levels and safety logic, instrumentation and interlocks guarantee safe use in day-to-day operations, and allow full access for tool management in maintenance situations. Maintenance procedures are sped up by specific clean-up and maintenance sequences inbuilt in the software.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Dr. Jani Kivioja
CTO, Picosun Group
Tel: +358 50 321 1955
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun launches PicoOS™, a unified control software for PICOSUN® ALD modules and clusters

ESPOO, Finland, 2nd December 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, has launched Sprinter, a brand new, fully automated high throughput ALD production module for 300 mm wafers. Barrier, high-k and other films are deposited in Sprinter with perfect ALD for semiconductor (e.g. emerging memory, transistor, capacitor), display, and IoT component applications.

In Sprinter, single wafer film quality and uniformity are upscaled to fast batch processing with the highest reliability and repeatability(*).

Compared to vertical furnace reactors typically used for batch ALD processing, Sprinter provides higher film quality with lower thermal budget, so it is suitable also for temperature-sensitive devices.

Sprinter combines very fast process times with smaller batch sizes than in vertical furnaces, which allows greater production flexibility and minimized risk without sacrificing throughput.

The core of the Sprinter is its disruptively designed reaction chamber, where fully laminar precursor flows ensure perfect ALD deposition with no parasitic CVD growth. This minimizes the need for system maintenance.

“PICOSUN® Sprinter meets directly the challenges in high volume ALD manufacturing on 300 mm wafers. We are happy to unveil this product to our new and existing customers in 300 mm semiconductor markets, and offer them a truly disruptive, modern alternative to old technologies in batch ALD manufacturing,” says Mr. Jussi Rautee, CEO of Picosun Group.

SEMI S2/S8 certified PICOSUN® Sprinter module can be integrated to customer’s manufacturing line or cluster. It is suitable also for single wafer manufacturing lines as it does not disturb the process flow. Sprinter is run with Picosun’s new, proprietary PicoOS™ operating system and process control software.

“Together with Sprinter, we are launching also our PicoOS™ operating system. Own operating system and process control software, developed by our in-house software team, means the highest control precision and accuracy, the fastest service times, and the best reliability and quality for our customers,” continues Rautee.

Full stack PicoOS™ software allows control, operation and configuration of PICOSUN® ALD equipment – either standalone systems or full production clusters – via one unified, intuitive, and user-friendly graphical HMI and ensures smooth connection between the system and the customer’s factory automation via SECS/GEM protocol.

Sprinter is available for process demos at Picosun facilities. Sprinter module sales starts in January 2021 and full Sprinter cluster with several ALD modules, central vacuum wafer handling unit and EFEM is available later in spring 2021.

(*)PICOSUN® Sprinter ALD batch process data on 300 mm Si wafers, Al2O3 process as an example (more data available on request):

Parameter Value
Film thickness 1σ non-uniformity, within-wafer @ 200 oC About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
Web: www.picosun.com

• Read more about PICOSUN® Sprinter disrupts fast batch ALD on 300 mm wafers