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Belgium France Germany Ireland Italy United States Sub Fab 101 Training

Course Description

By the end of this course, participants will understand the scope of SubFAB and its critical role within the semiconductor manufacturing ecosystem, tracing its evolution and recognizing new trends. They will be able to identify and describe the core SubFAB systems and interpret typical facility layouts and equipment installation specifics. Learners will assess the environmental, and sustainability impacts of modern SubFABs. They will map a standard SubFAB organizational chart, typical roles, and responsibilities, and simulate incident-response workflows to reinforce operational readiness. Participants will be exposed to preventive maintenance and safety best practices to ensure reliability and compliance with regulations.

Who Should Attend

This course is designed for engineers and technicians in semiconductor manufacturing, equipment suppliers/OEM on-site service personnel, IE and MEP designers. 

Course Outline

  • Introduction & Course Logistics
    • Welcome, introductions, and platform quick start
    • Learning objectives and course flow
  • Module 1: SubFAB Fundamentals
    • Definition & scope of SubFAB
    • Historical evolution (from early fabs to today)
    • Core equipment & support systems overview
    • Typical facility layouts and installation configurations
  • Module 2: Environmental & Sustainability Considerations
    • Key environmental impacts (emissions, water/chemical use)
    • Gas abatement and PFAS management fundamentals
    • Metrics & case studies in sustainable SubFAB operation
  • Module 3: Organizational & Operational Structures
    • SubFAB org charts and stakeholder roles
    • Operational workflows (from tool install to maintenance)
    • Incident-response and escalation paths (role-play)
  • Module 4: Safety, Maintenance, & Reliability
    • Preventine- maintenance best practices
    • Safety protocols and hazard identification
    • Reliability metrics and continuous improvement loops
  • Module 5: Emerging Trends & Innovations
    • Automation, digital twins, and Industry 4.0 in SubFAB
    • Advanced materials handling and process integration
    • Open discussion: Where SubFAB will go next
  • Wrap-Up & Next Steps
    • Final Q&A and feedback collection
    • Certification requirements and further resources
    • Suggested post-course readings and SEMI standard references 

 

Instructor

Ilya Zabelinksy

Instructor Bio

 

 

 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United Kingdom

SEMI U

SubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends. 

  • Jerusalem: 10 am - 2 pm 
  • India: 12:30 pm - 4:30pm
  • England: 8 am -12 pm 
Pricing
  • Members: $349
  • Non-Members: $399

* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected]. 

9:00 am - 1:00 pm Off Add to Calendar 2026-07-15 09:00:00 2026-07-15 13:00:00 SubFAB 101: Foundations of Semiconductor Support Facilities (Americas/EU) SubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends. Jerusalem: 10 am - 2 pm India: 12:30 pm - 4:30pmEngland: 8 am -12 pm PricingMembers: $349Non-Members: $399* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected].  United Kingdom SEMI.org [email protected] Europe/Brussels public Europe/Brussels Register Now
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Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson.

PTI, one of the world’s top OSAT (Outsourced Semiconductor Assembly and Test) companies, worked with the Nordson applications team to set up a comprehensive PLP demonstration that achieved high-quality, void-free underfill results at scale, using the industry-leading ASYMTEK Vantage® Series fluid dispensing system, equipped with the ASYMTEK IntelliJet® Jetting system. Nordson’s precision technology mitigated warpage and optimized fluid flow while decreasing cycle time by almost 30%.

PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency as the semiconductor industry transitions from 300-mm wafers to panels. PTI is enabling PLP applications that are designed to meet the semiconductor industry’s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures.

Underfill has been pivotal in semiconductor packaging since the adoption of flip-chips in the 1990s. As applications have become more demanding, particularly in high-performance CPUs, GPUs, and advanced architectures like flip-chip and 2.5D/3D ICs, the importance of underfilling to enhance mechanical reliability and thermal performance has grown. Since the beginning, Nordson developed innovations for underfill processes as the industry evolved from PC board, substrate, wafer, and now panel applications.

Nordson’s distributor, Jetinn Global Equipment Ltd., supported the advancements discussed in this case study by investing in demonstration equipment and providing expert technical support.

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M Merck

Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing ​

In the semiconductor industry where we routinely pattern sub-wavelength structures and require atomic-layer precision in our manufacturing processes, it’s easy to assume that we can simply measure everything we’re doing and all the structures we create. In reality, though, metrology and inspection have the challenging task of not just keeping up with device technology but staying far enough ahead that we can actually “see” our results and confirm the progress we’re making.

In this webinar, co-hosted with the Electronics business of Merck KGaA, Darmstadt, Germany; we will explore the metrology and inspection space to learn more about technological advances driving this vital segment of semiconductor manufacturing.

The webinar will feature presentations by Eric Beyne, PhD, Senior Fellow, VP R&D and Director of 3D System Integration Program for imec, and Dario Alliata, PhD, Senior Application Director for Metrology & Inspection at the Electronics business of Merck KGaA, Darmstadt, Germany.

Following the presentations, an interactive Q&A segment will allow attendees a chance to deepen their understanding of how materials innovation and advanced metrology intersect at the leading edge of manufacturing.

Join us to engage with peers and pioneers working at the forefront of materials science and semiconductor innovation!

 

United States

Dario Alliata
Dario Alliata, PhD
Senior Director of Applications
The Electronics business of Merck KGaA, Darmstadt, Germany

The Role & the Challenge of Metrology and Inspection in Advanced Packaging of AI Chips

The massive adoption of social networking and artificial intelligence has pushed the semiconductor industry to develop devices capable of supporting the required infrastructures. Increasingly powerful computer process units (CPU) are used to allow data centers to process trillions of information exchanges, while faster graphic process units (GPU) enable virtual and assisted reality.
Cost leveraging is now reachable with the integration of multiple dies in the same package, each one fabricated to handle specific functionalities with the most cost-effective technology node, which is a form of heterogeneous integration. This session highlights some examples of metrology and inspection solutions aimed at securing the manufacturability of devices for High Computing Power fundamental for AI applications. More in detail, it explores the challenge of the fabrication of chip-to-chip interconnections that are key for the heterogeneous integration of active components with vertical stacking like DRAM for High Bandwidth memories, where process tolerances are increasingly narrow and conditions to measure more and more extremes.

Biography
Dr. Dario Alliata joined Unity-SC, now part of the Electronics business of Merck KGaA, Darmstadt, Germany in the U.S. and Canada. In 2016 as product manager and is now Sr. Director of Applications with focus on Advanced packaging and Specialty substrates & devices.
He worked in the semiconductor industry for more than 25 years, initially in R&D centers and later in equipment makers. He spent his entire career developing process control solutions for securing the manufacturing chain in the semiconductor industry.
He received a MD in Physics from the University of Milan (Italy) and hold a Ph.D. in Physics & Chemistry from the University of Berne (Switzerland).

EB
Eric Beyne, PhD
VP R&D / Program Director 3D System Integration Program / Senior Fellow
imec

Sub-Micron Pitch Scaling of Hybrid Bond Interconnects: Metrology Challenges

Advanced 3D integration technology will increasingly rely on hybrid bonding technology for both wafer-to-wafer and die-to-wafer bonding. This allows for micrometer and sub-micrometer pitch interconnects, resulting in very high 3D interconnect densities, compatible with the back-end-of -line interconnect layers of active logic and memory die. The results are “seamlessly” interconnected die. Off-chip interconnects become equivalent (or better) than on-chip interconnects.
These great system-level benefits however come at some challenges. Small overlay errors or surface imperfections can prevent defects, resulting in yield loss. Critical process, steps, such as CMP, wafer dicing and surface cleaning steps, need to be monitored with higher accuracy to maintain a good process. New parameters, such as wafer shape, distortion, surface profile slopes, and copper pad recess levels need to be measured and continuously monitored. This poses significant challenges to metrology related to hybrid bonding. The presentation will highlight these needs and show some practical solutions.

Biography
Eric Beyne obtained a degree in electrical engineering in 1983 and the Ph.D. in Applied Sciences in 1990, both from the Katholieke Universiteit Leuven, Belgium. Since 1986 he has been with IMEC in Leuven, Belgium where he has worked on advanced packaging and interconnect technologies. Currently, he is imec senior fellow, VP R&D and program director of imec’s 3D System Integration program.

Michael Weigand
Michael Weigand
Senior Application Manager
Brewer Science

Moderator

Biography
I'm a seasoned Senior Application Manager at Brewer Science with over two decades of experience in Semiconductor industry. I lead application teams at Brewer Science Inc, focusing on advanced materials for the semiconductor industry. With a background in Material Science, I enjoy tackling technical challenges, from optimizing critical processes to finding creative ways to characterize materials.

EMG

Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany 

10:00 am - 11:00 am Off Add to Calendar 2025-09-17 10:00:00 2025-09-17 11:00:00 Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing ​ Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles WATCH NOW
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Breakthrough in Semiconductor Lithography Recognized by the American Chemical Society

WILMINGTON, Del., June 10, 2025 – DuPont (NYSE: DD) today announced that 13 of its current and former scientists and engineers have been named 2025 Heroes of Chemistry by the American Chemical Society (ACS) for an innovative program that progressed semiconductor lithography.

The award recognizes the collaborative development of embedded barrier layer technology, a transformative advancement in 193 nm immersion lithography that significantly improved chip fabrication processes by increasing yield, reducing defects, and enhancing process efficiency. The honored team includes Deyan Wang, Ph.D., Cong Liu, Ph.D., Doris Kang, Ph.D., MingQi Li, Ph.D., Shintaro Yamada, Ph.D., Stefan Caporale, Chengbai Xu, Ph.D., George Barclay, Ph.D., ChunYi Wu, Joon Seok Oh, Li Jia, Jinrong Liu, and Anthony Zampini.

Formulations containing embedded barrier technology have been widely adopted in lithography processes across the global semiconductor industry, supporting advancements for technologies such as artificial intelligence (AI), advanced computing and consumer electronics.

Embedded barrier layer technology addresses key challenges in early immersion lithography such as defectivity and process stability. By integrating barrier functionality directly into the photoresist, fabricators can simplify their lithography processes, with lower materials usage and reduced energy consumption. This advanced technology contributes to improvements in operational efficiency and sustainability for high-volume chip fabrication.

“The introduction of embedded barrier layer technology marked a critical breakthrough innovation for the global semiconductor industry, by extending the capabilities of what is possible with 193 immersion lithography to support the production of advanced, energy-efficient chips,” said Randal King, Vice President of R&D/Technology, Qnity™, DuPont Electronics. “Embedded barrier layer solutions were first implemented over a decade ago and continue to be widely used today. The success of this team demonstrates how materials innovation is powering amazing leaps in technology.”

The ACS Heroes of Chemistry Award is presented annually to industrial scientists whose work has led to the successful development and commercialization of impactful chemistry-based products. The 2025 awardees will be formally recognized at a ceremony in August, as part of the ACS Fall 2025 meeting in Washington, D.C.

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

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As world leaders act to secure access to these minerals, companies come under pressure to follow due diligence guidelines to promote ethical sourcing of these materials for their supply chains.  Regulations such as the US Dodd-Frank Wall Street Reform and Consumer Protection Act (Section 1502), EU Regulation 2017/821 and the EU Corporate Sustainability Due Diligence Directive require companies to trace materials through their supply chains and report to the public about their use of conflict minerals. 

Several industry associations, including the Responsible Business Alliance’s Responsible Minerals Initiative, were created to help companies with their due diligence efforts. Reports such as those issued by the US Government Accountability Office on Conflict Minerals offer insights into the efficacy of these regulations and suggest improved approaches for industry engagement. 

The SEMI Responsible Supply Chain (RSC) working group was recently formed to host discussions on these topics. This webinar will provide insights from speakers Jennifer Peyser, Responsible Business Alliance Senior Vice President of Responsible Sourcing, and Kimberly Gianopoulos, Managing Director for the International Affairs and Trade team at the U.S. Government Accountability Office (GAO).

United States

8:00 am - 8:05 am
Kim Harrison
Dr. Kimberly Harrison, Ph.D
Senior MEMS Engineer
AMFitzgerald & Associates

Welcome and Introductions of RSC working group

Dr. Harrison is a MEMS Engineer with AMFitzgerald & Associates, a design firm located in the Bay Area California. She has a doctoral degree in mechanical engineering from Stanford University, and has worked as a designer and process engineer in the semiconductor industry for 10 years. She was nominated as a 2022 MEMS & Sensors Industry Group Emerging Leader. As a founding member and leader of the SEMI Responsible Supply Chain Working Group, she hopes to bring SEMI members together to discuss solutions to human rights issues in the semiconductor supply chain.

Conflict Minerals Supply Chain Overview

8:05 am - 8:35 am
Kimberly Gianopoulos
Kimberly Gianopoulos
Managing Director for the International Affairs and Trade
U.S. Government Accountability Office (GAO)

Report Review

Director Gianopoulos oversees a 140-person team that reviews a wide variety of federal government oversight issues, including International Security Assistance, Bilateral and Multilateral Foreign Assistance, International Trade and Finance, and U.S. Diplomatic Presence and Management. She serves as a facilitator in GAO’s Learning Center and participates in recruiting activities. Ms. Gianopoulos has received several awards, including a Distinguished Service Award, a Meritorious Service Award, a Client Service Award, and several Results Through Teamwork awards. Ms. Gianopoulos earned a Bachelor’s degree in Mathematics and a Master’s degree in Public Analysis and Administration from the State University of New York at Binghamton. She is a Certified Government Financial Manager and a member of Pi Alpha Alpha, the Global Honor Society for Public Affairs and Administration.

Jen Peyser
Jennifer Peyser
Executive Director
Responsible Minerals Initiative

RMI Activity Overview

“The RMI supports over 500 downstream, midstream, and upstream member companies with a suite of due diligence standards and tools, data, guidance, training, and other resources for global responsible sourcing and regulatory compliance. Our facility and supply chain due diligence standards are rooted in longstanding international norms while reflecting emerging corporate and stakeholder priorities for regulatory compliance, managing sustainability risks and impacts, and fostering responsible mineral supply chains.”

8:35 am - 8:55 am

Q&A

8:55 am - 9:00 am

Summary and Closing Remarks

SCM 8:00 am - 9:00 am Off Add to Calendar 2025-07-09 08:00:00 2025-07-09 09:00:00 Critical Minerals, Due Diligence and the Semiconductor Supply Chain United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register for On-demand
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Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing:
    • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
    • Etching and Cleaning Processes: Plasma and wet etching processes
    • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
    • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
    • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
    • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
    • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio

Testimonials 

See what course participants had to say about this course!

  • "The expansive width of coverage with sufficient depth; well curated, relevant information with live references, and the open style of delivery which made the course more of a sharing than a lecture, was enjoyable."
  • "Denny's knowledge and ability to explain things in simplified ways was awesome!"
  • "I really enjoyed going over the topics and watching the in-depth videos. I also liked how we received the slide information prior to the class."
  • "The range of topics was perfect for an intro course."
  • "Denny did a great job explaining complex topics. The opportunity to ask questions directly was beneficial for the entire class. If a question couldn't be answered immediately, it was addressed by the next break at the latest."
  • "Thank you very much for the informative course. I appreciate the in-depth and in-detail insight in all aspects of Semiconductor Manufacturing!"

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Pricing
  • Members: $995
  • Non-Members: $1,195

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

7:30 am - 3:00 pm Off Add to Calendar 2025-11-11 07:30:00 2025-11-12 15:00:00 Overview of Semiconductor Manufacturing (Virtual Training, Americas) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingMembers: $995Non-Members: $1,195* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Testimonials 

See what course participants had to say about this course!

  • "Denny Frye knows so much about the history of the semiconductor industry that he was able to tie together many different industries and technologies that I have heard about but never knew how they were connected."
  • "Great overview of the semiconductor industry & market."
  • "This was a very detailed course on many facets of the industry, would recommend!"
  • "It was a great mix of technical and overview of the key players in the market!"
  • "Good blend on technical and commercial topics."
  • "Excellent introduction to the semiconductor world."
  • "Great session on the understanding of the semiconductor industry in a nutshell."

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

United States

SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing
  • Members: $845
  • Non-Members: $945

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

7:30 am - 3:00 pm Off Add to Calendar 2025-11-10 07:30:00 2025-11-10 15:00:00 Understanding Semiconductor Technology and Business (Virtual Training, Americas) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $845Non-Members: $945* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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Toulouse, 5 June 2025 – RECIF Technologies is pleased to announce the launch of R.PACK, the next-generation software suite designed for RECIF sorters. With an emphasis on usability, efficiency, and innovation, R.PACK introduces a suite of advanced features aimed at simplifying the management of wafer sorting equipment.

Built for Speed, Designed for Precision

R.PACK enhances operational efficiency for users of RECIF’s COMPACT and SMART sorters, featuring advanced capabilities and a modern interface designed to streamline wafer sorting processes

Key Features of R.PACK:

  • Refined User Interface: The design of R.PACK makes it easier than ever to create recipes and monitor jobs, ensuring smoother operations and increased productivity.
  • Seamless Transition: Current users will experience minimal disruption when transitioning to R.PACK, thanks to its intuitive interface that simplifies adoption.
  • Ongoing Software Enhancements: R.PACK is built on a forward-compatible framework, with updates released annually to deliver new features and performance improvements. The first major update was rolled out in January 2025, with the next release scheduled for Q1 2026 — part of an ongoing roadmap to enhance user experience and expand system capabilities.

Commitment to Innovation and User Experience

The release of R.PACK reinforces RECIF Technologies’ ongoing commitment to providing high-performance solutions for the semiconductor industry. By focusing on a more intuitive and efficient wafer sorting process, R.PACK marks the first in a series of improvements designed to elevate both the user experience and operational efficiency.

"We believe R.PACK will significantly enhance our customers' workflows and performance," said Thomas Brillouet, the R&D Manager at RECIF Technologies. "By providing enhanced features and a modernized interface, we empower our customers with tools that maximize safety, enhance efficiency, and optimize equipment performance with minimal effort."

Availability and Future Updates

The first major update for R.PACK is available now, with additional updates scheduled annually every Q1. R.PACK is compatible with RECIF sorters (COMPACT & SMART) and will fully replace the WISE software by 2027.

For more information on R.PACK, including system requirements and update schedules, visit www.reciftech.com.

Regular Pricing

SEMI Members: $75

Non-Members:  $149

SEMI Members: Use your corporate email address during log in to be recognized as a SEMI Member.

Students:  Free

Contact Andreia Smith-Moritz ([email protected]) with a picture of your student ID to receive your discount code.

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In this engaging two-hour Masterclass organized by SEMI, we explore the groundbreaking role of magnetic materials, particularly magnetic nanoparticles (MNPs), in biomedical fields. The session commences with an in-depth review of the physics and synthesis of MNPs, including comprehensive discussions on fundamental theories, synthesis methods, and advanced MNP surface functionalization strategies. Attendees will gain insights into the characterization techniques used to analyze the physicochemical properties of MNPs.

The Masterclass transitions to the applications of MNPs in therapeutic and diagnostic contexts. We will review cutting-edge MNP-based therapies, such as magnetic hyperthermia therapy, targeted drug and gene delivery, and magnetic neurostimulation. In addition, we will discuss various MNP-based diagnostic techniques, including magnetoresistive (MR) sensing, nuclear magnetic resonance (NMR), magnetic particle spectroscopy (MPS), magnetic resonance imaging (MRI), and magnetic particle imaging (MPI). A critical focus of this Masterclass will be on safety and biocompatibility issues associated with the use of MNPs in vivo, examining the toxicity of MNPs, immune responses, and their circulation time in the human body.

The latter part of the session will introduce participants to the innovative field of micromagnetic neural stimulation, an infant yet extremely promising field. We will delve into the design and efficacy of micromagnetic devices, such as the Magnetic Pen (MagPen) and Magnetic Patch (MagPatch) Array, which utilize micrometer-sized coils (μcoils) for targeted neural activation. This is particularly for patients with spinal cord injuries (SCI) and for reducing opioid dependency, with insights drawn from current research supported by the NIH Blueprint Medtech Program. By the end of the Masterclass, attendees will have a comprehensive understanding of the potential clinical applications of MNPs and MEMs-based micromagnetic neurostimulators.

 

ABOUT THE SPEAKER

Dr. Renata Saha, Senior Scientist, Dupont

Dr. Renata Saha is a Senior Scientist at DuPont located in Wilmington, DE. She holds a PhD in Electrical and Computer Engineering from the University of Minnesota, Twin Cities, which she earned in August 2023. Her undergraduate degree in Electronics & Communication Engineering was obtained from the National Institute of Technology in Durgapur, India. During the summer of 2017, she was an undergraduate research intern at Conseil européen pour la Recherche Nucléaire (CERN), located in Geneva, Switzerland working on the ALICE experiment upgrade.

Dr. Saha is the recipient of 3-year College of Science & Engineering Fellowship, Women in Technology Scholarship 2021-2022 from Cadence Design Systems, and the Graduate Neuromodulation Research Fellowship 2022-2023 from MnDRIVE. She was also elected an iREDEFINE Fellow in 2022 by ECEDHA and was named a Rising Star in EECS. She has published over 30 journal articles, 3 US patents, and 2 book chapters.

Her expertise and research interests involve designing and developing microelectromechanical systems (MEMs) devices for neuromodulation and cardiovascular monitoring, characterizing magnetic nanoparticles (MNPs) for potential biomarkers. Outside of her research and work, Dr. Saha is trained in Indian classical dance form, Odissi, and enjoys performing and choreographing the art form.

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Renata Saha
Renata Saha
Senior Scientist
Dupont
Gity Samadi
MODERATOR
Gity Samadi
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech ESD Alliance FlexTech

In this two-hour Masterclass, Dupont Senior Scientist Renata Saha delves into the biomedical applications of magnetic nanoparticles (MNPs), covering their manufacturing, functionalization as well as therapeutic and diagnostic uses including safety considerations such as biocompatability and toxicology. 

10:00 am - 12:00 pm Off Add to Calendar 2025-10-29 10:00:00 2025-10-29 12:00:00 FEMC #26 Innovations in Magnetic Materials: Applications in Biomedical Engineering In this two-hour Masterclass, Dupont Senior Scientist Renata Saha delves into the biomedical applications of magnetic nanoparticles (MNPs), covering their manufacturing, functionalization as well as therapeutic and diagnostic uses including safety considerations such as biocompatability and toxicology.  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch Now!
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Course Description

The instructor discusses the applied aspects of plasma-assisted etching from a general point of view. The emphasis is on mechanistic understanding. The etching of Si and its compounds is covered in detail. The chemistries used in the etching of other technology-related materials such as Al, organics, and III-V compounds are summarized. Other topics presented include selectivity, loading, ARDE and feature scale problems, damage, and issues associated with high-density plasma RIE. A section on plasma diagnostics and ion-beam based etching methods is briefly discussed. 

Learning Objectives

  • Understand the fundamentals of dry etching and the basic concepts of plasma etching
  • Understand the physics of rf glow discharges (both high and low density)
  • Understand the surface science aspects of RIE including the role of energetic ions
  • Recognize the factors which influence etching anisotropy
  • Define the steps of plasma-surface chemistry leading to etching

Topics Covered

  • Fluorocarbon plasma etching of Si and its compounds
  • Selectivity, loading effects, and aspect ratio dependent etching
  • Uniformity of etching, damage, feature charging issues, and particles
  • Etching of other materials (Al, organics, III-V compounds, etc)
  • Plasma diagnostics such as optical emission spectroscopy with actinometry, mass spectrometry and laser-induced fluorescence
  • Issues in high density plasma etching, wall effects, and ion beam-based methods
  • Deep Reactive Ion Etching (DRIE)
  • Applications and processing etching using ALE
  • End point detection

Who Should Attend

This course is intended for scientists, technicians and others working with or interested in the dry etching of materials in reactive gas glow discharges, particularly those who do not have extensive experience in the field. 

Instructor

Richard Beaudry

PT International, LLC

Instructor Bio
 

Testimonials

See what previous course participants had to say about this training!

  • "Instructors' Process and Hardware knowledge were impressive."
  • "I finally gained a clear understanding of the RIE process."
  • "The instructor had a very good knowledge of the content."
  • "I had a great time to learn fundamental concepts of plasma etching course from SEMI."
  • "The aspect of the course that I found most beneficial was the Bosch processing parameter discussions on profile management. This subject was clearly the expertise of the presenter who skillfully addressed my questions regarding the subject."

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

- SEMI U

This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. 

Pricing
  • Members: $745
  • Non-Members: $845

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:00 am - 12:00 pm Off Add to Calendar 2025-10-27 08:00:00 2025-10-28 12:00:00 Plasma Etching, ALE, & RIE (Virtual Training, US & EU) This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail and the factors which influence anisotropy of etching are highlighted. Plasma-assisted etching equipment is described including capacitively coupled, inductively coupled and wave-generated plasmas sources. PricingMembers: $745Non-Members: $845* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Sold Out
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