camLine will host its U.S. Forum 2025 on October 10, 2025, at Intel’s Chandler campus in Arizona; a one-day event dedicated to exploring how semiconductor manufacturers are addressing today’s most critical operational challenges.

Fabs worldwide face growing demands for higher output, tighter process control, and reduced environmental impact. Achieving these goals requires more than equipment upgrades; it calls for a coordinated, data driven approach across manufacturing execution and material control systems.

Under the theme “Define a Future with Digital Continuity: Power Up Smart Manufacturing,” the forum will examine how Manufacturing Execution Systems (MES), Material Control Systems (MCS), and Digital Twin technologies are being deployed to optimize material flow, cut inefficiencies, and support sustainable growth in live production environments.

The program will feature a keynote from Daniel C. Rodriguez, Intel Vice President and General Manager of the Edge Computing Group, alongside sessions that share real factory use cases, technical insights, and live demonstrations. A central element is the voice of customers, with manufacturers presenting measurable results and lessons learned from implementing these systems in production environments.

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Asahi/America, the leader in thermoplastic fluid flow technology, is pleased to announce several updates to its sales leadership team.

Effective July 1, 2025, Rob Marsiglia has been promoted to Eastern Regional Sales Manager. With over seven years of experience at Asahi/America, Marsiglia brings a wealth of technical and leadership experience to his new role. Most recently, he served as Team Manager for the company’s industrial piping products, where he worked closely with customers to support industrial piping specifications and applications. Based in New Jersey, Marsiglia will now oversee sales operations throughout the Eastern region, continuing to deliver service and support to customers. Rob Marsiglia can be reached at [email protected] or 617-653-0585.

As of May 16, 2025, Ryan Diaz has joined the company as District Sales Manager, responsible for the Southern California, Southern Nevada, and Hawai‘i sales territory. Bringing over 16 years of experience in industrial product sales, Diaz offers deep industry knowledge and a strong customer-centric approach. In his new role, he will focus on supporting distributors and end-users within his territory by providing tailored product recommendations, technical support, and project guidance. Ryan Diaz can be contacted at [email protected] or 714-916-6605.

Effective June 30, 2025, Stephen Harder joins Asahi/America as Business Development Manager, focusing on the semiconductor and microelectronics markets. Harder brings more than 20 years of experience from roles at OEMs and distribution companies, where he specialized in business development for the semiconductor industry. He is based in Portland, OR and will play a key role in expanding Asahi/America’s presence in these high-tech market segments. Stephen Harder can be reached at [email protected] or 971-505-1834.

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Channahon, Ill. [July 22, 2025] – Diversified CPC International, an industry leader in the production and distribution of high-purity propellants, hydrocarbon refrigerants, and specialty gas products, is pleased to welcome Terri Wittmann as senior strategic account manager.

In this role, she will spearhead initiatives that reinforce Diversified CPC’s commitment to advancing partnerships with suppliers and manufacturers within the semiconductor industry.

Wittmann has more than 20 years of experience serving companies that depend on industrial and specialty gases. She spent a decade at Airgas, where she held several key account leadership roles, most recently serving as national account manager for the company’s energy and chemical segment.

“I am excited about the benefits Terri will bring to our suppliers, customers, and other key players that drive our country’s technological leadership,” said Dan Drury, Diversified CPC’s vice president of commercial strategy and execution. “She is relentlessly dedicated to ensuring companies achieve their service, operational, and financial objectives.”

Wittmann has a bachelor’s degree in quantitative business analysis from Penn State University.

About Diversified CPC International

Diversified CPC International, a Sumitomo Corporation of Americas (SCOA) Portfolio Company, is a global leader in producing high-purity hydrocarbons, specialty gases and blends. Key offerings include propellants, refrigerants, foam blowing agents and solvents. These high-purity products help customers improve their safety, sustainability and financial outcomes. The company also offers custom formulation, safety training and services related to gas storage and handling. Established in 1964, Diversified CPC has six locations and leverages proprietary equipment and purification processes to meet customer needs.

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Lightium, MPI Corporation, and Axiomatic_AI Announce Strategic Partnership to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions
Zurich, Switzerland; Hsinchu, Taiwan; and Boston, USA – January 6, 2025 – Lightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.
This strategic collaboration aims to revolutionize the testing and qualification processes of photonic integrated circuit (PIC) devices by uniting state-of-the-art artificial intelligence, next-generation hardware, and deep domain expertise. The IAITS platform will deliver breakthrough performance in testing workflows—enabling unmatched efficiency, precision, and scalability to meet the ever-evolving demands of the photonics industry.
A Unified Vision for the Future of Photonics Testing
This partnership is driven by a shared commitment to deliver groundbreaking AI driven and self-optimizing solutions to the photonics industry. By combining Axiomatic_AI’s cutting-edge, reasoning-based, self-learning artificial intelligence with MPI Corporation’s industry-leading wafer probing systems and automation software, and leveraging Lightium AG’s advanced testing infrastructure and deep expertise in ultra-high-speed photonic device measurements, the collaboration aims to bring fully integrated, intelligent photonic integrated circuit (PIC) test solutions to market.
Together, the three companies are creating a unified AI platform that addresses the growing complexity and performance demands of characterizing photonic integrated circuits—unlocking new levels of automation, precision, and scalability for next-generation applications.
Disruptive Value Creation Across Hardware and Human Resources
The Intelligent, Autonomous, and Integrated Test Solution (IAITS) introduces a new paradigm in photonic integrated circuit (PIC) testing, delivering transformative value across both technology infrastructure and human capital.
Key Benefits of IAITS:
• Increased Throughput: By automating complex test routines, minimizing downtime, and optimizing measurement system utilization, IAITS significantly accelerates test cycles and reduces iteration times.
• Enhanced Human Efficiency: The system reduces reliance on manual operation, programming, and debugging—freeing skilled personnel to focus on high-value engineering and strategic innovation tasks.
IAITS will be commercially available as an advanced software add-on package for MPI Corporation’s wafer probing systems. Designed to support both R&D and high-volume production environments, the solution sets a new industry benchmark for efficiency, precision, and scalability—ultimately lowering the total cost of testing and accelerating time-to-market for next-generation PIC devices.
About Lightium AG
Lightium AG is a Swiss-based startup specializing in Photonic Integrated Circuit (PIC) foundry and design services, built on its proprietary, production-grade Thin-Film Lithium Niobate (TFLN) platform. Lightium accelerates customer innovation by delivering unmatched photonic performance, a streamlined and cost-efficient supply chain, and seamless scalability from prototyping to high-volume manufacturing.
As Europe’s first production-grade TFLN foundry, Lightium plays a pivotal role in enabling next-generation photonic solutions across a diverse range of industries, including telecommunications, data communications, quantum computing, artificial intelligence, and space technologies.
Further information can be found at: Lightium - Thin Film Lithium Niobate (TFLN) Photonic Foundry
About MPI Corporation
MPI Corporation, headquartered in Taiwan, is a global leader in advanced probe systems and testing solutions for the semiconductor, photonic, and photonic integrated circuit (PIC) industries. The company designs and manufactures high-performance wafer probing systems known for their exceptional precision, automation capabilities, and scalability—empowering cutting-edge testing across research, development, and high-volume production.
MPI’s innovations play a critical role in advancing next-generation technologies in wireless communication, electronics, and photonics. The company is publicly listed on the Taipei Exchange (TAIEX: 6223).
For more information, please visit: About MPI Corporation – Global Semiconductor Testing Leader
About Axiomatic_AI Inc.
Axiomatic_AI Inc., headquartered in Boston, is a pioneering startup developing physics-based reasoning artificial intelligence to accelerate innovation and reduce the cost and risk associated with deep-tech development. Its cutting-edge AI technologies are redefining how high-tech industries design, measure, and optimize complex systems—enabling faster, smarter decision-making across R&D and production environments.
Axiomatic_AI’s mission is to unlock new efficiencies and capabilities in fields where precision and complexity are paramount.
Learn more at: https://axiomatic-ai.com/mission/

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Kitchener, Ontario, July 15, 2025 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry has launched a new service offering to help OEMs comply with the SEMI® Cybersecurity Standard E187: Specification for Cybersecurity of Fab Equipment.

“PEER Group’s new PEER® E187 Compliance Assessment is a comprehensive third-party service for OEMs that provides the essential training, assessment, documentation, and guidance to help their equipment comply with SEMI E187,” says Doug Suerich, PEER Group’s Director of Marketing.

Released in 2022, SEMI E187 provides a baseline level of security for new equipment being shipped to factories. It applies specifically to computing devices installed on fab equipment that run Microsoft Windows or Linux. Already mandatory at some factories, SEMI E187 is being increasingly adopted as part of factory acceptance requirements.

“PEER Group is uniquely positioned to assist with E187 compliance thanks our leadership in SEMI’s Semiconductor Manufacturing Cybersecurity Consortium (SMCC), participation in SEMI Standards development, and our decades of experience working with both OEMs and factories to meet fab specification requirements and achieve SEMI Standards compliance,” shares Suerich, who also serves as an SMCC Governing Council member.

To help educate OEMs on how to comply with SEMI E187, PEER Group is hosting a free webinar on July 24, 2025. For more information, including how to register, visit: https://attendee.gotowebinar.com/register/7410295402908186710?source=se…

About PEER Group
PEER Group® is the leading global supplier of innovative factory and tool automation and connectivity software for the semiconductor industry. Since our founding in 1992, we have been committed to developing best-in-class solutions that help OEMs and factories reduce their time to market, risk, and costs by solving their most challenging automation, connectivity, and SEMI Standards compliance problems. Follow PEER Group on. Follow PEER Group on LinkedIn.

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This cutting-edge panel-level wet processing demo tool handles large 510 × 515 mm substrates, delivering world class, high density Through Glass Vias (TGV) formation and ultra-small taper angles essential for advanced packaging in high performance computing.

Gütenbach, Germany – July 15, 2025 – RENA Technologies, a leading manufacturer of wet processing equipment for semiconductor and advanced packaging production, today announced the ramp-up of its dedicated glass core substrates facility in Germany. This new line, designed for substrates up to 510 × 515 mm, immediately opens for customer test lots, underscoring RENA's proven expertise in glass processing and creating new opportunities for process development and customer sample production. “As experts in precision wet processing, we can now offer large panel demo services for high aspect ratio through glass via (TGV) formation on various glass types,” said Dr. Holger H. Kuehnlein, SVP Technology at RENA. “Our alkaline based TGV process delivers extremely small taper angles, low sidewall roughness, and exceptional dimensional control at panel scale, enabling high density via applications. Customers can begin validating these capabilities today.”

Why Glass, and Why Wet Processing?
Glass substrates offer significant advantages for advanced electronics, including ultra-flat surfaces, low dielectric loss, and superior thermal stability. However, realizing these benefits at scale requires defect free surface preparation and the formation of uniform, high density TGVs with minimal taper angles. RENA's wet processing systems are specifically designed to address both challenges:
1. Surface Engineering – Our systems ensure precise cleaning and stress relief across 600 x 600mm panels with submicron total thickness variation (TTV).
2. Chemically Formed TGVs – Following initial laser modifications performed by our specialist partners, RENA’s proprietary chemistries form, enlarge and shape each via to exact specifications. This process consistently delivers very small taper angles and smooth sidewalls, ideal for subsequent metallization.

By collaborating with leading German and international laser partners, RENA offers customers the flexibility to choose their preferred laser vendor while ensuring all downstream wet processing steps are handled by our advanced equipment.

Key Highlights of the New Facility
Panel Size: Focus on 510 x 515mm and up to 600 × 600mm, smaller possible
Tool Set: Alkaline TGV etching, advanced rinse/dry, optical inspection & metrology
Field-Proven Recipes: Process conditions migrated from high volume tools
On-Demand Access: Customers may run demo substrates, qualify custom chemistries, or request full process flows
Sustainability: Low temperature chemistries and closed loop water reclamation reduce energy and ultrapure water (UPW) consumption

Market Impact
High-Performance Computing (HPC) as well as 5G/6G RF modules increasingly require new package designs, including panel-level fan-out and trend towards more complex chiplet architectures. Glass substrates, long considered the “holy grail” for core and interposer material, effectively eliminate the limitations imposed by warpage and dielectric loss in organic substrates. By combining laser modification from our vetted partners with RENA's chemistry driven via shaping, designers can now validate glass packaging concepts on the lab-platform proven at 600x600mm dimensions.
“With this lab-tool, we've created a great opportunity for semiconductor manufacturers to perform demos on panel level glass substrates,” added Peter Schneidewind, CEO of RENA. “From surface preparation to via formation, our wet process flow is ready for customers substrates to support TGV technology breakthroughs. This is world class made in Black Forest.”

Availability & Engagement Model
• Testing available now
• Flexible collaboration: Bring your own laser modified substrates, or leverage RENA’s ecosystem partners to benefit from joint process development support, and metrology services for process validation.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

CONTACT
Sales:
Felix Fink
Phone: +49 7723 9313-403
E-Mail: [email protected]

Press:
Dirk Hensel
Phone:+49 7723 9313-914
E-Mail: [email protected]
www.rena.com

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