RoodMicrotec N.V. publishes the unaudited Interim Report for 2022

• Total income EUR 7.3 million (HY1 2021: EUR 7.3 million)
• EBITDA EUR 1.4 million (HY1 2021: EUR 1.3 million)
• Net profit EUR 0.6 million (HY1 2021: EUR 0.4 million)

Deventer, July 21, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today publishes the unaudited Interim Report and the half-year results for the period ended on June 30, 2022.

The total income in the first half-year of 2022 is EUR 7.3 million, which is equal to the total income reported for the first half-year of 2021 and for the second half of 2021. The stable total income is driven by a continued strong delivery level, especially in the test operations unit. In the first half of 2021 we ordered and received wafers for one of our SCM customers to manage the supply chain during a planned change of an assembly house. About EUR 0.4 million was realized for these wafers as total income and approximately the same amount was accounted for in the cost for raw materials and consumables. This resulted in a higher total income and a higher cost of materials in the first half of 2021 without an impact on the net profit. These parts will be delivered during the second half of 2022 where only part of the selling price will be recognized in the total income. The profit will therefore be positive.

EBITDA increased from EUR 1.3 million for the first half of 2021 to EUR 1.4 million for the first half of 2022. The lower cost of raw materials together with a good cost control have continued to reduce the overall costs in the first half-year of 2022.

Compared to the first half of 2021, the depreciation was lower in the first half of 2022 due to lower investments during 2021. The financing costs remained unchanged.

The net profit for the first half-year of 2022 increased by 47% to EUR 0.6 million compared to the first half-year of 2021.

(x EUR 1,000) Unaudited
HY1 2022 Unaudited
HY1 2021
Total Income 7,317 7,282
EBITDA 1,440 1,317
Net profit 644 437

 
Net cash flow from operating activities was positive with EUR 0.3 million (2021: positive with EUR 0.9 million). The change is the result of an increase in working capital during the first half of 2022. Net cash flow was negative with EUR 0.6 million (2021: positive with EUR 0.6 million). This was mainly due to the lower net cash from operating activities as well as investments and redemption of the 2012 perpetual bond during the first half of 2022.

The order book increased considerably compared to December 31, 2021, which is encouraging and indicates that a big part of the forecasted increase in total income for 2022 over last year is now covered with orders.

“Despite the general supply chain situation in the world, we have been able to continue our test operations at a high utilization level. This shows that we have logistics under control and are well prepared for the future increase in demand”, says Martin Sallenhag, CEO of RoodMicrotec. “The global shortage of semiconductor supplies as well as logistic challenges may still impact our ability to meet our plan for the full-year 2022, but we are closely monitoring the situation to be able to act if necessary.”

Unaudited Interim Report 2022
You will find the complete unaudited Interim Report 2022, which is available only in English and as an electronic version, on our corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.

Conference call
CEO Martin Sallenhag and CFO Arvid Ladega will present the unaudited Interim Report 2022 and respond to questions. You are invited to join RoodMicrotec’s conference call for media, analysts and shareholders (a Microsoft TEAMS event) on Thursday, July 21, 2022 at 9:30 CEST

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+49 69 509544247 Germany, Frankfurt am Main
+31 20 399 9804 The Netherlands, Amsterdam
+32 2 895 09 68 Belgium, Bruxelles
+41 43 217 23 02 Switzerland, Zurich

Find a local number – in case you are in another country
Phone Conference ID: 760 330 187#

Financial calendar
July 21, 2022 Conference call for media, analysts and shareholders
October 13, 2022 Trading update quarter 3-2022
January 26, 2023 Publication (preliminary) annual total income 2022

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com
Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is only published in English. This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.

• Read more about RoodMicrotec N.V. publishes the unaudited Interim Report for 2022

Established in July of 1982 by Sig, Kail, and Mariellen Wathne (hence the name, “SiKaMa”), Sikama was founded to design, develop, and manufacture high quality reflow soldering and curing systems utilizing a first of its kind high efficiency conductive heating technology to support the demands of the electronics industry.

After nearly 40 successful years, Sikama was purchased by Herb Weigel. Keeping with the mission originated by the founders, Herb’s goal is to elevate Sikama’s products to keep pace with the demands of the industry and exceed customer expectations. With an enhanced product roadmap and a growing number of services to support customers, Sikama is positioned better than ever to meet the increasing demands of its customers.

Sikama continues to grow its production space and team to meet the increasing demand for small footprint, high efficiency, and long-lasting products. In addition, with the launch of the fluxless EA UP1200, the company is positioned better than ever to meet the needs of the most demanding applications.

Here’s what was happening in 1982 when Sikama was founded:

• Time Magazine’s Machine of the Year was The Computer
• Biggest Blockbuster of 1982 was E.T.: The Extra-Terrestrial
• Superbowl XVI Champions were the San Francisco 49ers
• Billboard’s #1 Song was Physical by Olivia Newton-John
• Adobe was founded in California by Chuck Geschke and John Warnock

• Read more about Sikama International Celebrates 40th Anniversary

Chip Integration Technology Center (CITC) and Henkel announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for RF and power electronics. Under the terms of the partnership, Henkel will supply commercialized and developmental pressureless sintering die attach formulations and CITC will provide testing and analysis of the materials within next-generation package designs.

CITC’s Thermal High-Performance Packaging program focuses on thermo-mechanical design strategies and device packaging platforms that integrate low-stress, high-reliability rugged interconnect solutions. As die attach and molding materials are often limiting factors for the optimal operation of RF and power packages, Henkel is the ideal partner or innovation in this application area.

In addition to ongoing work in its state-of-the-art R&D centers, Henkel wants to accelerate time-to-market for its semiconductor packaging materials through strategic relationships across industry, government, and academia. CITC, which collaborates with leading power and RF device packaging companies, provides a unique opportunity to characterize and analyze Henkel’s high-thermal die attach formulations as an enabler for leading-edge device designs.

“Henkel’s pressureless sintering die attach materials are already proven in certain mobile applications,” explained Ramachandran “Ram” Trichur, the company’s Global Market Segment Head, Semiconductor Packaging Materials. “We want to extend that success to other sectors such as automotive, where large, high-power chips are the norm. Our pressureless sintering solutions are unique because they deliver the simple, low-stress processability of conventional die attach adhesives and very high thermal conductivity capabilities. The work at CITC will augment our in-house projects, allowing additional performance and reliability validation.”

The new die attach technology has the potential to enable the replacement of lead (Pb) within RF and power semiconductor devices that incorporate larger die on copper leadframes, allowing the introduction of high operating temperature gallium nitride (GaN) and silicon carbide (SiC) power die technologies. Many of CITC’s partners are actively integrating these new chip structures, making the cooperative project an excellent proving ground for Henkel’s pressureless sintering platform.

“In Henkel, we have found a material innovator that will enable the development of power and RF devices with a holistic approach that leverages the latest in die attach technology,” concluded CITC General Manager, Jeroen van den Brand. “With many major power device manufacturers based in Europe, and in Nijmegen in particular, we view this partnership as vital to satisfying the current and future demands within these important market sectors.”

About CITC
Chip Integration Technology Center (CITC) is a non-profit joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
www.citc.org

About Henkel
Henkel operates globally with a well-balanced and diversified portfolio. The company holds leading positions with its three business units in both industrial and consumer businesses thanks to strong brands, innovations and technologies. Henkel Adhesive Technologies is the global leader in the adhesives market – across all industry segments worldwide. In its Laundry & Home Care and Beauty Care businesses, Henkel holds leading positions in many markets and categories around the world. Founded in 1876, Henkel looks back on more than 140 years of success. In 2021, Henkel reported sales of more than 20 billion euros and adjusted operating profit of about 2.7 billion euros. Henkel employs about 53,000 people globally – a passionate and highly diverse team, united by a strong company culture, a common purpose to create sustainable value, and shared values. As a recognized leader in sustainability, Henkel holds top positions in many international indices and rankings. Henkel’s preferred shares are listed in the German stock index DAX.
www.henkel-adhesives.com/electronics

Contact
CITC: Marco Koelink | M +31 6 15 15 66 41 | E [email protected]
Henkel: Ruud de Wit | M +31 6 43 37 21 08 | E [email protected]

• Read more about CITC and Henkel forge partnership to accelerate high-thermal die attach solutions

Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Russ Sanchez has joined the company’s senior leadership team as Vice President of Quality and Managing Director of YES’s new Technology Center in Chandler, Arizona.

Mr. Sanchez, who is based in Chandler, is a seasoned operations and business leader with over two decades of experience driving excellence in the manufacturing operations of semiconductors, microelectronics, printed electronics, antenna technology, and hard drives.

“Russ has an impressive track record of developing technology centers and manufacturing operations to support the growth of high-technology sector customers,” said Rezwan Lateef, President of YES. “His ability to implement quality systems and to partner closely with our customers to realize their next-generation devices will be invaluable as we move into the next phase of our company’s growth.”

Mr. Sanchez came to YES from NthDegree Worldwide Technologies, where he was Vice President of Operations. Before that, he held a variety of roles within Manufacturing and Quality at technology companies including Airgain, NXP Semiconductors, ST Microelectronics/Western Digital Corporation, Hynix Semiconductor of America, and Philips Semiconductors. He holds a Bachelor of Science degree in Business Administration from the University of Phoenix.

About YES
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.

• Read more about Russ Sanchez Joins YES as VP of Quality and Managing Director of YES Technology Center

A long-term, strategic, enterprise-level technology collaboration aims to further increase production efficiencies and reduce costs for Micron and its suppliers.

Cambridge, MA, July 13, 2022 – Today, Athinia™ announced that Micron Technology, Inc. (Nasdaq: MU), a global leader in innovative memory and storage solutions, plans to use the Athinia™ data analytics platform to create a pioneering data collaboration ecosystem that will help lead a continued journey of digital transformation with Micron’s critical suppliers. Athinia™’s state-of-the-art AI-driven quality control methodology will be able to further improve process and device yield, reduce costs and accelerate time to value generation using select data and insights from Micron’s supply chain. Athinia™, launched in December 2021, is a partnership between Merck KGaA, Darmstadt, Germany (DAX:MKGAF) and Palantir Technologies Inc. (NYSE:PLTR).

“The secure architecture provided by Athinia™ will allow Micron and its suppliers to share a single source of real-time data without compromising data ownership, governance, privacy and security,” said Laura Matz, CEO of Athinia™ and Chief Science and Technology Officer of Merck, KGaA, Darmstadt, Germany. “Through data sharing and collaboration, the platform leverages machine learning-driven analytics to solve critical challenges.”

Using Athinia™’s platform, Micron’s suppliers will be able to share their process and manufacturing data as well as key parameters, offering secure collaboration on a much larger population of critical data analytics. Micron and its suppliers can expect to see improvements in yields, shortened qualification times and enhanced quality.

“Micron is leading the industry in adopting the Athinia™ platform for its new ecosystem. Through data collaboration, Athinia™ can help to achieve key objectives for the semiconductor industry such as the improvement of material quality and sustainability, supply chain resilience as well as the acceleration of innovation cycles,” said Kai Beckmann, Member of the Executive Board of Merck KGaA, Darmstadt, Germany and CEO Electronics. “Ultimately, data analytics and collaboration will allow a wide range of benefits to the entire semiconductor industry.”

“The production and delivery of semiconductors is absolutely vital to our collective welfare and security,” said Alexander C. Karp, co-founder and chief executive officer of Palantir Technologies Inc. “We are committed to ensuring that Micron and Athinia™ have the software they need to address the supply chain challenges involved in the distribution of one of the world’s most essential and important products.”

About Athinia Technologies LLC
Data for Pioneers. Athinia™ provides a data analytics platform that brings manufacturers and materials suppliers together to share, aggregate, and analyze data to unlock efficiencies and time to market, while improving quality, supply chain and sustainability. All this without taking ownership of data.

Athinia™ is a partnership between Merck KGaA, Darmstadt, Germany (DAX:MKGAF), and Palantir Technologies Inc. (NYSE:PLTR). Athinia is headquartered in Cambridge, MA, USA. Athinia operates independently from the Electronics business of Merck KGaA, Darmstadt, Germany. More information can be found at www.athinia.com, LinkedIn and Twitter.

About Merck KGaA, Darmstadt, Germany
Merck KGaA, Darmstadt, Germany, a leading science and technology company, operates across healthcare, life science and electronics. Around 60,000 employees work to make a positive difference to millions of people’s lives every day by creating more joyful and sustainable ways to live. From advancing gene editing technologies and discovering unique ways to treat the most challenging diseases to enabling the intelligence of devices – the company is everywhere. In 2021, Merck KGaA, Darmstadt, Germany, generated sales of € 19.7 billion in 66 countries.

The company holds the global rights to the name and trademark “Merck” internationally. The only exceptions are the United States and Canada, where the business sectors of Merck KGaA, Darmstadt, Germany, operate as EMD Serono in healthcare, MilliporeSigma in life science, and EMD Electronics in electronics. Since its founding in 1668, scientific exploration and responsible entrepreneurship have been key to the company’s technological and scientific advances. To this day, the founding family remains the majority owner of the publicly listed company.

About Palantir Technologies Inc.
Foundational software of tomorrow. Delivered today. Additional information is available at https://www.palantir.com.

For more information please contact [email protected]

• Read more about Micron to Select Athinia™ for Pioneering Data Collaboration

Deventer, July 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, will publish the Company’s first half-year report for 2022 before stock opening on July 21, 2022.

CEO Martin Sallenhag and CFO Arvid Ladega will comment on the report and will respond to questions during the conference call for media, analysts and shareholders on July 21, 2022 at 9:30 CEST.

You are invited to join the Microsoft TEAMS event using the following login instructions:
Join with your computer or mobile app Click here to join the meeting
Or call in (audio only)
+49 69 509544247 Germany, Frankfurt am Main
+31 20 399 9804 The Netherlands, Amsterdam
+32 2 895 09 68 Belgium, Bruxelles
+41 43 217 23 02 Switzerland, Zurich

Find a local number – in case you are in another country
Phone Conference ID: 760 330 187#

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English only.

• Read more about RoodMicrotec N.V.: Invitation to the presentation of the first half-year’s results for 2022

Sikama International is excited to exhibit at SEMICON West 2022 this July, presenting the innovative Electron Attachment fluxless reflow technology, our upcoming 40th anniversary, and an extensive product line for a broad range of applications providing customers with the highest efficiency, smallest footprint, and most versatility in the industry. Our patented Electron Attachment technology, developed in partnership with AirProducts™, provides unmatched performance offering truly safe and residue-free fluxless reflow. The system is operated with N2 cover gas and an H2/N2 blend with less than 5% hydrogen, ensuring safe operation. The EA UP1200 utilizes an electrically isolated ceramic roller transport mechanism to move the work item from zone-to-zone through the oven. The work item is deoxidized in the EA zones prior to reflow which eliminates the need for flux coating or washing. This technology has shown to be superior to formic acid processes time and time again. In addition, this revolutionary breakthrough offers the safest and lowest cost per wafer yet for the semiconductor packaging industry.

Sikama is looking forward to discussing their full product line at SEMICON West this year. Visit our booth #1447 to learn more and enter to win an iPad Air!

• Read more about Sikama International at SEMICON West 2022 – “Reliable, Repeatable, Responsible Reflow”

Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that it has promoted Dan O’Connell to Vice President of Strategic Accounts.

Mr. O’Connell joined YES in November of 2021 as Senior Director of Key Account Management. In his newly expanded role, he will work closely with the company’s Sales, Marketing and Technology teams to nurture strategic customer relationships and ensure YES’s alignment with current and future customer technology requirements.

“Dan’s extensive strategic account experience in the semiconductor industry has contributed to our rapid growth,” said Rezwan Lateef, President of YES. “His proven ability to develop strong industry relationships aimed at enabling technology roadmaps, coupled with his intimate knowledge of Advanced Packaging processes, make Dan a valued addition to our senior leadership team.”

Prior to joining YES, Mr. O’Connell held senior key account management positions of increasing responsibility at ASM Pacific Technology Ltd., Tokyo Electron (TEL), LAM/Novellus, and Ebara. He holds a bachelor’s degree in Chemical Engineering from Worcester Polytechnic Institute.

About YES
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.

• Read more about YES Names Dan O’Connell as Vice President of Strategic Accounts

Deventer, June 21, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and EnSilica plc, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), today announce that they have successfully brought a mixed signal automotive ASIC to commercial production following the official launch of a new flagship vehicle by a premium automotive company. The ASIC provides key differentiating features in the chassis control of the vehicle.

As announced in 2018, RoodMicrotec was selected by EnSilica to support it in the qualification and testing of this mixed signal automotive ASIC. RoodMicrotec will undertake final testing and shipment of the ASICs for EnSilica.

EnSilica is pleased to confirm that the main production run has now commenced with the official launch of the vehicle. The production schedule for more than 2.5 million ASICs over the next 12 months has been received. The ASIC has an anticipated seven-year production life and depending on the model, there are up to 24 ASICs per vehicle.

“It has been exciting to support EnSilica in bringing this project to production over the last few years. We are now looking forward to supporting production of this device in our Nördlingen facility”, says Martin Sallenhag, CEO of RoodMicrotec. “It again shows the demand for our unique combined capabilities, in depth experience and excellent track record in bringing automotive products to the market for our valued customers.”

“We are delighted to be entering the full production volume of this exciting project, having successfully collaborated with RoodMicrotec over a number of years. Our joint effort across this highly technical automotive project has now resulted in successful launch of the vehicle”, says Ian Lankshear, CEO of EnSilica.

About EnSilica
EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar and communications systems. EnSilica has a track record in delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has a design centres across the UK and in Bangalore, India and Porto Alegre, Brazil.
Further information on EnSilica at www.ensilica.com

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
Further information on RoodMicrotec at www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

• Read more about Premium Automotive Vehicle Launched with EnSilica’s Key Mixed Signal ASIC

Zurich, Switzerland / Heidelberg, Germany – Heidelberg Instruments Nano AG in Zurich, a subsidiary office of Heidelberg Instruments Mikrotechnik GmbH celebrated the 10-year anniversary of the commercialization of the NanoFrazor system series. The NanoFrazor is based on the Thermal Scanning Probe (t-SPL) technology and can be used for nanopatterning of quantum devices on 1D/2D materials, grayscale photonics devices, nanofluidic structures or biomimetic substrates for cell growth.

Originally the Thermal Scanning Probe technology was developed at IBM, where a group of researchers showed that the sharp tips of atomic force microscopes can be heated and used as a tool to “drill” nanoscale holes and later to write arbitrary nanostructures by using special, evaporating materials.

After exploring the technology at IBM, Felix Holzner and Philip Paul incorporated SwissLitho AG as a spin-off from ETH Zurich (Heidelberg Instruments Nano AG since 2021) as CEO and CTO with the idea of selling nanolithography equipment for t-SPL. The technical term “Thermal Scanning Probe Lithography” was then replaced by the product name “NanoFrazor”.

After starting operations of then SwissLitho in early 2013, the first commercial NanoFrazor machine named “Titlis”, a NanoFrazor Explore, was installed in 2014 at McGill University in Canada. “Titlis” is still running and just recently received an upgrade with the integration of the laser writer module jointly developed in Heidelberg and Zurich. Today, more than 50 NanoFrazor systems have been installed at renowned facilities all over the world, with new customers lined up for future systems.

“The NanoFrazor team in Zurich works on various promising developments on the instrument as well as on the materials to continuously expand the applications range of the technology. There are still manifold open opportunities for the NanoFrazor, as it can still be considered novel, even 10 years after the start of its commercialization. Everyone at Heidelberg Instruments is excited to see how the NanoFrazor will have developed in another 10 years from now”, Konrad Roessler, CEO of Heidelberg Instruments Mikrotechnik says.

The anniversary was celebrated in the newly opened office of Heidelberg Instruments Nano in Zurich together with family, friends, and numerous partners, who supported the successful journey of the NanoFrazor.

About Heidelberg Instruments Mikrotechnik GmbH
With over 35 years of experience and more than 1,200 installed systems, Heidelberg Instruments is one of the leading international players in developing and producing high-precision photolithography systems and nanofabrication tools. Heidelberg Instruments systems are installed in industrial and scientific facilities around the world. They are used for efficient direct writing and photomask fabrication for various industries, including semiconductors, quantum computing, photonics, 2D materials, IoT, and many related fields.

• Read more about Heidelberg Instruments celebrates 10 years of NanoFrazor