downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Default Banner Image

Singapore

Previous Page
Singapore

RoodMicrotec N.V. reports preliminary total income of EUR 16.5 million for 2022
• The preliminary total income for 2022 of EUR 16.5 million exceeded the outlook by EUR 0.9 million
• Order book value increased by 19% compared to end of 2021
• Cash position very healthy to support further growth

Deventer, January 26, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today publishes the unaudited preliminary total income for the financial year 2022. The unaudited preliminary total income for 2022 amounted to EUR 16.5 million, which is 14% higher than in 2021 (EUR 14.5 million) resulting in a second consecutive year with double-digit growth. Notably, this is the highest total income since 2000, and it shows that RoodMicrotec is focusing on the right fast-growing future-oriented markets.

In the second half of 2022, the unaudited preliminary total income was EUR 9.2 million - an increase of 28% compared to the second half of 2021 (EUR 7.2 million). In 2022, the order book increased by 19% compared to the orders booked at the end of 2021, which is a good predictor for a steady quality of the services provided and a high satisfaction level of our customers.

“Again, we managed to outperform our expectations by focusing on our core business and services. In 2022, we saw significant increases in demand from our customers both for new products as well as for existing products”, says Martin Sallenhag, CEO of RoodMicrotec. “We are very pleased with the overall development of the Company in 2022 and expect a further increase in total income for 2023. The excellent cash situation enables us to invest for future growth where necessary.”

Throughout 2022, the Test Operations unit showed a strong increase, which was related to the excellent services provided by RoodMicrotec to its new and existing customers. The Supply Chain Management unit showed a limited increase in 2022 compared to last year. The sharp increase in the second half of 2022 compared to the first half of 2022 was due to a higher demand for existing products as well as the production ramp-up in the context of new long-term contracts. In 2022, the Qualification & Failure Analysis unit saw a decrease compared to 2021. However, the total income for the second half of 2022 was 9% higher than for the first half of 2022, which shows that new customer projects are now starting.

Total income per operational unit for the financial year 2022 compared to the financial year 2021:
(x € 1,000) FY 2022 FY 2021 Change
Test Operations 10,034 7,938 +26%
Supply Chain Management 3,533 3,364 +5%
Qualification & Failure Analysis 2,980 3,230 -8%

TOTAL 16,547 14,532 +14%

Outlook
RoodMicrotec expects the total income for 2023 to be in the range of EUR 17.0 million to EUR 17.5 million, with a profit before tax of 5-10%, and thus in line with the financial targets. The geopolitical situation in the world and the current energy crisis throughout Europe could have an impact on the Company’s business. The Management is keeping a close eye on the situation and is doing everything possible to mitigate any potentially negative impact.

Audit
The financial data in this press release have not been audited.

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses of the Board of Management and on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, conditions of the worldwide semiconductor industry, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

Financial calendar
April 13, 2023 Trading update quarter 1-2023
April 20, 2023 Publication annual report 2022
April 20, 2023 Conference call for media, analysts and shareholders
June 6, 2023 Annual general meeting of shareholders
July 20, 2023 Publication interim report 2023
July 20, 2023 Conference call for media, analysts and shareholders
October 19, 2023 Trading update quarter 3-2023

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors.
RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany. For more information visit https://www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that it has sold a VertaCure XP G2 system to Korea’s LB Semicon. The VertaCure XP G2 is the latest generation of YES’s flagship VertaCure vacuum curing system, and LB Semicon’s will be the first such system to be installed in Korea. Delivery is expected at the end of March.

Key factors in the purchase decision were the VertaCure XP G2’s superior throughput, exceptional particle performance, and thorough PI/PBO curing capability – all benefits derived from its proven vacuum-based process. The system will support a bump/RDL application for wafer-level chip scale packaging (WLCSP). It accommodates both 200mm and 300mm wafers, providing valuable flexibility for this and future applications.

“As semiconductor chip manufacturers seek to produce ever-smaller products with higher performance and lower power consumption, wafer bumping technology is expanding its application scope and creating greater value. In order to keep up with this trend, LB Semicon is deeply committed to continuous research and development,” said LB Semicon’s CEO, Dr. Nick (Namseog) Kim. “We believe that YES’s VertaCure XP G2 curing system will enable our company to deliver the cutting-edge technology needed as Korea continues its growth as a world-class semiconductor powerhouse.”

“We are pleased and proud that our VertaCure XP G2 was selected for this leading-edge application,” said Bioh Kim, President of YES Korea. “This order showcases YES’s growing role as a trusted global partner in the production of innovative technologies. We look forward to supporting LB Semicon’s efforts, now and into the future.”

About YES
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.

About LB Semicon
Based in Pyeongtaek, South Korea, LB Semicon provides bumping, probe test, back-end, and WLCSP services for display driver integrated circuits (DDI), CMOS image sensors (CIS), and power management integrated circuits (PMIC) used in electronic devices such as TVs, monitors, and mobile phones.
LBS has continuously developed and evolved its technology since the company’s founding in 2000, starting with gold bumping for TFT LCD and OLED DDIs, and expanding over the years into solder bumping, Cu pillar bumping, and WLCSP. The company maintains solid partnerships with top semiconductor chip manufacturers in Korea and elsewhere, and has more than a thousand employees. For more information, please visit www.lbsemicon.com.

PRESS RELEASE | Nijmegen, the Netherlands, January 19, 2023

Chip Integration Technology Center (CITC) will intensify its cooperation with acoustic microscopy expert PVA TePla Analytical Systems GmbH. The cooperation offers exciting opportunities for both organizations to benefit from the synergies that exist between them.

Successfully determining which materials and processes are reliable for packaging is crucial to the mass commercialization of power and WBG semiconductors. Flawless basic materials are the key to flawless products. Cracks, cavities, detachment, or inclusions result in failures during the subsequent production process, which can be avoided with the help of reliable material analysis.

To realize this in its Thermal High-Performance packaging program, CITC is going to use the PVA TePla Scanning Acoustic Microscopy (SAM) 302 HD2 system. The microscope system provides non-destructive quality control capabilities and will therefore allow CITC to assess the reliability of the sinter die attachment to the leadframe.

The collaboration will also see both parties sharing information with their respective businesses to showcase the technical capability and infrastructure on offer at both organizations. Finally, PVA TePla and CITC will be exploring opportunities to jointly develop research opportunities.

Peter Czurratis, Managing Director of PVA TePla is excited about the partnership: “CITC is an upcoming and leading research center focused on new semiconductor wafer technologies and new trends in packaging and systems integration. Their cooperation with semiconductor companies and universities provides us with an excellent research platform for defining our future roadmap for the next generation of acoustic microscopes.”

CITC Business Development Manager, Marco Koelink, is also looking forward to this collaboration: “PVA TePla is one of the leading suppliers of Scanning Acoustic Microscopes. Through this collaboration, CITC will gain access to advanced analytical capabilities that will help us not only to analyze and identify bond layer failures, but also better understand material performance and predict failures at an early stage. That is a crucial capability in the development of robust and reliable bonding technologies.”

About CITC
Chip Integration Technology Center (CITC) is a non-profit joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
www.citc.org

About PVA TePla
With experience and know-how, PVA TePla AG has for many years supported important manufacturing processes and technological developments, primarily in the semiconductor, hard metal, electrical/electronics, and optical industries, but also in the forward-looking fields of energy, photovoltaics, and environmental technology.
https://www.pvatepla.com/en

PRESS RELEASE | Nijmegen, the Netherlands | January 16, 2023

Chip Integration Technology Center (CITC) today announced the appointment of Mark Luke Farrugia as its new general manager. As of March 1, Farrugia will take over the responsibilities from general manager Jeroen van den Brand, who fulfilled the role ad interim.

Farrugia has an extensive background in the semiconductor backend industry. Prior to this appointment, he worked for almost sixteen years at NXP Semiconductors and most recently as technical director at Nexperia Semiconductors.

He explains why he is now switching to CITC: “Innovation work within semiconductor packaging has been my greatest professional passion for the past 27 years. Breakthrough innovation requires a dedicated organization having the right focus, knowledge and passion and determination, and I see this in CITC.”

In his position as general manager, Farrugia will be responsible for the further development of CITC as an internationally distinctive and well-recognized center of semiconductor and photonic chip packaging technology. “CITC is a young organization, and therefore needs to put itself on the semiconductor packaging map. This should be done by understanding the needs and expectations of the industry, building and enhancing the right competences, and by collaborating with other organizations. I look forward to working with the CITC team, as well as scouting and mentoring the next generation, dealing with the highly complex puzzle of understanding what the various industry stakeholders would like to achieve, and ultimately, to delivering results that have a meaningful impact on the industry.”

Roel Fonville, chair of the CITC Supervisory Board, expresses that this is what qualified Farrugia for the position at CITC: “The Supervisory Board is enthusiastic about the appointment of Mark Luke Farrugia as general manager of CITC. Mark Luke has substantive expertise, an up-to-date business network, entrepreneurial thinking and a strong drive to further internationalize CITC as an innovation center in the field of packaging.”

The position of general manager became vacant following the sad passing of CITC founder and first general manager Barry Peet in July 2022.

About CITC
Chip Integration Technology Center (CITC) is a non-profit joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and powered by Holland Semiconductors. It is also supported by local and regional governments.
www.citc.org

Roger Wood to retire as CEO effective July 7, 2023; Robert Blanding named as successor and has been appointed President of Tosoh Quartz, Inc. (TQI) effective January 1, 2023.

Tosoh Corporation announced today that Mr. Roger E. Wood, Chief Executive Officer, and President of Tosoh Quartz Inc. will retire as CEO effective July 7, 2023. Mr. Wood will step down from his duties as President as of January 1, 2023, and remain CEO until July 7, 2023, at which time he will retire from the company. Robert Blanding, currently Chief Financial Officer, will take on the role of President and successor as of January 1, 2023.

Mr. Wood possesses more than 45 years of management experience in the semiconductorrelated quartz industry with Tosoh Quartz, Inc., and has been CEO & President since 2006. Mr. Wood joined the organization in 1978 as the sixth employee when it was known by its former name, Weiss Scientific Glassblowing Company, and has held many roles across the company as it has grown. Weiss was acquired by Japan-based Tosoh Corporation in 1994, and was renamed Tosoh Quartz, Inc. in 2000. Tosoh Quartz Inc., headquartered in Portland, OR also has operations in Durham, England.

“I am grateful to have spent 45 years with this great company, and very honored to have had the opportunity to lead it for the last sixteen years. I consider myself fortunate to have witnessed the innovation and creativity that enabled us to support the Semiconductor industries growth from its infancy to its current status. I believe the future holds even greater opportunities and I
am confident that Robert Blanding, as our new President, is the right choice to lead us on this path.”

Mr. Blanding joined TQI in 2019 as Chief Financial Officer and has a wealth of manufacturing and technology industries experience, along with a proven record of leadership in global businesses. Prior to TQI, Mr. Blanding spent three years at HP Inc. as a Senior Director within the ink and toner businesses; three years at ESCO Corporation (now part of the Weir Group) as the Vice President of Finance for the Products and Mining Divisions; and eighteen years at Intel Corporation in a variety of operational finance roles including eight years directly supporting manufacturing organizations as well as a role in Intel Capital, supporting mergers and acquisitions and an international role supporting the Europe, Middle East, and Africa sales region. Mr. Blanding holds a BA in Business Administration from the Foster School of Business at the University of Washington, and an MBA from the Kelley School of Business at Indiana University.

About Tosoh Quartz Inc.
Tosoh Quartz Inc. and Tosoh Quartz Japan, lead the industry in the production of quartz glass products for use by the semiconductor industry in the manufacture of integrated circuits. Tosoh Quartz Inc. has been operating in the Portland area since 1970 and in Durham, England since 1993, and is a member of Tosoh Corporation’s Advanced Materials Division along with sister
companies Tosoh Quartz Corporation (Japan), Tosoh Quartz Co., Ltd. (Taiwan), Tosoh SGM Corp. (Japan), Tosoh TSC (China), Tosoh SMD and Tosoh SMC.

Tosoh Corporation is the parent company of a Japanese chemical and specialty products and materials group that comprises over 100 companies worldwide and a multiethnic workforce of more than 12,000 people. 

Tosoh’s principal markets include the chemical and petrochemical, construction, automotive, consumer electronics, information technology, bioscience, and environmental markets. 

Tosoh is a global chemical company that supplies manufacturers with the materials they need to produce the things that make modern life all that it is and everything it can be.

Kitchener, Ontario, January 11, 2023 – PEER Group® will showcase its full suite of innovative testing, connectivity, and automation solutions at booth A836 during SEMICON Korea. The annual tradeshow and conference, which is happening February 1-3, 2023 at COEX in Seoul Korea, is the country’s preeminent semiconductor industry event.

“South Korea continues to be a very important market for us and we look forward to showcasing our entire suite of products and services during SEMICON Korea,” says Bob Kane, PEER Group’s Director of Factory Sales, Asia.

PEER Group is the semiconductor industry’s largest supplier of testing, connectivity, and automation software. “Most factory automation engineers are familiar with our flagship test application, SECSIM Pro®+,” remarks Kane, while adding: “Beyond testing, our connectivity and automation products are being used to power more than 90,000 active equipment connections in fabs around the world and our Professional Services team has automated more than 130 tool platforms while helping customers achieve more than 120 fab acceptances.”

Visitors to booth A836 will have the opportunity to meet with representatives from PEER Group’s global sales team, as well as members from Toward Future, PEER Group’s exclusive sales partner serving Korea. To learn more, and to schedule a meeting during SEMICON Korea, visit PEER Group’s event page.

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

January 12th, 2023 – Tempe, AZ: Moov, a data-fueled marketplace for used semiconductor equipment, today announced David Duke as Head of Enterprise Partnerships. A 27-year semiconductor industry veteran, Duke has led over $1bn in strategic fab level sales and exclusive remarketing of semiconductor equipment, including developing and running the largest equipment resale operations in the world at GlobalFoundries and GE Capital.

“We are excited to welcome equipment remarketing pioneer and semiconductor industry veteran, David Duke, to Moov,” said Moov CEO and co-founder Steven Zhou. “David’s expertise stems from decades of experience devoted to semiconductor equipment, first as an exec at top equipment manufacturers focusing on their service offerings, and then building the largest remarketing programs in the world at GE Capital and GlobalFoundries. This is the type of world-class talent we know will continue to make Moov successful as we deepen our global partnerships with semiconductor manufacturers in 2023 and beyond.”

Duke has held executive positions at semiconductor equipment behemoths AMAT, KLA, and Cymer (ASML), with focus on equipment services. At GE Capital, Duke served as VP of Sales, leading US and European sales of semiconductor and test equipment. At GlobalFoundries, Duke was responsible for acquisitions, valuations, and recovery of surplus assets, building GlobalFoundries’ remarketing process to world-class standards. Most recently, Duke served as President of US and Korea for precision deposition equipment manufacturer Kateeva.

“I was initially drawn to Moov because Moov’s approach is highly ethical, transparent, and truly has customers' best interests in mind,” said David Duke, Head of Enterprise Partnerships at Moov. “With the technology, marketplace data, and full aftermarket service suite Moov offers, manufacturers can more robustly incorporate used equipment into their enterprise procurement strategy and recoup capital on pre-owned assets at a scale never before possible.”

Duke will be responsible for establishing and growing Moov’s newly minted Enterprise Partnerships division. In this role, he will oversee strategic enterprise partnerships with semiconductor manufacturers to leverage surplus equipment in a way that moves the needle strategically beyond individual tool sales. Moov offers chipmakers a compelling solution to resell idle assets. Moov’s global marketplace and wealth of secondary capital equipment market data offers sellers immediate access to global demand and data-driven valuation solutions to make more intelligent decisions. Moov’s global team offers expertise in equipment sales including compliance with trade and financial regulations. The new Enterprise Partnerships division will focus on complex, multi-asset sales including supporting manufacturers’ equipment needs during fab acquisition or divestiture. For more information on Moov’s strategic equipment remarketing services contact [email protected].

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov’s platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. To learn more, please visit Moov.co.

HATFIELD, Pa. (USA) January 5, 2023 — Brooks Instrument, a leader in precision fluid measurement and control technology, has earned a Supplier Excellence Award from Applied Materials, Inc., the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.

Applied’s Supplier Excellence Awards recognize the company’s top performing suppliers for outstanding technical and operational achievements in areas including quality, service, lead time, delivery, cost and responsiveness. Brooks Instrument received the award for Best in Class Performance.

“Applied Materials congratulates our Supplier Excellence Award recipients for achieving outstanding performance over the past year,” said Dr. Paul Chhabra, Corporate Vice President of Global Supply Chain at Applied Materials. “Having strategic relationships throughout the supply chain is more important than ever, and we thank our suppliers for their strong support and collaboration.”

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor manufacturing, fiber optics, thin film manufacturing, solar cells, LED, pharmaceutical, biopharmaceuticals, alternative energy, oil and gas, chemical and petrochemical.

With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers. Its broad family of products includes the brands UNIT Instruments, Tylan and Celerity.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Yee Ching (YC) Wong has joined the company’s senior leadership team as Vice President of Business Development for the Asia Pacific region.

Mr. Wong, who is based in Singapore, assumes overall responsibility for driving product penetration and for increasing backlog and revenue in the region. He will work closely with YES’s Global Sales team to meet booking and revenue targets, expand the customer base, and address new opportunities.

Prior to joining YES, Mr. Wong spent six years as Senior Director of Product Marketing at Veeco SE Asia Pte. Ltd. In that role, he successfully managed the integration of the Ultratech and Veeco sales teams in the region and delivered exceptional results with major customers. His tenure at Ultratech began in 2004 as a Senior Sales Manager in Shanghai and rose through Sales positions of increasing responsibility in Taiwan, China, Korea, and Singapore to become Ultratech’s General Manager of Litho Sales in Asia.

“I am very pleased to welcome YC to the YES senior team,” said Alex Chow, President of YES Asia. “YC is a proven leader and brings with him an impressive track record in the semiconductor capital equipment market. We expect his market understanding, business acumen, and well-honed teambuilding skills to serve him well in driving market share growth for YES in this dynamic region and strengthening key customer relationships at the C-suite and SVP level.”

Mr. Wong holds a bachelor’s degree in Business Administration from the University of Western Sydney, Australia, and an MBA from the National University of Singapore.

About YES
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.

Heidelberg, Germany – We are happy to announce that one hundred and fifty MLA 150 Maskless Aligners have been successfully installed worldwide at our customers facilities. First launched to the market in 2015, the revolutionary maskless technology of the MLA 150 has become firmly established within the advanced microfabrication community.

The MLA 150 was the first and only tool that has become a true alternative to mask-based aligners, offering extremely high exposure speed, high frontside and backside alignment accuracies, warpage compensation, high resolution and high accuracy, and the ability to expose on any substrate size from pieces that are a few square millimeters up to full 8” wafers. Further adding to the flexibility, the non-contact exposure technique for the MLA150 in addition to the simple ease of use makes this the ideal tool in rapid prototyping environments, for low to mid-volume production, and for research and development. Common application areas include MEMS, electronics, micro-optics, micro-fluidics, sensors, and many more.

École Polytechnique Fédérale de Lausanne (EPFL) – Pioneer in maskless technology
The beta-version of the MLA 150 was installed in August 2014 at the Center of MicroNanoTechnology (CMi) of the renowned École Polytechnique Fédérale de Lausanne (EPFL) located in Switzerland, being one of Europe’s most vibrant and cosmopolitan science and technology centres. The CMi is a complex of clean rooms and processing equipment devoted to microtechnology made accessible to trained academic and industrial users. The CMi is at the same time one of the pioneers in maskless lithography.

In 2022, the CMi purchased their second MLA 150 Maskless Aligner, which was installed most recently. “The MLA 150 is today one of the most important equipment in our facility, and there are many users that daily use the machine for printing. So, we wanted to have two of them”, emphasizes Julien Dorsaz, the manager of the photolithography division of the CMi. To get insights into the work at the CMi, and to learn about the MLA 150 experience of the users, we conducted a 30-minute interview with Julien Dorsaz. Get the full interview on our YouTube channel.

Today, the MLA 150 serves as a trusted, indispensable workhorse in many multi-user facilities, microfabrication labs, and research institutes. Since its market introduction, the MLA 150 has developed into one of our most important technologies in our company’s product portfolio. Setting the bar for state-of-the-art maskless lithography, the MLA 150 promises continuous market growth in the coming years.

For further information please visit: www.heidelberg-instruments.com

Results per page
Select
Results per page
Subscribe to Singapore