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In the two-day event, leading manufacturing partners will show how application visions in manufacturing are implemented through concrete software solutions and considerations. You will experience first-hand the presentation of application case details from various industrial manufacturers and their ongoing collaboration with partner camLine.

In association with Elisa IndustrIQ, you will get first insights into camLine’s AI-driven manufacturing strategy. Development highlights of camLine’s sophisticated LineWorks Suite, InFrame Synapse, XperiDesk, and Cornerstone software products will also be presented for discussion. Several solution demo stations will be available in the foyer.

In the User Group Meetings, participants are given the opportunity to vote on the priorities of future product
developments.

Register now: https://www.camline.com/forum-registration/

On-Demand Pricing

FULL CONFERENCE
SEMI Member: $149.00
Non-Member: $225.00

DAY 1—Tuesday, November 8, 2022
SEMI Member: $49.00
Non-Member: $75.00

DAY 2Wednesday, November 9, 2022
SEMI Member: $49.00
Non-Member: $75.00

DAY 3Thursday, November 10, 2022
SEMI Member: $49.00
Non-Member: $75.00

STUDENTS—FREE
Contact us at [email protected] with a picture of your student ID to receive your discount code.

CONTACT
Mark da Silva
[email protected]

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Sponsorship Contact

[email protected]
Sr. Sales Manager, SEMI
Tel: +1.408.943.7047 
Email: [email protected]

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GSMC On-Demand gives you access to approved presentations and videos. You'll hear global experts share strategies and best practices to improve manufacturing data capture and analysis. Find ideas and solutions to maintain business continuity and meet the increasing demands of customers.  

  • ACCESS GSMC On-Demand 24/7 until December 11, 2022.
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2022 Organizing Committee

  • John Behnke | INFICON

  • Holland Smith | INFICON

  • Chan Pin Chong | KULICKE & SOFFA

  • Michael Arnold | PEER GROUP

  • Bobby Mitra | TEXAS INSTRUMENTS

  • James Lin | UMC

United States

TUESDAY, NOVEMBER 8, 2022 | TIMES IN PT

SESSION 1—Intelligent ACQUIRE: Data Sources, Variety and Acquisition

7:00 am
Mark da Silva
Mark da Silva
SEMI

Opening Remarks

7:02 am
Ajit Manocha
SEMI

Conference Opening Remarks

7:15 am
Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Keynote: Autonomous Smart Factory of the Future

7:35 am
Michael Arnold
Michael Arnold
PEER Group

Moderator Welcome

7:40 am
Praneetha Poloju
Praneetha Poloju
Chief Technologist
Microsoft

Azure Data Estate for Foundry Data Connectivity and Architecture Modernization​

Bella Chan
Bella Chan
Microsoft

Azure Data Estate for Foundry Data Connectivity and Architecture Modernization

8:05 am
Doug Suerich
Doug Suerich
PEER Group

End-to-End Smart Manufacturing: Using EDA to Advance the Backend ​

8:30 am
Fahad Golra
Dr. Fahad Golra
Research & Innovation Coordinator
Agileo Automation

Challenges in Edge to Cloud Level Data Sharing Across Value Chains in Semiconductor Industry

8:55 am
Padmanabha Kannampalli
Padmanabha Kannampalli
Engineer
Teradyne

Data Connectivity in Semiconductor Test—Challenges

9:20 am
Alan Weber
Alan Weber
Vice President, New Product Innovations
Cimetrix by PDF Solutions

Seeing is Understanding: Improving the Visibility into Smart Manufacturing Operations by Raising Our Standards​

9:40 am
Michael Arnold
Michael Arnold
PEER Group

Closing Remarks

SESSION 2—Intelligent INSIGHTS: Current Point Systems

5:00 pm
James Lin, UMC
MODERATOR
James Lin
UMC

Welcome Remarks

5:05 pm
CS Tan
CS Tan
Group VP & General Manager
STMicroelectronics

Product/Process Digitalization for Smart Manufacturing—Future is OPTIMIZED​

5:30 pm
John Foley
John Foley
Kulicke & Soffa

Big Data Analytics for Back-End Assembly Equipment​

5:55 pm
Bappaditya Dey
Bappaditya Dey
Senior R&D Engineer
imec

Deep Learning Denoiser Assisted Framework for Robust SEM Contour Extraction and Analysis for Advanced Semiconductor Node

6:20 pm
Ivan Aduna
Ivan Aduna
KY Technology

Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory​

6:45 pm
Anis Rahman
Anis Rahman
Chief Technology Officer
AR Photonics

A New Technique of Continuous Wave Cameraless T-Ray Imaging for Semiconductor Interfaces Analysis and Wafer Scale Die Sorting ​

7:35 pm
James Lin
UMC

Closing Remarks

WEDNESDAY, NOVEMBER 9, 2022 | TIMES IN PT

SESSION 3—Intelligent DIGITAL TWIN: Multi-Level Digital Twin

7:00 am
Holland Smith
MODERATOR
Holland Smith
Inficon

Welcome Remarks

7:05 am
Marc Engel
Marc Engel
Agileo Automation

How Existing Semiconductor Equipment Can Benefit From Digital Twins

7:30 am
Sarbajit Ghosal
Sarbajit Ghosal
SC Solutions

Development of Digital Twins for Manufacturing Applications

7:55 am
Basil Milton
Basil Milton
Kulicke & Soffa

Wire Bonding Digital Twin Enhancements for Smart Manufacturing

8:20 am
Shankar Ranganathan
Shankar Ranganathan
Associate General Manager R&D
HCL Technologies

Scalable Options to Support Semiconductor Capital Equipment's

8:45 am
Sriny Sundararajan
Sriny Sundararajan
CTO
Clip Automation

Ensuring Trust & Traceability: Secure Data Exchanges for Real-Time, Multi-Party Data Sharing in Industry 4.0 and Smart Manufacturing

Vikrant Kahlir
Vikrant Kahlir
Vendia
9:10 am
Anuj Mahendrum
Anuj Mahendru
Global Director, Semiconductor and Hi-Tech Industries
Rockwell Automation

Cleanroom Redefined—Addressing the Wafer Transport Challenge

9:35 am
Holland Smith
Holland Smith
Inficon

Closing Remarks

SESSION 4—Intelligent PREDICT: AI/ML Solution Integration

5:00 pm
Chan Pin Chong
MODERATOR
Chan Pin Chong
Kulicke & Soffa

Welcome Remarks

5:05 pm
KEYNOTE | John Herlocker, PhD | TIGNIS
Jon Herlocker, PhD
CEO
Tignis

KEYNOTE: Empowering Process Engineers With Self-Service AI/ML

5:30 pm
Jasper van Heugten
Jasper van Heugten
minds.ai

An Overview of How AI Is Reshaping Semiconductor Manufacturing: A Case Study in Fab Scheduling Using Deep Reinforcement Learning

5:55 pm
Jimmy Bramante
Jimmy Bramante
Inficon

Blurring Boundaries: Overcoming Context to Enable Deep Learning on Process Data​

6:20 pm
Nikunj Mehta
Nikunj Mehta
Founder & CEO
Falkonry

Automated, Field Deployed, Time Series Anomaly Detection With Time Series AI

6:45 pm
Erik Collart
Erik Collart
Global Product Manager SCADA
Edwards

Effective Use of Vacuum Assets Through Smart Manufacturing

7:10 pm
Yak Hua Khoo, ViTrox Technologies
Yak Hua Khoo
ViTrox Technologies

SMT Electronic Smart Close-Loop Prediction System​

7:30 pm
Chan Pin Chong
Chan Pin Chong
Kulicke & Soffa

Closing Remarks

THURSDAY, NOVEMBER 10, 2022 | TIMES IN PT

SESSION 5—Intelligent AUTONOMY: Smart, Autonomous Control

7:00 am
Bobby Mitra
MODERATOR: Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Welcome Remarks

7:05 am
Christoph Koegler, Infineon
Christoph Koegler
Director Innovation, Digitalization & AI
Infineon

A Flood of Problems Drained—Fixing Valves the Smart Way​

7:30 am
Gautham Unni
Gautham Unni
AWS

AWS for Semiconductor Smart Manufacturing ​

7:55 am
Peter Lendermann
Peter Lendermann
Chief Business Development Officer
D-SIMLAB Technologies

Enhanced Predictions, Smarter Actions: A Few Lessons Learnt on the Path towards 'Autonomy' in Frontend Production​

8:20 am
Ivy Qin
Ivy Qin
Senior Director of Engineering
Kulicke & Soffa

Road to Autonomous Wire Bonder

8:45 am
Matthew Putman
Matthew Putman
CEO
Nanotronics

Inspect, Correct, Protect

9:10 am
Christophe Curny
Christophe Curny
Soitec

Soitec 4.0 Journey​

9:35 am
Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Closing Remarks

SESSION 6 — Foundational Topics

5:00 pm
John Behnke
MODERATOR
John Behnke
General Manager FPS Product Line
Inficon

Welcome Remarks

5:05 pm
Koen de Backer
Koen de Backer
Vice President Smart Manufacturing and Artificial Intelligence
Micron

KEYNOTE: Leveraging Smart Manufacturing to Achieve Sustainability Goals

5:30 pm
Ming Chang Wu
Ming-Chang (Bright) Wu
Hon Hai Research Institute, Foxconn

Toward Digital Resilience – Transforming Management Practices Based on Cybersecurity 2.0 Standards​

5:55 pm
Jim Montgomery
Jim Montgomery
Principal Solution Architect
TXOne Networks

Is Wait-and-See a Good OT Security Strategy?

6:20 pm
Houng Sun
Dr. Houng Sun
Mirle

Advanced Automation for Smart Manufacturing​

6:45 pm
Andrew Seward, TEL
Andrew Seward
Field Solutions Product Marketing and Analytics Manager
TEL
David Gross, Siemens
Dave Gross
Portfolio Development Executive
Siemens

SEMI Smart Manufacturing Maturity Assessment Model 

7:10 pm
John Behnke
John Behnke
General Manager FPS Product Line
Inficon

Conference Closing Discussion—Where do we go from here?​

Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

7:35 pm
John Behnke
John Behnke
General Manager FPS Product Line
Inficon

Closing Remarks

- FOA ITL Standards

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Discover ideas and solutions for making your manufacturing smarter.

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Event format

Kitchener, Ontario, July 27, 2022 – PEER Group®, the largest supplier of innovative factory automation software for the semiconductor industry, is inviting software developers to register for a virtual hiring event happening on August 16, 2022, beginning at 4:00 p.m. ET.

The hiring event is part of the Kitchener-based software company’s planned growth strategy to add talented resources across all engineering departments to meet the demand for its software products and solutions. The openings are located at the company’s Toronto and Kitchener offices.

The two-hour drop-in event will provide attendees the opportunity to learn about the current openings and speak with PEER Group representatives, including members of the software development management team, several software developers, and the talent acquisition team.

“This is a great time to start a career in the semiconductor industry,” shares Mike Pryzmant, PEER Group’s Director of Engineering Services. “Our software teams do amazing work making sure the world’s largest semiconductor factories and tools are operating at their best. The challenges we face are complex, exciting, and always interesting.”

Scott McKee, PEER Group’s Talent Manager, along with members of his team, will be present to share details about working at PEER Group, including the hybrid work model, flex hours, comprehensive benefits plan, expert mentorship, personal development and career opportunities, profit sharing, and more.

“The way we designed this hiring event is to give jobseekers a forum to learn about anything they want to know about our culture, industry, or development projects,” says McKee. “We’ll have several team members, both technical and from the HR side, who will be able to provide in-depth answers to any questions prospective candidates may have.”

PEER Group has been having a banner year in 2022, which marks the company’s 30th year in business. In March, PEER Group was named a 2022 Intel EPIC Outstanding Supplier – one of only six companies out of more than 9,000 Intel suppliers to receive the recognition. Great Place to Work Canada named PEER Group one of Canada’s Best Workplaces for the 11th time. The company also opened a new 4,000 sq. ft. office in the heart of downtown Toronto.

Those interested in attending the hiring event can register by completing the form and uploading a resume using the link below. All attendees will be entered into a draw for a chance to win an Apple iPad.

PEER Group Hiring Event registration page: https://bit.ly/3zpZpiV .

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

Deventer, July 27, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and Rohde & Schwarz GmbH & Co. KG, a market leader in the fields of measurement technology and communications, today announce the continuation of their longstanding partnership through several new projects in ASIC development.

The two companies have been working together for over 10 years and in this period RoodMicrotec has carried out the test development for various high frequency ASICs used by Rohde & Schwarz in their products. RoodMicrotec performs wafer and component level tests as well as qualifications prior to product launch. For the coming years, further projects of this kind are already scheduled.

"At Rohde & Schwarz, we rely on our own in-house expertise to develop our high-performance ASICs and therefore count on partners who share our high standards. We appreciate the quality RoodMicrotec offers - from quotation to test development, qualification and volume testing," says Bastian Nagel, Senior Director Mixed Signal ASIC Development at Rohde & Schwarz.

RoodMicrotec also appreciates the collaboration with Rohde & Schwarz, especially the respectful interaction and the high level of professional expertise.

Jan de Koning Gans, Managing Director of RoodMicrotec GmbH says: "Our projects with Rohde & Schwarz constantly pose new technical challenges, thus allowing us to broaden our know-how and the quality of our work from project to project."

About Rohde & Schwarz
The Rohde & Schwarz technology group develops, produces and sells a wide range of electronic capital goods. The company’s entire product portfolio represents a valuable contribution to a secure and networked world. In the markets of test & measurement, secure communications, networks & cybersecurity, as well as broadcast & media, customers around the world rely on Rohde & Schwarz and its technologically leading solutions. In addition to its well-established business areas, the Group invests in future technologies such as artificial intelligence, Industrial Internet of Things (IIoT), 6G, cloud, and quantum technology.

Further Information
Email: [email protected], Web: www.rohde-schwarz.com

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

RoodMicrotec N.V. publishes the unaudited Interim Report for 2022

• Total income EUR 7.3 million (HY1 2021: EUR 7.3 million)
• EBITDA EUR 1.4 million (HY1 2021: EUR 1.3 million)
• Net profit EUR 0.6 million (HY1 2021: EUR 0.4 million)

Deventer, July 21, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today publishes the unaudited Interim Report and the half-year results for the period ended on June 30, 2022.

The total income in the first half-year of 2022 is EUR 7.3 million, which is equal to the total income reported for the first half-year of 2021 and for the second half of 2021. The stable total income is driven by a continued strong delivery level, especially in the test operations unit. In the first half of 2021 we ordered and received wafers for one of our SCM customers to manage the supply chain during a planned change of an assembly house. About EUR 0.4 million was realized for these wafers as total income and approximately the same amount was accounted for in the cost for raw materials and consumables. This resulted in a higher total income and a higher cost of materials in the first half of 2021 without an impact on the net profit. These parts will be delivered during the second half of 2022 where only part of the selling price will be recognized in the total income. The profit will therefore be positive.

EBITDA increased from EUR 1.3 million for the first half of 2021 to EUR 1.4 million for the first half of 2022. The lower cost of raw materials together with a good cost control have continued to reduce the overall costs in the first half-year of 2022.

Compared to the first half of 2021, the depreciation was lower in the first half of 2022 due to lower investments during 2021. The financing costs remained unchanged.

The net profit for the first half-year of 2022 increased by 47% to EUR 0.6 million compared to the first half-year of 2021.

(x EUR 1,000) Unaudited
HY1 2022 Unaudited
HY1 2021
Total Income 7,317 7,282
EBITDA 1,440 1,317
Net profit 644 437


Net cash flow from operating activities was positive with EUR 0.3 million (2021: positive with EUR 0.9 million). The change is the result of an increase in working capital during the first half of 2022. Net cash flow was negative with EUR 0.6 million (2021: positive with EUR 0.6 million). This was mainly due to the lower net cash from operating activities as well as investments and redemption of the 2012 perpetual bond during the first half of 2022.

The order book increased considerably compared to December 31, 2021, which is encouraging and indicates that a big part of the forecasted increase in total income for 2022 over last year is now covered with orders.

“Despite the general supply chain situation in the world, we have been able to continue our test operations at a high utilization level. This shows that we have logistics under control and are well prepared for the future increase in demand”, says Martin Sallenhag, CEO of RoodMicrotec. “The global shortage of semiconductor supplies as well as logistic challenges may still impact our ability to meet our plan for the full-year 2022, but we are closely monitoring the situation to be able to act if necessary.”

Unaudited Interim Report 2022
You will find the complete unaudited Interim Report 2022, which is available only in English and as an electronic version, on our corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.

Conference call
CEO Martin Sallenhag and CFO Arvid Ladega will present the unaudited Interim Report 2022 and respond to questions. You are invited to join RoodMicrotec’s conference call for media, analysts and shareholders (a Microsoft TEAMS event) on Thursday, July 21, 2022 at 9:30 CEST

Login-information:
Join with your computer or mobile app Click here to join the meeting
Or call in (audio only)
+49 69 509544247 Germany, Frankfurt am Main
+31 20 399 9804 The Netherlands, Amsterdam
+32 2 895 09 68 Belgium, Bruxelles
+41 43 217 23 02 Switzerland, Zurich

Find a local number – in case you are in another country
Phone Conference ID: 760 330 187#

Financial calendar
July 21, 2022 Conference call for media, analysts and shareholders
October 13, 2022 Trading update quarter 3-2022
January 26, 2023 Publication (preliminary) annual total income 2022

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com
Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is only published in English. This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.

Established in July of 1982 by Sig, Kail, and Mariellen Wathne (hence the name, “SiKaMa”), Sikama was founded to design, develop, and manufacture high quality reflow soldering and curing systems utilizing a first of its kind high efficiency conductive heating technology to support the demands of the electronics industry.

After nearly 40 successful years, Sikama was purchased by Herb Weigel. Keeping with the mission originated by the founders, Herb’s goal is to elevate Sikama’s products to keep pace with the demands of the industry and exceed customer expectations. With an enhanced product roadmap and a growing number of services to support customers, Sikama is positioned better than ever to meet the increasing demands of its customers.

Sikama continues to grow its production space and team to meet the increasing demand for small footprint, high efficiency, and long-lasting products. In addition, with the launch of the fluxless EA UP1200, the company is positioned better than ever to meet the needs of the most demanding applications.

Here’s what was happening in 1982 when Sikama was founded:

• Time Magazine’s Machine of the Year was The Computer
• Biggest Blockbuster of 1982 was E.T.: The Extra-Terrestrial
• Superbowl XVI Champions were the San Francisco 49ers
• Billboard’s #1 Song was Physical by Olivia Newton-John
• Adobe was founded in California by Chuck Geschke and John Warnock

Chip Integration Technology Center (CITC) and Henkel announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for RF and power electronics. Under the terms of the partnership, Henkel will supply commercialized and developmental pressureless sintering die attach formulations and CITC will provide testing and analysis of the materials within next-generation package designs.

CITC’s Thermal High-Performance Packaging program focuses on thermo-mechanical design strategies and device packaging platforms that integrate low-stress, high-reliability rugged interconnect solutions. As die attach and molding materials are often limiting factors for the optimal operation of RF and power packages, Henkel is the ideal partner or innovation in this application area.

In addition to ongoing work in its state-of-the-art R&D centers, Henkel wants to accelerate time-to-market for its semiconductor packaging materials through strategic relationships across industry, government, and academia. CITC, which collaborates with leading power and RF device packaging companies, provides a unique opportunity to characterize and analyze Henkel’s high-thermal die attach formulations as an enabler for leading-edge device designs.

“Henkel’s pressureless sintering die attach materials are already proven in certain mobile applications,” explained Ramachandran “Ram” Trichur, the company’s Global Market Segment Head, Semiconductor Packaging Materials. “We want to extend that success to other sectors such as automotive, where large, high-power chips are the norm. Our pressureless sintering solutions are unique because they deliver the simple, low-stress processability of conventional die attach adhesives and very high thermal conductivity capabilities. The work at CITC will augment our in-house projects, allowing additional performance and reliability validation.”

The new die attach technology has the potential to enable the replacement of lead (Pb) within RF and power semiconductor devices that incorporate larger die on copper leadframes, allowing the introduction of high operating temperature gallium nitride (GaN) and silicon carbide (SiC) power die technologies. Many of CITC’s partners are actively integrating these new chip structures, making the cooperative project an excellent proving ground for Henkel’s pressureless sintering platform.

“In Henkel, we have found a material innovator that will enable the development of power and RF devices with a holistic approach that leverages the latest in die attach technology,” concluded CITC General Manager, Jeroen van den Brand. “With many major power device manufacturers based in Europe, and in Nijmegen in particular, we view this partnership as vital to satisfying the current and future demands within these important market sectors.”

About CITC
Chip Integration Technology Center (CITC) is a non-profit joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
www.citc.org

About Henkel
Henkel operates globally with a well-balanced and diversified portfolio. The company holds leading positions with its three business units in both industrial and consumer businesses thanks to strong brands, innovations and technologies. Henkel Adhesive Technologies is the global leader in the adhesives market – across all industry segments worldwide. In its Laundry & Home Care and Beauty Care businesses, Henkel holds leading positions in many markets and categories around the world. Founded in 1876, Henkel looks back on more than 140 years of success. In 2021, Henkel reported sales of more than 20 billion euros and adjusted operating profit of about 2.7 billion euros. Henkel employs about 53,000 people globally – a passionate and highly diverse team, united by a strong company culture, a common purpose to create sustainable value, and shared values. As a recognized leader in sustainability, Henkel holds top positions in many international indices and rankings. Henkel’s preferred shares are listed in the German stock index DAX.
www.henkel-adhesives.com/electronics

Contact
CITC: Marco Koelink | M +31 6 15 15 66 41 | E [email protected]
Henkel: Ruud de Wit | M +31 6 43 37 21 08 | E [email protected]

Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Russ Sanchez has joined the company’s senior leadership team as Vice President of Quality and Managing Director of YES’s new Technology Center in Chandler, Arizona.

Mr. Sanchez, who is based in Chandler, is a seasoned operations and business leader with over two decades of experience driving excellence in the manufacturing operations of semiconductors, microelectronics, printed electronics, antenna technology, and hard drives.

“Russ has an impressive track record of developing technology centers and manufacturing operations to support the growth of high-technology sector customers,” said Rezwan Lateef, President of YES. “His ability to implement quality systems and to partner closely with our customers to realize their next-generation devices will be invaluable as we move into the next phase of our company’s growth.”

Mr. Sanchez came to YES from NthDegree Worldwide Technologies, where he was Vice President of Operations. Before that, he held a variety of roles within Manufacturing and Quality at technology companies including Airgain, NXP Semiconductors, ST Microelectronics/Western Digital Corporation, Hynix Semiconductor of America, and Philips Semiconductors. He holds a Bachelor of Science degree in Business Administration from the University of Phoenix.

About YES
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.

A long-term, strategic, enterprise-level technology collaboration aims to further increase production efficiencies and reduce costs for Micron and its suppliers.

Cambridge, MA, July 13, 2022 – Today, Athinia™ announced that Micron Technology, Inc. (Nasdaq: MU), a global leader in innovative memory and storage solutions, plans to use the Athinia™ data analytics platform to create a pioneering data collaboration ecosystem that will help lead a continued journey of digital transformation with Micron’s critical suppliers. Athinia™’s state-of-the-art AI-driven quality control methodology will be able to further improve process and device yield, reduce costs and accelerate time to value generation using select data and insights from Micron’s supply chain. Athinia™, launched in December 2021, is a partnership between Merck KGaA, Darmstadt, Germany (DAX:MKGAF) and Palantir Technologies Inc. (NYSE:PLTR).

“The secure architecture provided by Athinia™ will allow Micron and its suppliers to share a single source of real-time data without compromising data ownership, governance, privacy and security,” said Laura Matz, CEO of Athinia™ and Chief Science and Technology Officer of Merck, KGaA, Darmstadt, Germany. “Through data sharing and collaboration, the platform leverages machine learning-driven analytics to solve critical challenges.”

Using Athinia™’s platform, Micron’s suppliers will be able to share their process and manufacturing data as well as key parameters, offering secure collaboration on a much larger population of critical data analytics. Micron and its suppliers can expect to see improvements in yields, shortened qualification times and enhanced quality.

“Micron is leading the industry in adopting the Athinia™ platform for its new ecosystem. Through data collaboration, Athinia™ can help to achieve key objectives for the semiconductor industry such as the improvement of material quality and sustainability, supply chain resilience as well as the acceleration of innovation cycles,” said Kai Beckmann, Member of the Executive Board of Merck KGaA, Darmstadt, Germany and CEO Electronics. “Ultimately, data analytics and collaboration will allow a wide range of benefits to the entire semiconductor industry.”

“The production and delivery of semiconductors is absolutely vital to our collective welfare and security,” said Alexander C. Karp, co-founder and chief executive officer of Palantir Technologies Inc. “We are committed to ensuring that Micron and Athinia™ have the software they need to address the supply chain challenges involved in the distribution of one of the world’s most essential and important products.”

About Athinia Technologies LLC
Data for Pioneers. Athinia™ provides a data analytics platform that brings manufacturers and materials suppliers together to share, aggregate, and analyze data to unlock efficiencies and time to market, while improving quality, supply chain and sustainability. All this without taking ownership of data.

Athinia™ is a partnership between Merck KGaA, Darmstadt, Germany (DAX:MKGAF), and Palantir Technologies Inc. (NYSE:PLTR). Athinia is headquartered in Cambridge, MA, USA. Athinia operates independently from the Electronics business of Merck KGaA, Darmstadt, Germany. More information can be found at www.athinia.com, LinkedIn and Twitter.

About Merck KGaA, Darmstadt, Germany
Merck KGaA, Darmstadt, Germany, a leading science and technology company, operates across healthcare, life science and electronics. Around 60,000 employees work to make a positive difference to millions of people’s lives every day by creating more joyful and sustainable ways to live. From advancing gene editing technologies and discovering unique ways to treat the most challenging diseases to enabling the intelligence of devices – the company is everywhere. In 2021, Merck KGaA, Darmstadt, Germany, generated sales of € 19.7 billion in 66 countries.

The company holds the global rights to the name and trademark “Merck” internationally. The only exceptions are the United States and Canada, where the business sectors of Merck KGaA, Darmstadt, Germany, operate as EMD Serono in healthcare, MilliporeSigma in life science, and EMD Electronics in electronics. Since its founding in 1668, scientific exploration and responsible entrepreneurship have been key to the company’s technological and scientific advances. To this day, the founding family remains the majority owner of the publicly listed company.

About Palantir Technologies Inc.
Foundational software of tomorrow. Delivered today. Additional information is available at https://www.palantir.com.

For more information please contact [email protected]

Kitchener, Ontario, July 13, 2022

PEER Group®, the largest supplier of innovative semiconductor factory automation software, is proud to share that two members of its engineering team have been recognized by SEMI during SEMICON West 2022 for contributions they’ve made to the semiconductor industry.

The recipients are Albert Fuchigami, who received the 2022 Leadership Award, and Kristen Matsumoto, who was named among the inaugural SEMICON West 20 Under 30 recognition program. SEMI is the global industry association representing the electronics manufacturing and design supply chain.

Fuchigami, a Senior Software Developer at PEER Group, was presented with the honor during the Standards Awards Ceremony & Networking Event, which took place July 12 during SEMICON West. In a statement provided by SEMI, Fuchigami was chosen for providing “immense value to the SEMI Standards program,” and “through his mentorship, Albert has proven himself to be a true leader and a pillar of the SEMI Standards program.”

“I am honored to receive this award,” shares Fuchigami, who co-leads the SEMI North America Data Diagnostic Acquisition Task Force and contributes to the Information & Control Technical Committee. “Working with the technical committee members in developing standards that drive our industry forward is incredibly rewarding.”

This year marks the first-ever SEMICON West 20 Under 30 recognition program, which honors the industry's brightest young leaders who have demonstrated success in their careers in the microelectronics supply chain.

For Matsumoto, a Senior Quality Assurance Specialist at PEER Group, being part of the cohort of 20 Under 30 winners reaffirms his passion and excitement for working in the semiconductor industry. “I've been incredibly lucky in my career to work on interesting projects with incredible people,” says Matsumoto, while adding: “As the role semiconductors play in our world continues to increase, we're going to have to solve a lot of problems, and do a bunch of really cool science and engineering. It's going to be a fun few decades.”

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..