MILPITAS, CALIF. –– November 15, 2022 –– The 2022 Phil Kaufman Award ceremony and banquet honoring Dr. Giovanni De Micheli will be held Thursday, February 23, 2023, from 6:30 p.m. until 9:30 p.m. at The GlassHouse, 2 South Market Street in San Jose, Calif.

The evening will be hosted by the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA). Early bird ticket pricing is available through Friday, January 13, 2023, at $175 per individual from member companies and $225 each for non-members. After January 13, member tickets are $225 each and $275 per non-member. Member pricing is offered for individuals or companies that are active SEMI or IEEE members.

Corporate sponsorship opportunities are available. Contact Bob Smith, executive director of the ESD Alliance, at [email protected] for more information.

Dr. De Micheli is Professor and Director of the Institute of Electrical Engineering (IEL) and of the Integrated Systems Centre at the École Polytechnique Fédérale de Lausanne (EPFL) in Lausanne, Switzerland. He is being recognized for his contributions to electronic design automation (EDA). His research on EDA tools and methodologies has helped drive significant advances in the academic field of design automation and made a lasting impact on the industry through their incorporation into commercial EDA solutions.

About the Phil Kaufman Award
The Phil Kaufman Award, co-sponsored by the ESD Alliance and CEDA, honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The annual award was established in 1994 as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2021 recipient was Dr. Anirudh Devgan, President and CEO of Cadence Design Systems. Visit the Phil Kaufman Award webpage for more details and a list of previous recipients.

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in touch with IEEE CEDA:
Website: www.ieee-ceda.org
LinkedIn: https://www.linkedin.com/groups/8343531
Facebook: https://www.facebook.com/ieeeceda/
Twitter: https://twitter.com/IEEECEDA

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

• Read more about 2022 Phil Kaufman Award Ceremony and Banquet Honoring Dr. Giovanni De Micheli Scheduled for February 23 in San Jose

microMIRA™ provides highly uniform, force-free lift-off of material layers at high speeds;
more than ten 3D-Micromac laser systems sold for microLED applications to date

Chemnitz, Germany, November 7, 2022—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets, today announced that a leading optical solutions provider has purchased multiple microMIRA™ Laser Lift-Off (LLO) systems from 3D-Micromac for use in the production of microLED devices. The customer will install the new microMIRA systems in pilot- and production lines at its state-of-the-art LED chip factory in Asia.

Laser Lift-Off an Enabling Process for microLEDs
MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime, and low power consumption. Potential applications include very large displays for indoor and outdoor use, as well as high-resolution displays for augmented reality (AR) and virtual reality (VR) wearable devices.

However, the microLED fabrication process is vastly more complex than LCD and OLED manufacturing, and faces several technical challenges that must be overcome before microLEDs can be readily available in the mass market. Among these challenges is detaching and transferring the processed microLED chips from the donor or growth substrate (e.g., sapphire) to an intermediate substrate for subsequent testing without damaging the expensive growth substrate, allowing it to be repurposed for future use. The microMIRA system from 3D-Micromac precisely addresses this task with superior performance.

3D-Micromac’s microMIRA system provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The system is capable of processing different substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.

According to Uwe Wagner, CEO of 3D-Micromac, “This multiple system order is a testament to our ability to provide innovative and enabling laser micromachining solutions for industrial applications serving both mature and emerging markets. It also represents an important milestone for 3D-Micromac as we continue to expand our product offerings and services into the display industry, addressing the production needs for exciting new display technologies, including microLEDs. To date, 3D-Micromac has sold more than 10 laser processing systems for microLED applications, including our industry-benchmark microMIRA laser-lift-off system as well as our recently introduced microCETI™ micromachining platform.”

The microMIRA LLO system has been used successfully in mass production by electronics manufacturers globally for years. In addition to gallium nitride (GaN) lift-off from glass and sapphire substrates in microLED display manufacturing, the microMIRA system can also be used for layer separation in semiconductor and sensor manufacturing, as well as for laser annealing and crystallization for surface modification.

More information on microMIRA, including our latest white paper “Laser technologies for microLED production,” can be found at https://3d-micromac.com/laser-lift-off/micromira/.

About 3D-Micromac
Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

• Read more about 3D-Micromac receives order for multiple Laser Lift-Off systems for microLED device manufacturing

Kitchener, Ontario, November 3, 2022 – PEER Group®, the largest supplier of innovative factory automation software products, has announced the appointment of industry veteran Torsten Werneke as its new European OEM Account Manager.

“Throughout my time in the semiconductor industry, PEER Group has always been an impressive company,” says Werneke. “The quality and design of their products, focus on customer satisfaction, and honesty and openness made it an easy decision to join as the new European OEM Account Manager.”

Werneke has more than 25 years of industrial software development and process management experience in the semiconductor and photovoltaic industries. Based in Friedrichshafen, Germany and working out of PEER Group’s Dresden office, he will be responsible for supporting all current European OEM customers while expanding PEER Group’s presence in Europe.

“There is much excitement in the European semiconductor industry,” says Werneke. “Factories are taking advantage of significant investments to expand production and equipment makers are looking for ways to enhance their tool automation and data collection capabilities to help support this expansion. PEER Group provides the products and solutions for precisely these challenges.”

Previous to working at PEER Group, Werneke, who holds a Mechanical Engineering degree from Chemnitz University of Technology, spent time as a process engineer at Infineon Technologies before founding itemic AG, an APC platform supplier for lithography, CMP, and etching tools. After selling itemic’s core technology to ASML, Werneke launched another venture manufacturing high-end ultra-flat light panels for commercial applications.

“As we get ready to celebrate next year’s twentieth anniversary since the opening of our European office, I am pleased to welcome Torsten to the PEER Group team,” shares Mike Barrett, Director, Global OEM Sales at PEER Group. “His industry knowledge and software development expertise will be of great value to the European equipment makers looking to automate their tools and get accepted into semiconductor fabs.”

Werneke, along with other members of PEER Group, will be attending SEMICON Europa, happening November 15-18. To schedule a meeting with him during the show, visit PEER Group's SEMICON Europa event page and complete the form.

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award-winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and is one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

• Read more about PEER Group appoints Torsten Werneke as its new European OEM Account Manager

Kitchener, Ontario, October 26, 2022 – PEER Group®, the largest supplier of innovative factory automation software products is excited to attend SEMICON Europa 2022, happening November 15-18 at Messe München in Munich, Germany.

Co-presented with electronica, the four-day show is billed as the “strongest single event for electronics manufacturing in Europe,” bringing together all facets of the semiconductor manufacturing supply chain. There has been increased focus placed on the European semiconductor industry as of late, most notably with the recent announcement of the European Chips Act which, if adopted, would see more than € 43 billion of public and private investments funneled into strengthening Europe’s semiconductor supply chain.

“Next year will mark twenty years since PEER Group first opened its Dresden office,” says Mike Barrett, Director, Global OEM Sales at PEER Group, “and as investments into the European semiconductor industry increase, we are ready to work closely with our current and future customers and partners in helping them achieve their tool and factory automation goals.”

In addition to exhibiting, PEER Group’s Director of Marketing, Doug Suerich, will be presenting the topic: Treading lightly: How a pandemic pivot to remote integrations helped reduce our carbon footprint, as part of the SEMICON Europe Sustainability Summit. The presentation will share lessons learned from two years of performing remote discoveries, integrations, and inspections and how, in some instances, these lessons have become best practices for our customers going forward.

For more information, visit PEER Group’s SEMICON Europa event page: https://www.peergroup.com/news-events/events/semicon-europa-2022/?utm_source=internal&utm_medium=europa&utm_campaign=SEMI

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

• Read more about PEER Group showcasing automation expertise at SEMICON Europa

• Total income of EUR 4.3 million in Q3 2022, a year-over-year growth of 19%
• Order book value has further grown since the beginning of the quarter
• New investments to increase capacity and capabilities

Deventer, October 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the third quarter of 2022. The total income for the quarter was EUR 4.3 million, which is 19% higher than the total income in the third quarter of 2021 (EUR 3.6 million). The test operations department is continuing to grow with existing and new customers. The total income for the first nine months of 2022 was EUR 11.6 million, which is 6% higher than the total income for the first nine months of 2021 (EUR 10.9 million). Due to long-term contracts and increasing demand from new customers, the value of the order book is higher than at the beginning of the quarter. This generates a good basis for the upcoming quarters.

“We are very pleased with the high total income throughout the year and especially with the third quarter, which drew the highest quarterly total in the last 20 years”, says Martin Sallenhag, CEO of RoodMicrotec. “We keep investing in new equipment to be able to support the increasing demands from our customers. During 2022, we have purchased new handlers and testers as well as new equipment for the Qualification and Failure Analysis department.”

Outlook
RoodMicrotec expects the total income in 2022 to be in the range of EUR 15.0 million to EUR 15.6 million with a positive result before tax. The current situation in the world regarding lead-times for wafers and packaging as well as shipment delays may impact the ability to achieve the expected total income. The war in Ukraine as well as the current energy crisis could also have an impact on the business but in the short term we don’t see any significant impacts. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any impact.

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, political situation, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

Financial calendar
January 26, 2023 Publication (preliminary) annual total income 2022
April 13, 2023 Trading update for the first quarter of 2023
April 20, 2023 Publication annual report 2022
April 20, 2023 Conference call for press and analysts
June 6, 2023 Annual general meeting of shareholders
July 20, 2023 Publication interim report 2023
July 20, 2023 Conference call for press and analysts
October 19, 2023 Trading update for the third quarter of 2023

Audit
The financial data in this press release have not been audited.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well established as a highly valued partner for many companies worldwide. The Company provides full turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions, the English version shall prevail.

• Read more about RoodMicrotec reports a 19% year-over-year growth rate for the third quarter of 2022

Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, launches the new Plasma Enhanced Atomic Layer Deposition (PEALD) system, "AD-800LP". The main target of the system is gate oxide film deposition for next-generation power devices of silicon carbide (SiC) and gallium nitride (GaN) materials, which will play important role toward carbon neutral.

The plasma enhanced ALD system "AD-800LP" is a multi-purpose R&D system equipped with a unique ICP plasma source called "Tornado ICP", in addition to the conventional thermal ALD capability. AD-800LP enables various film deposition such as oxide or nitride films by Tornado ICP, which is Samco's proprietary plasma technology and is different from remote plasma. Tornado ICP enables stable plasma discharge even in the high-pressure range during ALD deposition.

“We are also considering a cluster ALD system that can connect multiple reaction chambers for production” says Tsukasa Kawabe, President and COO of Samco. “The launch of the AD-800LP will greatly enhance our presence in the world ALD equipment market.” Tsukasa adds.

As a global mid-sized company, Samco has successfully delivered numerous dry etch systems and plasma enhanced CVD systems for the electronic device field, mainly for compound semiconductors such as SiC, GaN, and GaAs, not only in Japan but also in the United States, Europe, Taiwan, Korea, China, Southeast Asia, India, and other countries.

The new Research Center for Nano Thin Films & Materials, which opened in February 2022, conducts research and development of unique thin film deposition, including ALD system. Samco will continue to utilize our "thin-film technology" to develop unique products and expand sales globally.

AD-800LP system photo

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including BAW filters, SiC power devices, GaN RF devices, GaAs VCSELs, InP lasers, microLEDs, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samcointl.com/.

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]

• Read more about Samco Unveils Plasma Enhanced ALD System for SiC and GaN Power Devices

Illinois Institute of Technology (Illinois Tech) alumnus Rick Carlson (MATH ’70), vice president of sales for Verific Design Automation, a leading provider of SystemVerilog, Verilog, VHDL, and UPF Parser Platforms, has been elected to the College of Computing Board of Advisors.

Carlson graduated from Chicago’s comprehensive tech-focused university with a Bachelor of Science in Mathematics and was also a member of the Illinois Tech men’s basketball team. “I’m exceptionally proud to join the College of Computing’s Board of Advisors,” he says. “Illinois Tech and the College of Computing provide students of all backgrounds with the best-in-class computational and data science platform to excel in their respective fields.”

With more than 40 years of experience in the electronic design automation (EDA) industry, Carlson will help the College of Computing promote its collective power of difference to advance technology and progress for all. He will serve as an advocate to reinforce the college’s position as the leading creator of computational talent, knowledge and innovation for Chicago and beyond.

Carlson is a Lanza techVentures Investment Partner and an adviser to many EDA startups in his role as vice president of sales for Verific. He was one of the co-founders of the ESD Alliance (formerly the EDA Consortium), an industry trade association that is a SEMI Technology Community. While at Highland Software (now Flexera Software), Carlson helped launch FLEXlm, a software license manager intended for corporate environments to provide floating licenses to multiple computer software end users.

About Illinois Institute of Technology’s College of Computing
Illinois Tech created the College of Computing in 2020 as part of an effort to drive Chicago’s thriving tech ecosystem by educating a future diverse workforce that is rigorously trained in data and computation. Illinois Tech is home to the Midwest’s only Bachelor of Science in Artificial Intelligence degree, and the numerous cybersecurity and intelligence pathways at Illinois Tech explore not only the deep foundations of fast-growing fields of computer science, but also emphasize societal ethics in developing this technology. The United States Department of Homeland Security and the National Security Agency have designated Illinois Institute of Technology (Illinois Tech) as a National Center of Academic Excellence in Cyber Defense Education. The university’s Center for Cyber Security and Forensics Education (C2SAFE) is at the core of Illinois Tech’s designation. Additionally, the center is a member of the United States Strategic Command (USSTRATCOM) Academic Alliance and North American Defense and Security Academic Alliance (NADSAA).

About Verific Design Automation
Verific Design Automation is the leading provider of SystemVerilog, Verilog, VHDL and UPF Parser Platforms that enable project groups to develop advanced electronic design automation (EDA) products quickly and cost effective worldwide. With offices in Alameda, Calif., and Kolkata, India, Verific has shipped more than 60,000 copies of its software used worldwide by the EDA and semiconductor industry since it was founded in 1999.

Engage with Verific at:
Email: [email protected]
Website: www.verific.com
LinkedIn: https://www.linkedin.com/company/verific-design-automation-inc/
Facebook: https://www.facebook.com/Verific-Design-Automation-100448363329771/

• Read more about Verific’s Rick Carlson Appointed Advisory Board Member for the College of Computing at Illinois Institute of Technology