China http://china.semi.org.cn/templets/default/index_content.php?mid=444 Technical

Haining Shi
Jiaxing Shi
Zhejiang Sheng
China

Sep 26, 2020 - Sep 27, 2020 Off Add to Calendar 2020-09-26 00:00:00 2020-09-27 00:00:00 China (Haining) Semiconductor Equipment & Materials Elite Summit Haining Shi Jiaxing Shi Zhejiang Sheng China SEMI.org [email protected] America/Los_Angeles public Sep 22, 2020

Register SEMI-ESDA-SF logo lockup Business Executive Technical

The ESD Alliance, a SEMI Technology Community, and the SEMI Foundation are collaborating with VLSI System Design to promote VSDOpen 2020, a virtual conference being presented on October 10, 2020.

VLSI System Design provides global online training courses that teach students semiconductor chip design. SEMI recognizes workforce development as one of the most critical needs facing the semiconductor industry. The ESD Alliance and SEMI Foundation are promoting this event as part of SEMI’s broad mission to accelerate workforce development for our industry.

VSDOpen 2020 is a one-day virtual online event featuring three keynote speakers (Jan Rabaey – UC Berkeley, Naveed Sherwani – SiFive and Michael Wishart – eFabless). In addition, the conference will showcase semiconductor IP designed by students, education, research demonstrations, and networking opportunities for designers, researchers, tool developers, and students.

There is no charge to attend VSDOpen 2020. Click the button below to learn more about the event and to register.

India

Oct 10, 2020 ESD Alliance Workforce Development

VSDOpen 2020 Conference

Chip Design * IP * Keynotes * Education * Networking

8:00 am - 2:00 pm Off Add to Calendar 2020-10-10 08:00:00 2020-10-10 14:00:00 VSDOpen Conference 2020 India SEMI.org [email protected] Asia/Kolkata public Sep 11, 2020 Asia/Kolkata

United States https://eps.ieee.org/education/eps-webinars.html Technical

Online, Eastern Time
United States

Sep 10, 2020 Off Add to Calendar 2020-09-10 00:00:00 2020-09-10 00:00:00 Packaging of Electronics for Medical, Health and Wearables Applications Online, Eastern Time United States SEMI.org [email protected] America/New_York public Sep 1, 2020 America/New_York

Register Now

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Featured Speakers

Virtual Global Smart Manufacturing Conference Event Guide

 

 

 

 

 

 

 

 

 

Globalized supply chains, combined with limited travel and access to experts, has led to rapid acceleration in implementations of smart manufacturing strategies. These systems are focused on improving things such as:

• Quality and yield
• Efficiency
• Security and safety
• Optimizing manufacturing cost

This inaugural Global SEMI Smart Manufacturing event brought together experts around the world to share strategies and best practices for professionals improving their manufacturing data capture & analysis and maintaining business continuity, while meeting increasing demands of customers.

The Virtual Conference includes:

• 6 Keynotes 
• 6 Tutorials
• 6 Case Studies

Want to hear about all of our Smart Manufacturing Activities?  Register for the Interest List.

For more information contact Ayo Kajopaiye at [email protected].

United States

Oct 23, 2020 - Nov 23, 2020 FOA ITL Standards

The [LIVE] event is over, but the presentations and content remains fresh and applicable via the ON DEMAND platform.  To access the information, just register for the event and click on the Agenda for access to the presentations.

Content available until November 23, 2020

Global Smart Manufacturing Conference

Sensing, Connecting & Predicting for Capturing the ROI of Smarter Manufacturing

12:00 am - 12:00 am Off Add to Calendar Disabled Jun 2, 2021 America/Los_Angeles

Registration

Pre-registration period: Sep 1 (Tue) - Oct 15 (Tue), 2020

Registration fee

• SEMI members / Student: KRW 250,000
• Non-members: KRW 300,000

 

Register Now

South Korea Square-banner(1000-1000).jpg Business Technical

 

SPONSORS

  Sponsorship Opportunities: JoAnn Lee([email protected])

 

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NOTICE

• Presentation files agreed by speakers will be provided to attendees. It will be informed how to download the files after the event.
• The agenda will be subject to change without notice.
• Live session will start Oct 19, 2:00pm.
• On-demand Session is accessible during Oct 19 - 20.

 

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CONTACT

  Sera Jung(+82-2-531-7831 / [email protected])

SMC Korea 2019 Photos

Room 401, COEX, Seoul
Gangnam-gu
Seoul
South Korea

Oct 19, 2020

[NOTICE] Due to the Social Distancing for preventing COVID-19, SEMI decided to hold SMC Korea 2020 as a Virtual Event.

 

Materials Driving Transformation of Industry

With advanced materials now a critical enabler of semiconductor growth applications, industry leaders have emphasized significance of innovation in materials. SMC Korea 2020, the premier conference on electronic materials, will gather top executives from every segment of semiconductor manufacturing to provide the most up-to-date developments in areas of advanced materials.
Join us at SMC Korea 2020 to advance your knowledges and network with the global leaders and professionals.

Strategic Materials Conference - SMC KOREA 2020

Oct 19 (Mon) - 20 (Tue), 2020 | Virtual

9:00 am - 5:40 pm Off Add to Calendar 2020-10-19 09:00:00 2020-10-19 17:40:00 SMC KOREA 2020 [NOTICE] Due to the Social Distancing for preventing COVID-19, SEMI decided to hold SMC Korea 2020 as a Virtual Event.   Materials Driving Transformation of Industry With advanced materials now a critical enabler of semiconductor growth applications, industry leaders have emphasized significance of innovation in materials. SMC Korea 2020, the premier conference on electronic materials, will gather top executives from every segment of semiconductor manufacturing to provide the most up-to-date developments in areas of advanced materials. Join us at SMC Korea 2020 to advance your knowledges and network with the global leaders and professionals. Room 401, COEX, Seoul Gangnam-gu Seoul South Korea SEMI.org [email protected] Asia/Seoul public Oct 12, 2020 Asia/Seoul

Registration

Open to all. 

Register Now

United States save your seat What's Driving Automotive Electronics Assembly and Packaging Technical

The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. The changes we will all experience include the nature of car ownership, how the car is powered, increased safety, and driver automation. Each of these changes is only possible with advances in electronics hardware and systems, electronics assembly, and semiconductor packaging. Indium Corporation’s Dr. Andy Mackie will discuss the impact of these changes on electronics assembly and packaging, and the impact of mission profiles on component and systems level reliability.

United States

Sep 17, 2020

What's Driving Automotive Electronics Assembly and Packaging

8:00 am - 9:00 am Off Add to Calendar 2020-09-17 08:00:00 2020-09-17 09:00:00 What's Driving Automotive Electronics Assembly and Packaging United States SEMI.org [email protected] America/Los_Angeles public Aug 24, 2020

REGISTRATION

This webinar is free of charge. 

REGISTER

Belgium France Germany Ireland Italy Russia United States REGISTER About Smart Manufacturing Business Technical

For sponsorship opportunities, please contact:

Cassandra Melvin, Director of Operations at [email protected]
Adi Hodorov, Manager, Sales and Key Accounts at [email protected] 

PRESS AND MEDIA

If you are interested in partnering with us or have any questions about press and media, please contact us.

Serena Brischetto, Senior Manager, Marketing and Communications at [email protected]

The SEMI SMART Manufacturing Initiative is a global effort to promote awareness and interest about smart manufacturing and industry 4.0. Through their collaborative efforts, the members of the SEMI SMART Manufacturing Regional Chapters meet regularly, both virtually and in person, to facilitate discussions for solving challenges and issues that impact manufacturing.  

The webinar will provide an update on pressing critical topics derived from key players across the supply chain and is recommended to semiconductor professionals interested in the European smart manufacturing trends and market.

Topics include:

• a summary of stakeholder-identified activities aligned to Industry 4.0
• key initiatives and emerging roadmaps
• standards
• best practices for improved process quality
• market updates
• overview of current Smart Manufacturing activities

Online, Central European Time
Germany

Dec 9, 2020 FOA

Free Webinar

European Collaborations Driving Smart Manufacturing Excellence
 

 

European Collaborations Driving Smart Manufacturing Excellence

4:00 pm - 5:30 pm Off Add to Calendar 2020-12-09 16:00:00 2020-12-09 17:30:00 Webinar - European Collaborations Driving Smart Manufacturing Excellence Free Webinar European Collaborations Driving Smart Manufacturing Excellence     Online, Central European Time Germany SEMI.org [email protected] Europe/Berlin public Jan 15, 2021 Europe/Berlin

United States Go FLEX Website Get Connected for Latest Updates https://flex.semi.org/ Business Executive Expositions Technical

FLEX CALL FOR ABSTRACTS—IS NOW CLOSED 

For late submissions please contact:
Michelle Fabiano
[email protected]

 

20 Years of Driving Innovation to Make the World Safer

You'll hear experts highlight the latest technical breakthroughs, unique electronics applications, and business strategies giving insight into the future of next-generation Integration beyond Moore's law era. Key technologies and markets in the areas of Smart Medical, Smart Mobility, Smart Manufacturing, Data, AI, and Displays will be explored throughout each technical track presented each day of FLEX week. 

Flexible hybrid electronics (FHE) present unique heterogeneous integration capabilities with unprecedented continuity with us and our world. This softer side of electronics represents high performance integrated devices that are curved and variable in form factor. Electronics that augment our daily activities and interact with our surroundings like no personal computing device ever has are emerging in new and varied application spaces. 

KEY TOPICS 

• February 22 » Session 1—FHE Systems 

• February 23 » Session 2—Materials Processing 

• February 24 » Session 3—Sensors & MEMS   

• February 25 » Session 4—Sustainability & Power 

• February 26 » Industry Virtual Tours 

ON-DEMAND AVAILABILITY

• February 15–21 
  Prepare and preview the On-Demand presentations in order to join each day ready for the interactive panel discussions and luminary keynote discussions.  

• February 26–March 26
  All content will be available for 30 days On-Demand in case you missed anything during FLEX week. 

WHO ATTENDS? 

Celebrating its 20th year, the online event will gather executives, product managers, business development professionals, and engineering directors as well as leading industry analysts and media for the latest developments, trends, and innovations in flexible hybrid electronics (FHE). More than 400 companies, universities, R&D labs, and government agencies from around the world have participated in FLEX conferences each year. 

Please fill out the FLEX Interest Form to stay updated on FLEX 2021 Conference & Expo.
 

Online, PST
United States

Feb 22, 2021 - Feb 26, 2021 FlexTech

FLEX IS GOING VIRTUAL!
This is the 20^th Anniversary of the FLEX Conference & Expo.
Thank you to the entire FLEX community, committee members, sponsors, attendees, and exhibitors, for your support. We are proud to have you with us on the journey into the next 20 years and beyond.

Organizers 

 

 

FLEX 20th Anniversary— Conference & Expo 2021

Virtual Event

Off Add to Calendar Disabled Nov 5, 2020

Call for abstracts

FLEX 2021

TOPICS & SUBMISSION FORM

America/Los_Angeles

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

The course explores how reliability testing plays a critical role for Flexible Hybrid Electronics throughout the development process. The presentation highlights how it is essential to create a reliability test plan that covers the requirements for EV, DV and finally though PV, in order to insure product reliability and performance.

The instructors discuss how the Molex design process is used to identify risks and challenges for custom FHE applications and how the various reliability test are used evaluate and eliminate the potential risk and challenges.

AGENDA

• Overview of Molex Printed Circuits Solutions
• FHE challenges & requirements
• Overview of reliability testing development process
• Reliability test standards
• Reliability lab set up
• Q&A

The various industry standards related to HMI, FHE, PE, Printed Sensors and other applications are also reviewed in conjunction with usage in reliability testing related to FHE.

Instructors Tom Seputis, Lab Manager, and Dave Rasmussen. Director, PCS Engineering, as they provide an overview of Molex Printed Circuit Solutions and the reliability testing and challenges related to Flexible Hybrid Electronics.

This Master Class is 4th in a series of 4 classes. Classes 1-3, and the series are also available On Demand at the following links:  

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#3 Integration Techniques for Flexible Electronics

Read more about the full Master Class Series

United States

Dave Rasmussen

Director of PCS Engineering

Molex

Tom Seputis

Lab Manager

Molex

Oct 21, 2020 - Jul 31, 2021

Flexible Electronics Master Class #4 explores best practices for ensuring reliability of FHE devices throughout the production process. The course is taught by experts from Molex's Printed Circuit Solutions Division which has been successfully building complex and reliable flexible circuits for many advanced applications.

Flexible Electronics Reliability Testing and Challenges

A Flexible Electronics Master Class

12:00 am - 12:00 am Off Add to Calendar Disabled Nov 2, 2020 America/Vancouver

Registration Includes: 

• Access to the recorded session for use by the same person, multiple times
• Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

Register Now

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

This Master Class is 3rd in a series of 4 classes.  Classes 1 and 2 are available On Demand.  Class 4 will be announced shortly.

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#4 Reliability Measurement and Test for Flexible Electronics

United States

Robert Street

Fellow, Palo Alto Research Center

Sep 24, 2020

The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

 

HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS

A Flexible Electronics Master Class

10:00 am - 12:00 pm Off Add to Calendar 2020-09-24 10:00:00 2020-09-24 12:00:00 Flexible Electronics Master Class#3: Integration The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.   United States SEMI.org [email protected] America/Vancouver public Aug 31, 2020 America/Vancouver