If you are interested in partnering with us or have any questions about press and media, please contact us.
Serena Brischetto, Senior Manager, Marketing and Communications at [email protected]
The SEMI SMART Manufacturing Initiative is a global effort to promote awareness and interest about smart manufacturing and industry 4.0. Through their collaborative efforts, the members of the SEMI SMART Manufacturing Regional Chapters meet regularly, both virtually and in person, to facilitate discussions for solving challenges and issues that impact manufacturing.
The webinar will provide an update on pressing critical topics derived from key players across the supply chain and is recommended to semiconductor professionals interested in the European smart manufacturing trends and market.
Topics include:
a summary of stakeholder-identified activities aligned to Industry 4.0
key initiatives and emerging roadmaps
standards
best practices for improved process quality
market updates
overview of current Smart Manufacturing activities
European Collaborations Driving Smart Manufacturing Excellence
European Collaborations Driving Smart Manufacturing Excellence
4:00 pm - 5:30 pm
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Add to Calendar2020-12-09 16:00:002020-12-09 17:30:00Webinar - European Collaborations Driving Smart Manufacturing ExcellenceFree Webinar
European Collaborations Driving Smart Manufacturing Excellence
Online, Central European Time GermanySEMI.org[email protected]Europe/Berlinpublic
Europe/Berlin
For late submissions please contact:
Michelle Fabiano [email protected]
20 Years of Driving Innovation to Make the World Safer
You'll hear experts highlight the latest technical breakthroughs, unique electronics applications, and business strategies giving insight into the future of next-generation Integration beyond Moore's law era. Key technologies and markets in the areas of Smart Medical, Smart Mobility, Smart Manufacturing, Data, AI, and Displays will be explored throughout each technical track presented each day of FLEX week.
Flexible hybrid electronics (FHE) present unique heterogeneous integration capabilities with unprecedented continuity with us and our world. This softer side of electronics represents high performance integrated devices that are curved and variable in form factor. Electronics that augment our daily activities and interact with our surroundings like no personal computing device ever has are emerging in new and varied application spaces.
KEY TOPICS
February 22 » Session 1—FHE Systems
February 23 » Session 2—Materials Processing
February 24 » Session 3—Sensors & MEMS
February 25 » Session 4—Sustainability & Power
February 26 » Industry Virtual Tours
ON-DEMAND AVAILABILITY
February 15–21
Prepare and preview the On-Demand presentations in order to join each day ready for the interactive panel discussions and luminary keynote discussions.
February 26–March 26
All content will be available for 30 days On-Demand in case you missed anything during FLEX week.
WHO ATTENDS?
Celebrating its 20th year, the online event will gather executives, product managers, business development professionals, and engineering directors as well as leading industry analysts and media for the latest developments, trends, and innovations in flexible hybrid electronics (FHE). More than 400 companies, universities, R&D labs, and government agencies from around the world have participated in FLEX conferences each year.
Please fill out the FLEX Interest Formto stay updated on FLEX 2021 Conference & Expo.
FLEX IS GOING VIRTUAL!
This is the 20th Anniversary of the FLEX Conference & Expo.
Thank you to the entire FLEX community, committee members, sponsors, attendees, and exhibitors, for your support. We are proud to have you with us on the journey into the next 20 years and beyond.
The course explores how reliability testing plays a critical role for Flexible Hybrid Electronics throughout the development process. The presentation highlights how it is essential to create a reliability test plan that covers the requirements for EV, DV and finally though PV, in order to insure product reliability and performance.
The instructors discuss how the Molex design process is used to identify risks and challenges for custom FHE applications and how the various reliability test are used evaluate and eliminate the potential risk and challenges.
AGENDA
Overview of Molex Printed Circuits Solutions
FHE challenges & requirements
Overview of reliability testing development process
Reliability test standards
Reliability lab set up
Q&A
The various industry standards related to HMI, FHE, PE, Printed Sensors and other applications are also reviewed in conjunction with usage in reliability testing related to FHE.
Instructors Tom Seputis, Lab Manager, and Dave Rasmussen. Director, PCS Engineering, as they provide an overview of Molex Printed Circuit Solutions and the reliability testing and challenges related to Flexible Hybrid Electronics.
This Master Class is 4th in a series of 4 classes. Classes 1-3, and the series are also available On Demand at the following links:
Flexible Electronics Master Class #4 explores best practices for ensuring reliability of FHE devices throughout the production process. The course is taught by experts from Molex's Printed Circuit Solutions Division which has been successfully building complex and reliable flexible circuits for many advanced applications.
Flexible Electronics Reliability Testing and Challenges
A Flexible Electronics Master Class
12:00 am - 12:00 am
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#4 Reliability Measurement and Test for Flexible Electronics
United States
Robert Street
Fellow, Palo Alto Research Center
The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS
A Flexible Electronics Master Class
10:00 am - 12:00 pm
Off
Add to Calendar2020-09-24 10:00:002020-09-24 12:00:00Flexible Electronics Master Class#3: IntegrationThe presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
United StatesSEMI.org[email protected]America/Vancouverpublic
America/Vancouver
#4 Reliability Measurement and Test for Flexible Electronics
United States
Robert Street
Fellow, Palo Alto Research Center
The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS
A Flexible Electronics Master Class
10:00 am - 12:00 pm
Off
Add to Calendar2020-09-24 10:00:002020-09-24 12:00:00Flexible Electronics Master Class#3: IntegrationThe presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
United StatesSEMI.org[email protected]America/Vancouverpublic
America/Vancouver
printing fine lines, pads and pad pitches with < 100um
logic circuits and resistors
bonding integrated circuits
integrating sensors of different types on flexible substrates without significant performance degradation
pick and place with micron-level accuracy
MASTER CLASS SERIES
This Master Class is 3rd in a series of 4 classes. Classes 1 and 2 are available On Demand. Class 4 will cover Building in Reliability Testing and is now available for registration.
The 1-hour class describes techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
HYBRID INTEGRATION TECHNIQUES FOR FLEXIBLE ELECTRONICS
A Flexible Electronics Master Class
12:00 am - 12:00 am
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This course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
Cornell University has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano ElectroMechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. This presentation highlights that, as well as a decision tree based AI model for predicting lithography outcomes.
The AI work used as the basis for the course has been applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience have been developed.
The course provides a useful basis upon which to formulate AI strategies for all thin film manufacturing sites.
This on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
Artificial Intelligence in Thin Film Manufacturing
A Flexible Electronics Master Class
10:00 am - 12:00 pm
Off
Add to Calendar2020-08-18 10:00:002020-08-18 12:00:00Flexible Electronics Master Class#2: AI in MfgThis on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.United StatesSEMI.org[email protected]America/Vancouverpublic
America/Vancouver
This course describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
The team from Cornell has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano ElectroMechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. We report on a decision tree based AI model for predicting lithography outcomes.
This work is being applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience are developed.
This course describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
Originally recorded August, 2020, this course is now offered On-Demand.
Artificial Intelligence in Thin Film Manufacturing
As new materials and process emerge to enable the integration of high performance micro-electronics into paper-thin, flexible hybrid electronics (FHE), there is an increasing demand for new power sources that also support the goals of ultra-thin and flexible.
Among the key challenges is the ability to achieve high energy densities as the battery thickness decreases to a point where the packaging becomes an increasing fraction of the total volume. The challenge is further complicated by the demanding duty cycles for many FHE systems that require both high power (periodic, large current bursts) and high energy (operation across many years in some cases).
At the same time, the new power sources must meet the typical high standards for safety, durability, compatibility with a wide range of storage and operation temperatures, and the needs to support effective integration into the FHE platforms.
The session reviews the challenges and progress for new power supplies that are emerging to meet the needs of the FHE community.
Course provided by Brian Berland, Chief Technology Officer, ITN Energy Systems
#2 AI in Thin-Film Manufacturing (2 hours)
This session describes how machine learning and AI-based approaches to research, development, and production brings advantages to clean room processes. AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.
The team from Cornell University has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano Electro Mechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. The work is applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience are developed and explained in this session.
Course instructors includes Amit Lal, Chris Ober, Peter Doerschuk, Banyamin Davaji from Cornell University, and Garry Bordonaro and Jeremy Clark with the Cornell NanoScale Facility.
#3 Hybrid Integration Techniques for Flexible Electronics (1.5 hours)
The 1-hour class describes techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
Specific topics covered in this session include:
printing interconnects
printing fine lines, pads and pad pitches with < 100um
logic circuits and resistors
bonding integrated circuits
integrating sensors of different types on flexible substrates without significant performance degradation
pick and place with micron-level accuracy
Course instruction given by Robert Street, Palo Alto Research Center
#4 Flexible Electronics Reliability Testing and Challenges (1.5 hours)
This online Reliability Engineering Master class is for people with an engineering or science background, who want to learn and use methods and techniques to conduct reliability analysis and improvement. This course is intentionally structured to show you a wide variety of reliability engineering knowledge and important applications.
This session outlines the foundation reliability engineering concepts and methods, and how to apply fundamental failure investigation techniques. You will also learn a range of effective workplace improvement solutions and risk analyses used to implement reliability engineering strategies.
Course Instruction given by Dave Rasmussen and Tom Seputis, Molex.
Flexible Hybrid Master Classes for 2021 are offered on many additional topics! Visit this page for entire list and links to more detailed information on each one.
SEMI FlexTech organizes this series of Flexible Electronics Master Classes on topics proving most challenging to the design, manufacture and use of flexible and printed electronics. The series enables product designers, integrators, and others new to the fields to evaluate technologies and components and make the best choices for their product.
The courses were offered to a live audience July-October, 2020, and are now available on-demand.
Flexible Electronics Master Class Series
Power Sources, Integration & AI and Reliability in Thin-Film Manufacturing
Master Class Abstract:As new materials and process emerge to enable the integration of high performance micro-electronics into paper-thin, flexible hybrid electronics (FHE), there is an increasing demand for new power sources that also support the goals of ultra-thin and flexible.
Among the key challenges is the ability to achieve high energy densities as the battery thickness decreases to a point where the packaging becomes an increasing fraction of the total volume. The challenge is further complicated by the demanding duty cycles for many FHE systems that require both high power (periodic, large current bursts) and high energy (operation across many years in some cases).
At the same time, the new power sources must meet the typical high standards for safety, durability, compatibility with a wide range of storage and operation temperatures, and the needs to support effective integration into the FHE platforms.
The webinar will review challenges and progress for new power supplies that are emerging to meet the needs of the FHE community.
SEMI FlexTech offers a series of Flexible Electronics Master Classes on topics proving most challenging to the use of flexible and printed electronics. The series enables product designers, integrators, and others new to the fields to evaluate technologies and components and make the best choices for their product.
The first course in the series is on Flexible Power Sources: Challenges, Progress and Integration. This course was offered to a live audience on July 29, 2020, and is now available on-demand.
Flexible Power Sources: Challenges, Progress, and Integration
The first in the FlexTech Master Class Series
11:00 am - 12:00 pm
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