Join us for the 20th Anniversary of FLEX!
TWENTY YEARS OF DRIVING INNOVATION TO MAKE THE WORLD SAFER
A Virtual Event for a Global Industry
FLEX, the flexible hybrid electronics (FHE) go-to event, is the center of technical and informative demonstration of flexible hybrid, printed electronics products, equipment, processes, materials, and the applications they enable.
Industry stakeholders—executives, product managers, business development professionals, and engineering directors as well as leading industry analysts and media—attend FLEX to gather information on the latest developments and make contacts for propelling their own interests. Over 400 companies, universities, R&D labs, and government agencies from around the world participate in various ways.
We're gearing up to populate the agenda with technical experts like you from the FLEX community.
The submission process is FREE.
SEMI FlexTech, and the FLEX 2021 Executive Committee invite you to submit an abstract for:
- Oral Presentation—SPEAKERS—Industry professionals from across the electronics supply chain are encouraged to submit an abstract to present on FHE innovation and the impact it has on the future of electronic products. FLEX 2021 will take place virtually and presenters will be asked to record their talk
- Poster Competition—STUDENTS—All students from research universities are welcome to submit posters describing their work and results. The posters are judged by a panel of industry and academic experts, and prizes are awarded to the top three students and their work. Author/co-author must be present their work.
TARGET DATES*
- October 16, 2020 | Deadline for Oral Presentation Abstracts. Student Posters can submit through December 20th.
- November 6, 2020 | Notification of Acceptance for Oral Presentations. Student Posters will be notified December 20th.
- November 15, 2020 | Sign a Speaker Agreement, provide a bio and headshot
- January 20, 2021 | Provide a digital .MP4 file of your presentation
- February 22–26, 2021 | Live Q&As, Panel Discussions, and Exhibition [global timezone coverage planned]
- February 15–March 15, 2021 | Recorded Presentations Available Online
*dates subject to change
TOPIC AREAS
We are seeking abstracts addressing flexible, hybrid and printed electronics breakthroughs and innovations in, but not limited to:
FLEXIBLE HYBRID ELECTRONICS (FHE) SYSTEMS
FHE system Integration is essential to maintain the pace of progress with higher performance and reliability, lower latency, smaller size, lighter weight, and lower power requirements. In scope technologies are:
- 2.5D or 3D integration with FHE.
- Additive processing with fine lines and pads.
- FHE sensor integration, for example:
- Temperature sensors with accuracy and long lifetime.
- Impact sensor to withstand high G shock without drift.
- Gas sensor with high selectivity.
- Antenna with high frequency, e.g., mm-wave applications.
- Printed replacement/enhancement to MEMS.
- Technology that enables FHE or the applications of FHE.
MATERIALS PROCESSING
Flexible hybrid electronics (FHE) materials, including conductors, semiconductors & insulators, providing a more extensive range of properties to meet the demand for lower cost, reduced power & higher performance devices, modules & packages. In scope technologies are:
- Next-generation, high stability printed conductors, semiconductors & dielectric materials.
- Vacuum processing of thin & thick film materials on flexible substrates for use in high-performance device applications.
- High-performance dielectric materials with enhanced electrical & mechanical properties required to meet the demands of next-generation FHE device applications.
- Development of metamaterials for use in FHE applications inclusive RF antennas, shielding & optics.
- Advanced patterning technologies for FHE.
- Novel display materials & processing for next-generation flexible display devices.
- Artificial intelligence (AI) utilization in new material & new process development, fab yield management & related areas.
- Materials reliability testing for FHE.
SUSTAINABILITY & POWER
We have included sustainability and power as a separate track, as SEMI - FlexTech leads with its commitment to the future of the planet, and we are asking for members of our community to help us expand and fulfill our vision.
- Carbon footprint reduction via design, materials selection, manufacturing, and/or product use of FHE devices.
- MedTech and Mobility: impact on food, water, health, climate.
- Power generation and storage for FHE, IoT, MEMS & Sensors.
- Power Value Chain
- Reduce, Reuse, Recycle: design rules to accelerate sustainability impact for FHE in MedTech, mobility, and wearables.
- Sustainability impact; strategy, tactics, metrics for success/progress with demonstrated results of progress.
SENSORS & MEMS
The integration of sensor systems on FHE platforms is critically essential for novel sensing applications enabling greater ease of use, lower cost, and added functionality. Abstracts are welcome addressing the challenges and discussing the opportunities of integrating sensors on FHE platforms, from materials, components, systems, design, performance, reliability, fabrication, and production point of view.
- Cuffless blood pressure sensing
- Environmental sensing for extreme environments
- Flexible sensors
- Human biochemistry sensing
- MEMS integration
- Sensing in unique wearable form factors (wearables, textiles, jewelry).
- Sensing systems and integration
APPLICATIONS
Our goal is to align FHE development with market needs. In addition to submissions for FHE technical development, end-user companies who have unmet requirements for FHE will also be of interest. Application areas include:
- Big Data/Artificial Intelligence (AI)
- Connectivity: RF, microwave, antennae, phased arrays, 5G, IoT.
- Consumer Electronics: smart home devices, robotics.
- Displays
- Medical: health, wellness, monitoring.
- Sensors and System Integration, as well as displays and display integration.
- Smart Infrastructure: buildings, surfaces, solar, energy storage.
- Smart Manufacturing
- Smart MedTech: structural health monitoring, medical, health, and wellness.
- Smart Transportation: automotive, aerospace, marine.
QUESTIONS?
Michelle Fabiano, IOM
Sr. Manager, Programs & Events, SEMI
[email protected]
About SEMI FlexTech
SEMI FlexTech is devoted to fostering the growth of the electronic display and the flexible, hybrid and printed electronics supply chain from R&D to commercialization. Find out more at www.flextech.org, or contact at [email protected]
Call for Speaker & Student Poster Abstracts
- Be recognized as a leader within the FHE community
- Special FLEX registration pricing
Presenters receive acknowledgment in the:
▪ FLEX 2021 Event Guide
▪ Conference Website
▪ Full Access to FLEX Presentations
Presentations must include practical recommendations for addressing commercialization issues or applications, providing innovative technological or market solutions driven by a use-case along with its integration challenges and system-level architecture decisions. Presentations should also cover how each challenge was addressed and overcome. Include the main message you wish to convey, your recommendations for the supply chain and how your presentation, demonstration or poster will advance the technology of FHE, PE or FE and/or manufacturing methods. Also, include what do you think we as an industry should be working on and what are you working on to demonstrate sustainability. Include any suggestions that SEMI FlexTech can do to achieve progress on your issues or recommendations. Abstracts and presentations should address why the technology presented matters and to whom.
▪ Abstracts should clearly outline a path forward and articulate a call-to-action.
▪ Commercial or marketing presentations will not be accepted.
▪ Speakers will receive discounted admission to FLEX 2021. No other compensation will be provided.
▪ Speakers will be required to sign a Speaker Agreement, provide a bio and headshot by November 15, and provide an electronic copy of his or her presentation by February 1, 2021.
▪ All final presentations will be made available to conference attendees and SEMI FlexTech members.
▪ Complete the Online Form
▪ Upload your abstract (100-300 words) describing the topic of your presentation and how it applies to the flexible, hybrid, and printed electronics products.
▪ Preference is given to original research and advancements in process and materials, to end-users, and potential end-users.
▪ SEMI FlexTech Members receive priority consideration.
NOTE: 2021 FLEX will be held virtually with a interactive digital platform focused on providing networking and product exhibition in a virtual environment. Recorded Presentations will be made live on Monday, February 15 2021.