Held over three days, this FOA members-only meeting will focus on key speakers, open forums, market updates, and content that you have come to expect. Please plan on joining fellow industry peers at the meeting to network and share insights and best practices on the latest business, and technology trends affecting the electronics manufacturing industry. The FOA community stays connected and continues the good dialogue on keeping our fabs productive with the innovative solutions that members continue to drive even in the virtual environment.
About Fab Owners Alliance (FOA)
The Fab Owners Alliance, a SEMI technology community, is an international, group of semiconductors & MEMS fab owners and industry suppliers who meet regularly to discuss and act on common manufacturing issues, combining strengths and resources to maintain and increase their global competitiveness. Established in 2004, the FOA consists of 25+ device companies with over 120 semiconductor manufacturing facilities and 65+ suppliers to the industry. With a network of global offices, the FOA connects fab managers and accelerates manufacturing excellence at semiconductor fabs around the world.
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FOA
8:00 am - 11:30 am
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Add to Calendar2021-06-22 08:00:002021-06-24 11:30:00Fab Owners Alliance 2021 Q2 Meeting United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Non-Member Price for Government, Military, and Academia: $199
Contact Michelle Fabiano at [email protected] for discount code. Must have a valid .gov, .mil or .edu or email address
Non-Member Price for Students: $199
Contact Michelle Fabiano at [email protected] for discount code. Must have a valid student identification card.
Bridging the Gap Between Engineering and the Life Sciences
OVERVIEW
The Symposium brought together experts to share their work and identify gaps to accelerating the development of technologies and optimize health outcomes. Topics covered included using AI in diagnostics and decision-making using AI; data fusion for real time diagnosis; and the impact of these technologies on rural and decentralized healthcare.
Layered on top was the topic of performance augmentation by reading biochemical markers, digital genomics, using new and proposed bio-sensors and wearables. We heard about tools and technologies available to assess physiological markers that are correlated to health and wellness such as stress, fatigue, chronic disease and cognition.
The forum focused on bringing together the players across the growing range of industries that are advancing human monitoring applications to:
share pre-competitive ideas that may be applied to product development
assess roadblocks in bringing human monitoring products to market
form partnerships that have become key in overcoming obstacles to successful manufacturing and product development
Symposium Planning Committee
Michael Brothers, PhD, UES
Dr. Andreas Caduff, Digital Medicine Society
Dr. Paul Chao, National Chiao Tung University
Caroline Desvergne, PhD, CEA-Leti
Doyle Edwards, Brewer Science
Dr. Johnsee Lee, Personal Genomics
Dr. Yi-Shao Liu, Helios Bioelectronics Inc.
Regina Shia, US Air Force Research Laboratory
Suren Uswatta, 1st Lt , US Air Force Research Laboratory
Natalie Wisniewski, PhD, Profusa, Inc.
Dr. Tsung-Lung Yang, Quality Improvement Center, Kaohsiung Veterans General Hospital
Background on SEMI NBMC
The Nano-Bio Materials Consortium (NBMC) was founded to bring together scientists, engineers and business development professionals from industry, government and universities to collaboratively initiate research and development of electronic technologies to improve human performance health monitoring, diagnostics and performance augmentation. The goal is to proactively build an ecosystem that can drive healthcare and medical electronics innovation towards products that serve society faster. These innovations are laying the groundwork for new products in in digital health and personalized medicine enabling overall health protection.
MODERATOR:
- Dr. Yi-Shao Liu, Helios Bioelectronics Inc.
PANELISTS:
- Dr. Paul Chao, National Chiao Tung University
Central Europe Time (CET)
MODERATOR:
- Dr. Yi-Shao Liu, Helios Bioelectronics Inc.
PANELISTS:
- Ben Carter, B-Secur
- Paru Deshpande, PhD, IMEC
- Dr. Golo von Basum, von basum consulting
- Dr. Paul Chao, National Chiao Tung University
Pacific Daylight Time (PDT)
MODERATOR:
- Dr. Yi-Shao Liu, Helios Bioelectronics Inc.
PANELISTS:
- Justin Reggi, HumanFirst
- Sheng Xu, UCSD
- Adrian Condon, B-Secur
- Matthew Dalton, Air Force Research Laboratory, Materials and Manufacturing Directorate
- Azar Alizadeh, GE Research
12:35 pm
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12:40 pm
Break for Moving to Breakout Rooms
12:40 pm
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1:00 pm
Breakout Rooms for Smaller Discussion
THURSDAY, JULY 29, 2021 (CST, CET, PDT) - SESSION 2: DECENTRALIZED DNA SEQUENCING & MOLECULAR DIAGNOSTICS
10:00 am
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10:05 am
MODERATOR
Dr. Yi-Shao Liu
Chief Operating Officer
Helios Bioelectronics, Inc.
Welcome
MODERATOR
Dr. Yi-Shao Liu
Chief Operating Officer, Helios Bioelectronics, Inc.
MODERATOR:
- Yu-Chuan Li, Taipei Medical Universtiy
PANELISTS:
- Paul Chua, Becton Dickinson
Central Europe Time (CET)
MODERATOR:
- Michael Brothers, UES, Inc.
PANELISTS:
- Angelos Echiadis, GlaxoSmithKline Pharmaceuticals Ltd
- Andrew Carmody, The Health Data Exchange
- Philipp Tholen, Zühlke Group
Pacific Daylight Time (PDT)
MODERATOR:
- Dr. Andreas Caduff, Digital Medicine Society
PANELISTS:
- Steve Steinhubl, PhysIQ
- Bobby Reddy, Jr., Prenosis
- Matteo Lai, Empatica
- Joseph Jarvis, Airman Biosciences Division (RHB), 711th Human Performance, Air Force Research Laboratory
12:35 pm
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12:40 pm
Breakout Room Instructions
12:40 pm
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1:00 pm
Breakout Rooms & Networking
THURSDAY, AUGUST 5, 2021 (CST, CET, PDT) - SESSION 4: APPLICATIONS IN RURAL & DECENTRALIZED HEALTHCARE IN THE DIGITAL AGE
10:00 am
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10:05 am
Welcome
MODERATOR (Chungyuan Standard Time (CST))
Stephen Lee
Director for Early Innovation Partnering for North Asia, Johnson & Johnson Innovation
MODERATOR (Central Europe Time (CET))
Jerome Mouly
Team Lead Analyst, Sensing & Actuating, Yole Développement
MODERATOR (Pacific Daylight Time (PDT))
Regina Shia
Research Psychologist, Air Force Research Laboratory
Associate Dean for Rural Health, MU School of Medicine & Senior Program Director for Health and Safety, MU Extension and Engagement
University of Missorui
Using Health Care Workforce, Community, and Health Indicators to Inform Policy, Education Methods, and Programming for Rural Providers Through Technology to Improve Health Outcomes in Missouri
- Tracy Greever-Rice, Director, MC Center for Health Policy
- E. Rachel Mutrux, Sr. Program Director, Missouri Telehealth Network & Show-Me ECHO
- Dena Higbee, Director, Russell D. and Mary B. Shelden Clinical Simulation Centers at the University of Missouri School of Medicine, and the Essig Simulation Center, Sinclair School of nursing
11:35 am
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12:05 pm
Jean-Charles DRON
e-Meuse santé COO
Département de la Meuse
E-Meuse santé, a Large-scale Transformation Project, Rooted in Territories, to Address Major Health Issues of the Population, Thanks to Digital, Organizational and Economic Innovations
The Global Smart MedTech Symposium was produced July 28-29, Aug 4-5, 2021, for a global audience with a wide range in international experts and panelists. Overall focused on bridging the gap between engineering and life sciences.
Each day had a different technical focus, enabling shared roadmaps and direction:
July 28 - Realtime Continuous Diagnostics & Monitoring
July 29 - Decentralized DNA Sequencing & Molecular Diagnostics
August 4 - Data Science & Infrastructure - AI/Data Fusion
August 5 - Applications in Rural & Decentralized Healthcare in the Digital Age
Presentations from subject matter experts and the subsequent panel discussions are available for each of three regions: Asia, Europe and North America.
2021 Global Smart MedTech Symposium
Bridging the Gap Between Engineering and the Life Sciences
Innovation for a Transforming World—Now On-Demand Through August 14, 2021
The transformation of our industry never ceases. As the data storm builds, the drivers for digital disruption are coming together at the first global conference for Innovation for a Transforming World.
Accelerated by the response to the global pandemic, the innovations enabled by the semiconductor ecosystem continue to evolve at breakneck speed. The crises of the past year emerged as a powerful force that hastened the merging of the physical and digital worlds. This brought dramatic changes to our ways of life.
At the tip of this rapidly building iceberg of challenges and opportunities, every business is weighing the most favorable blend of preservation and innovation. The Innovation for a Transforming World virtual event will explore the optimal balance of resources for both preserving current expertise and customers, while seeing where to innovate to engage the next technology demands and fortunes.
It is a fusion of strategy and successful tactics. It begins with design, materials, workforce, advanced manufacturing, and now, it adds utilization of unprecedented volumes of data, via the Cloud and AI. Not only will we forecast equipment, fab, packaging and semiconductor market demand, but also trends for emerging markets and design.
Offering insights for the digital next steps, the collaborative value of SEMI’s members provides the foundation that has helped to deliver the most productive half century in history. This platform and its tremendous collective assets will serve to power the global economy for the next 50 years.
Going forward, the space between the physical and digital will shrink even further, enabling us to do things we’ve never done before. Unheard-of innovations will materialize with greater frequency and immeasurable impact. Sharing best practices that can be applied today is critical to transformations.
PRESENTATION TOPICS
Day 1—Digital Transformation
How will your business thrive through disruption, providing resiliency, vision, and culture?
Does your organization have a 360* view of customer needs and digital touch points?
What are the next business models?
How has the process for innovation changed in a more decentralized world?
Day 2—Market Symposium: Market Outlook, Technology Trends, Market Indicators and Drivers
Explore how to garner a competitive edge in times of crisis.
Gain new strategies for customer engagement.
Build business resilience during disruption.
Access mid-year market outlook, technology trends, market indicators, and drivers to help guide business decisions.
Hear expert insights from Altimeter | Bank of America, Merrill Lynch | Cornami | Dell Technologies | Deloitte | SEMI | TechSearch International and more.
United States
8:00 am
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8:10 am
Ajit Manocha
CEO and President
SEMI
Welcome & SEMI Survey Results
8:10 am
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8:20 am
Heidi M. Hoffman
Senior Director, Corporate Marketing
SEMI
SEMI Member Survey on COVID Response & Impact
8:20 am
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8:40 am
Sven Smit
Chairman & Director
McKinsey Global Institute
Leading Toward and Beyond the COVID Exit
8:40 am
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9:05 am
Jennie Raubacher
Global Head of Semiconductor, Clean Tech & Auto Tech Investment Banking
The demand for microelectronics surged this past year as the COVID-19 pandemic accelerated a digital transformation of the way many of us work and live.
Join your C-suite colleagues in a webinar, hosted by Ajit Manocha, President & CEO of SEMI, for an analysis of the emerging business landscape and what post-pandemic operations and opportunities will look like. Featured speakers from McKinsey & Co. and Wells Fargo Securities will share their insights on the impact of the surge and the economic policies being enacted to strengthen the worldwide economy.
This webinar is a timely forum to better gauge future demand and ongoing challenges – and how to adapt your business accordingly.
CEO Webinar Series: Surging Chip Demand, Digital Transformation, and the Pandemic – What’s Next?
8:00 am - 9:30 am
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America/Los_Angeles
Strengths & weaknesses of printed conductor and filler types
Understanding the performance criteria of conductive inks
Resistance measurement, sheet resistance vs volume resistivity, unit conversion, measuring film thickness and surface roughness
Understanding the microstructure of low temperature printable conductors
Percolation conductors: silver filled Polymer Thick Film (PTF) inks and isotropic ECAs
Sinterable conductors: nanoparticle, metalorganic/particle hybrids, and copper inks
Semi-sinterable conductors
Test methods for mechanical and environmental reliability
Overview of how printing methods work
Methods with a master: Screen, flexo, gravure, gravure offset
'Digital' or direct write methods for 2D & 3D: jet based, microdispense,
Conventional, non-equilibrium photonic, chemical, and mechanical methods for curing
Understand the resolution and sheet resistance limits to AM of circuits
Calculating the tradeoffs to selecting the appropriate conductor for achieving a specific sheet resistance
Transparent printable conductors and films
About the Instructor
Mike Mastropietro has spent his entire 20+ year career working with printable electronically functional materials and additive manufacturing methods for FHE devices including: formulation, conventional printing, direct write printing, equilibrium and non-equilibrium curing methods, and application development. Prior to joining ACI, he spent two years at NextFlex managing their printing/direct write programs, and overseeing material selection and integration into devices.
At 27, he cofounded a nanoparticle ink company, PChem Associates, whose unique low temperature sintering ink technology was acquired a decade later by NovaCentrix. He started his career at Parelec Inc., pioneers of hybrid particle-metalorganic decomposition (MOD) based inks. He has received an IPC Distinguished Committee Service award for his contributions PE/FHE standards and is a Nextflex fellow. Mike holds a M.S degree in chemical engineering from The Pennsylvania State University where his research on synthesis of surfactant stabilized nanoparticles was awarded a 2000 Materials Research Institute Xerox Research Award.
This FHE Master Class covers all the basics of using printable conductors for additive manufacture of circuits on polymer substrates. Attendees will learn about the different types classes of conductive inks available, and how to characterize their performance and cost. Students will also procure an overview of traditional and digital printing methods, drying/curing/sintering methods, and design and assembly differences compared to traditional ‘printed’ circuit boards.
This class is offered OnDemand.
Printing, Curing and Characterization Methods for Printable Conductors
Flexible Electronics Master Class
Originally recorded - September 8, 2021
10:00 am - 12:00 pm
Off
Add to Calendar2021-09-08 10:00:002021-09-08 12:00:00FlexTech Master Class #8 MaterialsThis FHE Master Class covers all the basics of using printable conductors for additive manufacture of circuits on polymer substrates. Attendees will learn about the different types classes of conductive inks available, and how to characterize their performance and cost. Students will also procure an overview of traditional and digital printing methods, drying/curing/sintering methods, and design and assembly differences compared to traditional ‘printed’ circuit boards.
This class is offered OnDemand. United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
In the last few years, electronics packaging has rightfully emerged from the shadows of CMOS scaling to make a significant impact in high performance and mobile appliance computing.
In this course, we reviewed the key developments in this paradigm change and the implications these have on Flexible Hybrid Electronics especially the use of bare dielets, fine pitch interconnects and novel substrate materials.
The area of Flexible Hybrid Electronics (FHE) has also developed and is making a significant impact in the area of medical and wellness electronics. The first generation of these devices have, for most part, adapted Printed Circuit Board (PCB) technology by using thinner PCBs and assembling either thinned or thin packaged “older” generation of chips on to these platforms, typically with coarse printed wiring to connect a small number of such chips.
This approach, while immensely useful to get the field going, needs to adapt and borrow from the both silicon and advanced packaging technology trends, so that we can advance this trend to the next level. The key paradigm challenges ahead are: scaling FHE in general – this includes the adoption of dielet (chiplet) technology in more advanced CMOS nodes including edge-AI, higher performance interconnects, flexible high-density energy storage, wireless communication and advanced ergonomics and all of these at lower cost and higher reliability.
This talk addresses the challenges and outline a possible technology roadmap to achieve these goals in the next few years.
Featured Speaker Biography: Subramanian S. Iyer (Subu) is Distinguished Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Department and a joint appointment in the Materials Science and Engineering Department at the University of California at Los Angeles. He is Director of the Center for Heterogeneous Integration and Performance Scaling (CHIPS). Prior to that he was an IBM Fellow. His key technical contributions have been the development of the world’s first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm technology node used to make the first generation of truly low power portable devices as well as the first commercial interposer and 3D integrated products. He also was among the first to commercialize bonded SOI for CMOS applications through a start-up called SiBond LLC.
More recently, he has been exploring new packaging paradigms and device innovations that they may enable wafer-scale architectures, in-memory analog compute and medical engineering applications. He has published over 300 papers and holds over 75 patents. He has received several outstanding technical achievements and corporate awards at IBM. He is an IEEE Fellow, an APS Fellow, an iMAPS Fellow and a Distinguished Lecturer of the IEEE EDS and EPS and a member of the Board of Governors of IEEE EPS. He is also a Fellow of the National Academy of Inventors. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for emerging technologies in 2012 and the 2020 iMAPS Daniel C. Hughes Jr Memorial award.
View this Master Class On Demand! Learn why and how new packaging paradigms like chiplets and dielets are impacting the world of flexible hybrid electronics (FHE) from one of the industry's foremost experts, Dr. Subramanian Iyer of UCLA. The course explores how these packages are packing such a punch and enabling advanced performance in a much smaller and flexible footprint.
Flexible Hybrid Electronics 2.0 based on Fan-out Wafer Packaging
