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Executive

Registration for this webinar is free, but required.

United States Register & Watch PNT2 800x800 tile Business Executive Technical Featured Speakers
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This webinar unveiled the details of the 5-year $5M per year ($25M total) Positioning, Navigation, and Timing Phase 2 (PNT2) funded R&D Program starting in 2022.  The formal Request for Proposals (RFP) is expected on June 6, 2022.

The PNT2 program follows a successful Phase 1 program that saw 10 projects funded over 2 years starting in 2020 ($6M total funding).

Watch to learn how you can respond to the PNT2 RFP.  Topics covered:

  • technical thrust area
  • cost share requirements
  • proposal instructions
  • team requirements
  • Q&A

About the Speaker

Dr. Paul Carey joined SEMI in April 2021 and is responsible for managing the MSIG PNT program, the MSIG webinars, and supporting the Manufacturing, Device and Reliability Workgroups and all MSIG related conferences and events. Before joining SEMI, he worked at X-Ray imaging backplane supplier and FOA member, dpiX, in various positions starting in 2003.  He was the process, equipment, and yield manager in their Gen 2.5 Palo Alto glass Fab until 2012 when dpiX moved its production to a new Gen 4.5 Fab in Colorado Springs.  He rejoined dpiX in 2014 and worked on the flexible substrate equipment selection team and later became their first business development manager in 2018 when dpiX announced its Foundry Business.

Earlier positions were held at Applied Materials where he helped develop a laser annealing system for semiconductor shallow junctions and silicides, and start-up company FlexICs, where he was a co-founder and VP of Engineering.  FlexICs developed low temperature thin film transistor (TFT) fabrication technology relevant to flexible OLED displays now used in cellphones.  Prior to founding FlexICs, he worked as a staff scientist and program leader at Lawrence Livermore National Laboratory where his group initially developed the low temperature polysilicon-on-plastic TFT technology.

Dr. Carey received a double major BS from UC Berkeley in Electrical Engineering and Computer Science (EECS) and Materials Science and Engineering (MSE).  He received his MS in EECS from UC Berkeley and Ph.D. in MSE from Stanford University.

Virtual, Online
United States

Paul Carey, SEMI
Paul Carey
Director
SEMI MSIG
MSIG

Watch this webinar to learn more about this opportunity to propose for R&D Funding to advance the state-of-the-art in positioning, navigation and timing (PNT) technology.  

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

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Abstract/Description

Current electromechanical design practice is predicated on the exercise of expert-level judgement through an interactive and iterative design and fabrication process that requires skilled humans at every step. This approach doesn't scale because it is labor intensive, and therefore biases robots toward longer-lasting, more general-purpose (and expensive) designs in order to justify the development and fabrication costs. Though appropriate in some cases, not all applications are well-served by this process. Many robot applications might be better-served by rapidly-built special-purpose or single-use machines, but automated design and fabrication tools will be critical to control costs, accelerate development, and be responsive to application needs.

The overall goal is to make electromechanical systems (robots) so easy to design and fabricate that we could enable people who are application experts (but not necessarily robot design or fabrication experts) to rapidly create robots for their specific needs. Although Roboticists claim that robots are for dull, dirty, and dangerous use-cases, the community predominantly uses them for the first case, because robots are currently expensive and slow to build, which makes them precious. If we change this situation by making robots practically disposable/expendable, we could potentially re-imagine many robot use-cases.

With this future in mind, new design tools to convert high-level requirements specified by non-experts into concrete electromechanical design plans, new materials that leverage multi-material additive manufacturing, and new multi-material 3D printing methods to automatically convert these designs into functional robots are being developed. During this course we will describe these various areas of current study as well as possible applications for 3D printed robotics.

About the Instructors

Dr. Robert MacCurdy is an assistant professor in Mechanical Engineering at the University of Colorado Boulder where he leads the Matter Assembly Computation Lab (MACLab). He is developing new algorithms, materials, and fabrication tools to automatically design and manufacture electromechanical systems, with a focus on robotics. Rob did his PhD work with Hod Lipson at Cornell University and his postdoctoral work at MIT with Daniela Rus. He holds a B.A. in Physics from Ithaca College, a B.S. in Electrical Engineering from Cornell University, and an M.S. and PhD in Mechanical Engineering from Cornell University.

Dr Gregory Whiting is an Associate Professor in the Department of Mechanical Engineering and a member of the Materials Science and Engineering Program at the University of Colorado Boulder (CU).  At CU he leads the Boulder Experimental Electronics and Manufacturing (BEEM) Laboratory, which is focused on studying and developing materials, processes and devices for novel and additively manufactured electronic systems used in applications including distributed sensing (particularly for environmental monitoring) and robotics. Prior to joining CU in 2017, Greg was a member of the Rapid Evaluation Team at Google[X] and managed the Novel Electronics Area at the Palo Alto Research Center. He received a PhD from Cambridge University in 2007 and a BS from UC Berkeley in 2002.

United States

Dr. Robert MacCurdy
Dr. Robert MacCurdy
Asst. Professor of Mechanical Engineering
University of Colorado, Boulder
Greg Whiting
Greg Whiting, PhD.
Assoc. Professor
University of Colorado, Boulder
FlexTech

Fabricating robots using additive design and manufacturing methods has the potential to transform when, where and how the advantages of robots are brought to bear.  

Take this FlexTech Master Class to explore the potential applications and how to use new design tools, 3D printing methods and multi-material additive manufacturing to convert ideas into solid electromechanical robotic systems.

Led by Dr. Robert MacCurdy and Prof. Greg Whiting of the University of Colorado, Boulder, this course will provide you new ways to approach manufacturing, additive design and the role of robots.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
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SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

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Printed, flexible and hybrid electronics (PFHE) enable emerging applications in IoT, medical sensing, smart packaging and labels, structural monitoring, human wellness and performance, monitors, extreme environment, and display applications. At the same time, PFHE approaches can also provide faster product development, prototyping, and manufacturing cycles for single, custom items to large areas, low-cost mass manufacturing scales in additive, more sustainable pathways for electronics as they become even more ubiquitous in our world.

This class covers the basics of PFHE processing technologies, from dispensing and inkjet printing to roll to roll printing and coating, along with the materials and supplementary thermal processes that enable these processes.

Next-generation technologies are also explored for high-resolution PFHE and additive manufacturing that could provide new form factors and manufacturing approaches and exceed the performance of conventionally-processed electronics.  These technologies also have impact on unmet heterogeneous integration possibilities in fields ranging from electronics to optics and quantum materials.

Example PFHE and printed energy materials topics:

  • Dispensing and 3D printing of electronic and energy materials
  • Aerosol printing
  • High resolution inkjet printing and coating
  • Screen Printing
  • Flexographic Printing
  • Gravure printing
  • Slot die coating
  • Convective, IR and photonic thermal processing
  • Microcontact printing and embossing
  • Submicron electrohydrodynamic printing

About the Instructor

Devin MacKenzie

J. Devin MacKenzie is the Washington Research Foundation Professor of Clean Energy and an Associate Professor of Materials Science and Engineering and Mechanical Engineering at UW.  Dr. MacKenzie is also the director of the Washington Clean Energy Testbeds, an open access laboratory with world-class printed electronics, flexible electronics and energy device fabrication and testing capabilities. 

Dr. MacKenzie has 20 years of experience co-founding or leading startups in novel fabrication including as a co-founder and CEO of Imprint Energy commercializing printed  flexible batteries, as CTO of Add-Vision, a printed flexible OLED display company that was acquired in 2011, and as a VP at Kovio, an MIT spin out, leading printed Si RF device integration.  Devin also co-founded the world’s first printed electronics company, Plastic Logic Ltd. in the United Kingdom.  Previously Dr. MacKenzie was a researcher at AT&T Bell Laboratories.

Prior to entering the start-up world, Devin was a postdoc in Physics at the University of Cambridge and earned PhD, MS, and BS degrees from the University of Florida and MIT. Dr. MacKenzie has over 220 patents and publications and has been cited over 10,000 times.

This is the 11th Flexible Electronics Master Class. This and previous classes are available On Demand.  See the full list.

United States

FlexTech

The field of printed, flexible and hybrid electronics (PFHE) and energy devices provides pathways to new products and form factors for ultralight, thin, flexible and large-area electronics, sensors, processing, I/O, photonics, and power.  Indeed, flexible electronics is quietly transforming packages and enabling radical changes in electronics from the inside out.

In this Flexible Electronics Experts Class (recorded on June 22, 2022) you will learn the basics and the next generation improvements in processing technologies, from dispensing and inkjet printing to roll-to-roll printing and coating.  The instructor also addressed the latest materials and updates on supplementary thermal processing needs.

This course is appropriate for newcomers to the field, as well as those looking to rapidly gain information on the latest materials and equipment advancements.

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Registration Details

Attending this webinar is Free.

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Sponsored by

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Featured Speakers

About the Speaker

Dr. Chris Huang ASEDr. Chris Huang currently serves as Deputy Project Manager for MEMS & Photonics Engineering at ASE. In his current role, he is focused on MEMS and optical sensor packaging in automotive applications, as well as smart sensor and smart system technologies for emerging applications. Since joining ASE over four years ago, he has gained significant experience in the fields of sensor and actuator design, MEMS device and wafer manufacturing, and sensor packaging, including extensive work in the field of microfabrication of piezoresistive MEMS sensors and wafer bonding process.

Prior to ASE, he worked as an R&D Technologist at Asia Pacific Microsystems Inc., a pure-play MEMS foundry, where he managed the development of standard fabrication platforms for customizable sensors, such as MEMS optical actuators/piezoresistive pressure and force sensors. Dr. Huang has published over thirty-five technical SCI journal papers and international conference papers and holds eight worldwide patents on MEMS and sensor applications. Dr. Huang received his Ph.D. from National Tsing Hua University, Taiwan, where he also completed work as a post-doctoral researcher within the Department of Power Mechanical Engineering

United States

MSIG

The incredible power of MEMS technology and sensor applications has been elevated onto the world stage in recent times, given how they help enable technology and applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, and from 5G to beyond. 

During this SEMI MSIG webinar, ASE’s Dr. Chris Huang will elaborate and put a spotlight on the role that packaging technologies play and the innovation evolving to progress miniaturization and integration, both key attributes within the MEMS and Sensors arena.

He will present unique approaches required to overcome MEMS and Sensor packaging and test challenges and achieve highest possible performance when responding and interacting with any external or environmental stimuli.

Q&A will follow.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
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Registration

This meeting is open for FOA Members Only. It is free to attend, but registration is required.

If you are interested in becoming a member, please contact us at [email protected].

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Hotel Information

Suggested Hotels:

Residence Inn Minneapolis - 2.2 miles (7 min) from Honeywell

2750 Annapolis Cir N 

Plymouth, MN 55441 

(763) 577-1600

 

Hampton Inn & Suites Minneapolis - 2.3 miles (8 min) from Honeywell

10600 Wayzata Boulevard 

Minnetonka, MN 55305 

(952) 955-8855 

 

Courtyard Minneapolis West - 2.4 miles (9 min) from Honeywell

9980 Wayzata Blvd 

Saint Louis Park, MN 55426 

(952) 769-8997 

 

DoubleTree by Hilton Hotel Minneapolis - 5.2 miles (11 min) from Honeywell

1500 Park Place Blvd 

Minneapolis, MN 55416 

(952) 542-8600 

If you have any questions on booking your stay, please call the hotel.  Hotels are within ~5 miles or 10 min drive from Honeywell.

 

The closest airport is Minneapolis-St. Paul International Airport - MSP Airport

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About us - Honeywell helps organizations solve the world's most complex challenges in automation, the future of aviation and energy transition. As a trusted partner, we provide actionable solutions and innovation through our Aerospace Technologies, Building Automation, Energy and Sustainability Solutions, and Industrial Automation business segments – powered by our Honeywell Forge software – that help make the world smarter, safer and more sustainable.

Honeywell
12001 Highway 55
Plymouth, MN 55441
United States

Day 1 - Wednesday, April 30th, 2025: Golf Event & Welcome Reception

11:00 am - 5:30 pm

FOA Golf Event - Rush Creek Golf Club

Address:
Rush Creek Golf Club
7801 County Road 101
Maple Grove, MN 55311

6:00 pm - 9:00 pm

Welcome Reception - Rush Creek Golf Club

Address:
Rush Creek Golf Club
7801 County Road 101
Maple Grove, MN 55311

Day 2 - Thursday, May 1st, 2025: Membership Meetings

8:00 am - 11:30 am

Device Maker Morning Meeting

Honeywell

11:30 am - 1:00 pm

Lunch

All FOA members: Honeywell

SEEQ
1:00 pm - 5:50 pm

General Meeting

All FOA members: Honeywell
General Session to include: (Welcome remarks, charitable contribution, guest speakers, case studies and an overview of the facility)

3:35 pm - 5:05 pm

DM Fab Tour & SP Window Tour

Fab Tour will be a longer tour than the window tour

5:05 pm - 5:50 pm

DM Feedback Discussion

6:15 pm - 9:00 pm

Evening Social - WhirlyBall

Address:
WhirlyBall - Maple Grove
13644 80th Circle North
Maple Grove, MN 55369

INFICON
- FOA

The FOA Q2 Membership Meeting will occur at Honeywell in Plymouth, MN.  Plan now to attend and experience this impressive facility.

Please plan to join us for golf and networking on Day 1 and a full day of meetings on Day 2.   See below for the agenda.

Additional meeting details will be posted here as soon as they are confirmed.  FOA is a member-only event.  For questions on membership or anything FOA-related contact us at [email protected].

Sponsorships - Contact Karim Somani at [email protected]

8:00 am - 10:00 pm Off Add to Calendar 2025-04-30 08:00:00 2025-05-01 22:00:00 FOA Q2 Fab Meeting The FOA Q2 Membership Meeting will occur at Honeywell in Plymouth, MN.  Plan now to attend and experience this impressive facility.Please plan to join us for golf and networking on Day 1 and a full day of meetings on Day 2.   See below for the agenda.Additional meeting details will be posted here as soon as they are confirmed.  FOA is a member-only event.  For questions on membership or anything FOA-related contact us at [email protected] - Contact Karim Somani at [email protected] Honeywell 12001 Highway 55 Plymouth, MN 55441 United States SEMI.org [email protected] America/Los_Angeles public
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REGISTRATION

PRICING

  • Member: FREE
  • Non-Member: $49

Paul Cohen
1.978.769.2106 
[email protected]

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United States Register Now SEMI | ESDA logos Business Executive

The evening begins at the Keysight office, Thursday, April 28, at 5:00pm with the ESD Alliance Annual Membership Meeting. You'll get an overview of the past year's activities and discover what's in store for 2022. The meeting flows directly into a Welcome Reception followed by the powerful CEO Outlook.

Enjoy a lively, nourishing networking reception that kicks off the CEO Outlook panel. Hear influential executives from Arm CadenceD2S | Keysight | Siemens share their insights on the current and future state of the design and semiconductor industries. Ed Sperling, Editor-in-Chief of Semiconductor Engineering, moderates a spirited, robust discussion, including an audience Q&A.

Registration | FREE for ESD Alliance and SEMI members | Non-member: $49 per person. 

Keysight
5301 Stevens Creek Blvd.
Building 5
Santa Clara, CA 95051
United States

5:00 pm - 5:30 pm
Bob Smith
Executive Director
ESD Alliance

ESD Alliance Annual Membership Meeting

Overview of ESD Alliance activities for 2021 and plans for 2022.

5:30 pm - 6:30 pm

Networking

Enjoy light food and refreshments as you network with your peers.

6:30 pm - 7:30 pm
Ed Spurling, Semiconductor Engineering
Ed Sperling | Moderator
Editor in Chief
Semiconductor Engineering

Moderator & Panelists

Hear panelists from ARM | CADENCE | D2S | Keysight | Siemens EDA discuss the state of the electronic system design industry as well as their views of the outlook for the coming years.

• Simon Segars | Advisor | Arm
• Anirudh Devgan | President & CEO | Cadence
• Aki Fujimura | Chairman & CEO | D2S
• Niels Faché | Vice President & General Manager | Keysight
• Joseph Sawicki | Executive Vice President | Siemens EDA

ESD Alliance

ESD Alliance and co-sponsor Keysight welcome you to join us in-person for the Annual ESDA Membership Meeting & CEO Outlook at the Keysight office in Santa Clara, CA.

5:00 pm - 7:30 pm Off Add to Calendar 2022-04-28 17:00:00 2022-04-28 19:30:00 ESDA CEO Outlook & Membership Meeting ESD Alliance and co-sponsor Keysight welcome you to join us in-person for the Annual ESDA Membership Meeting & CEO Outlook at the Keysight office in Santa Clara, CA. Keysight 5301 Stevens Creek Blvd. Building 5 Santa Clara, CA 95051 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Registration

This meeting is open for FOA Members Only. 

If you are interested in becoming a member, please contact Karim Somani - [email protected].

 

United States Austin Marriott South Business Executive Expositions Technical

Hotel Information and Airport Information

Austin Marriott South

4415 South IH-35

Austin, Texas, 78744

Austin Marriott South for 219.00 USD per night - Last Day to Book: Monday, February 02, 2026

Booking link: Book your group rate for FOA Q1 Collaborative Forum

Austin-Bergstrom International Airport
3600 Presidential Blvd
Austin, TX 78719

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Austin Marriott South
4415 South IH-35
Austin, TX 78744
United States

10:30 am - 5:00 pm

FOA Golf Event (Tee Time Start) - Onion Creek Club

Onion Creek Club

2510 Onion Creek Parkway

Austin, TX 78747

5:00 pm - 9:00 pm

Women of FOA - Evening Dinner & Social Activity

Meeting room: Sycamore A&B

Day 1 -February 25, 2026 (times are subject to change)

8:00 am - 12:00 pm

Device Maker Morning Meeting - IDM's Only

Meeting room: Lone Star Ballroom

8:00 am - 8:30 am

Registration check-in & Gathering

8:30 am - 8:40 am
Karim Somani
SEMI

Meeting Start - Introductions, Agenda Review, Sponsor Recognition, Next Meetings

8:40 am - 9:40 am
Mark da Silva
SEMI

Open Forum Topics #1

9:40 am - 9:50 am
Rick Glasmann
MAX

Welcome Reception sponsor presentation - MAX

9:50 am - 10:30 am

Coffee Break

10:30 am - 10:40 am

Social Event sponsor presentation - INFICON

10:40 am
Mark da Silva
SEMI

Open Forum Topics #2

11:40 am - 11:50 am
Sean Tropsa
SEEQ

DM Lunch sponsor presentation - SEEQ

11:50 am - 1:00 pm

DM Lunch - IDM's Only

Lunch will be in rooms: Sycamore A&B and Bluebonnet

SEEQ

Continuation Day 1 - February 25, 2026 (times are subject to change)

12:00 pm - 6:00 pm

Exhibit Opens

Exhibits will be displayed in the foyer

1:00 pm - 6:00 pm

Session 1 - General Meeting for all FOA Members

Meeting Room: Lone Star Ballroom

1:00 pm - 1:10 pm
Mark da Silva

Welcome remarks & Updates

Removing Manufacturing Bottlenecks (Case Studies)

1:10 pm - 1:35 pm
GlobalFoundries & Semilab

Next-Generation In-Line AFM Metrology for Silicon and GaN Applications

1:35 pm - 2:00 pm
Northrop Grumman & Applied Materials

Reduction of Through-Silicon Via (TSV) Sidewall Roughness through Process Optimization in Bosch Dry Etch Process: A Collaborative Study

2:00 pm - 2:30 pm
Tosca Derrick
Baker Tilly

Industry – Tariff Updates

2:30 pm - 2:55 pm
Broadcom & Fabworx Solutions

Particles vs. Productivity: Root-Cause Solutions that Unlocked Tool Performance

2:55 pm - 3:25 pm

Coffee Break #1 – Sponsored by JST

JST

Improving Fab Efficiency (Case Study)

3:25 pm - 3:50 pm
ST Microelectronics & INFICON

From Insight to Action: Elevating Employee Efficiency with Smart Detection and Targeted Data Delivery

3:50 pm - 4:20 pm
Inna Skvortsova
Market Research Manager, SEMI’s Market Intelligence
SEMI

SEMI Market Outlook - Fab Investments, Equipment and Materials Forecast

4:20 pm - 4:50 pm
Michelle Williams-Vaden
Executive Director, SEMI Foundation
SEMI

SEMI Foundation

4:50 pm - 4:55 pm

Wrap-up & directions to Welcome Networking Reception (within the hotel)

7:00 pm - 10:00 pm

Welcome Networking Reception

Room: Sycamore A&B and Bluebonnet - Sponsored by MAX Group

MAX IEG

Day 2 - February 26 2026

8:00 am - 12:00 pm

Session 2 - General Meeting

Meeting Room: Lone Star Ballroom

8:00 am - 6:00 pm

Exhibits Open

8:00 am - 8:40 am
Karim Somani

Gathering & Welcome Remarks

Improve Long-Term Plant Viability (Case Studies)

8:40 am - 9:02 am
Qorvo & camLine

Lessons from the SPACE Deployment Project: Implementation at Qorvo Wafer Fab

9:05 am - 9:30 am
FormFactor & Olsson

Transforming a Mature Semiconductor Factory to Meet FormFactor’s Advanced Manufacturing Needs

9:30 am - 9:55 am
Polar Semiconductor & Mortenson

Polar Semiconductor Expansion and Modernization Project

9:55 am - 10:05 am
ControlSoft

Break Sponsor Presentation - ControlSoft

10:05 am - 10:35 am

Coffee Break #2 – Sponsored by ControlSoft

ControlSoft
10:35 am - 11:00 am
Analog Devices & ControlSoft

Transformation in Motion: A solution for 200mm fab AMHS upgrades

Agentic AI in Manufacturing (Case Study)

11:00 am - 11:25 am
Intel & Seeq

Intel + Seeq’s Multi-Agent Architecture to "Dim the lights" in facilities Operations

11:25 am - 11:35 am
Michelle Williams-Vaden
Executive Director, SEMI Foundation
SEMI

Thursday Lunch sponsor presentation - WFOA

11:35 am - 1:30 pm

Lunch - All Members & Speakers

Lunch will be in rooms: Sycamore A&B, Bluebonnet and Wrangler

SEMI Foundation

Continuation Day 2 - February 26, 2026

1:30 pm - 6:00 pm

Session 3 - General Meeting

Meeting room: Lone Star Ballroom

1:30 pm - 1:45 pm
Mark da Silva

SEMI Technology Community Update

Improving Fab Efficiency (Case Studies)

1:45 pm - 2:10 pm
Qorvo & Siconnex

Improved Fab Productivity

2:10 pm - 2:35 pm
FOA DM & Flexciton

Solving Fab-Level Execution Gaps with Intelligent Action Prioritization and Quantified Impact Modeling

2:35 pm - 3:05 pm
Taimur Burki
Sustainability Consultant
SEMI

Sustainability - Waste Management and how to Make $$ off of your waste

3:05 pm - 3:35 pm

Coffee Break #3

3:35 pm - 4:00 pm
Analog Devices & Seertech Solutions

Driving Fab Efficiency Through Automated Workforce Qualification and MES-Integrated OJT Enforcement

4:00 pm - 4:25 pm
M.I.T. Lincoln Laboratory & Eyelit

Enhancing Semiconductor R&D Workflow Flexibility and Traceability through Eyelit’s Manufacturing Operations Management Platform

Deployment of Digital Twins (Case Study)

4:25 pm - 4:50 pm
GlobalFoundries & D-SIMLAB Technologies

Dynamic Simulation Enabled Prescriptive Analytics for the AI-Driven Autonomous Factory of the Future

4:50 pm - 5:05 pm
Peilun Sun
Consortium Manager, SCC
SEMI

From Fab Floor to Climate Impact: How SCC Supports Manufacturing Decarbonization

5:05 pm - 5:25 pm
Karim Somani

FOA – Inside the Fab (@ Northrop Grumman Jul 28 – Jul 30) & Wrap-up

7:00 pm - 10:00 pm

FOA Annual Poker Tournament: Austin Marriott South

Poker Tournament: Sycamore A&B, Bluebonnet and Wrangler

Inficon logo

FOA Events - February 24, 2026

- FOA Workforce Development

Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits.  

This event is for FOA Members only.  To learn more about becoming an FOA member, email [email protected]Visit the FOA web pages.

8:00 am - 10:00 pm Off Add to Calendar 2026-02-24 08:00:00 2026-02-26 22:00:00 FOA Summit (Q1 Collaborative Forum) Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits.  This event is for FOA Members only.  To learn more about becoming an FOA member, email [email protected]. Visit the FOA web pages. Austin Marriott South 4415 South IH-35 Austin, TX 78744 United States SEMI.org [email protected] America/Chicago public America/Chicago
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Belgium China France Germany Ireland Italy Japan South Korea Taiwan United States Register Now https://discover.semi.org/new-gdsi-dicing-process-webinar-on-demand.html MSIG WEbinar tile Business Executive Technical Featured Speakers

About the Speaker:  Rich Boardman is a 15-year veteran of the Semiconductor industry whose expertise lies in equipment sets, process technology and consumables related to wafer or substrate dicing, grinding or polishing. Rich is a Senior Sales Engineer at GDSI, located in San Jose, California.

United States

Richard Boardman GDSI
Richard Boardman
Senior Sales Engineer
GDSI

Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication. 

In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications.

The Stealth laser dicing process is a water-free, particle-free wafer singulation method.  It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting.

Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. .

8:00 am - 9:00 am Off Add to Calendar 2022-03-30 08:00:00 2022-03-30 09:00:00 MSIG Webinar GDSI Dicing Process Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.  In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications. The Stealth laser dicing process is a water-free, particle-free wafer singulation method.  It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting. Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. . United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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GDSI logo

This webinar graciously underwritten by GDSI.  Registration is free to all attendees.

GDSI logo
Belgium China France Germany Ireland Italy Japan South Korea Taiwan United States Register Now https://discover.semi.org/designing-mems-with-ge-polaris-process-webinar-on-dem… 20220302 MSIG Webinar GE Business Executive Technical Featured Speakers

About the Speaker:  Robert MacDonald is a MEMS engineer at GE’s Research. His research is focused on high performance inertial sensors. He has over 20 years of experience in the MEMS and semiconductor industries. His work has covered the product life cycle of chemical, inertial and optical sensors from design through market introduction and manufacturing.

United States

Robert MacDonald, GE Research
Robert MacDonald
MEMS Engineer
GE Research
MSIG

Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.

In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs.

8:00 am - 9:00 am Off Add to Calendar 2022-03-02 08:00:00 2022-03-02 09:00:00 MSIG Webinar GE Polaris Process Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication. In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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United States

Scotten Jones
Scotten Jones
President
IC Knowledge
Naotao Horiguchi imec
Naoto Horiguchi
Program Director, Logic CMOS device technology
imec
Galya Stoeva
Galya Stoeva, moderator
Co-Chief Sales Officer
IceMOS Technology
EMG ESD Alliance FOA SOI Standards Workforce Development

Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET).  As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures based on Horizontal Nanosheet technology. Such a fundamental shift in transistor architecture will create new challenges to processes and materials, presenting opportunities for companies well-positioned for this shift.

In this webinar, SEMI EMG brings experts to explain the technology trends driving the industry adoption of Gate All Around, how the major players are approaching this transition, and the implications this will have on the material supply chain

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
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