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Registration is free of charge, but must be done in advance 

 

 

 

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UCLA
Los Angeles, CA
United States

1:00 pm - 3:00 pm

Phase 2 Project Introductions

- Low-SWaP-C, GPS-free PNT technology
- Novel materials, fabrication & packaging techniques and approaches
- Advancements in atomic clock and quantum sensor photonics

3:00 pm - 4:30 pm

Break Out Sessions

Thrust Area 1: Novel Materials, Fabrication, and Packaging Techniques for Low-SWaP Inertial and PNT Sensors
Thrust Area 2: Advanced Active and Passive Integrated Photonics for Low-SWaP Atomic Clocks, Quantum Systems, & PNT Sensors
Thrust Area 3: Advancements Towards Low-SWaP, GPS-Free PNT Technologies

4:30 pm - 5:00 pm

Group Reports & Wrap Up

MSIG
SEMI MSIG has another $5M in R&D funding for sensor positioning, navigation, and timing (PNT) technology development! Register now to attend our half-day Gap Analysis workshop, taking place April 30, the afternoon before our premier sensor technology-event, the MEMS & Sensors Technical Congress (MSTC). Meet US Gov’t subject matter experts (SME’s) to discuss PNT pain points and get insights into this year’s request for proposals (RFP).
 
The workshop will feature presentations from the new 2024 PNT projects and identify areas for this year’s RFP.
 
Have your voice heard, as SEMI MSIG and the Army Research Lab work to fund PNT R&D technology improvements in a 5-year (2022-2027) $25M program. This gap analysis workshop is a critical component of the program’s 2nd year activities.
1:00 pm - 5:00 pm Off Add to Calendar Disabled America/Los_Angeles

Hotel

Cambridge hotels are expensive in late May, so we have made a deal for you, click here!

We have a room block reserved at DoubleTree Suites by Hilton Hotel Boston, Cambridge for May 21, 2023 through May 25, 2023. Booking your room is simple, just select "Book a Room" to receive your group's preferred rate. Must book rooms before May 12th to obtain discounted rate.

Please book your hotel reservations online for MSTC 2023 Conference or guests can call our 24-7 reservations desk to book your room or please ask for the Front Desk and then provide the Group Code: MSTC 

Book a Room Here

*must book rooms before May 12th to obtain discount rate. 

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Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Midwest Breakfast Forum.

Contact Lin Tso, [email protected] to learn about available sponsorship opportunities.

 

Organized by the SEMI Arizona Chapter — 

Join us for the Arizona Chapter Breakfast Forum to explore the thriving innovation ecosystem in the Silicon Desert. 

Is Silicon Desert the New Innovation Hub?


With the influx of high-tech companies and substantial government funding through the CHIPS Act, Arizona has invested over $65 billion in the semiconductor sector emerging as the top destination for semiconductor jobs, investments, and ecosystem expansion in the United States.

Arizona promises to play a leading role in the future of U.S. chip manufacturing and innovation, this has led to the question, is the Silicon Desert the new technology hub?

To maximize opportunities under the CHIPS Act, Arizona has launched an unprecedented collaborative effort, bringing together stakeholders from state and local governments, industry, trade groups, economic development organizations, universities and community colleges, workforce partners, and more.

Get first-hand insight on—

  • Market Trends & Technology Drivers, Emerging Sectors, Forecast and Outlook
  • Semiconductor Growth and How It Will Impact Silicon Desert
  • University and State Infrastructure and R&D
  • Empowering a Sustainable Future in Semiconductor Manufacturing
  • Training the Workforce

These informative sessions will equip you with a comprehensive understanding of Silicon Desert's potential as an innovation powerhouse, the opportunity to network with industry leaders, and foster collaboration with like-minded professionals.

Register now and be a part of this exciting journey shaping the future of technology in the Silicon Desert.

In-Person + Virtual
EMD Electronics
8555 S River Pkwy
Tempe, AZ 85284
United States

Wednesday, May 1, 2024 | Mountain Time

7:30 am - 8:00 am

Check-In and Breakfast

EMD Electronics
8:00 am - 8:05 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:05 am - 8:10 am
Kate Dei Cas, EMD Electronics
Kate Dei Cas
Executive Vice President, Global head of Delivery Systems & Services
EMD Electronics, a business of Merck KGaA, Darmstadt, Germany

Welcome Remarks

8:10 am - 8:35 am
Kevin Gorman, EMD Electronics
Kevin Gorman
Senior Vice President & Head of Patterning Solutions
EMD Electronics, a business of Merck KGaA, Darmstadt, Germany

Keynote

8:35 am - 9:00 am
Cori Masters, GARTNER
Cori Masters
Sr. Director Research Analyst, Semiconductor/High Tech Supply Chain
Gartner
9:00 am - 9:25 am
Sean Fogarty, Greater Phoenix Economic Council
Sean Fogarty
Vice President, International Business Development
Greater Phoenix Economic Council
9:25 am - 9:45 am

Break

9:45 am - 9:55 am
Karla Moran, Arizona Public Service
Karla Moran
Manager of Economic Development
Salt River Project (SRP)
9:55 am - 10:05 am
Kelly Patton, Arizona Public Service
Kelly Patton
Economic Development Manager
Arizona Public Service (APS)
10:05 am - 10:25 am
Spencer Wall, DSV Inventory Management Solutions
Spencer Wall
Vice President, Business Development
DSV Inventory Management Solutions

Transforming Your Supply Chain From a Cost Center to a Competitive Advantage

11:30 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

Closing Remarks

SEMI Breakfast Forum Organized by SEMI Arizona Chapter

In-Person + Virtual | Mountain Time


We are sold out!

Thank you for your support. We are excited to welcome you to an outstanding event with excellent speaker lineup and attendees. 

7:30 am - 11:45 am Off Add to Calendar 2024-05-01 07:30:00 2024-05-01 11:45:00 SEMI Arizona Chapter Breakfast Forum—Is Silicon Desert the New Innovation Hub? SEMI Breakfast Forum Organized by SEMI Arizona ChapterIn-Person + Virtual | Mountain TimeWe are sold out!Thank you for your support. We are excited to welcome you to an outstanding event with excellent speaker lineup and attendees.  In-Person + Virtual EMD Electronics 8555 S River Pkwy Tempe, AZ 85284 United States SEMI.org [email protected] America/Phoenix public America/Phoenix 2

Registration

Early Bird (Before April 11, 2024):

Member: $75 | Non-member: $100

Regular:

Member: $100 | Non-member: $125

Registration is final. No refunds provided. No substitutions.

Krish Raghunath
Email: [email protected]
Phone: +1.408.943.6982

+
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Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Midwest Breakfast Forum.

Contact Lin Tso, [email protected] to learn about available sponsorship opportunities.

AI Driving Fabs of the Future...People, Technology, Infrastructure

There has never been a more exciting time in the history of semiconductor manufacturing. Following the supply chain disruption of the early 2020s, teams rushing to expand operations and add capacity are looking to maximize operating leverage amidst a challenging market backdrop. With dozens of new fully automated 300mm fabs set to open their doors in the next two years, here are the burning questions—

  • What does it mean for the existing 200mm legacy fabs? 
  • What challenges will we face in 2024?
  • How can we solve them together? 

Learn about current market trends, workforce development, equipment advancements, and AI's potential uses in manufacturing. 
Join the conversation on—

  • KEYNOTE: The 5th Industrial Revolution: The Adjacent Possible of AI in Semiconductor Manufacturing—Analog Devices
  • Macro Trends and Value Creation in the Semiconductor Industry—McKinsey & Company
  • What Does It Mean for the Existing 200mm Legacy Fabs?—Microchip Technology
  • AI Use Cases in the Fab—Applied Materials
  • SEMI Smart Manufacturing Initiative—Microchip Technology
  • EXECUTIVE PANEL: Discussion for Talent Acquisition, Workforce Development, Labor Shortage

The SEMI Pacific Northwest Breakfast Forum is a great way to network with colleagues while meeting other local industry leaders.
 

Analog Devices—ADI
14320 SW Jenkins Road
Beaverton, OR 97005
United States

Pacific Time | Thursday, April 25, 2024 | In-Person + Virtual

8:00 am - 8:30 am

Check-In and Networking Breakfast

Analog Devices Logo 170x65
8:30 am - 8:32 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:32 am - 8:35 am
Matt Kleinke, Siltronic
Matt Kleinke
Co-Chair of SEMI Pacific Northwest Chapter and Vice President Sales, Americas
Siltronic Corporation
Ian Anderson, Mortenson and PNW Chapter Co-chair
Ian Anderson
Co-Chair of SEMI Pacific Northwest Chapter and Assistant Project Manager
Mortenson

Welcome and Introduction

8:35 am - 9:00 am
Henry Marcil, McKinsey & Company
Henry Marcil
Partner
McKinsey & Company

Macro Trends, Value Creation and Geopolitics in the Semiconductor Industry

9:00 am - 9:25 am
Daniel Burlingame, PNW KEYNOTE
Daniel Burlingame
General Manager and Managing Director, Beaverton Wafer Fab
Analog Devices

KEYNOTE—The 5th Industrial Revolution: The Adjacent Possible of AI in Semiconductor Manufacturing

9:25 am - 9:50 am
David Hanny, Applied Materials
David Hanny
Senior Director
Applied Materials

AI Use Cases in the Fab

9:50 am - 10:05 am

Break

10:05 am - 10:30 am
Gary Stinson, Microchip Technology
Gary Stinson
Senior Yield Manager
Microchip Technology

Smart Manufacturing Challenges and Opportunities for a Legacy Fab

10:30 am - 11:20 am
Damian Scandiffio, Acara Solutions
Moderator
Damian Scandiffio
Director
Acara Solutions
11:20 am - 11:45 am

Tour of Analog Devices

All registered attendees are welcome to join us for a tour of the recently renovated ADI Fab.

Organizer: SEMI Pacific Northwest Chapter

IN-PERSON + VIRTUAL
8:00–11:45am Pacific Time (PT)

8:00 am - 11:45 am Off Add to Calendar 2024-04-25 08:00:00 2024-04-25 11:45:00 Pacific Northwest Chapter Breakfast Forum Organizer: SEMI Pacific Northwest ChapterIN-PERSON + VIRTUAL8:00–11:45am Pacific Time (PT) Analog Devices—ADI 14320 SW Jenkins Road Beaverton, OR 97005 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles 2

ADI Fab Tour

Analog Devices Fab Facility Tour

Cleanroom Transformation—Beaverton, OR

Join us for a tour of the recently renovated Beaverton factory which added a new cleanroom below the existing production cleanroom! Ryan Bestwick will lead the SEMI attendees through the chronology of this incredible fab transformation.

VISITOR PARKING INFORMATION

Analog Devices Fab Facility Tour

Registration

Early Bird (Before March 26, 2024):

Member: $75 | Non-member: $100

Regular:

Member: $100 | Non-member: $125

Registration is final. No refunds provided. No substitutions.

Krish Raghunath
Email: [email protected]
Phone: +1.408.943.6982

+
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Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Midwest Breakfast Forum.

Contact Lin Tso, [email protected] to learn about available sponsorship opportunities.

Join us for the Midwest Chapter Forum—

What's Going on in the Silicon Heartland? Opportunities and Growth Outlook in the Semiconductor Sector

The CHIPS Act helps the U.S. regain semiconductor manufacturing leadership. The bill also advances the nation’s strengths in the semiconductor and microelectronics arena, including the automotive sector. Join us to hear executive experts, from Ohio, Michigan, and Indiana, share how their state is helping to boost the industry with significant new manufacturing projects.

SEMI Midwest Breakfast Forum is an excellent opportunity to LEARN, NETWORK, and SHARE your business solutions and ideas—Register Today!

This new regional chapter was formed to serve SEMI Members in the Midwest region. Its goal is to support member companies to grow and prosper collectively. Future chapter forums will identify, discuss, and find solutions to current topics impacting our industry. 

In-Person—Eastern Time
The Ohio State University, Ohio Union
1739 North High Street - The Great Hall Meeting Room
Columbus, OH 43210
United States

Eastern Time | Tuesday, April 9, 2024 | In-Person

8:00 am - 8:30 am

Check-In and Breakfast

8:30 am - 8:35 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:35 am - 8:40 am
Dave Brewster, Managing Director, Jobs Ohio
Dave Brewster
SEMI Midwest Chapter Co-Chair and Managing Director
Jobs Ohio
Vidya Vijay
Vidya Vijay
SEMI Midwest Chapter Co-Chair and Senior Program Manager
Nordson Corporation

Welcome and Introductions

8:40 am - 8:45 am
Peter Mohler, The Ohio State University
Peter Mohler, PhD
Executive Vice President, Research Innovation & Knowledge
The Ohio State University

Keynote—Growing the Silicon Heartland Through Partnerships

8:45 am - 9:05 am
Steven Ringel, The Ohio State University
Steven A. Ringel, PhD
Distinguished University Professor, Associated Vice President for Research, Executive Director of the Institute for Materials and Manufacturing Research
The Ohio State University

Keynote—Building on Our Strengths, How Ohio State is Meeting the Challenge and Leading the Future

9:05 am - 9:30 am
Aaron Aboagye, McKinsey & Company
Aaron Aboagye
Managing Partner
McKinsey & Company

Trends and Opportunities in the Semiconductor Industry

9:30 am - 9:40 am

Break

9:40 am - 10:05 am
Duane Detwiler, Honda Research Institute
Duane Detwiler
Vice President
Honda Research Institute, Inc. USA

Sustainable Mobility Futures Research & Innovation

10:05 am - 10:30 am
Kevin Hoggatt, Intel
Kevin Hoggatt
Director of State Government Affairs for Ohio
Intel

The Silicon Heartland: Advancing American Semiconductor Manufacturing and Technology Leadership

10:30 am - 10:55 am
Chuck Bohac, Everspin Technologies
Chuck Bohac
Director of Strategic Business Development
Everspin Technologies

Evolution of the Stand Alone MRAM Technology and Markets

10:55 am - 11:30 am
Alissa Comella, The Ohio State University
Alissa Comella
Associate Vice President, Corporate Partnerships Enterprise for Research, Innovation, and Knowledge
The Ohio State University

Mobilizing the Semiconductor Workforce

Executive Panel Discussion with the Above Speakers

11:30 am
Dave Brewster, Managing Director, Jobs Ohio
Dave Brewster
SEMI Midwest Chapter Co-Chair, Managing Director
Jobs Ohio

Closing Remarks

SEMI Breakfast Forum Organized by SEMI Midwest Chapter

In-Person

Eastern Time

Hosted and Breakfast Forum Sponsored by The Ohio State University

8:00 am - 11:30 am Off Add to Calendar 2024-04-09 08:00:00 2024-04-09 11:30:00 Midwest Chapter Breakfast Forum—What's Going on in the Silicon Heartland? - Opportunity and Growth Outlook SEMI Breakfast Forum Organized by SEMI Midwest ChapterIn-PersonEastern TimeHosted and Breakfast Forum Sponsored by The Ohio State University In-Person—Eastern Time The Ohio State University, Ohio Union 1739 North High Street - The Great Hall Meeting Room Columbus, OH 43210 United States SEMI.org [email protected] America/New_York public America/New_York 2

WILMINGTON, Del., Jan. 22, 2024 — DuPont (NYSE: DD) today announced that Drew Chambers has been named global business director, Lithography Technologies business in DuPont Electronics & Industrial, effective Jan. 1. Chambers succeeds George Barclay, Ph.D., who has elected to retire after more than 25 years of service.

“George Barclay’s significant contributions to our lithography business and portfolio have been tremendous and we are grateful for the lasting legacy he leaves with our organization,” said Sang Ho Kang, VP & General Manager, Semiconductor Technologies, DuPont Electronics & Industrial. “A true technical expert, George is a prolific innovator and visionary leader.”

“Drew Chambers has demonstrated outstanding leadership across multiple technology segments in electronics and is a strong proponent of delivering results to meet the needs of our customers,” said Kang. “In his new role as the leader of our lithography materials portfolio, Drew will play a pivotal role in furthering our offerings for extreme ultraviolet lithography and other advanced patterning solutions.”

Chambers brings a diversity of experiences both at DuPont and elsewhere in the electronics industry. He joined DuPont in 2019 as global marketing director for chemical mechanical planarization (CMP) pads in CMP Technologies and most recently served as acting business director. Prior to DuPont, he led the Electronics & Surface Technologies segment for Ferro Corporation, led regional sales and marketing for ESL ElectroScience (now part of Ferro Corporation), and worked in new business development for Lutron Electronics. Earlier in his career, Chambers held several roles in engineering, product management and account management in the semiconductor materials segment with Rohm and Haas Electronic Materials (now part of DuPont). Chambers holds an MBA from Duke University’s Fuqua School of Business and a BS in chemical engineering from Lafayette College.

DuPont Lithography Technologies is a global leader in materials for microlithography, with offerings enabling advanced patterning at the most advanced technology nodes; and bringing quality, yield and defectivity improvements to existing lithography processes. DuPont’s portfolio includes ArF photoresists, KrF photoresists, i/g line photoresists, extreme ultraviolet (EUV) photoresists, advanced overcoats, EUV underlayers and anti-reflective coating materials. Lithography Technologies is part of Semiconductor Technologies in DuPont Electronics & Industrial.

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial, and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. http://electronics.dupont.com

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

Semiconductor equipment platform company SurplusGLOBAL has announced its participation in the SEMICON KOREA 2024 exhibition, in collaboration with its subsidiary EQ GLOBAL. The SEMICON KOREA 2024 exhibition, which commenced in 1987, stands as a prominent event for the South Korea semiconductor industry, showcasing the latest semiconductor materials, equipment, and related technologies. The event also encompasses a semiconductor technology symposium, market trend forums, and purchase consultation sessions. This year is scheduled to take place from January 31 to February 2 at COEX in Seoul, with approximately 500 companies expected to participate.

 

[Photo: SurplusGLOBAL booth at SEMICON KOREA 2024 exhibition]

 

Bruce Kim, CEO of SurplusGLOBAL, stated, "We are accelerating our global network expansion, with a presence now established in Mainland China, the United States, Japan, Taiwan(China), and Singapore. Our business is evolving beyond the focus on legacy semiconductor equipment distribution to include refurbishing, manufacturing, and parts production and distribution." He continued, "Our Global Parts Platform business, leveraging South Korea's semiconductor equipment parts infrastructure, provides repair, manufacturing, and services to global semiconductor companies. This expansion is fueled by the increasing market demand. Currently, we serve over 50 companies, supplying obsolete parts. Recently, we facilitated prompt recovery by delivering urgent parts to Japanese semiconductor fabs affected by an earthquake. Additionally, we are actively developing e-commerce through 'Global Parts Platform: Marketplace,' with plans to introduce AI-based personalized recommendation services by the end of this year."
SurplusGLOBAL will be located at booth DS30 in Hall D at SEMICON KOREA, participating as a joint exhibitor with its subsidiary EQ GLOBAL. The company plans to showcase Head Motor components used in RF generators and CMP (Chemical Mechanical Polishing) equipment, along with repair services.
In December of last year, SurplusGLOBAL was selected by the Ministry of Employment and Labor as a 'Great Workplace for Youth.'
 

 

United States Spectrochip tile Business Technical Featured Speakers

Kevin (Cheng-Hao) Ko received his Physics Ph.D. from State University of New York, Stony Brook (SUNY, Stony Brook) in 1995. During his thesis research, he worked at Beamline X1A of the National Synchrotron Light Source (NSLS) at Brookhaven National Laboratory (BNL) to construct the world's first Mult-channel Scanning Photoemission Electron Microscope (SPEM) by focusing soft X-rays using a zone plate under the supervision of Prof. Janos Kirz. After receiving his Ph.D. degree, he was invited by Taiwan Nation Synchrotron Radiation Research Center (NSRRC) to lead a team to develop X-ray Microcopy technology in Taiwan. By 1999 Ko’s team had successfully developed the world’s most advanced SPEM. After that, Dr. Ko started to devote his efforts to developing the SpectroChip technology. After nearly 20 years of research and development, Ko’s team was finally able to mass produce the SpectroChip using wafer-based methodology and founded the company SpectroChip, Inc. This technology received 9 national best innovation awards in Taiwan and one international best application award in Asia. To enable further global business development of the SpectoChip technology, in 2023, Dr. Ko and Dr. Sean Lin founded SPU System Inc.

United States

dr. ko
Dr. Kevin (Cheng-Hao) Ko
MSIG

SpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card.  It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology.  The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization.  This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.

In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology.

8:00 am - 9:00 am Off Add to Calendar 2024-02-21 08:00:00 2024-02-21 09:00:00 SpectroChip: an Optical System-on-Chip Enabling Ultra-Portable Devices for Broad Industrial Sensing Applications SpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card.  It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology.  The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization.  This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch On-demand
Event format

Lansdale, PA – Greene Tweed, a leading global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Fusion® F07, a performance-enhanced fluoroelastomer. Developed by Greene Tweed material scientists and application engineers, Fusion® F07 is specifically crafted to withstand common Etch and CVD oxygen/fluorine based gases in semiconductor processing subfab lines, at temperatures up to 355°F (180°C).

With an expected lifetime of at least 6 months, Fusion® F07 lasts longer than standard FKM in subfab vacuum system lines. As a result, the new performance enhanced FKM extends the time between planned maintenance activities. Notably, it provides a better total cost of ownership where applications do not require an FFKM compound.

“At Greene Tweed, we enable customers to operate efficiently and safely in the world’s most demanding environments. We understand that the semiconductor industry needs reliability and longevity. Fusion® F07 is a result of meticulous research and development, aimed at not only extending the life of their system but also improve operational efficiency,” says Magen Buterbaugh, President and CEO, Greene Tweed.

Fusion® F07 can be purchased as a seal assembly or as an individual O-Ring. Customers can effortlessly upgrade to Fusion® F07 and experience the benefits of extended lifetime and the resultant reduced operating costs as the seals are form-fit replaceable with other industry standard (KF/ISO flange fittings) seals. A blue outer ring allows for easier identification upon installation and replacement. Fusion® F07 seals are available in most typical sizes, including KF16, KF25, KF40, KF50, ISO63, ISO80, ISO100, ISO160, and ISO200.

About Greene Tweed
As a leading global provider of sealing solutions to the semiconductor industry for over four decades, Greene Tweed engineers advanced elastomer seals and thermoplastic components that are found in a broad range of mission-critical equipment in key process areas of the world’s semiconductor fabs, including etch, deposition, aqueous, and electro-chemical (electroplating). The company is now investing in Korea with its upcoming state-of-the-art manufacturing facility expected to commence production this year. “Greene Tweed has a history of investing to meet the demands of our global customers and the Korea expansion offers the organization an opportunity to support the continued growth of the semiconductor industry in the region. The multi-million-dollar investment represents a significant increase in the company’s global manufacturing capacity while enabling supply chain resiliency,” said Magen Buterbaugh.

Reaffirms Full Year 2023 Revenue Expectations Above $1.1 billion

BEVERLY, Mass., Jan. 16, 2024 -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today increased financial guidance for the fourth quarter of 2023 and reaffirmed its expectations for the full year. Based on preliminary fourth quarter financial results, the Company expects revenue for the fourth quarter of 2023 to be greater than $300 million, above the approximately $295 million prior guidance, and reaffirmed its expectation for full year 2023 revenue above $1.1 billion. Earnings per diluted share for the fourth quarter of 2023 are now forecasted to be greater than $2.05, above prior guidance of approximately $2.00.

President and CEO Russell Low commented, “Our excellent financial performance in the fourth quarter and for the full year 2023 resulted from strong execution by Axcelis employees, combined with our leadership position in the growing power device market.” Low continued, “Based on our strong yearend backlog and fourth quarter bookings, especially in power devices, we expect the power device market to remain healthy in 2024. We also believe that the mature process technology and memory segments, two markets in which Axcelis is well-positioned, will recover in the second half of the year, enabling strong growth in 2025.”

James Coogan, executive vice president and chief financial officer said, “We look forward to discussing our results for 2023 and expectations for 2024 on our upcoming fourth quarter and full year earnings call. We believe we are still on track to achieve our $1.3 billion revenue model in 2025. This expectation is based on continued demand for the Purion product family, continued bookings strength, and a backlog stretching into 2025.” Coogan continued, “Additionally, we continue to manage spending to improve our earnings power and to invest in R&D to strengthen our market position.”

Fourth Quarter and Full Year 2023 Conference Call
The Company will release financial results for the fourth quarter and full year 2023 on Wednesday, February 7, 2024, at 4:00 p.m. Eastern Time (ET). The Company will host a call to discuss the results for the fourth quarter and full year 2023 on Thursday, February 8, 2024, at 8:30 a.m. ET. The call will be available to interested listeners via an audio webcast that can be accessed through the Investors page of Axcelis' website at www.axcelis.com, or by registering as a Participant here https://edge.media-server.com/mmc/p/su3u4oev. Webcast replays will be available for 30 days following the call.

Safe Harbor Statement
This press release contains forward-looking statements under the SEC safe harbor provisions. These statements, which include our guidance for future financial performance, are based on management’s current expectations and should be viewed with caution. They are subject to various risks and uncertainties, many of which are outside the control of the Company, including the timing of orders and shipments, the conversion of orders to revenue in any particular quarter, or at all, the continuing demand for semiconductor equipment, relative market growth, continuity of business relationships with and purchases by major customers, competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and global economic, political and financial conditions. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other documents filed from time to time with the Securities and Exchange Commission.

About Axcelis
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 40 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.

CAST logo

About Collaborative Alliance of Semiconductor Test (CAST)

CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.

CAST logo
United States 453x388_Homepage_Ad_tile_Spectro_3.png Technical
Highlighted content

Unlike the semiconductor ‘frontend’, the ‘backend’ has little standardization with lots of different interfaces and behaviors between different equipment suppliers.  How can we standardize it and gain the efficiencies that standards brought to the frontend?  SEMI has several standards suites that could be used depending on the customer’s needs, including SECS/GEM, EDA/Interface A and RITdb.  This webinar will describe the benefits of each, as well discuss challenges around traceability and other issues commonly encountered in the backend, and how standards can benefit the equipment users.

United States

3:00 pm - 3:05 pm
Alan Weber
Vice President, New Product Innovations
Cimetrix

Opening Remarks

Alan Weber is currently the Vice President, New Product Innovations for Cimetrix Incorporated. Previously he served on the Board of Directors for eight years before joining the company as a full-time employee in 2011.

Alan has been a part of the semiconductor and manufacturing automation industries for over 40 years. He holds bachelor's and master's degrees in Electrical Engineering from Rice University.

3:05 pm - 3:15 pm
Brian Rubow
Director of Solutions Engineering
Cimetrix

SECS/GEM

Brian Rubow is the Director of Solutions Engineering for Cimetrix. He is well-known within the industry due to his involvement with the SEMI standards committees. He currently serves as the co-chairs for the North America Information and Control Committee, the North America GEM300 Task Force, and the North America DDA Task Force. Rubow has both a bachelor’s and a master’s in engineering from Brigham Young University.

3:15 pm - 3:25 pm
Albert Fuchigami
Senior Software Developer
PEER Group

EDA/Interface A

Albert Fuchigami is a senior software developer at PEER Group Inc. and has spent more than 20 years helping semiconductor OEMs integrate their equipment into factories around the world. He is a globally recognized leader in the SEMI Standards Program, co-leads the North America Data Diagnostic Acquisition (DDA) Task Force, and contributes to the Information & Control Technical Committee. Albert enjoys demonstrating how standards can maximize data communication with factory host systems and is a champion for integrating HTTP/2 with gRPC and Protocol Buffers technology into the Equipment Data Acquisition (EDA) / Interface A standards. He holds a Bachelor of Mathematics (Computer Science) degree from the University of Waterloo.

3:25 pm - 3:35 pm
Stacy Ajouri
Senior Member of Technical
Texas Instruments
Mark Roos
CEO
Roos Instruments

RITdB

Stacy Ajouri is a Senior Member of Technical Staff at Texas Instruments in the Test Technology Group. She is the co-chair of the North America Automated Test Equipment (ATE) Technical Committee and the RITdb Task Force. She has over 30 years of experience across multiple disciplines related to test and test operations. Pulling from that experience, she supports the implementation of RITdb proof of concepts (POCs) focusing what is needed by the manufacturing and engineering community.

Mark Roos is CEO of Roos Instruments, a longtime producer of semiconductor ATE. He co-chairs the North America ATE Technical Committee and the RITdb Task Force. Roos has been involved in standards development for ATE for the past 20 years. He is currently heavily involved in the focus of RITdb POCs on scaling and latency.

3:35 pm - 3:45 pm
Dave Huntley
Product Manager Assembly Products
PDF Solutions

Traceability and E142

Dave Huntley was the founder and president of KINESYS Software in 1992 which developed the Assembly Line Production Supervisor (ALPS). PDF Solutions acquired the ALPS in 2017 and Dave now works in Strategic Marketing, Business Development & Standards Liaison focused on defect / process tracking and single device traceability across the supply chain.

He has a long history working with SEMI. He was co-lead of the Sort Map task force responsible for the SEMI E142 Specification for Substrate Mapping Standard. Dave is now the co-lead for the Traceability committee and two SEMI task forces; 1) Advanced Backend Factory Integration working on applying and extending wafer fab automation standards to assembly and test and 2) Single Device Traceability task force working on blockchain traceability for the supply chain.

3:45 pm - 3:55 pm
Alan Weber
Vice President, New Product Innovations
Cimetrix

Closing Remarks

CAST 3:00 pm - 4:00 pm Off Add to Calendar 2024-02-22 15:00:00 2024-02-22 16:00:00 Standardizing the Semiconductor Manufacturing Backend United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

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About Collaborative Alliance of Semiconductor Test (CAST)

CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.

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