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Moov, the world's largest and fastest growing marketplace for used semiconductor equipment, today announced that Rajiv Chegu has been promoted to the newly created role of Chief Operating Officer (COO).

Since joining Moov in 2022, Chegu has served as Head of Operations, running the gamut of company operations: people, processes and strategy. In his role as COO, Chegu’s expanded focus will include taking the helm of Moov’s product organization, strategic development of data products and services to drive both internal efficiency and external customer value, and continuing to drive market expansion as Moov grows its global presence.

“Rajiv’s experience running multiple functions across the operational, data, and product domains at leading B2B startups coupled with the rigor from his experience in private equity portfolio operations and top tier consulting is invaluable to Moov as we continue our trajectory of hyper-growth,” said Steven Zhou CEO and cofounder of Moov Technologies.

Prior to Moov, Chegu worked with B2B software companies, notably as an operator at CB Insights where he led teams across corporate development, data operations, business intelligence, and product as an SVP and at a leading lower middle market Private Equity firm. He also brings experience from the Boston Consulting Group, where he helped stand up the firm’s Growth Tech practice, working with leading pre-IPO technology companies.

Chegu’s promotion signals Moov’s plans to continue expanding its global footprint, product footprint, and market penetration. In 2023, Moov announced expansion of its presence in South Korea and the establishment of a new office in the strategic global semiconductor hub of Taipei. Moov unveiled a series of new product features at this year’s SEMICON West exhibition and conference, which leverage data and automation to further simplify the process of buying and selling semiconductor equipment and parts on Moov’s marketplace. This year, Moov also announced the establishment of a new enterprise partnerships division to grow strategic long-term relationships with leading semiconductor manufacturers across a variety of complex acquisition and divestiture projects.

“As we look ahead to 2024, we are excited to share a series of big product and growth announcements as we continue to transform the high tech equipment supply chain,” said Zhou.

For more information on Moov, visit www.moov.co.

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov's platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. To learn more, please visit Moov.co.

Kitchener, ON, January 11, 2024 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, is highlighting its lineup of SEMI Standards compliance test products at booth A434 during SEMICON Korea 2024.
“We are excited to return SEMICON Korea and look forward to connecting with our partners and customers at the show,” says Bob Kane, PEER Group’s Director of Factory Sales, Asia. “SEMI Standards compliance testing is critical for passing the factory acceptance test. OEMs that validate their tools using PEER Group’s test applications before shipping increase their chances of a successful factory integration and securing repeat business from factories.”
PEER Group’s test products include SECSIM Pro®+, which has been trusted by equipment manufacturers for more than 20 years to test and validate SECS/GEM communications. Also highlighted during the show are PFAT™, a workflow-based scenario test designer used by factories and OEMs to ensure equipment meets factory requirements, and CCS Envoy™, a factory automation standards compliance tester.
Visitors to booth A434 will have the opportunity to meet with representatives from PEER Group’s global sales team, as well as members from Toward Future, PEER Group’s exclusive sales partner serving South Korea. SEMICON Korea, which is happening January 31 - February 2, is the country’s leading semiconductor industry event.
To learn more, and to schedule a meeting during SEMICON Korea, visit PEER Group’s event page.

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. An award-winning company, PEER Group’s commitment to quality has been recognized by Intel’s EPIC Supplier Program, naming PEER Group a Distinguished Supplier in 2023 and an Outstanding Supplier in 2022. Follow PEER Group on LinkedIn.

Registration

Member Price: $49

Non-Member Price: $99

Registration is final. No refunds provided. No substitutions.

Krish Raghunath
Email: [email protected]
Phone: +1.408.943.6982

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Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley & Northeast Virtual Forum.

Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.

The SEMI Silicon Valley and Northeast Chapters Present:

Semiconductor Industry Outlook 2026 

As we step into 2026, the semiconductor industry continues to evolve at an unprecedented pace, driven by technological innovation, global market dynamics, and shifting economic conditions. Join us for an engaging virtual forum where leading experts will share insights into the trends, challenges, and opportunities shaping the future of the semiconductor ecosystem.

Topics Include:

  • Key market and technology trends shaping the industry.
  • Expert forecasts for 2026 and beyond.
  • Geopolitical impacts.
  • Emerging and expanding markets

Don’t miss out—register now to secure your spot!
 

United States

Virtual Forum | Wednesday, March 4, 2026 | Pacific Time

8:30 am
Joe Stockunas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:35 am
Luke Chang
Moderator
Luke Chang, PhD
Silicon Valley Chair; Program Director
SCREEN

Welcome Remarks

8:40 am
Duncan Meldrum, Headshot
Duncan Meldrum, PhD, CBE™
Business Economist
Hilltop Economics

Uncertainty and the Economic Outlook - Economic Growth and Semiconductors: Focus on the Risks

9:05 am
Scarlett Bickerton
Scarlett Bickerton
Manager, Federal & State Affairs
SEMI

SEMI Advocacy: Shaping the Policy Impacting Corporate Initiatives

9:30 am
Rebecca Routson
Rebecca Routson
Principal Director
CHIPS Metrology Program

CHIPS Metrology Program Update

9:55 am
Joe Gaustad, ClassOne
Joe Gaustad
Director of Product Development
ClassOne Technology

The New 300mm Customer

10:20 am
 Inna Skvortsova
Inna Skvortsova
Research Manager, Market Intelligence
SEMI

From AI Gold Rush to Fab Reality: Capacity, Fab Investments and Materials Outlook

10:45 am

Q&A

10:55 am
Sophia Rogalskyj_TEL
Sophia Rogalskyj
Etch Development Engineer and Northeast Chapter Co-Chair
NY Creates

Closing Remarks

8:30 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles 2 Register Now
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Registration

2024 Technology Workshops Enabling the Future of Electronics

Registration Fee
(April 16 & 17 only)

$250 members
$399 non-members

SEMI members who wish to join the NextFlex Workshop on April 19th should contact [email protected] for a special discount code.

Cancellation Policy

Cancellations received on or before March 16, 2024, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after March 16, 2024, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to Michelle Fabiano at [email protected].

2024 Technology Workshops Enabling the Future of Electronics
United States Future of Electronics Tile Technical

Recommended Hotel

Hotel Room

Residence Inn by Marriott

4610 Vestal Pkwy E, Vestal, NY 13850
TEL: (607) 770-8500

Hotel Room
https://www.idsnm.com/
https://www.engr.washington.edu/

SEMI NBMC Technical Gap Analysis Workshop - Tues. 4/16 - 8 am-6 pm 
During this workshop, attendees will address the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives. Breakfast, and lunch will be included and reception at the end of the day will be included.

SEMI FlexTech FHE Technical Gap Analysis Workshop - Wed. 4/17 - 8 am-4 pm, followed by tours of Binghamton University labs
Attendees will then turn their sights to completing a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Breakfast, lunch and tours of Binghamton University lab tours will conclude the day.

Binghamton University Tours - Wed. 4/17 - 4:00pm - 5:30pm
The tour will include facilities that are part of the S3IP (Small Scale Systems Integration & Packaging) a New York State Center of Excellence, CAMM (Center for Advanced Microelectronics Manufacturing) a New York State Center of Advanced Technology and home to the New York Node of NextFlex, the Analytical & Diagnostics Laboratory, the IEEC (Integrated Electronics Engineering Center) a New York State Center of Advanced Technology and NECCES (the Northeast Center for Chemical Energy Storage). 

Register for Tour

Binghamton University 2024 Art of Science Exhibit - Wed. 4/17 - 4:00pm - 5:30pm
Binghamton University holds an annual contest that celebrates the beauty of science through photographs and images that describe some aspect of research and captured visually.  The advances in imaging technology and tools mean that scientists have an increased ability to generate exciting data as well as to create compelling works of art and workshop attendees are invited to the opening reception for the 2024 Art of Science Exhibit in the atrium of the Center of Excellence Building. Contest winners will be announced, and refreshments will be served. 

In addition:
NextFlex Workshop– Thurs, 4/18 
NextFlex will convene the hybrid electronics community for a one-day workshop at Binghamton University in New York on April 18 to explore and define collaborative responses to soon to be announced opportunities under the CHIPS and Science Act, including the National Advanced Packaging Manufacturing Program (NAPMP), with a specific focus on advancing hybrid electronics for industrial and medical applications.

Additional information and separate registration
SEMI members who wish to join the NextFlex Workshop on April 19th should contact [email protected] for a special discount code.

Binghamton University, Innovative Technologies Complex (ITC)
85 Murray Hill Rd
Vestal, NY 13850
United States

Tuesday, April 16

7:00 am - 8:00 am

Registration and Breakfast

8:00 am
Dr. Grupen-Shemansky is the Chief Technology Officer and VP of Technology Communities at SEMI.
Melissa Grupen-Shemansky
Vice President, Technology Communities
SEMI

Opening Remarks

8:15 am
Stephaney Shanks
Stephaney Shanks
Division Director, Integrative Health and Performance Sciences
UES, a BlueHalo company

Vision and Mission of NBMC

8:30 am
Gina Tollefson
Air Force Research Laboratory

NBMC Gap Analysis Workshop - AFRL Perspective

8:40 am
Robert Andosca
Robert Andosca
Co-founder, President, and CEO/CTO
INVIZA® Health

Energy Harvesting for Wearables

9:10 am
Muyang Lin
Muyang Lin
University of California, San Diego

A Fully Integrated Wearable Ultrasound System to Monitor Deep Tissues in Moving Subjects

9:25 am - 9:55 am

Break

9:55 am
Dylan Shah
Dylan Shah
Arieca

Self-Powered Wireless Soft Electronics

10:10 am
Teresa Abraham
Teresa Abraham
Sapphiros

Low-cost, Connected Blood Collection Device with Onboard Biosensors to Detect Biomarkers for Human/Cognitive Performance

10:25 am
Robert Andosca
Robert Andosca
Co-founder, President, and CEO/CTO
INVIZA® Health

Smart Remote Patient / Airmen Monitoring (RPM / RAM) Platform

10:35 am
Azar Alizadeh
Principal Scientist
GE HealthCare Technology & Innovation Center

Multiplexed Wireless Interstitial Fluid Monitoring Devices for Stress Assessment

10:50 am
Jack Ly
Jack Ly
UES

Transdermal Optical Microneedle Sensors for Continuous Monitoring of Physiological Analytes in Interstitial Fluid

11:05 am
Anthony Wertz
Anthony Wertz
Research Intern
Carnegie Mellon University

Liquid Metal Embedded Elastomers: Electromigration Characterization and Use in Stretchable Sensors

11:20 am
John Strang
John Strang
CEO
Dermisense

Crossing the Chasm to Commercialization

11:35 am
David Kim
David Kim
North Carolina State University

Liquid Metal Filled Fibers for Next Generation E-Textiles

11:50 am
William Jamie Tyler
William "Jamie" Tyler
Co-founder, Executive Leader and Professor
IST, LLC

Auricular Bioelectronics for Medicine and Augmented Human-Machine Cognition

12:05 pm
Cameron Good
Carmeron Good
Vice President, Research and Product Development
Attune

Individualized Focused Ultrasound Stimulation of the Brain to Enhance Alertness and Cognitive Performance

12:20 pm - 1:30 pm

Networking Lunch

1:30 pm - 3:00 pm

Breakout Strategy Sessions

Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.

3:00 pm - 3:15 pm

Break

3:15 pm - 4:45 pm

Breakout Sessions Readout

4:45 pm - 6:15 pm

Networking Reception

Wednesday, April 17

7:00 am - 8:00 am

Registration and Breakfast

8:00 am
Gity Samadi
Gity Samadi
Senior Director
SEMI

Opening Remarks

8:05 am
Robert Bob Praino
Bob Praino
Chief Operating Officer (COO) and Co-founder
CHASM Advanced Materials

FHE Consortium Mission and Vision

8:20 am
Dan Balder
Dan Balder
Engineering Manager
SunRay Scientific
Madhu Stemmermann
Madhu Stemmermann
CEO and Co-Founder
Sunray Scientific

Advancements in Scalable Anisotropic Adhesive for FHE Manufacturing

8:40 am
Rafael Tudela
Rafael Tudela
Technical Program Leader for Flexible and Printed Electronics
Tapecon

Bending the Future: The Expanding Horizons of Flexible Hybrid Electronics

8:55 am
Eric Acome
Eric Acome
CEO and Co-Founder
Artimus Robotics

HASEL Artificial Muscles: High Performance Electrostatic Transducers Enabled by the Combination of Flexible Electronics and Liquid Dielectrics

9:10 am - 9:40 am

Break

9:40 am
Mike Mastropietro
Michael A. Mastropietro
CTO/Director of R&D
ACI Materials, Inc.

Materials and Processes for High Volume Integration of Stretchable Circuits into E-Textile

9:55 am
Devin MacKenzie
Devin MacKenzie
Washington University

Breaking Through 10 Micron Barrier to Enable 3D Structuring of RF Antennas Interconnects Arrays for FHE

10:10 am
Dave Keicher
Dave Keicher
IDS

Aerosol Printing with Industrial Reliability - Performance Results for the NanoJet Gen2 Printhead

10:25 am
Robert Bob Praino
Bob Praino
CHASM Advanced Materials

Revisiting Transparent Antennas for 5G and Beyond - FT19-21-203

10:40 am
Amit Lal
Cornell University

Minimum Viable Virtual Fab for Accelerated Innovation of Semiconductor Manufacturing Processes and Future Devices

10:55 am
Felippe Pavinatto
Felippe Pavinatto
GE Aerospace

Printed RF Passive Sensors for High-Temperature Applications in Aerospace

11:10 am
Peter Doerschuck
Peter Doerschuk
Cornell University

AI Models for Optimizing FHE Printing Aided by Ultrasound Metrology

11:25 am
Emmanouil Tentzeris
Emmanouil Tentzeris
Ed and Pat Joy Chair Professor
Georgia Institute of Technology, School of ECE

Additively Manufactured Flexible " Smart" Packaging and Reconfigurable On-Package Antenna Arrays for Next Generation 5G/mm Wave System on Package Designs

11:40 am
Deepak Trivedi
Deepak Trivedi
GE Aerospace

CogniWorm: Compliant and Autonomous Grub for Navigation and Inspection fo Warped, Complex and Rough Environments

11:55 am - 1:05 pm

Networking Lunch

1:05 pm - 2:35 pm

Breakout Strategy Sessions

Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.

2:35 pm - 2:50 pm

Break

2:50 pm - 4:00 pm

Breakout Sessions Readout

4:00 pm - 5:30 pm

Binghamton University Laboratory Tours & 2024 Art of Science Exhibit and Reception

The tour will include facilities that are part of the S3IP (Small Scale Systems Integration & Packaging) a New York State Center of Excellence, CAMM (Center for Advanced Microelectronics Manufacturing) a New York State Center of Advanced Technology and home to the New York Node of NextFlex, the Analytical & Diagnostics Laboratory, the IEEC (Integrated Electronics Engineering Center) a New York State Center of Advanced Technology and NECCES (the Northeast Center for Chemical Energy Storage).

- FlexTech


Presented by

FlexTech nbmc and NextFlex logo

 

Hosted by

Binghamton University Logo

 

Join leaders from FlexTech, NBMC, NextFlex and the microelectronics industry in this dynamic workshop, where we'll explore advancements, challenges, and solutions in critical technologies like flexible hybrid electronics, hybrid electronics, wearables, bio-signal sensing for real-time cognitive and physical state monitoring, and more. Participate in hands-on sessions, cross-disciplinary discussions, and gain insights from industry and academia through impactful talks. Contribute your suggestions in dynamic breakout sessions to shape and enable the future of these technologies.

7:30 am - 6:00 pm Off Add to Calendar 2024-04-16 07:30:00 2024-04-17 18:00:00 2024 Technology Workshops Enabling the Future of Electronics Presented by Hosted by Join leaders from FlexTech, NBMC, NextFlex and the microelectronics industry in this dynamic workshop, where we'll explore advancements, challenges, and solutions in critical technologies like flexible hybrid electronics, hybrid electronics, wearables, bio-signal sensing for real-time cognitive and physical state monitoring, and more. Participate in hands-on sessions, cross-disciplinary discussions, and gain insights from industry and academia through impactful talks. Contribute your suggestions in dynamic breakout sessions to shape and enable the future of these technologies. Binghamton University, Innovative Technologies Complex (ITC) 85 Murray Hill Rd Vestal, NY 13850 United States SEMI.org [email protected] America/Los_Angeles public

Event Contact

For questions, please contact Michelle Fabiano at [email protected].

Register Now

REGISTRATION

Registration is free.

Belgium France Germany Ireland Italy Japan South Korea United States REGISTER NOW EPA Thumbnail Image_NEW Business Executive

The webinar will feature senior leaders and other experts from EPA and provide SEMI members with an overview of EPA’s efforts under the PFAS Strategic Roadmap; the recently finalized reporting rules under the Toxic Substances Control Act (TSCA) and the Toxics Release Inventory (TRI) program; the review and management of new PFAS chemicals under the TSCA New Chemicals program; and an update on research and development activities, including analytical test methods development.  In addition to hearing directly from EPA officials on these important topics, participants will have an opportunity to ask questions at the end.  

United States

Welcome Remarks

1:00 pm
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

Speakers

Michal Freedhoff, PhD, U.S. Environmental Protection Agency
Dr. Michal Freedhoff
Assistant Administrator, Office of Chemical Safety and Pollution Prevention
U.S. Environmental Protection Agency
Matt Klasen, U.S. Environmental Protection Agency
Matt Klasen
PFAS Council Manager
U.S. Environmental Protection Agency
Susan Burden, PhD, U.S. Environmental Protection Agency
Dr. Susan Burden
PFAS Executive Lead, Office of Research and Development
U.S. Environmental Protection Agency
Stephanie Griffin, U.S. Environmental Protection Agency
Stephanie Griffin
Team Lead, Data Collection Branch, Office of Pollution Prevention and Toxics
U.S. Environmental Protection Agency
Shari Barash, U.S. Environmental Protection Agency
Shari Barash
Acting Director, New Chemicals Division, Office of Pollution Prevention and Toxics
U.S. Environmental Protection Agency
Tyler Lloyd, U.S. Environmental Protection Agency.jpg
Tyler Lloyd
Team Leader, Risk Management Branch 1, New Chemicals Division, Office of Pollution Prevention and Toxics
U.S. Environmental Protection Agency
2:00 pm

Adjourn

Join us to learn more about several of the U.S. Environmental Protection Agency’s recent actions related to PFAS and their relevance to the semiconductor manufacturing industry.

1:00 pm - 2:00 pm Off Add to Calendar Disabled America/New_York
Event format

Deventer, December 12, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and HE System Electronic GmbH, an established development and manufacturing partner for sensors and power electronics, today announce their cooperation to perform certified validation of power modules in the field of electromobility. All qualification and reliability tests will be carried out in compliance with the AQG 324 standard, among others, and the final product will be used in high power solutions such as car batteries. The partnership was initiated in 2021 and is now even stronger with this new project.

The majority of projects at HE System Electronic are located in the automotive sector. In this area, it is important to be certified or accredited according to quality management standards such as VDA 6.2 and DIN EN ISO / IEC 17025:2018.

“RoodMicrotec is one of the few independent service providers in the European region that can carry out a complete validation according to AQG 324. This makes the cooperation with RoodMicrotec so valuable,” says Axel Weber, CEO of HE System Electronic GmbH.

For RoodMicrotec, this partnership fits well into their general range of services and the company is looking forward to realizing further projects in this area, thus planning to expand its capacities.

“The final product from HE System Electronic is highly interesting. Because of this, we have added power cycling to our qualification capabilities. An additional tester with extended high power capabilities has already been ordered, so we can expand our capabilities and provide additional support to our customers,” says Martin Sallenhag, CEO of RoodMicrotec.

About HE System Electronic GmbH
HE System Electronic is a medium-sized electronics and microsystems technology company based in Veitsbronn in the location for business of the metropolitan region Nuremberg. Founded as a provider for electronic manufacturing services in the field of hybrid technology, HE System Electronic is well established as a competent partner for development and manufacturing and has been successful on the market for its customers in the product areas of sensor technology and power electronics for many years. The parent company, TKH Technologie Deutschland AG, based in Bielefeld, is supporting the growth and thus, HE System Electronic offers its customers the best of two worlds: the financially stable background of a healthy and profitable holding company as well as the innovative strength and short distances of a medium-sized company.
For more information please visit he-system.com/en.
Further information
Axel Weber – CEO, Klaus Aßmann – Distribution
Phone +49 911 97 58 10, E-mail: [email protected].

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information, please visit https://www.roodmicrotec.com.
Further information
Martin Sallenhag, CEO or Arvid Ladega, CFO
Phone +31 570 745623, E-mail [email protected].

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

Registration Details

Registration is required for this event as it is likely to reach maximum room capacity, at which point interested attendees will be waitlisted.

SEMI Members:  $100

Non-Members of SEMI:  $150

Refunds possible before January 10, 2024.  Substitutions allowed up to January 24.

Questions? Contact James Amano at [email protected].

Belgium France Germany Ireland Italy United States Register Now 2024 EHS Summit Business Executive Technical

The Summit includes strategic business and technical information for many levels and sectors of the ecosystem, including:

  • Government relations/advocacy staff
  • EHS regulatory professionals
  • Senior executives
  • Business development
  • Device manufacturers
  • Equipment suppliers
  • Materials suppliers
  • Component suppliers
  • Fab and facility systems construction companies

SEMI
673 South Milpitas Avenue
Milpitas, CA 95035
United States

8:30 am - 9:00 am

Registration & Networking

9:00 am - 9:05 am
James Amano, SEMI
James Amano
Senior Director, EHS
SEMI

Welcome

9:05 am - 9:20 am
James Amano, SEMI
James Amano
Sr. Director, EHS
SEMI

Europe PFAS Restriction Proposal

9:20 am - 9:45 am
Russ LaMotte
Russ LaMotte
Principal
Beveridge & Diamond PC

US EPA PFAS Reporting rule

9:45 am - 10:10 am
Andrew Petraszak
Andrew Petraszak
Tokyo Electron
Ben Kallen, SEMI
Ben Kallen
SEMI

PFAS US States Proposals & Positions

10:10 am - 10:30 am

Break

10:30 am - 11:00 am
Lauren Crane
Lauren Crane
Lam Research

European Regulations

Including: EU Machinery Regulation, Battery Regulation, Cybersecurity Resiliency Act (CRA), AI regulation, the Ecodesign “passport” concept. UK Conformity Assessed (UKCA) mark. California fan efficiency regulation. SEMI EHS Standards update.

11:00 am - 11:25 am
Allen Karpman
Allen Karpman
Arkema

AIM Act: HFC Allocations

11:25 am - 11:50 am
Kristine Baranski, PE, Intel
Kristine Baranski, PE
Global Air Program Manager
Intel

AIM Act: challenges with new refrigerants

11:50 am - 12:10 pm
Katelyn Walck
Katelyn Walck
Chemours
Jim Snow SCREEN
James Snow
SCREEN

SIA PFAS Consortium

12:10 pm - 1:15 pm

Lunch & Networking

1:15 pm - 1:35 pm
James Amano, SEMI
James Amano
SEMI

SEMI PFAS Initiative

1:35 pm - 2:00 pm
Russ LaMotte
Russ LaMotte
Principal
Beveridge & Diamond

TSCA PBT: PIP, DecaBDE, What's Next?

2:00 pm - 2:35 pm
Ben Gross, Applied Materials
Ben Gross
Applied Materials
Supika Mashiro
Supika Mashiro
TEL
Katelyn Walck
Katelyn Walck
Chemours
Lauren Crane
Lauren Crane
Lam Research

Supply Chain Inquiry Panel - sharing best practices

2:35 pm - 2:55 pm

Q&A

2:55 pm - 3:00 pm

Wrap-Up

3:00 pm - 3:30 pm

Networking

Standards

Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry.

Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include:

  • US EPA PFAS Reporting Rule 
  • US AIM Act HFC phasedown: challenges with new refrigerants 
  • US AIM Act HFC Allocation 
  • EU: PFAS Restriction Proposal, F-gas, Revised Machinery Regulation, Revised Battery Regulation, Pending Cybersecurity resiliency regulation, Pending AI regulation, the ecodesign “passport” concept.
  • Updates from SEMI PFAS Initiative and other collaborative industry efforts.
  • US EPA TSCA: PIP 3:1, DecaBDE…what's next?
  • Panel discussion on supply chain communication.

Plan now to attend, network and strategically prepare your company.  This event is offered as an in-person briefing only.

8:30 am - 3:30 pm Off Add to Calendar 2024-01-25 08:30:00 2024-01-25 15:30:00 2024 EHS Summit Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry. Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include: US EPA PFAS Reporting Rule  US AIM Act HFC phasedown: challenges with new refrigerants  US AIM Act HFC Allocation  EU: PFAS Restriction Proposal, F-gas, Revised Machinery Regulation, Revised Battery Regulation, Pending Cybersecurity resiliency regulation, Pending AI regulation, the ecodesign “passport” concept. Updates from SEMI PFAS Initiative and other collaborative industry efforts. US EPA TSCA: PIP 3:1, DecaBDE…what's next? Panel discussion on supply chain communication. Plan now to attend, network and strategically prepare your company.  This event is offered as an in-person briefing only. SEMI 673 South Milpitas Avenue Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
United States Standards%20.jpg

SEMI HQ
673 South Milpitas Blvd
Milpitas, CA 95035
United States

Monday, March 25, 2024

1:00 pm - 4:00 pm

International Compliance and Regulatory Committee (ICRC) [SEMI EHSS Division]

Tuesday, March 26, 2024

9:00 am - 12:00 pm

Facilities & Gases Technical Committee Chapter Meeting

9:00 am - 12:00 pm

Silicon Wafer Technical Committee Chapter Meeting

1:00 pm - 4:00 pm

Liquid Chemicals (day 1) Technical Committee Chapter Meeting

Wednesday, March 27, 2024

9:00 am - 4:00 pm

Information & Control Technical Committee Meeting

10:00 am - 12:00 pm

Physical Interfaces & Carriers Technical Committee Meeting

1:00 pm - 4:00 pm

Liquid Chemicals (day 2) Technical Committee Meeting

(Tentative) - Refer to Day 1 Agenda

Thursday, March 28, 2024

9:00 am - 3:00 pm

Environmental, Health & Safety Technical Committee Meeting

3:00 pm - 5:00 pm

Metrics Technical Committee Meeting

- Standards

Registration is open!

After 3/22, In-Person attendees must register at the front desk.

 

Join us for the SEMI Standards Meetings!

SEMI Standards will host 8 committees + over 40 task forces engaged in various standardization activities, including:

  • Environmental, Health, and Safety (EH&S)
  • Facilities
  • Gases
  • Information & Control
  • Liquid Chemicals
  • Metrics
  • Physical Interfaces & Carriers
  • Silicon Wafer

Note | Some Technical Committees + Task Forces may meet virtually outside of this Meeting set. Please check the Standards Event Calendar for updates.

FULL SCHEDULE | (PDF) or (Excel)

All meetings are in Pacific Time.
Subject to change, please check back frequently.
Last updated: March 22, 2024
 

Off Add to Calendar 2024-03-25 00:00:00 2024-03-28 00:00:00 North America Standards Spring Meetings 2024 Registration is open!After 3/22, In-Person attendees must register at the front desk. Join us for the SEMI Standards Meetings!SEMI Standards will host 8 committees + over 40 task forces engaged in various standardization activities, including:Environmental, Health, and Safety (EH&S)FacilitiesGasesInformation & ControlLiquid ChemicalsMetricsPhysical Interfaces & CarriersSilicon WaferNote | Some Technical Committees + Task Forces may meet virtually outside of this Meeting set. Please check the Standards Event Calendar for updates.FULL SCHEDULE | (PDF) or (Excel)All meetings are in Pacific Time.Subject to change, please check back frequently.Last updated: March 22, 2024  SEMI HQ 673 South Milpitas Blvd Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public

Registration

& Virtual Access

Registration is required whether you are attending IN-PERSON or VIRTUAL!

Virtual + Voting instructions will be sent to registered members the week prior to the meeting set.

PLEASE NOTE

  • In addition, you must be a SEMI Standards Program Member to participate in the meetings. 
  • Membership is FREE!
  • Fill out the Application Form to be a Standards Member.

Contact

Kevin Nguyen
Manager, International Standards Operations
(EH&S, Silicon Wafer)

Laura Nguyen
Sr. Coordinator, International Standards
(Facilities, Gases, Liquid Chemicals, Physical Interfaces & Carriers, Flexible Hybrid Electronics)

Michelle Sun
Coordinator, International Standards
(Information & Control, Metrics)

Registration is free

Belgium France Germany Ireland Italy Japan South Korea United States ESDA_Thumbnail Image Business Executive
Highlighted content

United States

Moderator

9:00 am
Raj Gautam Dutta, CEO, Silicon Assurance
Moderator
Raj Gautam Dutta
CEO
Silicon Assurance

Panelists

Serge Leef
Serge Leef
Head of Secure Microelectronics
Microsoft
Swarup Bhunia, Semmoto Endowed Professor and Director of Warren B. Nelms Institute
Swarup Bhunia
Semmoto Endowed Professor and Director
Warren B. Nelms Institute
Salman Nasir
Salman Nasir
Sr. Technical Program Manager
Battelle
John Hallman
John Hallman
Digital Verification Technology Solutions Manager
Siemens EDA
Steve Carlson
Steve Carlson
Director/Solutions Architect, Aerospace and Defense Solutions
Cadence Design Systems
Ming Zhang
MIng Zhang
VP of R&D Acceleration
PDF Solutions
EMG

Many semiconductor-based systems are moving toward 2.5D and 3D designs consisting of different pre-manufactured chips (chiplets) that perform specific functions. These are often provided by multiple vendors and are typically interconnected using an interposer. However, unlike monolithic multi-function chips, chiplets can be developed anywhere and at any process node. As such, chiplets from untrusted vendors can be unreliable or malicious. Third parties can reverse engineer, overproduce, or steal the IP of chiplets. Consequently, they raise new security challenges for an industry still figuring out ways to effectively mitigate hardware security threats to monolithic chips.

The webinar will focus on the potential threats that occur at the different stages of bringing chiplets to life, including design, assembly, and testing. The panelists will assess current safeguards to mitigate these risks and discuss open challenges for industry and academia.

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles Register Now
Event format

Registration for this course is free.

For questions, please contact Paul Trio at [email protected]

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Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam EMS course Ad tile Business Executive

Electromagnetic Interference and Electrical Overstress Management: Why, What, and How

Electromagnetic interference (EMI) is becoming more critical in all aspects of semiconductor manufacturing, affecting productivity and yield.  

The SEMI E176 Standard, "Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment," addresses this issue. This document provides practical, actionable guidance on establishing an acceptable EMI environment in semiconductor processes: from assessing the EMI environment to EMI mitigation to verification. SEMI E176 sets recommended EMI limits for different process categories. The Standard can benefit every stage of the semiconductor process and electronic assembly.  
 

Who Should Attend:

  • Semiconductor Device Manufacturers
    • Manufacturing and Quality Directors
    • Department and Production Managers
    • Line Supervisors
    • Sales: VP and Managers
  • Equipment Manufacturers
    • Director-Level and VP Engineering and QA
    • Engineering Department Managers
    • Sales: VP and Managers (customer satisfaction)

 

Meet the Instructor

Vladimir Kraz

 

 

 

 

 

Vladimir Kraz, President, OnFILTER

Biography

 

 

SEMI HQ
CA
United States

1. Overview of SEMI and SEMI Standards
- SEMI as a resource for your company

2. EMI and EMC - an overview

3. Effect of EMI on processes and equipment
- EMI and Electrical Overstress
- Equipment precision
- Process variations
- Other problems

4. Sources and propagation of EMI

5. Overview of SEMI E.33
- Emphasis on Table 1: Compliance Assignment/Responsibility Table

6. Overview of SEMI E.176

7. Basics of a viable EMI program at a factory based on SEMI E.176
- Purpose
- Structure
- Resources and budget
- Similarity and synergy with already-existing ESD program

Standards

Join us for a hybrid experience with both in-person and virtual attendance options.

4:00 pm - 5:00 pm Off Add to Calendar 2023-12-18 16:00:00 2023-12-18 17:00:00 EMI and EOS Management Course Join us for a hybrid experience with both in-person and virtual attendance options. SEMI HQ CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register now
Event format