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WILMINGTON, Del., Jan. 22, 2024 — DuPont (NYSE: DD) today announced that Drew Chambers has been named global business director, Lithography Technologies business in DuPont Electronics & Industrial, effective Jan. 1. Chambers succeeds George Barclay, Ph.D., who has elected to retire after more than 25 years of service.

“George Barclay’s significant contributions to our lithography business and portfolio have been tremendous and we are grateful for the lasting legacy he leaves with our organization,” said Sang Ho Kang, VP & General Manager, Semiconductor Technologies, DuPont Electronics & Industrial. “A true technical expert, George is a prolific innovator and visionary leader.”

“Drew Chambers has demonstrated outstanding leadership across multiple technology segments in electronics and is a strong proponent of delivering results to meet the needs of our customers,” said Kang. “In his new role as the leader of our lithography materials portfolio, Drew will play a pivotal role in furthering our offerings for extreme ultraviolet lithography and other advanced patterning solutions.”

Chambers brings a diversity of experiences both at DuPont and elsewhere in the electronics industry. He joined DuPont in 2019 as global marketing director for chemical mechanical planarization (CMP) pads in CMP Technologies and most recently served as acting business director. Prior to DuPont, he led the Electronics & Surface Technologies segment for Ferro Corporation, led regional sales and marketing for ESL ElectroScience (now part of Ferro Corporation), and worked in new business development for Lutron Electronics. Earlier in his career, Chambers held several roles in engineering, product management and account management in the semiconductor materials segment with Rohm and Haas Electronic Materials (now part of DuPont). Chambers holds an MBA from Duke University’s Fuqua School of Business and a BS in chemical engineering from Lafayette College.

DuPont Lithography Technologies is a global leader in materials for microlithography, with offerings enabling advanced patterning at the most advanced technology nodes; and bringing quality, yield and defectivity improvements to existing lithography processes. DuPont’s portfolio includes ArF photoresists, KrF photoresists, i/g line photoresists, extreme ultraviolet (EUV) photoresists, advanced overcoats, EUV underlayers and anti-reflective coating materials. Lithography Technologies is part of Semiconductor Technologies in DuPont Electronics & Industrial.

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial, and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. http://electronics.dupont.com

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

Semiconductor equipment platform company SurplusGLOBAL has announced its participation in the SEMICON KOREA 2024 exhibition, in collaboration with its subsidiary EQ GLOBAL. The SEMICON KOREA 2024 exhibition, which commenced in 1987, stands as a prominent event for the South Korea semiconductor industry, showcasing the latest semiconductor materials, equipment, and related technologies. The event also encompasses a semiconductor technology symposium, market trend forums, and purchase consultation sessions. This year is scheduled to take place from January 31 to February 2 at COEX in Seoul, with approximately 500 companies expected to participate.

 

[Photo: SurplusGLOBAL booth at SEMICON KOREA 2024 exhibition]

 

Bruce Kim, CEO of SurplusGLOBAL, stated, "We are accelerating our global network expansion, with a presence now established in Mainland China, the United States, Japan, Taiwan(China), and Singapore. Our business is evolving beyond the focus on legacy semiconductor equipment distribution to include refurbishing, manufacturing, and parts production and distribution." He continued, "Our Global Parts Platform business, leveraging South Korea's semiconductor equipment parts infrastructure, provides repair, manufacturing, and services to global semiconductor companies. This expansion is fueled by the increasing market demand. Currently, we serve over 50 companies, supplying obsolete parts. Recently, we facilitated prompt recovery by delivering urgent parts to Japanese semiconductor fabs affected by an earthquake. Additionally, we are actively developing e-commerce through 'Global Parts Platform: Marketplace,' with plans to introduce AI-based personalized recommendation services by the end of this year."
SurplusGLOBAL will be located at booth DS30 in Hall D at SEMICON KOREA, participating as a joint exhibitor with its subsidiary EQ GLOBAL. The company plans to showcase Head Motor components used in RF generators and CMP (Chemical Mechanical Polishing) equipment, along with repair services.
In December of last year, SurplusGLOBAL was selected by the Ministry of Employment and Labor as a 'Great Workplace for Youth.'
 

 

United States Spectrochip tile Business Technical Featured Speakers

Kevin (Cheng-Hao) Ko received his Physics Ph.D. from State University of New York, Stony Brook (SUNY, Stony Brook) in 1995. During his thesis research, he worked at Beamline X1A of the National Synchrotron Light Source (NSLS) at Brookhaven National Laboratory (BNL) to construct the world's first Mult-channel Scanning Photoemission Electron Microscope (SPEM) by focusing soft X-rays using a zone plate under the supervision of Prof. Janos Kirz. After receiving his Ph.D. degree, he was invited by Taiwan Nation Synchrotron Radiation Research Center (NSRRC) to lead a team to develop X-ray Microcopy technology in Taiwan. By 1999 Ko’s team had successfully developed the world’s most advanced SPEM. After that, Dr. Ko started to devote his efforts to developing the SpectroChip technology. After nearly 20 years of research and development, Ko’s team was finally able to mass produce the SpectroChip using wafer-based methodology and founded the company SpectroChip, Inc. This technology received 9 national best innovation awards in Taiwan and one international best application award in Asia. To enable further global business development of the SpectoChip technology, in 2023, Dr. Ko and Dr. Sean Lin founded SPU System Inc.

United States

dr. ko
Dr. Kevin (Cheng-Hao) Ko
MSIG

SpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card.  It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology.  The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization.  This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.

In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology.

8:00 am - 9:00 am Off Add to Calendar 2024-02-21 08:00:00 2024-02-21 09:00:00 SpectroChip: an Optical System-on-Chip Enabling Ultra-Portable Devices for Broad Industrial Sensing Applications SpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card.  It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology.  The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization.  This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch On-demand
Event format

Lansdale, PA – Greene Tweed, a leading global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Fusion® F07, a performance-enhanced fluoroelastomer. Developed by Greene Tweed material scientists and application engineers, Fusion® F07 is specifically crafted to withstand common Etch and CVD oxygen/fluorine based gases in semiconductor processing subfab lines, at temperatures up to 355°F (180°C).

With an expected lifetime of at least 6 months, Fusion® F07 lasts longer than standard FKM in subfab vacuum system lines. As a result, the new performance enhanced FKM extends the time between planned maintenance activities. Notably, it provides a better total cost of ownership where applications do not require an FFKM compound.

“At Greene Tweed, we enable customers to operate efficiently and safely in the world’s most demanding environments. We understand that the semiconductor industry needs reliability and longevity. Fusion® F07 is a result of meticulous research and development, aimed at not only extending the life of their system but also improve operational efficiency,” says Magen Buterbaugh, President and CEO, Greene Tweed.

Fusion® F07 can be purchased as a seal assembly or as an individual O-Ring. Customers can effortlessly upgrade to Fusion® F07 and experience the benefits of extended lifetime and the resultant reduced operating costs as the seals are form-fit replaceable with other industry standard (KF/ISO flange fittings) seals. A blue outer ring allows for easier identification upon installation and replacement. Fusion® F07 seals are available in most typical sizes, including KF16, KF25, KF40, KF50, ISO63, ISO80, ISO100, ISO160, and ISO200.

About Greene Tweed
As a leading global provider of sealing solutions to the semiconductor industry for over four decades, Greene Tweed engineers advanced elastomer seals and thermoplastic components that are found in a broad range of mission-critical equipment in key process areas of the world’s semiconductor fabs, including etch, deposition, aqueous, and electro-chemical (electroplating). The company is now investing in Korea with its upcoming state-of-the-art manufacturing facility expected to commence production this year. “Greene Tweed has a history of investing to meet the demands of our global customers and the Korea expansion offers the organization an opportunity to support the continued growth of the semiconductor industry in the region. The multi-million-dollar investment represents a significant increase in the company’s global manufacturing capacity while enabling supply chain resiliency,” said Magen Buterbaugh.

Reaffirms Full Year 2023 Revenue Expectations Above $1.1 billion

BEVERLY, Mass., Jan. 16, 2024 -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today increased financial guidance for the fourth quarter of 2023 and reaffirmed its expectations for the full year. Based on preliminary fourth quarter financial results, the Company expects revenue for the fourth quarter of 2023 to be greater than $300 million, above the approximately $295 million prior guidance, and reaffirmed its expectation for full year 2023 revenue above $1.1 billion. Earnings per diluted share for the fourth quarter of 2023 are now forecasted to be greater than $2.05, above prior guidance of approximately $2.00.

President and CEO Russell Low commented, “Our excellent financial performance in the fourth quarter and for the full year 2023 resulted from strong execution by Axcelis employees, combined with our leadership position in the growing power device market.” Low continued, “Based on our strong yearend backlog and fourth quarter bookings, especially in power devices, we expect the power device market to remain healthy in 2024. We also believe that the mature process technology and memory segments, two markets in which Axcelis is well-positioned, will recover in the second half of the year, enabling strong growth in 2025.”

James Coogan, executive vice president and chief financial officer said, “We look forward to discussing our results for 2023 and expectations for 2024 on our upcoming fourth quarter and full year earnings call. We believe we are still on track to achieve our $1.3 billion revenue model in 2025. This expectation is based on continued demand for the Purion product family, continued bookings strength, and a backlog stretching into 2025.” Coogan continued, “Additionally, we continue to manage spending to improve our earnings power and to invest in R&D to strengthen our market position.”

Fourth Quarter and Full Year 2023 Conference Call
The Company will release financial results for the fourth quarter and full year 2023 on Wednesday, February 7, 2024, at 4:00 p.m. Eastern Time (ET). The Company will host a call to discuss the results for the fourth quarter and full year 2023 on Thursday, February 8, 2024, at 8:30 a.m. ET. The call will be available to interested listeners via an audio webcast that can be accessed through the Investors page of Axcelis' website at www.axcelis.com, or by registering as a Participant here https://edge.media-server.com/mmc/p/su3u4oev. Webcast replays will be available for 30 days following the call.

Safe Harbor Statement
This press release contains forward-looking statements under the SEC safe harbor provisions. These statements, which include our guidance for future financial performance, are based on management’s current expectations and should be viewed with caution. They are subject to various risks and uncertainties, many of which are outside the control of the Company, including the timing of orders and shipments, the conversion of orders to revenue in any particular quarter, or at all, the continuing demand for semiconductor equipment, relative market growth, continuity of business relationships with and purchases by major customers, competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and global economic, political and financial conditions. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other documents filed from time to time with the Securities and Exchange Commission.

About Axcelis
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 40 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.

CAST logo

About Collaborative Alliance of Semiconductor Test (CAST)

CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.

CAST logo
United States 453x388_Homepage_Ad_tile_Spectro_3.png Technical
Highlighted content

Unlike the semiconductor ‘frontend’, the ‘backend’ has little standardization with lots of different interfaces and behaviors between different equipment suppliers.  How can we standardize it and gain the efficiencies that standards brought to the frontend?  SEMI has several standards suites that could be used depending on the customer’s needs, including SECS/GEM, EDA/Interface A and RITdb.  This webinar will describe the benefits of each, as well discuss challenges around traceability and other issues commonly encountered in the backend, and how standards can benefit the equipment users.

United States

3:00 pm - 3:05 pm
Alan Weber
Vice President, New Product Innovations
Cimetrix

Opening Remarks

Alan Weber is currently the Vice President, New Product Innovations for Cimetrix Incorporated. Previously he served on the Board of Directors for eight years before joining the company as a full-time employee in 2011.

Alan has been a part of the semiconductor and manufacturing automation industries for over 40 years. He holds bachelor's and master's degrees in Electrical Engineering from Rice University.

3:05 pm - 3:15 pm
Brian Rubow
Director of Solutions Engineering
Cimetrix

SECS/GEM

Brian Rubow is the Director of Solutions Engineering for Cimetrix. He is well-known within the industry due to his involvement with the SEMI standards committees. He currently serves as the co-chairs for the North America Information and Control Committee, the North America GEM300 Task Force, and the North America DDA Task Force. Rubow has both a bachelor’s and a master’s in engineering from Brigham Young University.

3:15 pm - 3:25 pm
Albert Fuchigami
Senior Software Developer
PEER Group

EDA/Interface A

Albert Fuchigami is a senior software developer at PEER Group Inc. and has spent more than 20 years helping semiconductor OEMs integrate their equipment into factories around the world. He is a globally recognized leader in the SEMI Standards Program, co-leads the North America Data Diagnostic Acquisition (DDA) Task Force, and contributes to the Information & Control Technical Committee. Albert enjoys demonstrating how standards can maximize data communication with factory host systems and is a champion for integrating HTTP/2 with gRPC and Protocol Buffers technology into the Equipment Data Acquisition (EDA) / Interface A standards. He holds a Bachelor of Mathematics (Computer Science) degree from the University of Waterloo.

3:25 pm - 3:35 pm
Stacy Ajouri
Senior Member of Technical
Texas Instruments
Mark Roos
CEO
Roos Instruments

RITdB

Stacy Ajouri is a Senior Member of Technical Staff at Texas Instruments in the Test Technology Group. She is the co-chair of the North America Automated Test Equipment (ATE) Technical Committee and the RITdb Task Force. She has over 30 years of experience across multiple disciplines related to test and test operations. Pulling from that experience, she supports the implementation of RITdb proof of concepts (POCs) focusing what is needed by the manufacturing and engineering community.

Mark Roos is CEO of Roos Instruments, a longtime producer of semiconductor ATE. He co-chairs the North America ATE Technical Committee and the RITdb Task Force. Roos has been involved in standards development for ATE for the past 20 years. He is currently heavily involved in the focus of RITdb POCs on scaling and latency.

3:35 pm - 3:45 pm
Dave Huntley
Product Manager Assembly Products
PDF Solutions

Traceability and E142

Dave Huntley was the founder and president of KINESYS Software in 1992 which developed the Assembly Line Production Supervisor (ALPS). PDF Solutions acquired the ALPS in 2017 and Dave now works in Strategic Marketing, Business Development & Standards Liaison focused on defect / process tracking and single device traceability across the supply chain.

He has a long history working with SEMI. He was co-lead of the Sort Map task force responsible for the SEMI E142 Specification for Substrate Mapping Standard. Dave is now the co-lead for the Traceability committee and two SEMI task forces; 1) Advanced Backend Factory Integration working on applying and extending wafer fab automation standards to assembly and test and 2) Single Device Traceability task force working on blockchain traceability for the supply chain.

3:45 pm - 3:55 pm
Alan Weber
Vice President, New Product Innovations
Cimetrix

Closing Remarks

CAST 3:00 pm - 4:00 pm Off Add to Calendar 2024-02-22 15:00:00 2024-02-22 16:00:00 Standardizing the Semiconductor Manufacturing Backend United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

CAST logo

About Collaborative Alliance of Semiconductor Test (CAST)

CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.

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Moov, the world's largest and fastest growing marketplace for used semiconductor equipment, today announced that Rajiv Chegu has been promoted to the newly created role of Chief Operating Officer (COO).

Since joining Moov in 2022, Chegu has served as Head of Operations, running the gamut of company operations: people, processes and strategy. In his role as COO, Chegu’s expanded focus will include taking the helm of Moov’s product organization, strategic development of data products and services to drive both internal efficiency and external customer value, and continuing to drive market expansion as Moov grows its global presence.

“Rajiv’s experience running multiple functions across the operational, data, and product domains at leading B2B startups coupled with the rigor from his experience in private equity portfolio operations and top tier consulting is invaluable to Moov as we continue our trajectory of hyper-growth,” said Steven Zhou CEO and cofounder of Moov Technologies.

Prior to Moov, Chegu worked with B2B software companies, notably as an operator at CB Insights where he led teams across corporate development, data operations, business intelligence, and product as an SVP and at a leading lower middle market Private Equity firm. He also brings experience from the Boston Consulting Group, where he helped stand up the firm’s Growth Tech practice, working with leading pre-IPO technology companies.

Chegu’s promotion signals Moov’s plans to continue expanding its global footprint, product footprint, and market penetration. In 2023, Moov announced expansion of its presence in South Korea and the establishment of a new office in the strategic global semiconductor hub of Taipei. Moov unveiled a series of new product features at this year’s SEMICON West exhibition and conference, which leverage data and automation to further simplify the process of buying and selling semiconductor equipment and parts on Moov’s marketplace. This year, Moov also announced the establishment of a new enterprise partnerships division to grow strategic long-term relationships with leading semiconductor manufacturers across a variety of complex acquisition and divestiture projects.

“As we look ahead to 2024, we are excited to share a series of big product and growth announcements as we continue to transform the high tech equipment supply chain,” said Zhou.

For more information on Moov, visit www.moov.co.

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov's platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. To learn more, please visit Moov.co.

Kitchener, ON, January 11, 2024 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, is highlighting its lineup of SEMI Standards compliance test products at booth A434 during SEMICON Korea 2024.
“We are excited to return SEMICON Korea and look forward to connecting with our partners and customers at the show,” says Bob Kane, PEER Group’s Director of Factory Sales, Asia. “SEMI Standards compliance testing is critical for passing the factory acceptance test. OEMs that validate their tools using PEER Group’s test applications before shipping increase their chances of a successful factory integration and securing repeat business from factories.”
PEER Group’s test products include SECSIM Pro®+, which has been trusted by equipment manufacturers for more than 20 years to test and validate SECS/GEM communications. Also highlighted during the show are PFAT™, a workflow-based scenario test designer used by factories and OEMs to ensure equipment meets factory requirements, and CCS Envoy™, a factory automation standards compliance tester.
Visitors to booth A434 will have the opportunity to meet with representatives from PEER Group’s global sales team, as well as members from Toward Future, PEER Group’s exclusive sales partner serving South Korea. SEMICON Korea, which is happening January 31 - February 2, is the country’s leading semiconductor industry event.
To learn more, and to schedule a meeting during SEMICON Korea, visit PEER Group’s event page.

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. An award-winning company, PEER Group’s commitment to quality has been recognized by Intel’s EPIC Supplier Program, naming PEER Group a Distinguished Supplier in 2023 and an Outstanding Supplier in 2022. Follow PEER Group on LinkedIn.

Registration

Member Price: $49

Non-Member Price: $99

Registration is final. All registrants will receive the presentation recording after the event.

Taylor Zhao
Email: [email protected]

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Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley & Northeast Virtual Forum.

Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.

The SEMI Silicon Valley and Northeast Chapters Present:

Semiconductor Industry Outlook 2026 

As we step into 2026, the semiconductor industry continues to evolve at an unprecedented pace, driven by technological innovation, global market dynamics, and shifting economic conditions. Join us for an engaging virtual forum where leading experts will share insights into the trends, challenges, and opportunities shaping the future of the semiconductor ecosystem.

Topics Include:

  • Key market and technology trends shaping the industry.
  • Expert forecasts for 2026 and beyond.
  • Geopolitical impacts.
  • Emerging and expanding markets

Don’t miss out—register now to secure your spot!
 

United States

Virtual Forum | Wednesday, March 4, 2026 | Pacific Time

8:30 am
Joe Stockunas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:35 am
Luke Chang
Moderator
Luke Chang, PhD
Silicon Valley Chair; Program Director
SCREEN

Welcome Remarks

8:40 am
Duncan Meldrum, Headshot
Duncan Meldrum, PhD, CBE™
Business Economist
Hilltop Economics

Uncertainty and the Economic Outlook - Economic Growth and Semiconductors: Focus on the Risks

9:05 am
Scarlett Bickerton
Scarlett Bickerton
Manager, Federal & State Affairs
SEMI

SEMI Advocacy: Shaping the Policy Impacting Corporate Initiatives

9:30 am
Rebecca Routson
Rebecca Routson
Principal Director
CHIPS Metrology Program

CHIPS Metrology Program Update

9:55 am
Joe Gaustad, ClassOne
Joe Gaustad
Director of Product Development
ClassOne Technology

The New 300mm Customer

10:20 am
 Inna Skvortsova
Inna Skvortsova
Research Manager, Market Intelligence
SEMI

From AI Gold Rush to Fab Reality: Capacity, Fab Investments and Materials Outlook

10:45 am

Q&A

10:55 am
Sophia Rogalskyj_TEL
Sophia Rogalskyj
Etch Development Engineer and Northeast Chapter Co-Chair
NY Creates

Closing Remarks

8:30 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles 2 Register Now
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Registration

2024 Technology Workshops Enabling the Future of Electronics

Registration Fee
(April 16 & 17 only)

$250 members
$399 non-members

SEMI members who wish to join the NextFlex Workshop on April 19th should contact [email protected] for a special discount code.

Cancellation Policy

Cancellations received on or before March 16, 2024, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after March 16, 2024, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to Michelle Fabiano at [email protected].

2024 Technology Workshops Enabling the Future of Electronics
United States Future of Electronics Tile Technical

Recommended Hotel

Hotel Room

Residence Inn by Marriott

4610 Vestal Pkwy E, Vestal, NY 13850
TEL: (607) 770-8500

Hotel Room
https://www.idsnm.com/
https://www.engr.washington.edu/

SEMI NBMC Technical Gap Analysis Workshop - Tues. 4/16 - 8 am-6 pm 
During this workshop, attendees will address the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives. Breakfast, and lunch will be included and reception at the end of the day will be included.

SEMI FlexTech FHE Technical Gap Analysis Workshop - Wed. 4/17 - 8 am-4 pm, followed by tours of Binghamton University labs
Attendees will then turn their sights to completing a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Breakfast, lunch and tours of Binghamton University lab tours will conclude the day.

Binghamton University Tours - Wed. 4/17 - 4:00pm - 5:30pm
The tour will include facilities that are part of the S3IP (Small Scale Systems Integration & Packaging) a New York State Center of Excellence, CAMM (Center for Advanced Microelectronics Manufacturing) a New York State Center of Advanced Technology and home to the New York Node of NextFlex, the Analytical & Diagnostics Laboratory, the IEEC (Integrated Electronics Engineering Center) a New York State Center of Advanced Technology and NECCES (the Northeast Center for Chemical Energy Storage). 

Register for Tour

Binghamton University 2024 Art of Science Exhibit - Wed. 4/17 - 4:00pm - 5:30pm
Binghamton University holds an annual contest that celebrates the beauty of science through photographs and images that describe some aspect of research and captured visually.  The advances in imaging technology and tools mean that scientists have an increased ability to generate exciting data as well as to create compelling works of art and workshop attendees are invited to the opening reception for the 2024 Art of Science Exhibit in the atrium of the Center of Excellence Building. Contest winners will be announced, and refreshments will be served. 

In addition:
NextFlex Workshop– Thurs, 4/18 
NextFlex will convene the hybrid electronics community for a one-day workshop at Binghamton University in New York on April 18 to explore and define collaborative responses to soon to be announced opportunities under the CHIPS and Science Act, including the National Advanced Packaging Manufacturing Program (NAPMP), with a specific focus on advancing hybrid electronics for industrial and medical applications.

Additional information and separate registration
SEMI members who wish to join the NextFlex Workshop on April 19th should contact [email protected] for a special discount code.

Binghamton University, Innovative Technologies Complex (ITC)
85 Murray Hill Rd
Vestal, NY 13850
United States

Tuesday, April 16

7:00 am - 8:00 am

Registration and Breakfast

8:00 am
Dr. Grupen-Shemansky is the Chief Technology Officer and VP of Technology Communities at SEMI.
Melissa Grupen-Shemansky
Vice President, Technology Communities
SEMI

Opening Remarks

8:15 am
Stephaney Shanks
Stephaney Shanks
Division Director, Integrative Health and Performance Sciences
UES, a BlueHalo company

Vision and Mission of NBMC

8:30 am
Gina Tollefson
Air Force Research Laboratory

NBMC Gap Analysis Workshop - AFRL Perspective

8:40 am
Robert Andosca
Robert Andosca
Co-founder, President, and CEO/CTO
INVIZA® Health

Energy Harvesting for Wearables

9:10 am
Muyang Lin
Muyang Lin
University of California, San Diego

A Fully Integrated Wearable Ultrasound System to Monitor Deep Tissues in Moving Subjects

9:25 am - 9:55 am

Break

9:55 am
Dylan Shah
Dylan Shah
Arieca

Self-Powered Wireless Soft Electronics

10:10 am
Teresa Abraham
Teresa Abraham
Sapphiros

Low-cost, Connected Blood Collection Device with Onboard Biosensors to Detect Biomarkers for Human/Cognitive Performance

10:25 am
Robert Andosca
Robert Andosca
Co-founder, President, and CEO/CTO
INVIZA® Health

Smart Remote Patient / Airmen Monitoring (RPM / RAM) Platform

10:35 am
Azar Alizadeh
Principal Scientist
GE HealthCare Technology & Innovation Center

Multiplexed Wireless Interstitial Fluid Monitoring Devices for Stress Assessment

10:50 am
Jack Ly
Jack Ly
UES

Transdermal Optical Microneedle Sensors for Continuous Monitoring of Physiological Analytes in Interstitial Fluid

11:05 am
Anthony Wertz
Anthony Wertz
Research Intern
Carnegie Mellon University

Liquid Metal Embedded Elastomers: Electromigration Characterization and Use in Stretchable Sensors

11:20 am
John Strang
John Strang
CEO
Dermisense

Crossing the Chasm to Commercialization

11:35 am
David Kim
David Kim
North Carolina State University

Liquid Metal Filled Fibers for Next Generation E-Textiles

11:50 am
William Jamie Tyler
William "Jamie" Tyler
Co-founder, Executive Leader and Professor
IST, LLC

Auricular Bioelectronics for Medicine and Augmented Human-Machine Cognition

12:05 pm
Cameron Good
Carmeron Good
Vice President, Research and Product Development
Attune

Individualized Focused Ultrasound Stimulation of the Brain to Enhance Alertness and Cognitive Performance

12:20 pm - 1:30 pm

Networking Lunch

1:30 pm - 3:00 pm

Breakout Strategy Sessions

Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.

3:00 pm - 3:15 pm

Break

3:15 pm - 4:45 pm

Breakout Sessions Readout

4:45 pm - 6:15 pm

Networking Reception

Wednesday, April 17

7:00 am - 8:00 am

Registration and Breakfast

8:00 am
Gity Samadi
Gity Samadi
Senior Director
SEMI

Opening Remarks

8:05 am
Robert Bob Praino
Bob Praino
Chief Operating Officer (COO) and Co-founder
CHASM Advanced Materials

FHE Consortium Mission and Vision

8:20 am
Dan Balder
Dan Balder
Engineering Manager
SunRay Scientific
Madhu Stemmermann
Madhu Stemmermann
CEO and Co-Founder
Sunray Scientific

Advancements in Scalable Anisotropic Adhesive for FHE Manufacturing

8:40 am
Rafael Tudela
Rafael Tudela
Technical Program Leader for Flexible and Printed Electronics
Tapecon

Bending the Future: The Expanding Horizons of Flexible Hybrid Electronics

8:55 am
Eric Acome
Eric Acome
CEO and Co-Founder
Artimus Robotics

HASEL Artificial Muscles: High Performance Electrostatic Transducers Enabled by the Combination of Flexible Electronics and Liquid Dielectrics

9:10 am - 9:40 am

Break

9:40 am
Mike Mastropietro
Michael A. Mastropietro
CTO/Director of R&D
ACI Materials, Inc.

Materials and Processes for High Volume Integration of Stretchable Circuits into E-Textile

9:55 am
Devin MacKenzie
Devin MacKenzie
Washington University

Breaking Through 10 Micron Barrier to Enable 3D Structuring of RF Antennas Interconnects Arrays for FHE

10:10 am
Dave Keicher
Dave Keicher
IDS

Aerosol Printing with Industrial Reliability - Performance Results for the NanoJet Gen2 Printhead

10:25 am
Robert Bob Praino
Bob Praino
CHASM Advanced Materials

Revisiting Transparent Antennas for 5G and Beyond - FT19-21-203

10:40 am
Amit Lal
Cornell University

Minimum Viable Virtual Fab for Accelerated Innovation of Semiconductor Manufacturing Processes and Future Devices

10:55 am
Felippe Pavinatto
Felippe Pavinatto
GE Aerospace

Printed RF Passive Sensors for High-Temperature Applications in Aerospace

11:10 am
Peter Doerschuck
Peter Doerschuk
Cornell University

AI Models for Optimizing FHE Printing Aided by Ultrasound Metrology

11:25 am
Emmanouil Tentzeris
Emmanouil Tentzeris
Ed and Pat Joy Chair Professor
Georgia Institute of Technology, School of ECE

Additively Manufactured Flexible " Smart" Packaging and Reconfigurable On-Package Antenna Arrays for Next Generation 5G/mm Wave System on Package Designs

11:40 am
Deepak Trivedi
Deepak Trivedi
GE Aerospace

CogniWorm: Compliant and Autonomous Grub for Navigation and Inspection fo Warped, Complex and Rough Environments

11:55 am - 1:05 pm

Networking Lunch

1:05 pm - 2:35 pm

Breakout Strategy Sessions

Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.

2:35 pm - 2:50 pm

Break

2:50 pm - 4:00 pm

Breakout Sessions Readout

4:00 pm - 5:30 pm

Binghamton University Laboratory Tours & 2024 Art of Science Exhibit and Reception

The tour will include facilities that are part of the S3IP (Small Scale Systems Integration & Packaging) a New York State Center of Excellence, CAMM (Center for Advanced Microelectronics Manufacturing) a New York State Center of Advanced Technology and home to the New York Node of NextFlex, the Analytical & Diagnostics Laboratory, the IEEC (Integrated Electronics Engineering Center) a New York State Center of Advanced Technology and NECCES (the Northeast Center for Chemical Energy Storage).

- FlexTech


Presented by

FlexTech nbmc and NextFlex logo

 

Hosted by

Binghamton University Logo

 

Join leaders from FlexTech, NBMC, NextFlex and the microelectronics industry in this dynamic workshop, where we'll explore advancements, challenges, and solutions in critical technologies like flexible hybrid electronics, hybrid electronics, wearables, bio-signal sensing for real-time cognitive and physical state monitoring, and more. Participate in hands-on sessions, cross-disciplinary discussions, and gain insights from industry and academia through impactful talks. Contribute your suggestions in dynamic breakout sessions to shape and enable the future of these technologies.

7:30 am - 6:00 pm Off Add to Calendar 2024-04-16 07:30:00 2024-04-17 18:00:00 2024 Technology Workshops Enabling the Future of Electronics Presented by Hosted by Join leaders from FlexTech, NBMC, NextFlex and the microelectronics industry in this dynamic workshop, where we'll explore advancements, challenges, and solutions in critical technologies like flexible hybrid electronics, hybrid electronics, wearables, bio-signal sensing for real-time cognitive and physical state monitoring, and more. Participate in hands-on sessions, cross-disciplinary discussions, and gain insights from industry and academia through impactful talks. Contribute your suggestions in dynamic breakout sessions to shape and enable the future of these technologies. Binghamton University, Innovative Technologies Complex (ITC) 85 Murray Hill Rd Vestal, NY 13850 United States SEMI.org [email protected] America/Los_Angeles public

Event Contact

For questions, please contact Michelle Fabiano at [email protected].

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