BIOGRAPHY
Daniel’s passion lies in problem solving at the intersection between process, integration, and sustainability.
Daniel earned a BS and MS in Chemical Engineering from the University of Michigan. Daniel started his career at BOC/Linde designing air separation units, followed by work at General Electric designing reverse osmosis membranes. It was at Intel that Daniel discovered the excitement and complexity of semiconductor manufacturing. In his 14 years at Analog Devices, Daniel has held induvial contributor and management roles in Photolithography, CMOS Integration, Plasma Etch, and Thinfilms deposition, owning technology development and ramp of the Beaverton 180nm node.
Currently Daniel oversees the largest internal ADI factory located Beaverton, Oregon with an active $1.5B expansion currently underway.