The semiconductor market will be $1.3 trillion in 2026, $1.9 trillion in 2030, and $3.7 trillion in 2035.
The high growth of the semiconductor market is changing from being driven by generative AI to being driven by agentic AI. Physical AI will also have strong growth in the future, which will further impact the semiconductor market.
New products being developed by semiconductor companies are also allowing AI to address new applications which result in demand for more semiconductors.
The presentation will provide more details on areas of growth, and what does it mean for the semiconductor and electronics industries. And it is also important to monitor the factors that can result in a down phase of the semiconductor industry.
United States
10:00 am
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10:05 am
Joe Stockunas
President
SEMI Americas
Welcome Remarks
10:05 am
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10:50 am
Handel Jones, PhD
CEO
International Business Strategies (IBS)
How AI is Driving the Semiconductor Market and How Semiconductors Are Supporting Growth of AI Capabilities
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI
Joe Stockunas
President
SEMI Americas
SEMI Smart Data-AI Initiative Update and Closing Remarks
This webinar will discuss how AI is driving semiconductor market growth and shaping the future of the semiconductor and electronics industries.
AI Driving the Semiconductor Supercycle
Rising AI Demand and the Semiconductor Innovation Loop
10:00 am - 11:15 am
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Add to Calendar2026-07-09 10:00:002026-07-09 11:15:00AI Driving the Semiconductor Supercycle This webinar will discuss how AI is driving semiconductor market growth and shaping the future of the semiconductor and electronics industries.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Artificial intelligence (AI) continues to grow rapidly, driving unprecedented transformation. And for all the hype, the best is yet to come! But AI's energy footprint is growing rapidly and the global “data center gold rush” is already straining energy grids and natural resources around the world. This is a formidable challenge that cannot be ignored.
For industry, this is a strategic business imperative. AI access costs are mounting, and there is increasing stakeholder pressure to show ROI on AI investments. Competitive advantage derives from running AI systems as efficiently as possible, maximizing performance and minimizing energy consumption. And for the next big application of physical AI, efficiency becomes absolutely critical.
No entity can address this alone. The SEMI Smart Data-AI Initiative has been working to build a meaningful collaboration across the entire AI ecosystem to “bend the curve.” In this workshop, together with our alliance partner San Jose, we bring together distinguished leaders across the spectrum to share insights and chart the future course. Please join us at this exciting interactive event.
Mexican Heritage Plaza 1700 Alum Rock Ave San Jose, CA95116 United States
From AI to Quantum, the Future is Now in California
9:45 am
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10:05 am
David Fried
Chief AI Officer & Corporate VP
Lam Research
Keynote: Lam Research
From Chips to Tokens: Efficiency and Velocity in the AI Era
10:05 am
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10:25 am
Dr. Mahmut Ersin Sinangil
Distinguished Research Scientist
NVIDIA
Keynote: NVIDIA
From Watts to Intelligence: Building the Efficient AI Factory
10:25 am
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10:45 am
Yvonne Ferrier
Associate Principal
McKinsey & Co
Keynote: McKinsey & Co
Unlocking Efficient AI Inference at Scale
Break
10:45 am
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11:05 am
Networking Coffee Break
11:05 am
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11:10 am
Gity Samadi
Sr. Director R&D Programs
SEMI
Session Introduction: SEMI
11:10 am
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11:30 am
Vikrant Lal
Fellow
Optical Networks Division
Session Keynote: Nokia
At the Intersection of Photonics Innovation and AI's Energy Challenge
11:30 am
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12:15 pm
Panel Discussion
Chair, Gity Samadi
• Nokia – Vikrant Lal
• Aeluma - Jonathan Klamkin, CEO
• Avicena – Nigel Alvares, VP of Product & Marketing
• Veeco – Drew Hanser, VP of Technology
• ASE -Calvin Cheung, VP, Engineering and Business Development
Networking Break
12:15 pm
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1:30 pm
Lunch
1:30 pm
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1:40 pm
Melissa Grupen-Shemansky
VP & CTO
SEMI
Introduction to SEMI Technology Coalitions and Afternoon Sessions
1:40 pm
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2:00 pm
Christopher Wellise (CW)
VP-Sustainability
Equinix
Session Keynote: Equinix
The New Infrastructure Imperatives: Energy, Water & Community Impact
2:00 pm
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2:10 pm
Sundeep Bajikar
CVP Corporate Strategy & Marketing
Applied Materials
Panel Introduction: Applied Materials
Chip-to-Grid
2:10 pm
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3:00 pm
Panel Discussion
Chair, Sundeep Bajikar
• Equinix - Christopher Wellise (CW), VP of Sustainability
• City of San Jose - Erica Garaffo, Strategic Energy Customer Development Lead
• PG&E - Karen Khamou Ornelas, Senior Director of Data Center & Technology Growth
• Deloitte Consulting - Craig Lobdell, Senior Manager, Strategy, Growth, and Transformation
Networking Break
3:00 pm
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3:20 pm
Coffee Break
3:20 pm
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3:40 pm
Nuwan Jayasena
Fellow
AMD
Session Keynote: AMD
Managing Memory Architecture
3:40 pm
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4:00 pm
Cliff Young
TPU & Anton Architect, MLPerf co-founder
Google
Session Keynote: Google
Bounded Revolutionary Jumps
4:00 pm
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4:45 pm
Panel Discussion
Chair, Pushkar Apte
• Google – Cliff Young, TPU & Anton Architect, MLPerf co-founder
• AMD – Nuwan Jayasena, Senior Fellow
• SK Hynix – John Kim, Senior Director, Head of AI DC Technology
• Siemens/Mentor – Mark Malinoski, Solutions Director, Digital Transformation Engg.
• Qualcomm - Roberto Mijat, Director for AI Product Architecture and HW Systems
Presentations are only available to event registrants.
Future of AI Computing
Bending the Curve for Power & Performance [In-Person Event]
8:00 am - 6:45 pm
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America/Los_Angeles
Alliance Partner
The SEMI Smart Data-AI Initiative is organizing this workshop with our Alliance Partner, the City of San Jose. We are uniting the entire AI ecosystem including devices, materials, packaging, photonics, quantum, architectures and algorithms. Please join us in this exciting interactive workshop.
The Department of Defense needs non-linear advances in gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiological changes present in human breath. Currently, fieldable instruments for gas analysis are large (>0.5 cubic feet), expensive (>$50,000), and slow. Hand-held devices are limited to identification of specific targets such as nitrogen oxide, oxygen, and carbon dioxide or generalized estimated concentration of total volatile organic compounds (VOCs). Biohybrid sensing involves combining biological sensory elements with electronic components in a SWaP-C solution for fast and accurate detection of VOCs. Unprecedented VOC sensing potential lies within the biological sense of olfaction, which boasts rapid, selective, and sensitive capability to identify hundreds of thousands of compounds in complex environments. However, there are currently no commercially available devices harnessing the capability of olfaction due to the challenges in the bioelectronic interfacing necessary for maintaining long-term stability and environmental conditions necessary to sustain olfactory signaling elements (whether it be at the organ-, cell-, or protein-level). This course will provide an overview of the current state of biohybrid VOC sensing comparing and contrasting examples utilizing olfactory organ/tissue-based, cell-based, and protein-based modalities.
ABOUT THE SPEAKER
Dr. Elisabeth Steele is a biomedical engineer at Blue Halo serving as a Lead Scientist and Team Lead supporting sensor development at the Air Force Research Laboratory (AFRL). Her expertise is in neural tissue engineering and electrophysiology with recent focus in the design and testing of biohybrid gas sensors inspired by insect olfaction. Dr. Steel conducted neuromodulation research as a post-doctoral fellow with Dr. Tim Bruns at the University of Michigan. Additionally, she served as a Technical Sales Engineer with NeuroNexus Technologies, the industry leader in microelectrode array technology for neuroscience electrophysiology applications. She received her PhD (2018) and M.S. (2013) in Biomedical Engineering from Wayne State University in Detroit, Michigan. She completed her B.S. in Bioengineering in 2007 from University of Toledo.
This webinar features Dr. Elisabeth Steele of UES covering the status of non-linear advances in gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiological changes present in human breath.
Biohybrid Sensing Systems for Volatile Organic Compounds
Flexible Electronics Master Class #18
10:00 am - 12:00 pm
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Watch Now!
The healthcare industry has transformed over the last twenty-five years due to the co-development of diagnostics along with state-of-the-art therapeutics and treatments; notably, this has led to the field of companion diagnostics. The best example of this is the prescribed use of insulin based on glucose levels monitored via test strips or the continuous glucose monitor. The future goal of medicine is to have truly personalized treatment protocols based on an individual’s biometrics, physiology, and exposure.
However, this goal requires further identification and quantitation of biomarkers and health exposures, both biological and chemical, both at the point-of-care as well as in real-time. Therefore, technologies are needed that can miniaturize current diagnostics to make them inexpensive, simple-to-use, and ideally wearable.
However, where and what to sense remains a critical question to solve, as each biofluid, including blood, sweat, saliva, tears, breath, and exhaled breath condensate contains a different profile of biomarkers. Additionally, biomarkers have vastly different physiochemical properties and abundances, which present different challenges as well as require a range of sensing modalities. Therefore, this course will be an overview of the “What, Where, and How of Sensing to Meet Current and Future MedTech Needs”. At the end of the course, a perspective of where these technologies can impact the future of health outcomes will be presented as well as key considerations for future technologies to gain commercial acceptance
ABOUT THE SPEAKER
Dr. Michael Brothers, PMP currently is a Principal Scientist and Technical Program Manager at UES, a Blue Halo Company. In these roles, Dr. Brothers supervises contractors executing research to identify biomarkers indicative of human performance, develop novel sensors, as well as field research. Dr. Brothers also serves as a subject matter expert on biochemical sensors, both in the liquid phase and gas phase, for the 711th Human Performance Wing at Wright Patterson Air Force Base.
Notably, Dr. Brothers has co-authored multiple publications and patents on using novel sensing modalities to sense in complex fluids and environments, including jet fuel, sweat, saliva, and breath. Dr. Brothers has also served as the Principal Investigator on sensor development efforts for both optical based gas sensors and flexible, ink-printed gas sensors for wearable applications.
Dr. Brothers has his Ph.D. from the University of Illinois Urbana-Champaign in Chemical Biology and his B.S. in Chemistry and Biology from the University of Cincinnati.
This webinar featured Dr. Michael Brothers of UES, a Blue Halo Company, outlining the status of personalized medical treatment protocols based on an individual’s biometrics, physiology, and exposure. This course will be an overview of the “What, Where, and How of Sensing to Meet Current and Future MedTech Needs"
Perspectives on Biosensor Applications
Flexible Electronics Master Class #17
10:00 am - 12:00 pm
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In the last few years, electronics packaging has rightfully emerged from the shadows of CMOS scaling to make a significant impact in high performance and mobile appliance computing.
In this course, we reviewed the key developments in this paradigm change and the implications these have on Flexible Hybrid Electronics especially the use of bare dielets, fine pitch interconnects and novel substrate materials.
The area of Flexible Hybrid Electronics (FHE) has also developed and is making a significant impact in the area of medical and wellness electronics. The first generation of these devices have, for most part, adapted Printed Circuit Board (PCB) technology by using thinner PCBs and assembling either thinned or thin packaged “older” generation of chips on to these platforms, typically with coarse printed wiring to connect a small number of such chips.
This approach, while immensely useful to get the field going, needs to adapt and borrow from the both silicon and advanced packaging technology trends, so that we can advance this trend to the next level. The key paradigm challenges ahead are: scaling FHE in general – this includes the adoption of dielet (chiplet) technology in more advanced CMOS nodes including edge-AI, higher performance interconnects, flexible high-density energy storage, wireless communication and advanced ergonomics and all of these at lower cost and higher reliability.
This talk addresses the challenges and outline a possible technology roadmap to achieve these goals in the next few years.
Featured Speaker Biography: Subramanian S. Iyer (Subu) is Distinguished Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Department and a joint appointment in the Materials Science and Engineering Department at the University of California at Los Angeles. He is Director of the Center for Heterogeneous Integration and Performance Scaling (CHIPS). Prior to that he was an IBM Fellow. His key technical contributions have been the development of the world’s first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm technology node used to make the first generation of truly low power portable devices as well as the first commercial interposer and 3D integrated products. He also was among the first to commercialize bonded SOI for CMOS applications through a start-up called SiBond LLC.
More recently, he has been exploring new packaging paradigms and device innovations that they may enable wafer-scale architectures, in-memory analog compute and medical engineering applications. He has published over 300 papers and holds over 75 patents. He has received several outstanding technical achievements and corporate awards at IBM. He is an IEEE Fellow, an APS Fellow, an iMAPS Fellow and a Distinguished Lecturer of the IEEE EDS and EPS and a member of the Board of Governors of IEEE EPS. He is also a Fellow of the National Academy of Inventors. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for emerging technologies in 2012 and the 2020 iMAPS Daniel C. Hughes Jr Memorial award.
View this Master Class On Demand! Learn why and how new packaging paradigms like chiplets and dielets are impacting the world of flexible hybrid electronics (FHE) from one of the industry's foremost experts, Dr. Subramanian Iyer of UCLA. The course explores how these packages are packing such a punch and enabling advanced performance in a much smaller and flexible footprint.
Flexible Hybrid Electronics 2.0 based on Fan-out Wafer Packaging
